DESC:TECHNICAL FIELD OF THE INVENTION

[0001] The present invention relates in general to computing platforms and more particularly to a high-end modular computing server.
BACKGROUND OF THE INVENTION

[0002] Due to rapid advancements in technology and dynamic fluctuations in component availability, it becomes necessary to redesign the entire system due to changes in the component used.
[0003] One of the prior art discloses a distributed computing system. In this prior art, both a first computing node and a second computing node in the distributed computing system store information about a name, a size, and a communication peer side identifier of a first data flow graph parameter in a data flow graph. The first computing node stores the first data flow graph parameter, where the first computing node and the second computing node generate respective triplets based on same interface parameter generation algorithms and information about the first data flow graph parameter that are stored in the respective nodes. The triplet is used as an interface parameter of a message passing interface (MPI) primitive that is used to transmit the first data flow graph parameter between the first computing node and the second computing node. Data can be processed, in a more timely manner, by using a receiving primitive, and another to be executed sending primitive of the first computing node can be executed more quickly. Therefore, data transmission efficiency is improved. In addition, a dedicated data cache and a dedicated polling thread are set, so that in a message passing communication buffer, when a message receiving primitive is not invoked and a final destination address of a message is unknown, a message sending primitive can be used to send data, and a data sending result is immediately returned after sending of the data is completed.
[0004] Another prior art discloses a high-density server which includes a plurality of server enclosures, each of which includes an enclosure housing with a pair of module insertion /extraction parts, a pair of power source units, a plurality of cooling fans, and two pairs of server modules. Cooling fans are linearly aligned in a crosswise direction and positioned in proximity to the rear opening of the enclosure housing with upper rear openings and lower rear openings, while server modules are installed in module insertion /extraction parts inside the enclosure housing in an insertable/removable manner. Server modules have module trays for mounting electronic components and interface units. Interface units are retractably inserted into upper rear openings or lower rear openings in connection with power source units when server modules are moved in a lengthwise direction along module insertion /extraction parts inside the enclosure housing. The server enclosure is equipped with a redundant power transmitter establishing redundant multipoint-to -multipoint connections between power source units and server modules. This prior art provides a high - density server including a plurality of server modules with a redundant power source. In particular, this prior art aims to provide users with easy and free access to any devices and consoles installed in a high-density server while providing a redundant power source shared by plurality of nodes installed in a plurality of server modules.
[0005] Another prior art discloses a modular server system which includes a plurality of server groups, wherein each server group is adapted to receive a plurality of server modules, and a plurality of I/O groups, wherein each I/O group is adapted to receive a plurality of I/O components and includes a Switching arrangement with at least one switch element, wherein each of the plurality of I/O groups is allocated to exactly one of the plurality of server groups, the switch arrangement of each I/O group is directly coupled by a data link to each of the plurality of I/O components of the I/O group, the switch arrangement of each I/O group is directly coupled by a data link to each of the plurality of server modules of the server group allocated to the I/O group, and the Switch arrangement of each I/O group is coupled by a data link to at least one other switch arrangement of another I/O group.
[0006] The architecture described in this prior art allows modular server systems to be set up in which a multiplicity of different connection topologies between individual server modules and I/O components can be achieved. In this case, by suitable choice of the bus widths of connections and components used of the connection fabric, different data transmission speeds and modes between individual server modules and I/O components coupled therewith can be achieved.
[0007] Further prior art discloses a modular server system which includes a midplane having a system management bus and a plurality of blade interfaces on the midplane. The blade interfaces are in electrical communication with each other. A server blade is removed ably connectable to one of the plurality of blade interfaces on the midplane. The server blade has a server blade system management bus in electrical communication with the System management bus of the midplane, and a network interface to connect to a network. A media blade is removed ably connectable to one of the plurality of blade interfaces on the midplane, and the media blade has at least one Storage medium device.
[0008] Furthermore prior art discloses a server architecture, which comprises a plurality of first middle planes disposed horizon tally in the server chassis, and each of the first middle plane electrically coupled to a server board such that the server board is also horizontally disposed in the server chassis. By means of the server architecture in the prior art, in addition to providing a hot-swappable function to the server board, for the whole server system, horizontally arranged first middle plane and server board will not block the route for heat dissipating flow so that the heat dissipating efficiency with respect to the server will not be reduced.
[0009] The above-mentioned prior arts do not address obsolescence management and technology upgrades without the need to redesign the entire system. Therefore, there is a need in the art with a modular computing server platform to solve the above-mentioned limitations.
SUMMARY OF THE INVENTION

