FORM 2
THE PATENTS ACT, 1970
(39 of 1970)
&
THE PATENTS RULES, 2003
COMPLETE SPECIFICATION
[See section 10, Rule 13]
ELECTRONIC COMPONENT MOUNTING STRUCTURE AND OUTDOOR UNIT OF
AIR CONDITIONER;
MITSUBISHI ELECTRIC CORPORATION, A CORPORATION ORGANISED
AND EXISTING UNDER THE LAWS OF JAPAN, WHOSE ADDRESS IS 7-
3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO 1008310, JAPAN
THE FOLLOWING SPECIFICATION PARTICULARLY DESCRIBES THE
INVENTION AND THE MANNER IN WHICH IT IS TO BE PERFORMED.
2
DESCRIPTION
TITLE OF THE INVENTION:
ELECTRONIC COMPONENT MOUNTING STRUCTURE AND OUTDOOR UNIT OF
5 AIR CONDITIONER
Field
[0001] The present disclosure relates to an electronic
component mounting structure and an outdoor unit of an air
10 conditioner.
Background
[0002] In a power conversion circuit of an air
conditioner, a coil as an electronic component is used in
15 an alternating current unit for noise prevention/reduction,
or used in a direct current unit for power factor
improvement or harmonic current reduction. Regarding an
electronic component mounting structure, various techniques
have been proposed.
20 [0003] For example, Patent Literature 1 discloses a
power converter including a toroidal coil. In the power
converter described in Patent Literature 1, a coil cover
accommodating a toroidal coil is in contact with a lower
surface of a substrate. An opening of the coil cover and a
25 protrusion protruding upward from the bottom of a housing
of the power converter sandwich therebetween a heat
dissipation sheet that transfers heat generated in the
toroidal coil to the housing.
30 Citation List
Patent Literature
[0004] Patent Literature 1: Japanese Patent Application
Laid-open No. 2020-188131
3
Summary of Invention
Problem to be solved by the Invention
[0005] However, according to the technique of Patent
5 Literature 1 above, the heat dissipation sheet has low
flexibility and is not in intimate contact with the
electronic component so that a contact area between the
electronic component and the heat dissipation sheet is
small, which has resulted in a problem that the heat
10 generated in the toroidal coil is inefficiently transferred
to the housing.
[0006] In addition, according to the technique of Patent
Literature 1 above, there has been a problem that, due to
vibration of the electronic component during transportation
15 of the power converter, a joint portion between the
electronic component and a substrate or a joint portion
between the electronic component and the housing may
experience a fatigue failure.
[0007] The present disclosure has been made in view of
20 the above, and an object thereof is to provide an
electronic component mounting structure that can enhance
performance of dissipating heat of an electronic component
and suppress vibration of the electronic component.
25 Means to Solve the Problem
[0008] To solve the above problems and achieve an
object, an electronic component mounting structure
according to the present disclosure includes: an electronic
component; a metal plate including one surface and another
30 surface; and a heat dissipation component having
flexibility and elasticity. The heat dissipation component
is sandwiched between the one surface of the metal plate
and the electronic component with a region of the heat
4
dissipation component that faces the electronic component
being deformed along a shape of the electronic component
and being in intimate contact with the electronic
component, and the heat dissipation component being in
5 intimate contact with the one surface of the metal plate.
The electronic component and the metal plate are thermally
connected via the heat dissipation component.
Effects of the Invention
10 [0009] The electronic component mounting structure
according to the present disclosure has an effect of being
able to enhance the performance of dissipating the heat of
the electronic component and suppress the vibration of the
electronic component.
15
Brief Description of Drawings
[0010] FIG. 1 is a side view illustrating an electronic
component mounting structure according to a first
embodiment.
20 FIG. 2 is a top view illustrating the electronic
component mounting structure according to the first
embodiment.
FIG. 3 is a side view illustrating an electronic
component mounting structure according to a second
25 embodiment.
FIG. 4 is a top view illustrating the electronic
component mounting structure according to the second
embodiment.
FIG. 5 is an exploded side view illustrating an
30 electronic component mounting structure according to a
third embodiment.
FIG. 6 is a side view illustrating an electronic
component mounting structure according to a fourth
5
embodiment.
FIG. 7 is a top view illustrating the electronic
component mounting structure according to the fourth
embodiment.
5 FIG. 8 is a side view illustrating an electronic
component mounting structure according to a fifth
embodiment.
FIG. 9 is a top view illustrating the electronic
component mounting structure according to the fifth
10 embodiment.
FIG. 10 is a side view illustrating an electronic
component mounting structure according to a sixth
embodiment.
FIG. 11 is a top view illustrating the electronic
15 component mounting structure according to the sixth
embodiment.
FIG. 12 is a side view illustrating another electronic
component mounting structure according to the sixth
embodiment.
20 FIG. 13 is a top view illustrating the another
electronic component mounting structure according to the
sixth embodiment.
FIG. 14 is a block diagram illustrating a
configuration of an air conditioner according to a seventh
25 embodiment.
FIG. 15 is a refrigerant circuit diagram illustrating
a refrigeration cycle of the air conditioner according to
the seventh embodiment.
