Claims:
1. A motor drive system (MDS), comprising:
a heat-sink operatively coupled to a module in order to dissipate heat there from; and
a fan assembly configured to assist in heat dissipation with the heat sink by provision of an unobstructed channel of air there between.
2. The MDS as claimed in claim 1, wherein the MDS further includes at least one capacitor configured to serve as storehouse of electrical energy in the MDS.
3. The MDS as claimed in claim 2, wherein the module is a semiconductor device configured with one or more power components that emanate heat during working cycle, wherein the one or more power components are inverter and rectifier.
4. The MDS as claimed in claim 1, wherein the unobstructed channel is created due to absence of any component between the fan assembly and the heat-sink.
5. The MDS as claimed in claim 2, wherein the at least one capacitor housed in a separate capacitor bank so as not to obstruct the air channel of the fan assembly.
6. The MDS as claimed in claim 1, wherein the MDS is operatively coupled on a power board of PCB in a modular fashion.
7. The MDS as claimed in claim 3, wherein the semiconductor is an IGBT module.
8. The MDS as claimed in claim 1, wherein the fan assembly includes a mounting arrangement that removably attaches a fan through a snap-fit.
9. The MDS as claimed in claim 1, wherein whole of the fan assembly gets replaced in case of fault condition on account of its modular arrangement.
10. The MDS as claimed in claim 1, wherein the MDS further comprises a control mechanism configured to command at least the module that is a semiconductor.
, Description:
TECHNICAL FIELD

[0001] The present disclosure generally relates to the field of electrical drives. In particular, the present disclosure pertains to cooling systems for electrical drive systems. More specifically, the present disclosure relates to a modular arrangement of components of a motor drive system so as to enhance thermal efficiency, among other benefits.

BACKGROUND

[0002] Background description includes information that may be useful in understanding the present invention. It is not an admission that any of the information provided herein is prior art or relevant to the presently claimed invention, or that any publication specifically or implicitly referenced is prior art.
[0003] Motor drive system, such as for example but need not necessarily, three-phase LV drives are employed in wide industrial applications such as driving induction motors couples with pumps, fans, elevators etc. But they face serious limitations due to rigidity arrangement of components that can work for detrimental of heat dissipation of the system, among other shortcomings such as loss of overall efficiency.
[0004] Heat-sink can be generally used in such systems as an essential component so as to actively dissipate the heat generated by inverter set-up and the like. Further, a fan assembly can be provided to share load or even enhance heat dissipation rate by sharing burden of the heat-sink.
[0005] But in spite of such arrangements of components there have been complains regarding loss of system efficiency particularly due to thermal losses. This usually takes place due to undesired obstruction in the path of (cooling) air stream directed by fan assembly to heat-sink, wherein such obstruction can be due to constraints in placement of certain component(s). There is a serious need to provide a modular arrangement of components so as to cater to better inter-operability, especially between heat-sink and fan assembly of system while removing any obstruction there between.
[0006] There is a need in the art to provide a simple, compact and economical motor drive system that obviates shortcomings encountered primarily due to inefficient dissipation of heat. Further, it would be an added benefit for the system to allow reduction of size/power of fan and/or heat sink due to reduced resistance to air flow inside the system.
[0007] All publications herein are incorporated by reference to the same extent as if each individual publication or patent application were specifically and individually indicated to be incorporated by reference. Where a definition or use of a term in an incorporated reference is inconsistent or contrary to the definition of that term provided herein, the definition of that term provided herein applies and the definition of that term in the reference does not apply.
[0008] In some embodiments, the numbers expressing quantities of ingredients, properties such as concentration, reaction conditions, and so forth, used to describe and claim certain embodiments of the invention are to be understood as being modified in some instances by the term “about.” Accordingly, in some embodiments, the numerical parameters set forth in the written description and attached claims are approximations that can vary depending upon the desired properties sought to be obtained by a particular embodiment. In some embodiments, the numerical parameters should be construed in light of the number of reported significant digits and by applying ordinary rounding techniques. Notwithstanding that the numerical ranges and parameters setting forth the broad scope of some embodiments of the invention are approximations, the numerical values set forth in the specific examples are reported as precisely as practicable. The numerical values presented in some embodiments of the invention may contain certain errors necessarily resulting from the standard deviation found in their respective testing measurements.
[0009] As used in the description herein and throughout the claims that follow, the meaning of “a,” “an,” and “the” includes plural reference unless the context clearly dictates otherwise. Also, as used in the description herein, the meaning of “in” includes “in” and “on” unless the context clearly dictates otherwise.
[0010] The recitation of ranges of values herein is merely intended to serve as a shorthand method of referring individually to each separate value falling within the range. Unless otherwise indicated herein, each individual value is incorporated into the specification as if it were individually recited herein. All methods described herein can be performed in any suitable order unless otherwise indicated herein or otherwise clearly contradicted by context. The use of any and all examples, or exemplary language (e.g. “such as”) provided with respect to certain embodiments herein is intended merely to better illuminate the invention and does not pose a limitation on the scope of the invention otherwise claimed. No language in the specification should be construed as indicating any non-claimed element essential to the practice of the invention.
[0011] Groupings of alternative elements or embodiments of the invention disclosed herein are not to be construed as limitations. Each group member can be referred to and claimed individually or in any combination with other members of the group or other elements found herein. One or more members of a group can be included in, or deleted from, a group for reasons of convenience and/or patentability. When any such inclusion or deletion occurs, the specification is herein deemed to contain the group as modified thus fulfilling the written description of all groups used in the appended claims.