[0010] An aspect of the present invention is to address at least the above-mentioned problems and/or disadvantages and to provide at least the advantages described below.
[0011] Accordingly, in one aspect of the present invention relates to a modular computing server platform system. The server platform system comprising: a chassis with plurality of side walls, a power source unit, a plurality of cooling fans, a plurality of server modules. The plurality of server modules comprising at least one computing hardware module (100) positioned on the chassis comprising carrier cards (104) in industry standard form factor which incorporates add-on industry standard System-on-Module (SOM) (102), at least one storage module (200) positioned on the chassis comprises at least two standard Solid-state drives (SSDs) (201 & 202) packed in customized mechanical enclosure for storage of data and retrieval of information, at least one communication hardware module (400) positioned on the chassis comprises of connectors (402) mounted on a base carrier board (401) for accurate and reliable transfer of data, at least one graphics processing hardware module (500) positioned on the chassis having a graphic card (504) with a pluggable high performance graphics processing unit, where the graphics card (504) is mounted on a base carrier card (501) through standard interface which enables upgradability and at least one media for communication (Motherboard) (600) positioned on the chassis, where the motherboard module with connectors and interfaces for interconnect architecture, wherein the motherboard module comprises slots (601,603,604,605), one power supply slot (607) and a SATA cassette slot (602) having two SSD hard disk for storage, the motherboard module is configured to receive the plurality of modules (100, 200, 400 and 500) via slots (601,602,604,605), the slot (603) is to receive the computing hardware module (300).
[0012] Other aspects, advantages, and salient features of the invention will become apparent to those skilled in the art from the following detailed description, which, taken in conjunction with the annexed drawings, discloses exemplary embodiments of the invention.
BRIEF DESCRIPTION OF ACCOMPANYING DRAWINGS
[0013] The detailed description is described with reference to the accompanying figures. In the figures, the left-most digit(s) of a reference number identifies the figure in which the reference number first appears. The same numbers are used throughout the drawings to reference like features and modules.
[0014] Figure 1 shows a construction diagram of a modular computing server platform system according to an exemplary implementation of the present disclosure/ invention.
[0015] Figure 2 shows a storage module of the modular computing server platform system according to an exemplary implementation of the present disclosure/ invention.
[0016] Figure 3 shows computing hardware of the modular computing server platform system according to an exemplary implementation of the present disclosure/ invention.
[0017] Figure 4 shows communication hardware of the modular computing server platform system according to an exemplary implementation of the present disclosure/ invention.
[0018] Figure 5 shows a graphics processing hardware of the modular computing server platform system according to an exemplary implementation of the present disclosure/ invention.
[0019] Figure 6 shows a media for communication (Motherboard) of the modular computing server platform system according to an exemplary implementation of the present disclosure/ invention.
[0020] Figure 7 shows an MPU (Main Processing unit) Product image according to an exemplary implementation of the present disclosure/ invention.
[0021] Figure 8 shows a thermal simulation image 1 of the system according to an exemplary implementation of the present disclosure/ invention.
[0022] Figure 9 shows a thermal simulation image 2 of the system according to an exemplary implementation of the present disclosure/ invention.
[0023] Figure 10 shows an airflow diagram of the system according to an exemplary implementation of the present disclosure/ invention.
[0024] It should be appreciated by those skilled in the art that any block diagrams herein represent conceptual views of illustrative methods embodying the principles of the present disclosure. Similarly, it will be appreciated that any flow charts, flow diagrams, and the like represent various processes which may be substantially represented in computer readable medium and so executed by a computer or processor, whether or not such computer or processor is explicitly shown.
DETAILED DESCRIPTION OF THE INVENTION

