FIELD OF THE INVENTION:
This invention relates to a method of manufacturing an organic lighting device. More particularly this invention relates to a high throughput and high yield method of manufacturing an organic light emitting device (OLED).
BACKGROUND:
Organic light emitting devices (OLED) are increasingly becoming a popular technology for various applications including flat panel displays and lighting systems for illumination.
Organic light emitting devices are generally manufactured by employing various methods such as screen printing, dip coating, spray coating, doctored blade, spin coating, sputtering, evaporation etc on large sized panels involving panel by panel, roll to roll and other large form factor manufacturing processes. These large sized panels are later sliced to form organic light emitting devices of required product sizes. However, such large form factor manufacturing processes tend to increase defects and non-uniformities in the active layers of the organic light emitting devices. These defects lead to poor device performance and very low process yields for the organic light emitting devices. Further, slicing of the substrates results in loss of material as well as introduces additional process steps such as cleaning of debris which in turn reduces yield. This makes these devices highly expensive and non-competitive with other technologies. Furthermore, many of these manufacturing processes are not scalable leading to delays in faster commercialization for these devices.
In light of the above, there is a need of a method of manufacturing organic lighting device which overcomes the above mentioned problems and creates a process by which small form factor product sized substrate OLEDs can be manufactured with high throughput but largely devoid of problems mentioned above.
SUMMARY
It is an objective of the present invention to provide a method of manufacturing an organic lighting device which minimizes the defects in the devices.
Another objective of the present invention is to provide a method of manufacturing an organic lighting device which has a high throughput.
Another objective of the present invention is to provide a method of manufacturing an organic lighting device having uniformity of the coated materials..
Another objective of the present invention is to provide a method of manufacturing an organic lighting device that does not involve cutting or slicing the substrate.
Another objective of the present invention is to provide a method of manufacturing an organic lighting device with a form factor equal to the form factor of the input substrate.
Another objective of the present invention is to provide a method of manufacturing an organic lighting device with a customizable size.
Embodiments of the present invention provide a method of manufacturing an organic lighting device. The method includes high throughput first processing of one or more first product sized substrates employing one or more first small form factor manufacturing processes. Active layer deposition processing is performed on a plurality of the one or more first product sized substrates. High throughput second processing of one or more second product sized substrates employing one or more second small form factor manufacturing processes. The first product sized substrates are encapsulated with the second product sized substrates to form the organic lighting device.
The one or more first product sized substrates and one or more second product sized substrates have a first pre-defined form factor and a second pre-defined form factor, respectively, of less than or equal to 30cm X 30cm. The form factor of the organic lighting device is equal to the first predefined form factor.
In an embodiment of the present invention, the first small form factor manufacturing processing of the first product sized substrates and the second small form factor manufacturing processing of the second product sized substrates are batch processes. Examples of the first small form factor manufacturing processes and the second small form factor manufacturing processes include, but are not limited to dip coating, spin coating, doctored blade, spray coating, screen printing, sputtering, glass mastering, glass cleaning, photoresist mastering, electroforming, and evaporation.
The form factor of the organic lighting device is equal to the form factor of the first product sized substrates and the second product sized substrates. In an embodiment of the present invention, a
plurality of the organic lighting device of a small form factor are combined to form a large organic lighting device with a large form factor. The form factor of the large organic lighting device is customizable based on the requirement of a user. The large organic lighting device is formed without cutting or slicing the substrate.
