Abstract: A mold tool system (100) comprising: a runner assembly (102) having: a nozzle assembly (104); and a cooling insert assembly (106) being positioned proximate to the nozzle assembly (104) the cooling insert assembly (106) being configured to provide in use uniform cooling to the nozzle assembly (104). Several potential advantages may be realized with the above arrangement: (i) improvement of hot runner balance by creating a more uniform temperature on all drops (ii) reduction of energy usage in the hot runner by giving ability to include insulating features geometry or materials between the cooling medium and the hot components and/or (iii) simplification of design since water lines may now be in line with nozzle assemblies.
MOLD-TOOL SYSTEM INCLUDING COOLING-INSERT ASSEMBLY BEING
POSITIONED PROXIMATE TO NOZZLE ASSEMBLY
TECHNICAL FIELD
An aspect generally relates to (but is not limited to) molding systems and or mold-tool
system.
SUMMARY
The inventors have researched a problem associated with known molding systems that
inadvertently manufacture bad-quality molded articles or parts. After much study, the
inventors believe they have arrived at an understanding of the problem and its solution,
which are stated below, and the inventors believe this understanding is not known to the
public.
A current problem is that hot runner cooling is not adequately balanced. The current cooling
layouts may result in outer drops being subjected to increased cooling when compared to
the inner drops on a hot runner. Also, given the current technology of gundrilling for cooling
lines, it may be difficult to eliminate this feature. The final result may be for the outer drops
to have smaller part weights than the inner drops. The non-uniform cooling may result in a
large temperature variation in the hot runner plates. This variation may result in temperature
differences in the manifold and nozzle housing, which may adversely affect the balance of
the hot runner.
According to one aspect, there is provided a mold-tool system ( 1 00), comprising: a runner
assembly ( 1 02) having: a nozzle assembly ( 1 04); and a cooling-insert assembly ( 106) being
positioned proximate to the nozzle assembly ( 1 04), the cooling insert ( 106) being
configured to provide, in use, uniform cooling to the nozzle assembly ( 1 04).
Several potential advantages may be realized with the above arrangement: (i) improvement
of hot runner balance by creating a more uniform temperature on all drops, (ii) reduction of
energy usage in the hot runner by giving ability to include insulating features, geometry, or
materials between the cooling medium and the hot components, and/or (iii) simplification of
design since water lines may now be inline with nozzle assemblies.
Other aspects and features of the non-limiting embodiments will now become apparent to
those skilled in the art upon review of the following detailed description of the non-limiting
embodiments with the accompanying drawings.
DETAILED DESCRIPTION OF THE DRAWINGS
The non-limiting embodiments will be more fully appreciated by reference to the following
detailed description of the non-limiting embodiments when taken in conjunction with the
accompanying drawings, in which:
FIGS. 1, 2, 3 depict schematic representations of a mold-tool system (100).
The drawings are not necessarily to scale and may be illustrated by phantom lines,
diagrammatic representations and fragmentary views. In certain instances, details not
necessary for an understanding of the embodiments (and/or details that render other details
difficult to perceive) may have been omitted.
DETAILED DESCRIPTION OF THE NON-LIMITING EMBODIMENT(S)
FIGS. 1, 2, 3 depict the schematic representations of the mold-tool system (100). The moldtool
system (100) may include components that are known to persons skilled in the art, and
these known components will not be described here; these known components are
described, at least in part, in the following reference books (for example): (i) "Injection
Molding Handbook ' authored by OSSWALD/TURNG/G RAMANN (ISBN: 3-446-21 669-2),
(ii) "Injection Molding Handbook ' authored by ROSATO AND ROSATO (ISBN: 0-41 2-
99381 -3), (iii) "Injection Molding Systems" 3rd Edition authored by JOHANNABER (ISBN 3-
446-1 7733-7) and/or (iv) "Runner and Gating Design Handbook ' authored by BEAUMONT
(ISBN 1-446-22672-9). It will be appreciated that for the purposes of this document, the
phrase "includes (but is not limited to)" is equivalent to the word "comprising". The word
"comprising" is a transitional phrase or word that links the preamble of a patent claim to the
specific elements set forth in the claim which define what the invention itself actually is. The
transitional phrase acts as a limitation on the claim, indicating whether a similar device,
method, or composition infringes the patent if the accused device (etc) contains more or
fewer elements than the claim in the patent. The word "comprising" is to be treated as an
open transition, which is the broadest form of transition, as it does not limit the preamble to
whatever elements are identified in the claim.