[0025] The following description with reference to the accompanying drawings is provided to assist in a comprehensive understanding of exemplary embodiments of the invention as defined by the claims and their equivalents. It includes various specific details to assist in that understanding but these are to be regarded as merely exemplary. Accordingly, those of ordinary skill in the art will recognize that various changes and modifications of the embodiments described herein can be made without departing from the scope and spirit of the invention. In addition, descriptions of well-known functions and constructions are omitted for clarity and conciseness.
[0026] The terms and words used in the following description and claims are not limited to the bibliographical meanings, but, are merely used by the inventor to enable a clear and consistent understanding of the invention. Accordingly, it should be apparent to those skilled in the art that the following description of exemplary embodiments of the present invention are provided for illustration purpose only and not for the purpose of limiting the invention as defined by the appended claims and their equivalents.
[0027] It is to be understood that the singular forms “a,” “an,” and “the” include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to “a component surface” includes reference to one or more of such surfaces.
[0028] By the term “substantially” it is meant that the recited characteristic, parameter, or value need not be achieved exactly, but that deviations or variations, including for example, tolerances, measurement error, measurement accuracy limitations and other factors known to those of skill in the art, may occur in amounts that do not preclude the effect the characteristic was intended to provide.
[0029] Figures discussed below, and the various embodiments used to describe the principles of the present disclosure in this patent document are by way of illustration only and should not be construed in any way that would limit the scope of the disclosure. Those skilled in the art will understand that the principles of the present disclosure may be implemented in any suitably arranged communications system. The terms used to describe various embodiments are exemplary. It should be understood that these are provided to merely aid the understanding of the description, and that their use and definitions in no way limit the scope of the invention. Terms first, second, and the like are used to differentiate between objects having the same terminology and are in no way intended to represent a chronological order, unless where explicitly stated otherwise. A set is defined as a non-empty set including at least one element.
[0030] In the following description, for purpose of explanation, specific details are set forth in order to provide an understanding of the present disclosure. It will be apparent, however, to one skilled in the art that the present disclosure may be practiced without these details. One skilled in the art will recognize that embodiments of the present disclosure, some of which are described below, may be incorporated into a number of systems.
[0031] However, the systems and methods are not limited to the specific embodiments described herein. Further, structures and devices shown in the figures are illustrative of exemplary embodiments of the presently disclosure and are meant to avoid obscuring of the presently disclosure.
[0032] It should be noted that the description merely illustrates the principles of the present invention. It will thus be appreciated that those skilled in the art will be able to devise various arrangements that, although not explicitly described herein, embody the principles of the present invention. Furthermore, all examples recited herein are principally intended expressly to be only for explanatory purposes to help the reader in understanding the principles of the invention and the concepts contributed by the inventor to furthering the art and are to be construed as being without limitation to such specifically recited examples and conditions. Moreover, all statements herein reciting principles, aspects, and embodiments of the invention, as well as specific examples thereof, are intended to encompass equivalents thereof.
[0033] The various embodiments of the present disclosure/invention describe a modular computing platform system for a computing server.
[0034] The present invention design proposes to address the limitations in an effective manner. The high-speed signals provide an integrated system with all the modules logically connected to form a single coherent system.
[0035] The present invention relates to high-end computing server platform in industry standard small form factor. This is a 6-slot, 3/4-ATR (Air Transport Rack) system consisting of computing hardware based on Intel server processor system on module (SOM) and a graphics processing hardware based on Nvidia graphics processing unit (GPU). It also includes 300W Power supply module provides the required DC voltages. There is plurality of modules with each module designed to 3U form factor. The modular nature of the construction/design allows for easy maintenance and technology upgrade of the system. Each sub-module further designed in a way that it conform to the industry standard small form factor and hence can be upgraded without any changes in the system design.
[0036] In one embodiment of the present invention, industry standard computing SoM interposed on 3U form factor carrier card with requisite additional features, orthogonally mounted onto a motherboard slot with a customized thermal solution for conduction cooled system. This allows for upgradation of the computing hardware without any other changes in the system. Only the SoM module needs to be replaced.
[0037] In one embodiment of the present invention, industry standard graphic computing add-on card interposed on 3U form factor GPU carrier card with requisite additional features, orthogonally mounted onto a motherboard slot with a customized thermal solution for conduction cooled system. This allows for upgradation of the graphics processing hardware without any other changes in the system. Only the add-on card needs to be replaced.
[0038] In one embodiment of the present invention, industry standard add-on cards for MIL1553 and ARINC-429 interposed on a 3U carrier card. This allows for easy replacement based on the interface requirements.
[0039] In one embodiment of the present invention, storage module constituting of a storage device packed in customized mechanical enclosure conforming to 3U form factor conduction cooled slot for easy maintenance and upgradation.
[0040] In one embodiment of the present invention, a customized motherboard that has at least one industry standard based Power supply module slot, at least four numbers of 3U slots, at least one industry standard based Storage module slot, at least one industry standard based display module slot and at least one mSATA slot.
[0041] The above modules are uniquely arranged on the motherboard for optimized system performance vis-à-vis performance and thermal management.
[0042] The present invention system is with respect to small form factor high-end computing platform providing data server capabilities along with very high general purpose graphics processing (GPGPU) capabilities. There are a host of other functionalities providing standard industry communication interfaces. The present invention system provides for upgradability of any module in the system, meeting industry standards and not changing the system design, allowing for replacing the required module only. The modules are orthogonally mounted onto a customized backplane for logical connectivity between the modules. The architecture of the system provides for distributed computing between the computing hardware-1, computing hardare-2 and graphics processing module.