BRIEF DESCRIPTION OF THE DRAWINGS:
Embodiments of the present invention will hereinafter be described in conjunction with the appended drawings provided to illustrate and not to limit the scope of the claims, wherein like designations denote like elements, and in which:
FIG. 1 is a flowchart depicting a method of manufacturing an organic lighting device, in accordance with an embodiment of the present invention;
FIG. 2 is a flowchart depicting one or more first small form factor manufacturing processes for manufacturing an organic lighting device, in accordance with an embodiment of the present invention;
FIG. 3 is a flowchart depicting one or more second small form factor manufacturing processes for manufacturing an organic lighting device, in accordance with an embodiment of the present invention;
FIG. 4 is a flowchart depicting an encapsulating process for manufacturing an organic lighting device, in accordance with an embodiment of the present invention;
FIG. 5 is a flowchart depicting a method of manufacturing an organic lighting device, in accordance with another embodiment of the present invention;
FIG.6 is a system depicting one or more first small form factor manufacturing processes for manufacturing an organic lighting device, in accordance with an embodiment of the present invention;
FIG. 7 is a system depicting one or more second small form factor manufacturing processes for manufacturing an organic lighting device, in accordance with an embodiment of the present invention; and
FIG. 8 is a flowchart depicting an encapsulating process for manufacturing an organic lighting device, in accordance with an embodiment of the present invention.
DETAILED DESCRIPTION
Various embodiments of the present invention provide a method of manufacturing an organic lighting device of form factor less than or equal to 30 cm X 30 cm. The method includes performing one or more first small form factor manufacturing processes on one or more first product sized substrates, active layer deposition processing of a plurality of the one or more first product sized substrates, performing one or more second small form factor manufacturing processes on one or more second product sized
substrates and encapsulating the one or more first product sized substrates with the one or more second product sized substrates to form the organic lighting device.
Examples of the active layer deposition processes include at least one of thin film coating, evaporation, spin coating, screen printing processes and the like.
The first product sized substrates and the second product sized substrates have a pre-defined form factor of less than or equal to 30cm X 30cm. The form factor of the organic lighting device is equal to the form factor of the first product sized substrates and the second product sized substrates.
FIG. 1 is a flowchart depicting a method of manufacturing an organic lighting device, in accordance with an embodiment of the present invention.
At step 102, high throughput first processes are performed on one or more first product sized substrates. The first product sized substrates act as a substrate which form a base of the organic lighting device. In an embodiment of the present invention, the first product sized substrates are composed of a transparent material. Examples of transparent material include, but are not limited to, glass, transparent plastic, fiberglass, and foil. In an embodiment of the present invention, the first product sized substrates have a pre-defined form factor of less than or equal to 30cm X 30cm.
The high throughput first processing enables fast processing of the first product sized substrates in less time. Fast processing enables manufacturing of large quantity of the organic lighting device at a high rate. The high throughput first processes include one or more first small form factor manufacturing processes. In an embodiment of the present invention, the first small form factor manufacturing processes are conventionally optimized to manufacture sizes of less than or equal to 30 cm X 30 cm. Examples of the first small form factor manufacturing processes, include, but are not limited to dip coating, spin coating, doctored blade, spray coating, screen printing, sputtering, glass mastering, photoresist mastering, electroforming, and evaporation. In an embodiment of the present invention, the first small form factor manufacturing processes is a batch process. Details corresponding to the first small form factor manufacturing processes have been provided in detail in conjunction with FIG. 2.
At step 104, active layer deposition processing is performed on a plurality of the one or more first product sized substrates. The active layer deposition processing includes deposition of an active layer on the plurality of first product sized substrates. In an embodiment of the present invention, active layer is an organic layer. Examples of active layer deposition processes include at least one of thin film coating, spin coating and screen printing, dip coating, doctored blade, spray coating, screen printing, sputtering, glass mastering, photoresist mastering, electroforming, and evaporation
At step 106, high throughput second processing is performed on one or more second product sized substrates. The second product sized substrates are a substrate which forms the base of the organic lighting device. In an embodiment of the present invention, the second product sized substrates
are composed of a transparent material or any of other suitable material such as aluminum foil sheet. Examples of transparent material include, but are not limited to, glass, transparent plastic, fiberglass, and foil. The second product sized substrates can be of any size having small form factor. In an embodiment of the present invention, the second product sized substrates have a second pre-defined form factor of less than or equal to 30cm X 30cm.
