Abstract: [0001] A method of manufacturing a semiconductor device is provided. The method includes providing a transparent substrate having predefined active regions and non-active regions, Thereafter, the method includes spraying droplets of a lacquer on the predefined active regions to form corresponding lacquer layer regions, such that the non-active regions do not have presence of the lacquer. The lacquer layer regions are of a predefined thickness to enable their functional texturing. Texturing of lacquer layer enables light trapping or light extraction. Thereafter, one or more semiconductor layers are deposited o the lacquer layer regions and a cover substrate is provided. The cover substrate is joined to the transparent substrate at a portion of the non-active regions and encapsulates the lacquer layer regions and the one or more semiconductor layers between itself and the transparent substrate.
| # | Name | Date |
|---|---|---|
| 1 | 72-del-2011-abstract.pdf | 2011-08-21 |
| 1 | 72-del-2011-gpa.pdf | 2011-08-21 |
| 2 | 72-del-2011-claims.pdf | 2011-08-21 |
| 2 | 72-del-2011-form-5.pdf | 2011-08-21 |
| 3 | 72-del-2011-correspondence-others.pdf | 2011-08-21 |
| 3 | 72-del-2011-form-3.pdf | 2011-08-21 |
| 4 | 72-del-2011-description (complete).pdf | 2011-08-21 |
| 4 | 72-del-2011-form-2.pdf | 2011-08-21 |
| 5 | 72-del-2011-form-1.pdf | 2011-08-21 |
| 5 | 72-del-2011-drawings.pdf | 2011-08-21 |
| 6 | 72-del-2011-drawings.pdf | 2011-08-21 |
| 6 | 72-del-2011-form-1.pdf | 2011-08-21 |
| 7 | 72-del-2011-description (complete).pdf | 2011-08-21 |
| 7 | 72-del-2011-form-2.pdf | 2011-08-21 |
| 8 | 72-del-2011-correspondence-others.pdf | 2011-08-21 |
| 8 | 72-del-2011-form-3.pdf | 2011-08-21 |
| 9 | 72-del-2011-claims.pdf | 2011-08-21 |
| 9 | 72-del-2011-form-5.pdf | 2011-08-21 |
| 10 | 72-del-2011-gpa.pdf | 2011-08-21 |
| 10 | 72-del-2011-abstract.pdf | 2011-08-21 |