FIG. 16 is a first conceptual diagram illustrating a
30 configuration of an outdoor unit of an air conditioner to
which the electronic component mounting structure according
to any one of the first embodiment to the sixth embodiment
is attached.
6
FIG. 17 is a second conceptual diagram illustrating
the configuration of the outdoor unit of the air
conditioner to which the electronic component mounting
structure according to any one of the first embodiment to
5 the sixth embodiment is attached.
FIG. 18 is a third conceptual diagram illustrating the
configuration of the outdoor unit of the air conditioner to
which the electronic component mounting structure according
to any one of the first embodiment to the sixth embodiment
10 is attached.
Description of Embodiments
[0011] Hereinafter, an electronic component mounting
structure and an outdoor unit of an air conditioner
15 according to embodiments will be described in detail with
reference to the drawings. Note that, in the drawings,
common elements are assigned the same reference numerals,
and redundant description will be omitted.
[0012] First Embodiment.
20 FIG. 1 is a side view illustrating an electronic
component mounting structure 70 according to a first
embodiment. FIG. 2 is a top view illustrating the
electronic component mounting structure 70 according to the
first embodiment. FIG. 2 illustrates a state viewed from
25 above an electronic component 10.
[0013] The electronic component mounting structure 70 is
a mounting structure of the electronic component 10 capable
of suppressing vibration of the electronic component 10 and
efficiently dissipating heat generated in the electronic
30 component 10. As illustrated in FIG. 1, the electronic
component mounting structure 70 includes the electronic
component 10, a heat dissipation component 20 having
flexibility and elasticity, and a metal plate 30 having one
7
surface 31 and another surface 32. In the electronic
component mounting structure 70, the heat dissipation
component 20 and the electronic component 10 are mounted on
the one surface 31 of the metal plate 30 in this order from
5 the bottom. The one surface 31 of the metal plate 30 is an
upper surface of the metal plate 30 that is a surface of
the metal plate 30 on which the heat dissipation component
20 and the electronic component 10 are mounted.
[0014] Note that, in the first embodiment, a stacking
10 direction in which the electronic component 10, the heat
dissipation component 20, and the metal plate 30 are
stacked as illustrated in FIG. 1 corresponds to a vertical
direction. The vertical direction is a direction
perpendicular to an in-plane direction of the one surface
15 31 and the another surface 32 of the metal plate 30.
Moreover, the in-plane direction of the one surface 31 and
the another surface 32 of the metal plate 30 is parallel to
an upper surface 20a and a lower surface 20b of the heat
dissipation component 20 described later.
20 [0015] The electronic component 10 is a toroidal coil
including a core 11 and a winding 12 wound around the core
11, the core 11 being made of a magnetic material and
having an annular shape in the in-plane direction of the
one surface 31 of the metal plate 30. The electronic
25 component 10 is placed and held on the heat dissipation
component 20 while being laid transversely.
[0016] The electronic component 10 includes connection
terminals 41 attached to ends of the winding 12. The
electronic component 10 is connected, via the connection
30 terminals 41, to terminal blocks 42 installed on electronic
substrates 43 described later by screws 46.
[0017] Note that FIG. 1 illustrates the case where the
connection terminals 41, the terminal blocks 42, and the
8
screws 46 are used to connect the electronic component 10
and the electronic substrates 43, but the method of
connecting the electronic component 10 and the electronic
substrates 43 is not limited. For example, the electronic
5 component 10 and the electronic substrates 43 may be
connected by a method such as solder bonding.
[0018] The heat dissipation component 20 is sandwiched
between the one surface 31 of the metal plate 30 and the
electronic component 10. The heat dissipation component 20
10 has flexibility and elasticity. Flexibility is a property
in which a material is easily deformed. Elasticity is a
property in which a shape or volume of an object is changed
when a force is applied thereto, and the shape or volume is
restored when the applied force is removed, and is a
15 property having a repulsive force by which an object tries
to return to the original shape or volume when a force is
applied thereto.
[0019] The heat dissipation component 20 is fixed to the
one surface 31 of the metal plate 30 in a state in which
20 the lower surface 20b of the heat dissipation component 20
and the one surface 31 of the metal plate 30 are in
intimate contact with each other. In addition, with a
lower side of the electronic component 10 pressed against
the upper surface 20a of the heat dissipation component 20,
25 the heat dissipation component 20 is in intimate contact
with the electronic component 10 in a state in which, by
flexibility of the heat dissipation component 20, the shape
of a part of the heat dissipation component 20 on the side
of the upper surface 20a is deformed along the shape of the
30 electronic component 10 on the side of a lower surface 10a
to be described later. The lower side of the electronic
component 10 is a side of the electronic component 10
corresponding to the metal plate 30. The heat dissipation
9
component 20 is deformed almost to the maximum in terms of
flexibility to be able to hold the electronic component 10
in a state in which the electronic component 10 does not
move on the heat dissipation component 20.
5 [0020] The upper surface 20a of the heat dissipation
component 20 is a surface of the heat dissipation component
20 on a side where the electronic component 10 is disposed
in the stacking direction. The lower surface 20b of the
heat dissipation component 20 is a surface of the heat
10 dissipation component 20 on a side where the metal plate 30
is disposed in the stacking direction.