The high throughput second processes enable fast processing of the second product sized substrates. Fast processing enables manufacturing of large quantity of the organic lighting device at a high rate. The high throughput second processes include one or more second small form factor manufacturing processes. In an embodiment of the present invention, examples of the second small form factor manufacturing processes include, but are not limited to dip coating, spin coating, doctored blade, spray coating, screen printing, sputtering, glass mastering, photoresist mastering, electroforming, and evaporation. In an embodiment of the present invention, the second small form factor manufacturing processes are batch processes. Details corresponding to the second small form factor manufacturing processes have been explained in detail in conjunction with FIG. 3.
In various embodiments of the present invention, the first small form factor manufacturing processes and the second small form factor manufacturing processes are same. In an embodiment of the present invention, the first small form factor manufacturing processes and the second small form factor manufacturing processes do not involve the step of cutting, scribing or slicing of the first product sized substrates or the second product sized substrates.
At step 108, at least one of the first product sized substrates are encapsulated with the second product sized substrates to form the organic lighting device. In an embodiment of the present invention, encapsulation is done using a resin. The form factor of the organic lighting device is equal to the first predefined form factor and the second pre-defined form factor.
Example of resin includes, but is not limited to, an epoxy resin. Examples of the organic lighting device include, but are not limited to, Organic Light Emitting Diode (OLED), White Organic Light Emitting Diode (W-OLED), Active-matrix Organic Light Emitting Diodes (AMOLED), Passive-matrix Organic Light Emitting Diodes (PMOLED), Flexible Organic Light Emitting Diodes (FOLED), Stacked Organic Light Emitting Diodes (SOLED), Tandem Organic Light Emitting Diode , Transparent Organic Light Emitting Diodes (TOLED), Top Emitting Organic Light Emitting Diode, Bottom Emitting Organic Light Emitting Diode, Fluorescence doped Organic Light Emitting Diode (F-OLED), Phosphorescent Organic Light Emitting Diode (PHOLED) .
In various embodiments of the present invention, the one or more first small form factor manufacturing processes and the one or more second small form factor manufacturing processes are performed simultaneously. In an embodiment of the present invention, the first small form factor manufacturing processes, the active layer deposition process, the second small form factor
manufacturing processes and encapsulation process are conventionally optimized to meet required production rate with a minimum idle time.
FIG. 2 is a flowchart depicting the one or more first small form factor manufacturing processes for manufacturing the organic lighting device, in accordance with an embodiment of the present invention.
At step 202, the first product sized substrates are cleaned to remove unwanted substances from the surface of the first product sized substrates. In an embodiment of the present invention, the cleaning of the first product sized substrates is performed through various methods. Examples of the methods include, but are not limited to, water rinsing, air cleaning, ultrasonication, megasonication, detergents, organic solvents and inorganic solvents. The cleaned first product sized substrates may be dried using various means such as air drying, hot air drying, and IR heater.
At step 204, a light extraction layer is deposited on the first product sized substrates. The light extraction layer scatters the light efficiently and enhances the performance of the organic lighting devices. In an embodiment of the present invention, the light extraction layer has various forms. Examples of forms include, but are not limited to, nano-particle layer, gel layer, high refractive index layers such as that of SiNx, periodic array layers, and index matching layers.
A layer of a conducting oxide is coated on the first product sized substrate cells, at step 206. In an embodiment of the present invention, the conducting oxide layer is transparent in nature. Examples of the conducting oxide, include, but are not limited to Indium Tin Oxide, and Zinc Oxide. The conducting oxide is coated on the first product sized substrates using various methods, such as dip coating, spin coating, doctored blade, spray coating, screen printing, sputtering, glass mastering, photoresist mastering, electroforming, and evaporation.
At step 208, patterning is performed on the first product sized substrates. In an embodiment of the present invention, the first product sized substrates are patterned to adapt as per predefined design rules. In an embodiment of the present invention, various techniques such as lasers, mechanical devices, and chemical etching are used to pattern the first product sized substrates.