The definition of the mold-tool system (100) is as follows: a system that may be positioned
and/or may be used in an envelope defined by a platen system of the molding system, such
as an injection-molding system for example. The platen system may include a stationary
platen and a movable platen that is moveable relative to the stationary platen.
FIG. 1 depicts a cross sectional view of the mold-tool system (100). Generally, according to
the examples depicted in FIGS. 1, 2, 3, the mold-tool system (100) may include (and is not
limited to): a runner assembly (102). The runner assembly (102) may have (and is not
limited to): a nozzle assembly (104). The runner assembly (102) may also have (and is not
limited to) a cooling-insert assembly (106). The cooling-insert assembly (106) may be
positioned proximate to the nozzle assembly (104). The cooling-insert assembly (106) may
be configured to provide, in use, uniform cooling to the nozzle assembly (104). Specific
options are described below:
In accordance with the example depicted in FIG. 1, the nozzle assembly (104) may include
(and is not limited to): a valve-stem assembly (216), and a stem-actuator assembly (200) that
may be configured to actuate movement of the valve-stem assembly (216). The stemactuator
assembly (200) may include, for example, an air cylinder (202), a piston seal (204)
and a piston (206) that all cooperate to actuate movement of the valve-stem assembly (216)
in accordance to methods known to personal of skill in the art, so therefore the details for the
stem-actuator assembly (200) is not described here in any detail. It will be appreciated that
other mechanism may be used for the stem-actuator assembly (200). The nozzle assembly
(104) may also include a back-up pad (212) and a stem seal (214) the back-up pad (212) is
Placed between the stem-actuator assembly (200) and a manifold-plate assembly (122). The
stem seal (214) is positioned or supported by the back-up pad (212) and the stem seal (214)
slidably receives the valve-stem assembly (216). The manifold-plate assembly (122) defines
a melt channel (218) used for conveying a melt from a melt preparation assembly (known
and not depicted) to a mold assembly (known and not depicted). The valve-stem assembly
(216) is slidably received in the melt channel (218) of the manifold-plate assembly (122).
In accordance with the example depicted in FIG. 1, the cooling-insert assembly (106) may
include (and is not limited to): a backing-plate cooling insert assembly (110). The backingplate
cooling insert assembly (110) may be configured for: (i) placement, at least in part, in a
backing plate (120) of the runner assembly (102), and (ii) positioning proximate to the nozzle
assembly (104). An inlet (208) for a cooling line (209) and an outlet (210) for the cooling line
(209) may be provided by the backing plate (120).
In accordance with the example depicted in FIG. 2, the cooling-insert assembly (106) may
include (and is not limited to): a nozzle-drop cooling insert (112). The nozzle-drop cooling
insert (112) may be configured for placement, at least in part, between the manifold-plate
assembly (122) of the runner assembly (102) and the nozzle assembly (104).
The nozzle assembly (104) may include, by way of example (and is not limited to) the
following components: a spring assembly (300), a nozzle Locating insulator (302), a nozzle
housing (308) defining a nozzle melt channel (304), a nozzle heater (306) connected with the
nozzle housing (308), a nozzle tip (310), an anti-rotation tab (312) configured to prevent
rotation of the nozzle housing (308); the components identified in this paragraph are known
to persons of skill in the art, and so will not be further described in any further detail. The
manifold-plate assembly (122) may define a plate cooling mechanism (314) having a cooling
fluid.
It will be appreciated that according to an option, the cooling-insert assembly (106) may
include both the backing-plate cooling insert assembly (110) and the nozzle-drop cooling
insert (1 12) being used or installed at same time.
In accordance with another option, as depicted in FIG. 2, the cooling-insert assembly (106)
may include (and is not limited to): a thermal-barrier coating (124). The thermal-barrier
coating (124) may be applied, at least in part, to a surface of the cooling-insert assembly
(106), such as an outer surface and an inner surface or both. (106). The thermal-barrier
coating (124) may be configured to minimize, in use, heat transfer between the manifoldplate
assembly (122) and the cooling-insert assembly (106).