[0021] For the heat dissipation component 20, for
example, a heat dissipation sheet having insulation
properties is used. For example, when the upper surface
15 20a of the heat dissipation component 20, which is a
surface of the heat dissipation component 20 facing the
lower portion of the electronic component 10, is made
adhesive, the upper surface 20a of the heat dissipation
component 20 and the lower portion of the electronic
20 component 10 can be brought into intimate contact with each
other such that the upper surface 20a of the heat
dissipation component 20 and the lower portion of the
electronic component 10 are not separated from each other.
Note that a method of causing the upper surface 20a of the
25 heat dissipation component 20 and the lower portion of the
electronic component 10 to be in intimate contact with each
other so as not to peel off from each other is not limited.
[0022] Moreover, for example, when the lower surface 20b
of the heat dissipation component 20, which is a surface of
30 the heat dissipation component 20 facing the one surface 31
of the metal plate 30, is made adhesive, the lower surface
20b of the heat dissipation component 20 and the one
surface 31 of the metal plate 30 can be brought into
10
intimate contact with each other such that the lower
surface 20b of the heat dissipation component 20 and the
one surface 31 of the metal plate 30 are not separated from
each other. Note that a method of bringing the lower
5 surface 20b of the heat dissipation component 20 and the
one surface 31 of the metal plate 30 into intimate contact
with each other is not limited.
[0023] The heat dissipation component 20 may be fixed
while being stuck to the one surface 31 of the metal plate
10 30. Alternatively, contact surfaces between the heat
dissipation component 20 and the metal plate 30, that is,
the lower surface 20b of the heat dissipation component 20
and the one surface 31 of the metal plate 30 may be formed
with unevenness that fits together. In this case, when the
15 unevenness formed on the heat dissipation component 20 and
the metal plate 30 fits together, the heat dissipation
component 20 is fixed to the one surface 31 of the metal
plate 30.
[0024] In addition, the heat dissipation component 20
20 has a function of dissipating heat generated in the
electronic component 10 when the electronic component 10
operates. The heat dissipation component 20 is in direct
contact with the lower portion of the electronic component
10 as described above, thereby being thermally connected to
25 the electronic component 10. That is, the heat generated
in the electronic component 10 is transferred to the heat
dissipation component 20. The heat dissipation component
20 can then function as a heat dissipator that dissipates
the heat of the electronic component 10 transferred from
30 the electronic component 10.
[0025] Moreover, the heat dissipation component 20 is in
direct contact with the one surface 31 of the metal plate
30 as described above, thereby being thermally connected to
11
the metal plate 30. Thus, the heat dissipation component
20 has a function of transferring heat, which is generated
in the electronic component 10 when the electronic
component 10 operates, to the metal plate 30.
5 [0026] The metal plate 30 is a base substrate serving as
a base on which the heat dissipation component 20 and the
electronic component 10 are mounted in the electronic
component mounting structure 70. Also, the metal plate 30
has a function of dissipating the heat generated in the
10 electronic component 10 when the electronic component 10
operates. The metal plate 30 is thermally connected to the
electronic component 10 via the heat dissipation component
20. That is, the heat generated in the electronic
component 10 is transferred to the metal plate 30 via the
15 heat dissipation component 20. The metal plate 30 then
functions as a heat dissipator that dissipates the heat of
the electronic component 10 transferred via the heat
dissipation component 20.
[0027] In terms of the function of the base substrate
20 and the function as the heat dissipator that dissipates the
heat of the electronic component 10, the electronic
component mounting structure 70 adopts the metal plate 30
made of metal that is a material having relatively high
mechanical strength and thermal conductivity among various
25 materials.
[0028] Moreover, as illustrated in FIG. 1, above the one
surface 31 of the metal plate 30, two pieces of the
electronic substrates 43 are disposed so as to sandwich the
heat dissipation component 20 and the electronic component
30 10 in the in-plane direction of the one surface 31. On an
upper surface 43a of each of the electronic substrates 43,
the terminal block 42 is provided for electrically
connecting the connection terminal 41, which is attached to
12
the end of the winding 12 of the electronic component 10,
and the electronic substrate 43. The upper surface 43a of
the electronic substrate 43 is a surface opposite to a
surface of the electronic substrate 43 facing the side of
5 the metal plate 30. The electronic substrates 43 are each
held and fixed by a substrate holder 44 made of a material
such as resin.
[0029] The substrate holder 44 is attached and fixed to
the metal plate 30 via a column 45 fixed to the one surface
10 31 of the metal plate 30. That is, the substrate holder 44
is disposed above and away from the one surface 31 of the
metal plate 30, and holds the electronic substrate 43. A
gap 50 is formed between the substrate holder 44 and the
metal plate 30. Also, a gap 51 is formed between the
15 substrate holder 44 and the heat dissipation component 20.
[0030] In the electronic component mounting structure
70, the gap 51 is formed between the heat dissipation
component 20 and the substrate holder 44. Therefore, in
the electronic component mounting structure 70, heat can be
20 dissipated from a side surface of the heat dissipation
component 20 facing the substrate holder 44.
