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Microelectronic Package And Method Of Manufacturing Same
Abstract: A microelectronic package includes a substrate (110) a die (120) embedded within the substrate the die having a front side (121) and a back side (122) and a through-silicon-via (123) therein build-up layers (130) built up over the front side of the die and a power plane (140) in physical contact with the back side of the die. In another embodiment the microelectronic package comprises a substrate (210) a fIrst die (220) and a second die (260) embedded in the substrate and having a front side (221 261) and a back side (222 262) and a through-silicon-via (223 263) therein build-up layers (230) over the front sides of the fIrst and second dies and an electrically conductive structure (240) in physical contact with the back sides of the fIrst and second dies.
Notices, Deadlines & Correspondence
Patent Information
Applicants
INTEL CORPORATION
Inventors
1. NALLA Ravi K.
2. MANUSHAROW Mathew J.
3. DELANEY Drew
Specification
A microelectronic package includes a substrate (110) a die (120) embedded within the substrate the die having a front side (121) and a back side (122) and a through-silicon-via (123) therein build-up layers (130) built up over the front side of the die and a power plane (140) in
physical contact with the back side of the die. In another embodiment the microelectronic package comprises a substrate (210) a fIrst die (220) and a second die (260) embedded in the substrate and having a front side (221 261) and a back side (222 262) and a through-silicon-via (223 263) therein build-up layers (230) over the front sides of the fIrst and second dies and an electrically conductive structure (240) in physical contact with the back sides of the fIrst and second dies.
Documents
Application Documents
| # | Name | Date |
|---|---|---|
| 1 | Form-1.pdf | 2012-11-06 |
| 2 | Drawings.pdf | 2012-11-06 |
| 3 | 9369-CHENP-2012 FORM-18 22-11-2012.pdf | 2012-11-22 |
| 4 | 9369-CHENP-2012 CORRESPONDENCE OTHERS 22-11-2012.pdf | 2012-11-22 |
| 5 | 9369-CHENP-2012 ASSIGNMENT 26-11-2012.pdf | 2012-11-26 |
| 6 | 9369-CHENP-2012 CORRESPONDENCE OTHERS 26-11-2012.pdf | 2012-11-26 |
| 7 | 9369-CHENP-2012 POWER OF ATTORNEY 12-12-2012.pdf | 2012-12-12 |
| 8 | 9369-CHENP-2012 CORRESPONDENCE OTHERS 12-12-2012.pdf | 2012-12-12 |
| 9 | 9369-CHENP-2012 FORM-3 04-02-2013.pdf | 2013-02-04 |
| 10 | 9369-CHENP-2012 CORRESPONDENCE OTHERS 04-02-2013.pdf | 2013-02-04 |
| 11 | FORM-2.pdf | 2014-11-22 |
| 12 | ABSTRACT.pdf | 2014-11-22 |
| 13 | abstract 9369-CHENP-2012.jpg | 2014-11-22 |
| 14 | 9369-CHENP-2012-FER.pdf | 2018-01-16 |
| 15 | 9369-CHENP-2012-Information under section 8(2) (MANDATORY) [18-04-2018(online)].pdf | 2018-04-18 |
| 16 | 9369-CHENP-2012-FORM 3 [18-04-2018(online)].pdf | 2018-04-18 |
| 17 | 9369-CHENP-2012-OTHERS [31-05-2018(online)].pdf | 2018-05-31 |
| 18 | 9369-CHENP-2012-FER_SER_REPLY [31-05-2018(online)].pdf | 2018-05-31 |
| 19 | 9369-CHENP-2012-DRAWING [31-05-2018(online)].pdf | 2018-05-31 |
| 20 | 9369-CHENP-2012-COMPLETE SPECIFICATION [31-05-2018(online)].pdf | 2018-05-31 |
| 21 | 9369-CHENP-2012-Proof of Right (MANDATORY) [06-06-2018(online)].pdf | 2018-06-06 |
| 22 | 9369-CHENP-2012-PETITION UNDER RULE 137 [14-06-2018(online)].pdf | 2018-06-14 |
| 23 | 9369-CHENP-2012-PatentCertificate13-07-2020.pdf | 2020-07-13 |
| 24 | 9369-CHENP-2012-Marked up Claims_Granted 341314_13-07-2020.pdf | 2020-07-13 |
| 25 | 9369-CHENP-2012-IntimationOfGrant13-07-2020.pdf | 2020-07-13 |
| 26 | 9369-CHENP-2012-Drawings_Granted 341314_13-07-2020.pdf | 2020-07-13 |
| 27 | 9369-CHENP-2012-Description_Granted 341314_13-07-2020.pdf | 2020-07-13 |
| 28 | 9369-CHENP-2012-Claims_Granted 341314_13-07-2020.pdf | 2020-07-13 |
| 29 | 9369-CHENP-2012-Abstract_Granted 341314_13-07-2020.pdf | 2020-07-13 |
| 30 | 9369-CHENP-2012-RELEVANT DOCUMENTS [28-09-2022(online)].pdf | 2022-09-28 |
Search Strategy
| 1 | search(7)_12-12-2017.pdf |