In accordance with another option, the cooling-insert assembly (106) may include (and is not
limited to): a backing-plate cooling insert assembly (110). The backing-plate cooling insert
assembly (110) may be configured for: (i) placement, at least in part, in a backing plate (120)
of the runner assembly (102), and (ii) positioning proximate to the nozzle assembly (104). IN
addition, the cooling-insert assembly (106) may include (and is not limited to): a thermalbarrier
coating (124). The thermal-barrier coating (124) may be applied, at least in part, to a
surface of the cooling-insert assembly (106). The thermal-barrier coating (124) may be
configured to minimize, in use, heat transfer between the cooling-insert assembly (106) and
the back-up pad (212).
An example of the thermal-barrier coating (124) is NitroCoat (TRADEMARK), which is
manufactured by Toefco Engineered Coating Systems, Inc., 1220 N. 14th Street, Niles,
Michigan 49120 USA, telephone (269) 683-0188.
It will be appreciate that the nozzle-drop cooling insert (112) may include the thermal-barrier
coating (124) in accordance with one option. It will be appreciate that the backing-plate
cooling insert assembly (1 10) may include the thermal-barrier coating (124) in accordance
with another option.
It will also be appreciated that in accordance with another option, the cooling-insert assembly
(106) (as depicted in FIGS 1 or 2) may include (and is not limited to): a relatively lower
thermal conductivity material. The relatively lower thermal conductivity material may have a
relatively lower thermal conductivity than the thermal conductivity of the material of the
nozzle assembly (104) and the manifold-plate assembly (122). The relatively lower
conductivity material may be configured to minimize, in use, heat transfer between the nozzle
assembly (104) and the manifold-plate assembly (122).
According to another option, the cooling-insert assembly (106) includes (and is not limited to:
a relatively lower thermal conductivity material. The relatively lower thermal conductivity
material may have a relatively lower thermal conductivity than the thermal conductivity of a
material of the back-up pad (212). The relatively lower conductivity material may be
configured to minimize, in use, heat transfer between the back-up pad (212) and the backing
plate (120).
FIG. 3 depicts a perspective view of the mold-tool system (100), in which the cooling-insert
assembly (106) may include (and is not limited to): a feature (126). The feature (126) may be
configured to minimize, in use, heat transfer between the nozzle assembly (104) and the
cooling-insert assembly (106). The feature (126) may be machined to the cooling-insert
assembly (106). The feature (126) may include (by way of example and not limited to): a
scalloped portion (128).
It will be appreciated that the assemblies and modules described above may be connected
with each other as may be required to perform desired functions and tasks that are within
the scope of persons of skill in the art to make such combinations and permutations without
having to describe each and every one of them in explicit terms. There is no particular
assembly, components, or software code that is superior to any of the equivalents available
to the art. There is no particular mode of practicing the inventions and/or examples of the
invention that is superior to others, so long as the functions may be performed. It is
believed that all the crucial aspects of the invention have been provided in this document.
It is understood that the scope of the present invention is limited to the scope provided by
the independent claim(s), and it is also understood that the scope of the present invention
is not limited to: (i) the dependent claims, (ii) the detailed description of the non-limiting
embodiments, (iii) the summary, (iv) the abstract, and/or (v) description provided outside of
this document (that is, outside of the instant application as filed, as prosecuted, and/or as
granted). It is understood, for the purposes of this document, the phrase "includes (and is
not limited to)" is equivalent to the word "comprising". It is noted that the foregoing has
outlined the non-limiting embodiments (examples). The description is made for particular
non-limiting embodiments (examples). It is understood that the non-limiting embodiments
are merely illustrative as examples.
CLAIMS
WHAT IS CLAIMED IS:
1. A mold-tool system (100), comprising:
a runner assembly (102) having:
a nozzle assembly (104); and
a cooling-insert assembly (106) being positioned proximate to the nozzle
assembly (104), the cooling-insert assembly (106) being configured to provide, in use,
uniform cooling to the nozzle assembly (104).
2. The mold-tool system (100) of any preceding claim, wherein:
the cooling-insert assembly (106) includes:
a backing-plate cooling insert assembly (110) being configured for:
(i) placement, at least in part, in a backing plate (120) of the runner
assembly (102), and
(ii) positioning proximate to the nozzle assembly (104).