[0031] In the electronic component mounting structure 70
having the configuration described above, the heat
dissipation component 20 has flexibility, so that the heat
25 dissipation component 20 on which the electronic component
10 is mounted holds the electronic component 10 with the
upper surface 20a side of the heat dissipation component 20
being deformed along the shape of the lower portion of the
electronic component 10. The electronic component 10 is
30 thus held and fixed by the heat dissipation component 20
with the lower portion of the electronic component 10 being
buried in the heat dissipation component 20 and being in
intimate contact with the heat dissipation component 20 on
13
the side of the upper surface 20a.
[0032] More specifically, in the heat dissipation
component 20 on which the electronic component 10 is
mounted, the heat dissipation component 20 on the side of
5 the upper surface 20a is deformed along the shape of the
winding 12 of the electronic component 10, which generates
heat during the operation of the electronic component 10,
and the shape of the core 11 which is in contact with the
winding 12 and to which the heat generated in the winding
10 12 is transferred. The electronic component 10 is thus
held and fixed by the heat dissipation component 20 with
the lower portion of the electronic component 10 being
buried in the heat dissipation component 20, which is
deformed along the shape of the winding 12 and the shape of
15 the core 11 in the lower portion of the electronic
component 10, and with the winding 12 and the core 11 in
the lower portion of the electronic component 10 being in
intimate contact with the heat dissipation component 20 on
the side of the upper surface 20a.
20 [0033] That is, in the electronic component mounting
structure 70, the heat dissipation component 20 is deformed
along the uneven shape of the lower portion of the
electronic component 10 due to flexibility of the heat
dissipation component 20, and is in intimate contact with
25 the lower portion of the electronic component 10 along the
uneven shape of the lower portion of the electronic
component 10 to hold the electronic component 10.
[0034] Moreover, in the electronic component mounting
structure 70, the heat dissipation component 20 has
30 flexibility so that the lower surface 20b side of the heat
dissipation component 20 mounted on the metal plate 30 can
be deformed along the shape of the one surface 31 of the
metal plate 30. That is, in the electronic component
14
mounting structure 70, the heat dissipation component 20 is
deformed along the uneven shape of the one surface 31 of
the metal plate 30, and is fixed to the one surface 31 of
the metal plate 30 in intimate contact therewith along the
5 uneven shape of the one surface 31 of the metal plate 30.
[0035] Therefore, in the electronic component mounting
structure 70, a large contact area is secured between the
heat dissipation component 20 and the electronic component
10, and the adhesion between the heat dissipation component
10 20 and the electronic component 10 is enhanced. Moreover,
in the electronic component mounting structure 70, a large
contact area is secured between the heat dissipation
component 20 and the metal plate 30, and the adhesion
between the heat dissipation component 20 and the metal
15 plate 30 is enhanced.
[0036] As a result, the electronic component mounting
structure 70 can efficiently transfer the heat generated in
the electronic component 10 during the operation of the
electronic component 10 to the metal plate 30 via the heat
20 dissipation component 20, can reduce the thermal resistance
between the electronic component 10 and the metal plate 30,
and can enhance the performance of dissipating the heat
generated in the electronic component 10.
[0037] Moreover, in the electronic component mounting
25 structure 70, the heat dissipation component 20 is in
intimate contact with the electronic component 10 and the
metal plate 30, so that even when vibration is applied to
the electronic component mounting structure 70, vibration
of the electronic component 10 can be suppressed. Thus,
30 with the vibration of the electronic component 10 being
suppressed, the connection terminals 41 or the terminal
blocks 42, which are a connector between the electronic
component 10 and the electronic substrates 43, do not
15
experience a fatigue failure due to the vibration of the
electronic component 10. The connector between the
electronic component 10 and the electronic substrates 43
includes the connection terminals 41, the terminal blocks
5 42, and the screws 46.
[0038] Moreover, in the electronic component mounting
structure 70, the gaps 51 are formed between the heat
dissipation component 20 and the substrate holders 44, so
that the substrate holders 44 do not obstruct the
10 deformation of the heat dissipation component 20 in the inplane direction of the one surface 31 of the metal plate
30. As a result, in the electronic component mounting
structure 70, the heat dissipation component 20 is easily
brought into intimate contact with the lower portion of the
15 electronic component 10 along the shape of the lower
portion of the electronic component 10, and is also easily
brought into intimate contact with the one surface 31 of
the metal plate 30 along the uneven shape of the one
surface 31.
20 [0039] Moreover, in the electronic component mounting
structure 71, the electronic component 10 has the annular
shape in the in-plane direction of the one surface 31 of
the metal plate 30 and is laid transversely. Then, in the
electronic component mounting structure 71, the lower
25 surface 10a of the electronic component 10, which is a
surface orthogonal to a central axis C of the annular shape
of the electronic component 10, is disposed in contact with
the upper surface 20a of the heat dissipation component 20
while facing the upper surface 20a. The lower surface 10a
30 of the electronic component 10 includes a lower surface of
the core 11 and the winding 12 wound around the lower
surface of the core 11.