OBJECTS OF THE INVENTION

[0012] A general object of the present disclosure is to provide for a simple, compact and economical motor drive system that obviates shortcomings encountered primarily due to inefficient dissipation of heat.
[0013] An object of the present disclosure is to provide a modular arrangement of components of a motor drive system so as to enhance thermal efficiency.
[0014] An object of the present disclosure is to provide an unobstructed means to dissipate heat generated in a drive system in a dynamic fashion.
[0015] Yet another object of the present disclosure is to reduce fan power and/or heat-sink dimensions on account of reduced resistance to air mass for a motor drive system.

SUMMARY

[0016] Aspects of the present disclosure generally relate to the field of electrical drives. In particular, the present disclosure pertains to cooling systems for electrical drive systems. More specifically, the present disclosure relates to a modular arrangement of components of a motor drive system so as to enhance thermal efficiency, among other benefits. In an aspect, the present disclosure provides a motor drive system (MDS) that can include a heat-sink operatively coupled to a module in order to dissipate heat there from; and a fan assembly configured to assist in heat dissipation with the heat sink by provision of an unobstructed channel of air there between.
[0017] In an aspect, the present disclosure provides a motor drive system (MDS), that can include a semiconductor device (an IGBT module in a preferred embodiment) that can be configured with one or more power components that can emanate heat during working cycle; a heat-sink that can be operatively coupled to the semiconductor in order to dissipate heat there from; and a fan assembly that can be configured to assist in heat dissipation with the heat sink by provision of an unobstructed channel of air therebetween.
[0018] In an aspect, MDS can further include at least one capacitor that can be configured to serve as storehouse of electrical energy in the MDS, wherein the one or more power components can be inverter and rectifier, wherein the at least one capacitor can be housed in a separate capacitor bank so as not to obstruct the air channel of the fan assembly.
[0019] In an aspect, unobstructed channel, in accordance with an implementation of the present disclosure with MDS, can be created due to absence of any component between fan assembly and heat-sink, while the MDS can be operatively coupled on a power board PCB in a modular fashion.
[0020] In an aspect, fan assembly of the present disclosure can include a mounting arrangement that can removably attach a fan through a snap-fit, wherein whole of the fan assembly can be replaced in case of fault condition on account of its modular arrangement.
[0021] In an aspect, MDS can further comprise a control mechanism configured to command at least the semiconductor device.
[0022] Various objects, features, aspects and advantages of the inventive subject matter will become more apparent from the following detailed description of preferred embodiments, along with the accompanying drawing figures in which like numerals represent like components

BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The accompanying drawings are included to provide a further understanding of the present disclosure, and are incorporated in and constitute a part of this specification. The drawings illustrate exemplary embodiments of the present disclosure and, together with the description, serve to explain the principles of the present disclosure.
[0024] FIG. 1 illustrates an exemplary block diagram of a motor drive system in accordance to an embodiment of the present disclosure.
[0025] FIG. 2 illustrates exemplary front and top views of a motor drive system in accordance to an embodiment of the present disclosure.
[0026] FIG. 3 illustrates an exemplary top perspective view of a motor drive system in accordance to an embodiment of the present disclosure.
[0027] FIG. 4 illustrates an exemplary bottom perspective view of a motor drive system in accordance to an embodiment of the present disclosure.

DETAILED DESCRIPTION

[0028] The following is a detailed description of embodiments of the disclosure depicted in the accompanying drawings. The embodiments are in such detail as to clearly communicate the disclosure. However, the amount of detail offered is not intended to limit the anticipated variations of embodiments; on the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the present disclosure as defined by the appended claims.
[0029] Each of the appended claims defines a separate invention, which for infringement purposes is recognized as including equivalents to the various elements or limitations specified in the claims. Depending on the context, all references below to the "invention" may in some cases refer to certain specific embodiments only. In other cases it will be recognized that references to the "invention" will refer to subject matter recited in one or more, but not necessarily all, of the claims.
[0030] Various terms as used herein are shown below. To the extent a term used in a claim is not defined below, it should be given the broadest definition persons in the pertinent art have given that term as reflected in printed publications and issued patents at the time of filing.
[0031] Embodiments of the present disclosure generally relate to the field of electrical drives. In particular, the present disclosure pertains to cooling systems for electrical drive systems. More specifically, the present disclosure relates to a modular arrangement of components of a motor drive system so as to enhance thermal efficiency, among other benefits. In an aspect, the present disclosure provides a motor drive system (MDS) that can include a heat-sink operatively coupled to a module in order to dissipate heat there from; and a fan assembly configured to assist in heat dissipation with the heat sink by provision of an unobstructed channel of air there between.
[0032] FIG. 1 illustrates an exemplary block diagram of a motor drive system 100 in accordance to an embodiment of the present disclosure. As illustrated, inverter 102 and rectifier 104 can be power components that can be the heat dissipating source while they are expected to perform power conversion (say from AC to DC to AC) and drive the load as per command from a control mechanism 106. Further, heat-sink 150 can be designed in accordance with the inverter 102 and rectifier 104 that together form a single module (i.e. semiconductor 210 as best shown in FIGS. 3, and 4) while being housed in a same assembly while being mounted on the heat-sink 150 that can be preferably in close proximity of a cooling fan 120 for ample air circulation for heat removal. Moreover, a DC link capacitor 130 (a bank of capacitors can be best seen in FIGS. 2 and 3) can be responsible for coupling the power from AC source to inverter 102 and provide smooth power to the load in case of transient instability and like events.
[0033] In an aspect, the present disclosure provides a motor drive system (MDS), that can include a semiconductor device 210 (an IGBT module in a preferred embodiment) that can be configured with one or more power components that can emanate heat during working cycle; a heat-sink 150 that can be operatively coupled to the semiconductor 210 in order to dissipate heat there from; and a fan assembly 120 that can be configured to assist in heat dissipation with the heat sink 150 by provision of an unobstructed channel of air there between.
[0034] In an aspect, MDS 100 can comprise a control mechanism 106 that can be configured to command at least the semiconductor device 210 while it can be optimally configured to monitor and/or control working of other components such as, but not limited to, fan assembly 120, capacitor 130, display card 108, card 114, motor 116, and pump 118.