3. The mold-tool system (100) of any preceding claim, wherein:
the cooling-insert assembly (106) includes:
a nozzle-drop cooling insert (112) being configured for placement, at least in
part, between a manifold-plate assembly (122) of the runner assembly (102) and the
nozzle assembly (104).
4. The mold-tool system (100) of any preceding claim, wherein:
the cooling-insert assembly (106) includes:
a backing-plate cooling insert assembly (110) being configured for:
(i) placement, at least in part, in a backing plate (120) of the runner
assembly (102), and
(ii) positioning proximate to the nozzle assembly (104); and
a nozzle-drop cooling insert (112) being configured for placement, at least in
part, between a manifold-plate assembly (122) of the runner assembly (102) and the
nozzle assembly (104).
5. The mold-tool system (100) of any preceding claim, wherein:
the cooling-insert assembly (106) includes:
a thermal-barrier coating (124) being applied, at least in part, to an outer
surface of the cooling-insert assembly (106), the thermal-barrier coating (124) being
configured to minimize, in use, heat transfer between a manifold-plate assembly (122)
and the cooling-insert assembly (106).
6. The mold-tool system (100) of any preceding claim, wherein:
the cooling-insert assembly (106) includes:
a nozzle-drop cooling insert (1 12) being configured for placement, at least in
part, between a manifold-plate assembly (122) of the runner assembly (102) and the
nozzle assembly (104); and
a thermal-barrier coating (124) being applied, at least in part, to a surface of the
cooling-insert assembly (106), the thermal-barrier coating (124) being configured to
minimize, in use, heat transfer between the nozzle assembly (104) and the coolinginsert
assembly (106).
7. The mold-tool system (100) of any preceding claim, wherein:
the cooling-insert assembly (106) includes:
a backing-plate cooling insert assembly (110) being configured for:
(i) placement, at least in part, in a backing plate (120) of the runner
assembly (102), and
(ii) positioning proximate to the nozzle assembly (104); and
a thermal-barrier coating (124) being applied, at least in part, to a surface of the
cooling-insert assembly (106), the thermal-barrier coating (124) being configured to
minimize, in use, heat transfer between the cooling-insert assembly (106) and a back
up pad (212).
8. The mold-tool system (100) of any preceding claim, wherein:
the cooling-insert assembly (106) includes:
a backing-plate cooling insert assembly (110) being configured for:
(i) placement, at least in part, in a backing plate (120) of the runner
assembly (102), and
(ii) positioning proximate to the nozzle assembly (104); and
a thermal-barrier coating (124) being applied, at least in part, to a surface of the
cooling-insert assembly (106), the thermal-barrier coating (124) being configured to
minimize, in use, heat transfer between the backing plate (120) and the cooling-insert
assembly (106)
9. The mold-tool system (100) of any preceding claim, wherein:
the cooling-insert assembly (106) includes:
a relatively lower thermal conductivity material having a relatively lower thermal
conductivity than a thermal conductivity of a material of the nozzle assembly (104), the
relatively lower conductivity material being configured to minimize, in use, heat
transfer between the nozzle assembly (104) and a backing plate (120).
10. The mold-tool system (100) of any preceding claim, wherein:
the cooling-insert assembly (106) includes:
a relatively lower thermal conductivity material having a relatively lower thermal
conductivity than a thermal conductivity of a material of a back-up pad (212), the
relatively lower conductivity material being configured to minimize, in use, heat
transfer between the back-up pad (212) and a backing plate (120).
11 . The mold-tool system (100) of any preceding claim, wherein:
the cooling-insert assembly (106) includes:
a feature (126) configured to minimize, in use, heat transfer between the nozzle
assembly (104) and the cooling-insert assembly (106).
12. The mold-tool system (100) of any preceding claim, wherein:
the cooling-insert assembly (106) includes:
a feature (126) being machined to the cooling-insert assembly (106), the
feature (126) being configured to minimize, in use, heat transfer between the nozzle
assembly (104) and the cooling-insert assembly (106).
13. The mold-tool system (100) of any preceding claim, wherein:
the cooling-insert assembly (106) includes:
a feature (126) being machined to the cooling-insert assembly (106), the
feature (126) being configured to minimize, in use, heat transfer between the nozzle
assembly (104) and the cooling-insert assembly (106),
the feature (126) includes:
a scalloped portion (128).
4. A molding system having the mold-tool system (100) of any one of claims 1 to 11 .