[0040] In the electronic component mounting structure 70
16
having the configuration described above, the heat
dissipation component 20 is attached to the lower surface
10a that is the surface orthogonal to the central axis C of
the electronic component 10. That is, in the electronic
5 component mounting structure 71, the electronic component
10 is mounted with the lower surface 10a facing the upper
surface 20a of the heat dissipation component 20, the lower
surface 10a being a surface having a relatively larger
contact area with the upper surface 20a of the heat
10 dissipation component 20, which is the surface of the heat
dissipation component 20 on which the electronic component
10 is mounted, than with other surfaces of the heat
dissipation component 20 when the electronic component 10
is laid transversely and mounted on the heat dissipation
15 component 20. Therefore, it can be said that the
electronic component 10 has the annular shape in the inplane direction of the one surface 31 of the metal plate
30, and is disposed in the state in which the lower surface
10a orthogonal to the central axis C of the annular shape
20 of the electronic component 10 faces and is in contact with
the upper surface 20a of the heat dissipation component 20.
[0041] Therefore, in the electronic component mounting
structure 70, a large contact area can be secured between
the electronic component 10 and the heat dissipation
25 component 20. As a result, in the electronic component
mounting structure 71, the adhesion between the electronic
component 10 and the heat dissipation component 20 is
further enhanced, so that it is possible to more
effectively prevent the connection terminals 41 or the
30 terminal blocks 42, which are the connector between the
electronic component 10 and the electronic substrates 43,
from experiencing a fatigue failure due to the vibration of
the electronic component 10.
17
[0042] Moreover, the electronic component mounting
structure 71 can secure the large contact area between the
electronic component 10 and the heat dissipation component
20, thereby being able to more effectively transfer the
5 heat generated in the electronic component 10 during the
operation of the electronic component 10 efficiently to the
metal plate 30 via the heat dissipation component 20,
reduce the thermal resistance between the electronic
component 10 and the metal plate 30, and enhance the
10 performance of dissipating the heat generated in the
electronic component 10. Thus, by enhancing the
performance of dissipating the heat generated in the
electronic component 10, the electronic component mounting
structure 71 can prevent an increase in temperature of the
15 electronic component 10 and prevent malfunction of the
electronic component 10 due to an increase in temperature
of the electronic component 10.
[0043] Note that although the case where the electronic
component 10 is the toroidal coil has been described above,
20 the type of the electronic component 10 is not limited to
the toroidal coil.
[0044] As described above, in the electronic component
mounting structure 71, the heat dissipation component 20
having flexibility and elasticity is in intimate contact
25 with the electronic component 10 and the metal plate 30, so
that vibration of the electronic component 10 can be
suppressed. As a result, in the electronic component
mounting structure 71, it is possible to prevent the
occurrence of a fatigue failure in the connector between
30 the electronic component 10 and the electronic substrates
43 due to vibration of the electronic component 10 during
product transportation.
[0045] Therefore, the electronic component mounting
18
structure 70 according to the first embodiment has an
effect of being able to enhance the performance of
dissipating the heat of the electronic component 10 by
enhancing the heat transfer performance from the electronic
5 component 10 to the metal plate 30, and also to suppress
the vibration of the electronic component 10.
[0046] Second Embodiment.
FIG. 3 is a side view illustrating an electronic
component mounting structure 71 according to a second
10 embodiment. FIG. 4 is a top view illustrating the
electronic component mounting structure 71 according to the
second embodiment. Note that in the second embodiment,
components identical to those in the first embodiment
described above are denoted by the same reference numerals
15 as those assigned to such components in the first
embodiment, and a detailed description thereof will be
omitted.
[0047] The electronic component mounting structure 71
according to the second embodiment is different from the
20 electronic component mounting structure 70 according to the
first embodiment described above in that the heat
dissipation component 20 has a disk shape to match the
shape of the electronic component 10 in the in-plane
direction of the one surface 31 of the metal plate 30.
25 [0048] The electronic component mounting structure 71
having the configuration described above has the same
structure as the electronic component mounting structure 70
according to the first embodiment described above except
that the heat dissipation component 20 has the disk shape
30 in the in-plane direction of the one surface 31 of the
metal plate 30. Therefore, the electronic component
mounting structure 71 has an effect similar to that of the
electronic component mounting structure 70 according to the
19
first embodiment.
[0049] Also, the electronic component mounting structure
71 uses the heat dissipation component 20 having the shape
along the shape of the electronic component 10 in the in5 plane direction of the one surface 31 of the metal plate
30. Therefore, in the electronic component mounting
structure 71, the heat dissipation component 20 can be
reduced in size while leaving a portion of the heat
dissipation component 20 that effectively dissipates the
10 heat generated in the electronic component 10. The portion
of the heat dissipation component 20 that effectively
dissipates the heat generated in the electronic component
10 is a region of the heat dissipation component 20
corresponding to the annular shape of the electronic
15 component 10 in the in-plane direction of the one surface
31 of the metal plate 30.