At step 210, an edge covering layer is coated on the first product sized substrates to cover the edges of conducting oxide layer. In an embodiment of the present invention, the edge covering layer is coated on the first product sized substrates using various methods such as dip coating, spin coating, doctored blade, spray coating, screen printing, sputtering, glass mastering, photoresist mastering, electroforming, and evaporation. In an embodiment of the present invention, step 208 is performed after step 210, i.e. patterning is performed on the first product sized substartes coated with the edge covering layer. In an embodiment of the present invention, various techniques such as lasers, mechanical devices, and chemical etching are used to pattern the first product sized substrates.
At step 212, contamination and/or impurities are removed from the first product sized substrates to form coated one or more first product sized substrates. In an embodiment of the present invention, the contamination and/or impurities are removed by subjecting the first product sized substrates to an ozone treatment generated by UV light. The ozone treatment removes the contamination and/or impurities such as oil, grease and dirt.
Coated one or more first product sized substrates are received at step 214.
Active layer deposition processing is performed on the coated one or more first product sized substrates to deposit organic layers on the coated first product sized substrates. In an embodiment of the present invention, organic layer includes a conducting layer and emissive layer. In an embodiment of the present invention, the organic layers on the coated first product sized substrates are deposited employing vacuum thermal evaporation. In another embodiment of the present invention, the organic layers on the coated first product sized substrates are deposited employing organic vapor phase deposition.
FIG. 3 is a flowchart depicting one or more second small form factor manufacturing processes for manufacturing the organic lighting device, in accordance with an embodiment of the present invention.
At step 302, the second product sized substrates are cleaned to remove unwanted substances from the surface of the second product sized substrates. In an embodiment of the present invention, the second product sized substrates are composed of a transparent material. Examples of transparent material include, but are not limited to, glass, transparent plastic, fiberglass, and foil. In an embodiment of the present invention, the cleaning of the one or more second product sized substrates is performed through various methods. Examples of various methods include, but are not limited to, water rinsing, air cleaning, ultrasonication, megasonication, detergents, organic solvents and inorganic solvents. The cleaned second product sized substrates may be dried using various means such as air drying, hot air drying, and IR heater.
At step 304, contamination and/or impurities are removed from the second product sized substrates. In an embodiment of the present invention, the contamination and/or impurities are removed by subjecting the second product sized substrates to an ozone treatment generated by UV light. The ozone treatment removes the contamination and/or impurities such as oil, grease and dirt.
At step 306, desiccant mounting is performed on the second product sized substrates. Desiccant mounting is a degassing mechanism which includes attaching a gas absorbing chemical substance on the surface of the second product sized substrates. In an embodiment of the present invention, the gas absorbing chemical substance is attached using various methods such as direct mounting, dip coating, spin coating, doctored blade, spray coating, screen printing, sputtering, inkjet printing and evaporation.
Step 302, 304 and 306 lead to formation of a cleaned one or more second product sized substrates at step 308. The cleaned one or more second product sized substrates are free of impurity or contamination.
FIG. 4 is a flowchart depicting an encapsulating process for manufacturing an organic lighting device, in accordance with an embodiment of the present invention.
At step 402, resin is dispensed on the cleaned one or more second product sized substrates received at step 308. Dispensing is done by various methods including, but are not limited to, spin coating, screen printing, and XY movement coating. In an embodiment of the present invention, resin is an epoxy resin.
At step 404, the coated one or more first product sized substrates having organic layers and the second product sized substrates, from step 402, are pressed together to form a semi processed organic lighting device. In an embodiment of the present invention, pressing is done by mechanical means such as vacuum pressing.
At step 406, curing of the semi processed organic lighting device is performed by exposing to UV radiation. The UV radiation polymerizes the resin and encapsulates the first product sized substrates with the second product sized substrates to form the organic lighting device.