[0043] Figure 1 shows a construction diagram of a modular computing server platform system according to an exemplary implementation of the present disclosure/ invention.
[0044] The figure shows the construction diagram of a modular computing server platform system. The present invention system capable of data link processing responsible for all core functions including data acquisition, transformation, correlation and storage. The present invention fully modular system consists of at least one configurable compact computing hardware-1 (100), at least one configurable data storage hardware (200), at least one configurable compact computing hardware-2 (300), at least one configurable communication hardware (400), at least one configurable graphics processing hardware (500), at least one configurable power supply (700) and at least one customized motherboard (600).
[0045] These modules are designed to meet industry-approved standards and are arranged based on thermal and structural analysis of the system for improved thermal performance. These modules are logically connected with each other through high-speed link existing on the motherboard. Standard provision for data storage and retrieval of information. Industry standard connectors are used to bring out all the important interfaces onto the front panel.
[0046] In one embodiment of the present invention relates to a modular computing server platform system. The server platform system comprising: a chassis with plurality of side walls, a power source unit, a plurality of cooling fans, a plurality of server modules, the plurality of server modules comprising: at least one computing hardware module (100) positioned on the chassis comprising carrier cards (104) in 3U form factor which incorporates add-on industry standard System-on-Module (SOM) (102), at least one storage module (200) positioned on the chassis comprises at least two standard Solid-state drives (SSDs) (201 & 202) packed in customized mechanical enclosure for storage of data and retrieval of information, at least one communication hardware module (400) positioned on the chassis comprises of connectors (402) mounted on a base carrier board (401) for accurate and reliable transfer of data, at least one graphics processing hardware module (500) positioned on the chassis having a graphic card (504) with a pluggable high performance graphics processing unit, where the graphics card (504) is mounted on a base carrier card (501) through standard interface which enables upgradability and at least one media for communication (Motherboard) (600) positioned on the chassis, where the motherboard module with connectors and interfaces for interconnect architecture, wherein the motherboard module comprises slots (601,603,604,605), one power supply slot (607) and a SATA cassette slot (602) having two SSD hard disk for storage, the motherboard module is configured to receive the plurality of modules (100, 200, 400 and 500) via slots (601,602,604,605), the slot (603) is to receive the computing hardware module (300).
[0047] In one embodiment, each module of the plurality of modules is designed to 3U form factor.
[0048] The System-on-Module (SOM) (102) modules are mounted on the carrier cards through industry standard connectors for upgradation, where the modules have Intel (103) server grade processors with dual channel DDR4 memory.
[0049] In one embodiment, the modular computing server platform system further comprises at least one computing hardware module (300) positioned on the chassis.
[0050] The communication hardware module (400) comprises provision for add-on cards on Mini-PCIe connector and further supports MIL-STD-1553 (403) and ARINC 429 (404), cards to meet data conversion and data interfaces.
[0051] In one embodiment of the present invention, each module of the plurality modules is upgraded independently without affecting the other modules in the system.
[0052] In one embodiment, the modular computing server platform system holds plurality of modules mounted orthogonally to motherboard inside chassis placed at an optimum location for effective thermal management.
[0053] In one embodiment of the present invention, each module of the plurality modules comprises customized conduction cooled heat sink for thermal dissipation.
[0054] In one embodiment of the present invention, each module is logically connected with each other through high-speed link on the motherboard.
[0055] The Modular computing platform system is an embedded server based on VITA (VMEbus International Trade Association) standards. It is a 3/4-ATR system with 6-slots based on VITA standards in 3U form factor. It has two independent computing hardwares based on Intel processor, a graphics processing hardware based on Nvidia GPU and an IO card for MIL-1553 and ARINC applications. The system has ATR Chassis for conduction-cooled boards consisting of 3U based customized motherboard and a 300W DC-DC power supply module. A SATA cassette, which can hold at least two industrial SSD modules for both the computing hardware modules present on the customized motherboard. These modules are arranged based on thermal and structural analysis for better thermal performance. The Chassis is cooled by fans provided for forced air cooling.
[0056] In one embodiment, the thermal analysis and air flow images are provided in figures 8, 9 and 10.
[0057] The present invention is best suited to dedicated server applications where processing requirements are moderate compared to a multi-blade server, but the network and other IO connection requirements are unique and specific to the individual applications. Hence, the design is made modular, so all the sub modules, including the computing hardware, graphics processing hardware and IO cards can be upgraded and replaced independently.
[0058] Figure 2 shows a storage module of the modular computing server platform system according to an exemplary implementation of the present disclosure/ invention.
[0059] The figure shows the storage module of the modular computing server platform system. The storage module (200) with two industrial standard SSDs (201 & 202) packed in customized mechanical enclosure mounted on the motherboard for computing hardware-1 and computing hardware-2 respectively for storage of data and retrieval of information.
[0060] In one embodiment, multiple industry standard solid-state drives arranged in a cassette form, for storage and retrieval of information. The storage module can be further upgraded based on storage capacity requirement and technology, solutions from vendors across the industry.
[0061] Figure 3 shows computing hardware of the modular computing server platform system according to an exemplary implementation of the present disclosure/ invention.
[0062] The figure shows the computing hardware of the modular computing server platform system. The computing Hardware (100 & 300) of the system are the carrier cards (104) in 3U form factor VITA standard which holds add-on industry standard SOM (102). These SOM (System-on-Module) modules are mounted on the carrier cards through industry standard connectors and modules can be updated without change in design. These modules have Intel (103) server grade processors with dual channel DDR4 memory. The modules act as system controllers and run independently. They also include high-speed signals, serial peripheral interfaces and transfer protocols for different applications. These computing hardware’s have customized conduction cooled heat sink (101) is designed for thermal dissipation.