[0050] That is, in the electronic component mounting
structure 71, the electronic component 10 has a disk shape
in the in-plane direction of the one surface 31 of the
20 metal plate 30. It can then be said that the heat
dissipation component 20 has the disk shape that is larger
than the disk shape of the electronic component 10 and
follows the shape of the electronic component 10 in the inplane direction of the one surface 31 of the metal plate
25 30. In the in-plane direction of the one surface 31 of the
metal plate 30, the disk shape of the electronic component
10 and the disk shape of the heat dissipation component 20
are disposed coaxially.
[0051] As a result, the electronic component mounting
30 structure 71 can, at a lower cost than the electronic
component mounting structure 70 according to the first
embodiment described above, enhance the performance of
dissipating the heat of the electronic component 10 by
20
enhancing the heat transfer performance from the electronic
component 10 to the metal plate 30 and also suppress the
vibration of the electronic component 10. Therefore, the
electronic component mounting structure 71 can, at a lower
5 cost than the electronic component mounting structure 70,
prevent the connection terminals 41 or the terminal blocks
42, which are the connector between the electronic
component 10 and the electronic substrates 43, from
experiencing a fatigue failure due to the vibration of the
10 electronic component 10 during product transportation.
[0052] Third Embodiment.
FIG. 5 is an exploded side view illustrating an
electronic component mounting structure 72 according to a
third embodiment. Note that in the third embodiment,
15 components identical to those in the first embodiment
described above are denoted by the same reference numerals
as those assigned to such components in the first
embodiment, and a detailed description thereof will be
omitted.
20 [0053] The electronic component mounting structure 72
according to the third embodiment is different from the
electronic component mounting structure 70 according to the
first embodiment described above in that a recess 23 having
a shape along the shape of the lower portion of the
25 electronic component 10 is formed in the heat dissipation
component 20 on the side of the upper surface 20a.
[0054] The electronic component mounting structure 72
having the configuration described above has the same
structure as the electronic component mounting structure 70
30 according to the first embodiment described above except
that the recess 23 having the shape along the shape of the
lower portion of the electronic component 10 is formed in
the heat dissipation component 20 on the side of the upper
21
surface 20a. Therefore, the electronic component mounting
structure 72 has an effect similar to that of the
electronic component mounting structure 70 according to the
first embodiment.
5 [0055] In the electronic component mounting structure 72
having the configuration described above, it can be said
that the heat dissipation component 20 includes the recess
23 formed along the shape of a contact portion where the
electronic component 10 is in contact with the heat
10 dissipation component 20. Therefore, in the electronic
component mounting structure 72, the heat dissipation
component 20 is more easily brought into intimate contact
with the lower portion of the electronic component 10. As
a result, the electronic component mounting structure 72
15 can, more effectively than the electronic component
mounting structure 70 according to the first embodiment
described above, enhance the performance of dissipating the
heat of the electronic component 10 by enhancing the heat
transfer performance from the electronic component 10 to
20 the metal plate 30 and also suppress the vibration of the
electronic component 10. Therefore, the electronic
component mounting structure 72 can, more effectively than
the electronic component mounting structure 70, prevent the
connection terminals 41 or the terminal blocks 42, which
25 are the connector between the electronic component 10 and
the electronic substrates 43, from experiencing a fatigue
failure due to the vibration of the electronic component 10
during product transportation.
[0056] Fourth Embodiment.
30 FIG. 6 is a side view illustrating an electronic
component mounting structure 73 according to a fourth
embodiment. FIG. 7 is a top view illustrating the
electronic component mounting structure 73 according to the
22
fourth embodiment. Note that in the fourth embodiment,
components identical to those in the first embodiment
described above are denoted by the same reference numerals
as those assigned to such components in the first
5 embodiment, and a detailed description thereof will be
omitted.
[0057] The electronic component mounting structure 73
according to the fourth embodiment is different from the
electronic component mounting structure 70 according to the
10 first embodiment described above in that the heat
dissipation component 20 includes a first heat dissipation
component 21 and a second heat dissipation component 22 as
two types of the heat dissipation components 20 having
different flexibility and elasticity, the first heat
15 dissipation component 21 having relatively high flexibility
is disposed at a portion in contact with the electronic
component 10, and the second heat dissipation component 22
having relatively high elasticity is disposed at a portion
not in contact with the electronic component 10.
20 [0058] The electronic component mounting structure 73
having the configuration described above has the same
structure as the electronic component mounting structure 70
according to the first embodiment described above except
that the heat dissipation component 20 includes the first
25 heat dissipation component 21 and the second heat
dissipation component 22 as the two types of the heat
dissipation components 20 having different flexibility and
elasticity, and the first heat dissipation component 21
having relatively high flexibility is disposed on a surface
30 in contact with the electronic component 10. Therefore,
the electronic component mounting structure 73 has an
effect similar to that of the electronic component mounting
structure 70 according to the first embodiment.
23
[0059] The first heat dissipation component 21 is the
heat dissipation component 20 having flexibility and
elasticity in the electronic component mounting structure
73, and is the heat dissipation component 20 having
5 relatively higher flexibility than the second heat
dissipation component 22.