FIG. 5 is a flowchart depicting a method of manufacturing the organic lighting device, in accordance with another embodiment of the present invention.
At step 502, high throughput first processes are performed on one or more first product sized substrates.
At step 504, active layer deposition processing is performed on a plurality of the one or more first product sized substrates. In an embodiment of the present invention, the active layer deposition processing includes depositing an active layer on the plurality of the one or more first product sized substrates. In an embodiment of the present invention, active layer is an organic layer.
At step 506, high throughput second processing is performed on one or more second product sized substrates. The first small form factor manufacturing processes and the first small form factor manufacturing processes are conventionally optimized to manufacture sizes of less than or equal to 30 cm x 30 cm.
At step 508, at least one of the first product sized substrates are encapsulated with the second product sized substrates to form one or more organic lighting device. In an embodiment of the present invention, encapsulation is done using an epoxy resin. In various embodiments of the present invention, the form factor of the organic lighting device is equal to the first pre-defined form factor or the second predefined form factor.
At step 510, a plurality of the one or more organic lighting device are connected in a predefined manner to form a large organic lighting device with a large form factor. In various embodiments of the present invention, the large form factor is a multiple of the first pre-defined form factor or the second predefined form factor. The large form factor is customizable based on the requirement. For example, large organic lighting device having large form factor of 180cm x 180cm is formed by connecting 36 organic lighting devices of 30cm x 30 cm. In an embodiment of the present invention, the predefined manner is a series and/or parallel connection to optimize the optical output of the large organic lighting device. In various embodiments of the present invention, shape of the large organic lighting device is customizable. Examples of shape include a plane panel of required shape and size such as a rectangle, a hexagon, a square, a circle, a cube, a cuboid, a circular cylinder, a triangular cylinder, a pentagonal cylinder, a prism, a cone, a sphere and the like. The large organic lighting device acts as a surface light source. The light emitted from the surface light source appears to be emitted from a surface rather than a pointed light source.
FIG.6 is a system depicting one or more first small form factor manufacturing processes for manufacturing an organic lighting device, in accordance with an embodiment of the present invention. System 600 includes a cleaning module 602, a light extraction layer depositing module 604, a coating module 606, a patterning module 608, an edge covering module 610 and a contamination removal module 612.
Cleaning module 602 cleans the first product sized substrates to remove unwanted substances from the surface of the first product sized substrates. In an embodiment of the present invention, the cleaning of the first product sized substrates is performed through various methods. Examples of the methods include, but are not limited to, water rinsing, air cleaning, ultrasonication, megasonication, detergents, organic solvents and inorganic solvents
Light extraction layer depositing module 604 deposits a light extraction layer on the first product sized substrates. The light extraction layer scatters the light efficiently and enhances the performance of the organic lighting devices.
Coating module 606 coats a layer of a conducting oxide on the first product sized substrate cells. Examples of the conducting oxide, include, but are not limited to Indium Tin Oxide, and Zinc Oxide.
Patterning module 608 performs patterning on the first product sized substrates. In an embodiment of the present invention, various techniques such as lasers, mechanical devices, and chemical etching are used to pattern the first product sized substrates.
Edge covering module 610 coats an edge covering layer on the first product sized substrates to cover the edges of conducting oxide layer.
Contamination removal module 612 removes the contamination or impurities from the first product sized substrates to form coated one or more first product sized substrates.
In various embodiments of the present invention, cleaning module 602, light extraction layer depositing module 604, coating module 606, patterning module 608, edge covering module 610 and contamination removal module 612 are conventionally optimized to meet the required production rate with minimum idle time.
FIG. 7 is a system depicting one or more second small form factor manufacturing processes for manufacturing an organic lighting device, in accordance with an embodiment of the present invention. System 700 includes a cleaning module 702, a desiccant mounting module 704 and a contamination removal module 706.