[0063] The computing hardware is of standard form factor which holds an add-on industry standard system on module connected through industry standard interface on carrier card, which can be upgraded without change in design.
[0064] Figure 4 shows communication hardware of the modular computing server platform system according to an exemplary implementation of the present disclosure/ invention.
[0065] The figure shows the communication hardware of the modular computing server platform system. The communication hardware consists of small form factor Mini-PCIe connectors (402) mounted on the base carrier board (401) to provide a cost effective, lightweight, small size, rugged, and reliable bus interfaces. This Module supports MIL-STD-1553(403) and ARINC 429 (404) cards to meet data conversion and data interfaces. These components ensure the accurate and reliable transfer of flight-critical data. These modules can be easily updated without change in the design by upgrading the add-on cards.
[0066] Figure 5 shows a graphics processing hardware of the modular computing server platform system according to an exemplary implementation of the present disclosure/ invention.
[0067] The figure shows a graphics processing hardware of the modular computing server platform system. The graphics processing Hardware (500) is a General-Purpose Graphic Processing Unit (GPGPU) having a graphic card (504) with a pluggable high performance graphics mobile PCI express mezzanine (MXM) connector (502). This graphic card is mounted on a base carrier card (501) designed in VITA 3U form factor. This module can be updated without change in design, by replacing the graphic modules available in the industry. In the present invention system, the GPGPU is based on Nvidia high-end graphic chip (503). This module is configured as endpoint or slave to computing hardware-1, which provides graphics and single precision (FP32) compute performance, fast and expansive GDDR5X GPU memory, sophisticated hardware and software optimizations, advanced development frameworks, etc. A customized conduction cooled heat sink (506) designed for thermal dissipation.
[0068] The graphics processing hardware with a pluggable high performance graphics processing unit, provided on carrier card through industry standard interface on carrier card. This enables upgradability for across industry graphic cards without change in design.
[0069] Figure 6 shows a media for communication (Motherboard) of the modular computing server platform system according to an exemplary implementation of the present disclosure/ invention.
[0070] The figure shows the media for communication (Motherboard) of the modular computing server platform system. Media for communication (600) is a 3U based motherboard with 4 slots (601,603,604,605), one power supply slot (607) and a SATA cassette slot (602) having two SSD hard disk for storage. These modules are interconnected on a motherboard to meet the needs of both tree and mesh topologies. There is a data interchange switch (609) for high-speed interconnect for the ARINC, mil-1553, computing hardware-2 and display module connector (606). The display module is used to convert PCIe protocol to the high-resolution display. mSATA (608) mounted on the backside of the motherboard to meet the additional storage requirements for the system. The micro-controller on mother board is used for soft shutdown, monitoring the system temperature and controls the fans RPM according to the surface temperature of the system.
[0071] In one embodiment, the customized motherboard with standardized connectors and standard interfaces used for interconnect architecture, allows for future upgrades of all the modules. The motherboard features an electronic circuit with proprietary fused software for thermal management of the system by monitoring the temperature at optimum locations and the status of the cooling fan.
[0072] In one embodiment, each module of the present invention system can be upgraded independently without affecting the other modules in the system. The system architecture allows for the presence or absence of any of the modules, except for computing hardware-1, based on the system requirements.
[0073] In one embodiment, the system holds plurality of modules mounted orthogonally to motherboard inside chassis placed at an optimum location for effective thermal management. The modules have customized cooling mechanisms.
[0074] In one embodiment, the present invention system further includes a Power supply hardware (700) which is a 300W industry standard power supply module with wide input range and has a HOLDUP time up to 50mSec. It has special features which includes indefinite short circuit protection, over-voltage shutdown with auto-recovery, reverse battery protection and over temperature shutdown with auto-recovery.
[0075] The figure shows an example MPU (Main Processing unit) Product image, the figure 8 shows an example thermal simulation image 1 of the system, the figure shows a thermal simulation image 2 of the system and the figure 10 shows an example airflow diagram of the system.
[0076] The various embodiments described above are specific examples of a single broader invention. Any modifications, alterations or the equivalents of the above-mentioned embodiments pertain to the same invention as long as they are not falling beyond the scope of the invention as defined by the appended claims. It will be apparent to a person skilled in the art that the modular computing server platform system may be provided using some or many of the above-mentioned features or components without departing from the scope of the invention. It will be also apparent to a skilled person that the embodiments described above are specific examples of a single broader invention which may have greater scope than any of the singular descriptions taught. There may be many alterations made in the invention without departing from the spirit and scope of the invention.
[0077] Figures are merely representational and are not drawn to scale. Certain portions thereof may be exaggerated, while others may be minimized. Figures illustrate various embodiments of the invention that can be understood and appropriately carried out by those of ordinary skill in the art.
[0078] In the foregoing detailed description of embodiments of the invention, various features are grouped together in a single embodiment for the purpose of streamlining the disclosure. This method of disclosure is not to be interpreted as reflecting an intention that the claimed embodiments of the invention require more features than are expressly recited in each claim. Rather, as the following claims reflect, inventive subject matter lies in less than all features of a single disclosed embodiment. Thus, the following claims are hereby incorporated into the detailed description of embodiments of the invention, with each claim standing on its own as a separate embodiment.
[0079] It is understood that the above description is intended to be illustrative, and not restrictive. It is intended to cover all alternatives, modifications and equivalents as may be included within the spirit and scope of the invention as defined in the appended claims. Many other embodiments will be apparent to those of skill in the art upon reviewing the above description. The scope of the invention should, therefore, be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled. In the appended claims, the terms “including” and “in which” are used as the plain-English equivalents of the respective terms “comprising” and “wherein,” respectively.