[0060] Moreover, the second heat dissipation component
22 is the heat dissipation component 20 having flexibility
and elasticity in the electronic component mounting
10 structure 73, and is the heat dissipation component 20
having relatively higher elasticity than the first heat
dissipation component 21.
[0061] Then, in the electronic component mounting
structure 73, the first heat dissipation component 21
15 having relatively high flexibility is disposed at the
portion in contact with the electronic component 10.
Specifically, in the electronic component mounting
structure 73, the first heat dissipation component 21 is
provided in a quadrangular shape containing the core 11 of
20 the electronic component 10 in the in-plane direction of
the one surface 31 of the metal plate 30.
[0062] By including the heat dissipation component 20
having such a configuration, the electronic component
mounting structure 73 secures a large contact area between
25 the heat dissipation component 20 and the electronic
component 10 and also enhances the adhesion between the
heat dissipation component 20 and the electronic component
10, as described in the first embodiment. As a result, the
electronic component mounting structure 73 can efficiently
30 transfer the heat generated in the electronic component 10
during the operation of the electronic component 10 to the
metal plate 30 via the heat dissipation component 20, can
reduce the thermal resistance between the electronic
24
component 10 and the metal plate 30, and can enhance the
performance of dissipating the heat generated in the
electronic component 10.
[0063] Moreover, in the electronic component mounting
5 structure 73, the second heat dissipation component 22
having relatively high elasticity is disposed at the
portion not in contact with the electronic component 10.
Specifically, in the electronic component mounting
structure 73, the second heat dissipation component 22 is
10 formed in a frame shape that encloses the quadrangular
shape of the first heat dissipation component 21 from an
outer edge side of the first heat dissipation component 21
in the in-plane direction of the one surface 31 of the
metal plate 30. That is, the first heat dissipation
15 component 21 and the second heat dissipation component 22
are placed in a way that, in the in-plane direction of the
one surface 31 of the metal plate 30, the first heat
dissipation component 21 having relatively high flexibility
is placed in a region close to the central axis C of the
20 electronic component 10, and the second heat dissipation
component 22 having relatively high elasticity is placed in
a region far from the central axis C of the electronic
component 10. Note that the height of the first heat
dissipation component 21 is set equal to the height of the
25 second heat dissipation component 22.
[0064] With the second heat dissipation component 22
configured as described above, in the electronic component
mounting structure 73, when vibration is applied to the
electronic component mounting structure 73, deformation of
30 the first heat dissipation component 21 due to flexibility
thereof toward the outer edge of the quadrangular shape of
the first heat dissipation component 21 in the in-plane
direction of the one surface 31 of the metal plate 30 is
25
prevented by elasticity of the second heat dissipation
component 22 having relatively high elasticity. That is,
in the electronic component mounting structure 73,
deformation of the first heat dissipation component 21 is
5 prevented by elasticity of the second heat dissipation
component 22, so that vibration of the electronic component
10 can be suppressed.
[0065] As a result, as with the electronic component
mounting structure 70 according to the first embodiment
10 described above, the electronic component mounting
structure 73 can suppress the vibration of the electronic
component 10 even when vibration is applied to the
electronic component mounting structure 70. Thus, with the
vibration of the electronic component 10 being suppressed,
15 the connection terminals 41 or the terminal blocks 42,
which are the connector between the electronic component 10
and the electronic substrates 43, do not experience a
fatigue failure due to the vibration of the electronic
component 10. Therefore, the electronic component mounting
20 structure 73 in which the heat dissipation component 20
includes the first heat dissipation component 21 and the
second heat dissipation component 22 also obtains an effect
similar to that of the heat dissipation component 20 of the
electronic component mounting structure 70 according to the
25 first embodiment.
[0066] Note that the above description has described the
case where, in the in-plane direction of the one surface 31
of the metal plate 30, the first heat dissipation component
21 is placed in the region close to the central axis C of
30 the electronic component 10, and the second heat
dissipation component 22 is placed in the region far from
the central axis C of the electronic component 10, but the
placement of the first heat dissipation component 21 and
26
the second heat dissipation component 22 is not limited to
the placement described above. The placement of the first
heat dissipation component 21 and the second heat
dissipation component 22 can be changed as appropriate
5 without departing from the essence and scope of the effect
of the electronic component mounting structure 73 according
to the fourth embodiment described above.
[0067] Fifth Embodiment.
FIG. 8 is a side view illustrating an electronic
10 component mounting structure 74 according to a fifth
embodiment. FIG. 9 is a top view illustrating the
electronic component mounting structure 74 according to the
fifth embodiment. Note that in the fifth embodiment,
components identical to those in the first embodiment
15 described above are denoted by the same reference numerals
as those assigned to such components in the first
embodiment, and a detailed description thereof will be
omitted.
[0068] The electronic component mounting structure 74
20 according to the fifth embodiment is different from the
electronic component mounting structure 70 according to the
first embodiment described above in that the heat
dissipation component 20 is also disposed between the
substrate holders 44, which fix and hold the electronic
25 substrates 43, and the metal plate 30 in the in-plane
direction of the one surface 31 of the metal plate 30.