Cleaning module 702 cleans the second product sized substrates to remove unwanted substances from the surface of second product sized substrates. In an embodiment of the present invention, the second product sized substrates are composed of a transparent material. Examples of transparent material include, but are not limited to, glass, transparent plastic, fiberglass, and foil.
At step 704, Desiccant Mounting Module performs the desiccant mounting on the second product sized substrates by attaching a gas absorbing chemical substance on the surface of second sized substrates.
At step 706, Contamination Removal Module cleans the one or more second product sized substrates to remove impurity or contamination.
In various embodiments of the present invention, cleaning module 702, desiccant mounting module 704 and contamination removal module 706 are conventionally optimized to meet the required production rate with minimum idle time.
FIG. 8 is a system depicting an encapsulating process for manufacturing an organic lighting device, in accordance with an embodiment of the present invention. System 800 includes a dispensing module 802, an encapsulation module 804 and curing module 806.
Dispensing module 802 dispenses a resin on the cleaned one or more second product sized substrates. Dispensing is done by various methods including, but are not limited to, spin coating, screen printing, and XY movement coating. In an embodiment of the present invention, resin is an epoxy resin.
Encapsulation module 804 presses the coated one or more first product sized substrates having organic layers on the second product sized substrates to form a semi processed organic lighting device, In an embodiment of the present invention, encapsulation module 804 presses the second product sized substrate over the first product sized substrate.
Curing module 806 exposes the semi processed lighting device to Ultra Violet (UV) radiation. The UV radiation polymerizes the resin and encapsulates the first product sized substrates with the second product sized substrates to form the organic lighting device.
The form factor of the organic lighting device is equal to the form factor of the first product sized substrates and the second product sized substrates. The form factor of the organic lighting device is customizable based on the requirement of a user. Multiple organic lighting devices can be combined to form a large organic lighting device of a large form factor. The large organic lighting device is formed without cutting or slicing.
Embodiments of the present invention provide a method of manufacturing an organic lighting device of form factor less than or equal to 30 cm X 30 cm. The method includes performing high throughput one or more first small form factor manufacturing processing of one or more first product sized substrates, active layer deposition processing of a plurality of the one or more first product sized substrates, high throughput one or more second small form factor manufacturing processing of one or more second product sized substrates and encapsulating the first product sized substrates with the second product sized substrates. The one or more first product sized substrates and one or more first second film cells have a pre-defined form factor of less than or equal to 30cm X 30cm, hence reducing the defects in the organic lighting device.
In addition, pre-defined form factor of less than or equal to 30cm X 30cm achieves a uniformity of less than ±5% for different layers and reduces any homogeneities.
In the description herein for the embodiments of the present invention, numerous specific details are provided, such as examples of components and/or methods, to provide a thorough understanding of the embodiments of the present invention. One skilled in the relevant art will recognize, however, that an embodiment of the present invention can be practiced without one or more of the specific details, or with other apparatus, systems, assemblies, methods, components, materials, parts, and/or the like. In other instances, well-known structures, materials, or operations are not specifically shown or described in detail to avoid obscuring aspects of the embodiments of the present invention.
Reference throughout this specification to "one embodiment", "an embodiment", or "a specific embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of an embodiment of the present invention and not necessarily in all embodiments. Thus, respective appearances of the phrases "in one embodiment", "in an embodiment", or "in a specific embodiment" in various places throughout this specification are not necessarily referring to the same embodiment. Furthermore, the particular features, structures, or characteristics of any specific embodiment of the present invention may be combined in any suitable manner with one or more other embodiments. It is to be understood that other variations and modifications of the embodiments of the present invention described and illustrated herein are possible in
light of the teachings herein and are to be considered as part of the spirit and scope of the present invention.
It will also be appreciated that one or more of the elements depicted in the drawings/figures can also be implemented in a more separated or integrated manner, or even removed or rendered as inoperable in certain cases, as is useful in accordance with a particular application.