,CLAIMS:
1. A modular computing server platform system, the server platform system comprising:
a chassis with plurality of side walls, a power source unit, a plurality of cooling fans, a plurality of server modules, the plurality of server modules comprising:
at least one computing hardware module (100) positioned on the chassis comprising carrier cards (104) in 3U form factor which incorporates add-on industry standard System-on-Module (SOM) (102);
at least one storage module (200) positioned on the chassis comprises at least two standard Solid-state drives (SSDs) (201 & 202) packed in customized mechanical enclosure for storage of data and retrieval of information;
at least one communication hardware module (400) positioned on the chassis comprises of connectors (402) mounted on a base carrier board (401) for accurate and reliable transfer of data;
at least one graphics processing hardware module (500) positioned on the chassis having a graphic card (504) with a pluggable high performance graphics processing unit, where the graphics card (504) is mounted on a base carrier card (501) through standard interface which enables upgradability; and
at least one media for communication (Motherboard) (600) positioned on the chassis, where the motherboard module with connectors and interfaces for interconnect architecture, wherein the motherboard module comprises slots (601,603,604,605), one power supply slot (607) and a SATA cassette slot (602) having two SSD hard disk for storage, the motherboard module is configured to receive the plurality of modules (100, 200, 400 and 500) via slots (601,602,604,605), the slot (603) is to receive the computing hardware module (300).