[0035] FIG. 2 illustrates exemplary front and top views 200 and 250 respectively of a motor drive system 100 in accordance to an embodiment of the present disclosure. In an aspect, MDS 100 can include at least one capacitor 130 (while four capacitors have been shown herein for exemplary purposes while actual implementation can utilize more or less capacitors as well) that can be configured to serve as storehouse of electrical energy in the MDS 100, wherein the one or more power components can be inverter 102 and rectifier 104, wherein the at least one capacitor 130 can be housed in a separate capacitor bank (best shown in FIG. 3) so as not to obstruct the air channel of the fan assembly 120.
[0036] In an aspect, in accordance with an implementation of the present disclosure, semiconductor 210 can be in form of a single module that incorporates both inverter 102 and rectifier 104 form space and aesthetics considerations, among others. Further, it allows optimum placement/housing of the semiconductor 210 with heat-sink 150 as shown herein and from another angle through FIG. 4. This plays a crucial role in keeping the arrangement compact and more accessible to action of fan assembly 120 while capacitor(s) 130 can be placed in a separate bank nearby but without obstructing air channel from the fan assembly 120 to the heat-sink 150.
[0037] In an aspect, DC link capacitor 130, or more appropriately capacitor bank (showing 4 identical capacitors in FIGS. 2, and 3), can be intentionally kept away from air channel between heat-sink 150 and fan assembly 120 by instead housing the capacitor bank inside a separate chamber besides the heat-sink 150, primarily to reduce undue resistance for the cooling air.
[0038] FIG. 3 illustrates an exemplary top perspective view 300 of a motor drive system 100 in accordance to an embodiment of the present disclosure. In an aspect, unobstructed channel, in accordance with an implementation of the present disclosure with MDS 100, can be created due to absence of any component between fan assembly 120 and heat-sink 150, while the MDS 100 can be operatively coupled on a power board 220 of PCB in a modular fashion.
[0039] In an aspect, channel/bank of DC link capacitor 130 can be present separately, or towards one side of power board 210, so as not to block the air flow path. Further, fan assembly 120 can be a separate assembly that can be replaceably fitted on account of snap-fit provision of its housing, and therefore the complete fan assembly 120 can be modular and can be detached so as to replace in case of any fault.
[0040] In an aspect, fan assembly 120 of the present disclosure can include a mounting arrangement that can removably attach a fan through a snap-fit, wherein whole of the fan assembly 120 can be replaced in case of fault condition on account of its modular arrangement.
[0041] FIG. 4 illustrates an exemplary bottom perspective view 400 of a motor drive system 100 in accordance to an embodiment of the present disclosure. In an aspect, semiconductor 210, fan assembly 120 and heat-sink 150 can be arranged in a modular fashion in such a way as to enhance cooling efficiency, and as a result, over-all drive efficiency. Further, such enhancements make system of the present disclosure more applicable and suitable in case of, for example but need not necessarily, medium voltage drive, or power inverter modules wherein efficient heat dissipation is required.
[0042] Thus, the present disclosure provides motor drive system with components in a thermally-smart-modular arrangement that improves their interoperability and assembly costs related thereto, and increases productivity, while resulting in an overall reduction in dynamic heat dissipation of the system.
[0043] While the foregoing describes various embodiments of the invention, other and further embodiments of the invention may be devised without departing from the basic scope thereof. The scope of the invention is determined by the claims that follow. The invention is not limited to the described embodiments, versions or examples, which are included to enable a person having ordinary skill in the art to make and use the invention when combined with information and knowledge available to the person having ordinary skill in the art.

ADVANTAGES OF THE INVENTION

[0044] The present disclosure provides a simple, compact and economical motor drive system that obviates shortcomings encountered primarily due to inefficient dissipation of heat.
[0045] The present disclosure provides a modular arrangement of components of a motor drive system so as to enhance thermal efficiency.
[0046] The present disclosure provides provide an unobstructed means to dissipate heat generated in a drive system in a dynamic fashion.
[0047] The present disclosure reduces fan power and/or heat-sink dimensions on account of reduced resistance to air mass for a motor drive system.