As used in the description herein and throughout the claims that follow, "a", "an", and "the" includes plural references unless the context clearly dictates otherwise. Also, as used in the description herein and throughout the claims that follow, the meaning of "in" includes "in" and "on" unless the context clearly dictates otherwise.
The foregoing description of illustrated embodiments of the present invention, including what is described in the Abstract, is not intended to be exhaustive or to limit the present invention to the precise forms disclosed herein. While specific embodiments of, and examples for, the present invention are described herein for illustrative purposes only, various equivalent modifications are possible within the spirit and scope of the present invention, as those skilled in the relevant art will recognize and appreciate. As indicated, these modifications may be made to the present invention in light of the foregoing description of illustrated embodiments of the present invention and are to be included within the spirit and scope of the present invention.
Thus, while the present invention has been described herein with reference to particular embodiments thereof, a latitude of modification, various changes and substitutions are intended in the foregoing disclosures, and it will be appreciated that in some instances some features of the embodiments of the present invention will be employed without a corresponding use of other features without departing from the scope and spirit of the present invention as set forth. Therefore, many modifications may be made to adapt a particular situation or material to the essential scope and spirit of the present invention. It is intended that the present invention not be limited to the particular terms used in following claims and/or to the particular embodiment disclosed as the best mode contemplated for carrying out this present invention, but that the present invention will include any and all embodiments and equivalents falling within the scope of the appended claims.

WHAT IS CLAIMED IS:
1) A method of manufacturing an organic lighting device of form factor less than or equal to 30 cm X
30 cm, the method comprising
high throughput first processing of one or more first product sized substrates employing one or more first small form factor manufacturing processes;
active layer deposition processing of a plurality of the one or more first product sized substrates, wherein the active layer deposition processing is a batch process;
high throughput second processing of one or more second product sized substrates employing one or more second small form factor manufacturing processes; and
encapsulating at least one of the one or more first product sized substrates with at least one of the one or more second product sized substrates to form the organic lighting device, wherein the method of manufacturing the organic lighting device does not involve a cutting process.
2) The method according to claim 1 is conventionally optimized to meet the required production rate with a minimum of idle time.
3) The method according to claim 1 further comprising the step of connecting one or more organic lighting device to form a large organic lighting device of a large form factor, such that optical output of the large organic lighting device is optimized.
4) The method according to claim 1, wherein the form factor of the organic lighting device is customizable based on the requirement of a user, the form factor of the organic lighting device is a multiple of at least one of the first pre-defined form factor and the second pre-defined form factor.
5) The method according to claim 1, wherein the one or more first small form factor manufacturing processes is selected from the group comprising dip coating, spin coating, doctored blade, spray coating, screen printing, sputtering, glass mastering, photoresist mastering, electroforming, and evaporation.
6) The method according to claim 1, wherein the one or more second small form factor manufacturing processes is selected from the group comprising dip coating, spin coating, doctored blade, spray coating, screen printing, sputtering, glass mastering, photoresist mastering, electroforming, and evaporation.
7) The method according to claim 1, wherein the organic lighting device is selected from a group consisting of Organic Light Emitting Diode (OLED), White Organic Light Emitting Diode (W-OLED), Active-matrix Organic Light Emitting Diodes (AMOLED), Passive-matrix Organic Light Emitting Diodes (PMOLED), Flexible Organic Light Emitting Diodes (FOLED), Stacked Organic Light Emitting Diodes (SOLED), Tandem Organic Light Emitting Diode , Transparent Organic Light Emitting Diodes (TOLED), Top Emitting Organic Light Emitting Diode, Bottom Emitting Organic Light Emitting Diode, Fluorescence doped Organic Light Emitting Diode (F-OLED), Phosphorescent Organic Light Emitting Diode (PHOLED) .
8) The method according to claim 1, wherein the one or more first small form factor manufacturing processes are a batch process.
9) The method according to claim 1, wherein the one or more second small form factor manufacturing processes are a batch process.
10) The organic lighting device substantially as herein above described in the specification with reference to the accompanying drawings.