2. The server platform system as claimed in claim 1, wherein each module of the plurality of modules is designed to 3U form factor.

3. The server platform system as claimed in claim 1, wherein the System-on-Module (SOM) (102) modules are mounted on the carrier cards through industry standard connectors for upgradation, where the modules have Intel (103) server grade processors with dual channel DDR4 memory.

4. The server platform system as claimed in claim 1, further comprises at least one computing hardware module (300) positioned on the chassis.

5. The server platform system as claimed in claim 1, wherein the communication hardware module (400) comprises provision for add-on cards on Mini-PCIe connector and further supports MIL-STD-1553 (403) and ARINC 429 (404) to meet data conversion and data interfaces.

6. The server platform system as claimed in claim 1, wherein each module of the plurality modules is upgraded independently without affecting the other modules in the system.

7. The server platform system as claimed in claim 1 holds plurality of modules mounted orthogonally to motherboard inside chassis placed at an optimum location for effective thermal management.

8. The server platform system as claimed in claim 1, wherein each module of the plurality modules comprises customized conduction cooled heat sink for thermal dissipation.

9. The server platform system as claimed in claim 1, wherein each module is logically connected with each other through high-speed link on the motherboard.

10. The server platform system as claimed in claim 1, wherein the motherboard module is with standardized connectors and standard interfaces used for interconnect architecture, allows for future upgrades of all the modules.