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A microelectronic package, comprising:a die;a substrate; anda heat spreader coupled to the back side of the die, the heat spreader including a plurality of pillars coupled to the substrate, to shift thermally induced stress away from the corners and edges of the die and wherein a through-hole extends from a first exterior surface to a second exterior surface of the substrate, the through-hole configured to allow the flow of an underfill encapsulation material into a gap between the die, the substrate and the heat spreader.
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Notices, Deadlines & Correspondence
Notices, Deadlines & Correspondence
Patent Information
Application #
Filing Date
04 April 2003
Publication Number
Publication Type
Invention Field
Status
Email
Parent Application
Patent Number
Legal Status
Grant Date
2006-08-17
Renewal Date
Applicants
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD,
SANTA CLARA,
CALIFORNIA 95052,
Inventors
1. QING MA
919 BRENTWOOD DRIVE,
SAN JOSE,
CALIFORNIA 95129,
2. JAMES MAVEETY
1294 WEIBEL WAY,
SAN JOSE,
CALIFORNIA 95125,
3. QUAN TRAN
2048 FLINTBURY COURT,
SAN JOSE,
CALIFORNIA 95148,
Specification
Documents
Application Documents
| # | Name | Date |
|---|---|---|
| 1 | 370-mumnp-2003-claim(granted)-(4-4-2003).doc | 2018-08-08 |
| 1 | 370-MUMNP-2003-CORRESPONDENCE(RENEWAL PAYMENT LETTER)-(21-09-2006).pdf | 2006-09-21 |
| 2 | abstract1.jpg | 2018-08-08 |
| 3 | 370-mumnp-2003-power of authoritiy(3-8-2001).pdf | 2018-08-08 |
| 4 | 370-mumnp-2003-power of authoritiy(2-8-2005).pdf | 2018-08-08 |
| 5 | 370-mumnp-2003-petition under rule 137(2-8-2005).pdf | 2018-08-08 |
| 6 | 370-mumnp-2003-form-pct-ipea-409(4-4-2003).pdf | 2018-08-08 |
| 7 | 370-mumnp-2003-form 5(3-4-2003).pdf | 2018-08-08 |
| 8 | 370-mumnp-2003-form 3(3-4-2003).pdf | 2018-08-08 |
| 9 | 370-mumnp-2003-form 3(2-8-2005).pdf | 2018-08-08 |
| 10 | 370-MUMNP-2003-FORM 26(15-9-2009).pdf | 2018-08-08 |
| 12 | 370-mumnp-2003-form 2(granted)-(2-8-2005).pdf | 2018-08-08 |
| 13 | 370-mumnp-2003-form 1a(4-4-2003).pdf | 2018-08-08 |
| 14 | 370-mumnp-2003-form 19(21-7-2004).pdf | 2018-08-08 |
| 15 | 370-mumnp-2003-form 13(15-9-2009).pdf | 2018-08-08 |
| 16 | 370-mumnp-2003-drawing(2-8-2005).pdf | 2018-08-08 |
| 17 | 370-mumnp-2003-correspondnce(ipo)-(17-8-2006).pdf | 2018-08-08 |
| 18 | 370-mumnp-2003-correspondnce(22-3-2006).pdf | 2018-08-08 |
| 19 | 370-MUMNP-2003-CORRESPONDENCE(RENEWAL PAYMENT LETTER)-(7-9-2009).pdf | 2018-08-08 |
| 20 | 370-MUMNP-2003-CORRESPONDENCE(15-9-2009).pdf | 2018-08-08 |
| 21 | 370-mumnp-2003-claims(granted)-(2-8-2005).pdf | 2018-08-08 |