[0069] The electronic component mounting structure 74
having the configuration described above has the same
structure as the electronic component mounting structure 70
30 according to the first embodiment described above except
that the heat dissipation component 20 is also disposed
between the substrate holders 44, which fix and hold the
electronic substrates 43, and the metal plate 30 in the in-
27
plane direction of the one surface 31 of the metal plate
30. Therefore, the electronic component mounting structure
74 has an effect similar to that of the electronic
component mounting structure 70 according to the first
5 embodiment.
[0070] In the electronic component mounting structure
74, the heat dissipation component 20 disposed in the gaps
50 between the substrate holders 44 and the metal plate 30
is deformed by the downward pressing force received from
10 the substrate holders 44 and is in intimate contact with
the one surface 31 of the metal plate 30. As a result, the
electronic substrates 43 held by the substrate holders 44
are thermally connected to the one surface 31 of the metal
plate 30 via the substrate holders 44 and the heat
15 dissipation component 20. The downward pressing force
received from the substrate holders 44 is a pressing force
received from the substrate holders 44 in a direction
perpendicular to the in-plane direction of the one surface
31 of the metal plate 30, and is a pressing force in a
20 direction from the heat dissipation component 20 toward the
metal plate 30.
[0071] In the electronic component mounting structure
74, after the heat dissipation component 20 is disposed on
the one surface 31 of the metal plate 30 including the gaps
25 50 between the substrate holders 44 and the metal plate 30,
the substrate holders 44 are attached and fixed to the
metal plate 30 via the columns 45 fixed to the one surface
31 of the metal plate 30. As a result, the downward
pressing force described above is applied to the heat
30 dissipation component 20 between the substrate holders 44
and the metal plate 30 from the side of the upper surface
20a of the heat dissipation component 20 toward the metal
plate 30. Note that in this case, the heat dissipation
28
component 20 disposed between the substrate holders 44 and
the metal plate 30 is provided with through holes through
which the columns 45 pass.
[0072] Therefore, in the fifth embodiment, the
5 electronic component mounting structure is realized in
which the substrate holders 44 are provided above and away
from the one surface 31 of the metal plate 30, a part of
the heat dissipation component 20 is sandwiched between the
lower surfaces of the electronic substrates 43 protruding
10 from the substrate holders 44 in the in-plane direction of
the metal plate 30 or the lower surfaces of the substrate
holders 44 and the one surface 31 of the metal plate 30, is
deformed by the force applied downward from the substrate
holders 44, and is in intimate contact with the one surface
15 31 of the metal plate 30, and the electronic component 10
and the electronic substrates 43 are electrically connected
via a part of the heat dissipation component 20.
[0073] In the electronic component mounting structure
74, the heat dissipation component 20 disposed between the
20 substrate holders 44 and the metal plate 30 is deformed by
the downward pressing force received from the substrate
holders 44, so that the adhesion between the heat
dissipation component 20 and the metal plate 30 is further
improved. As a result, the electronic component mounting
25 structure 74 can more reliably, than the electronic
component mounting structure 70 according to the first
embodiment described above, enhance the performance of
dissipating the heat of the electronic component 10 by
enhancing the heat transfer performance from the electronic
30 component 10 to the metal plate 30 and also suppress the
vibration of the electronic component 10. Therefore, the
electronic component mounting structure 74 can more
reliably, than the electronic component mounting structure
29
70, prevent the connection terminals 41 or the terminal
blocks 42, which are the connector between the electronic
component 10 and the electronic substrates 43, from
experiencing a fatigue failure due to the vibration of the
5 electronic component 10 during product transportation.
[0074] Moreover, in the electronic component mounting
structure 74, the heat dissipation component 20 is in the
gaps 50 between the substrate holders 44 and the metal
plate 30, whereby the electronic substrates 43 are
10 thermally connected to the one surface 31 of the metal
plate 30 via the substrate holders 44 and the heat
dissipation component 20 disposed in the gaps 50.
Therefore, in the electronic component mounting structure
74, heat generated in the electronic substrates 43 during
15 the operation of the electronic substrates 43 can be
transferred to the metal plate 30 via the substrate holders
44 and the heat dissipation component 20 disposed in the
gaps 50. As a result, the electronic component mounting
structure 74 can enhance the performance of dissipating the
20 heat generated in the electronic substrates 43 and cool the
electronic substrates 43. By cooling the electronic
substrates 43, the electronic component mounting structure
74 can prevent an increase in temperature of the electronic
substrates 43 and prevent malfunction of the electronic
25 substrates 43 due to an increase in temperature of the
electronic substrates 43.
[0075] Sixth Embodiment.
FIG. 10 is a side view illustrating an electronic
component mounting structure 75 according to a sixth
30 embodiment. FIG. 11 is a top view illustrating the
electronic component mounting structure 75 according to the
sixth embodiment. Note that in the sixth embodiment,
components identical to those in the first embodiment
30
described above are denoted by the same reference numerals
as those assigned to such components in the first
embodiment, and a detailed description thereof will be
omitted.
5 [0076] The electronic component mounting structure 75
according to the sixth embodiment is different from the
electronic component mounting structure 70 according to the
first embodiment described above in that the electronic
substrate 43 and the substrate holder 44 each include an
10 opening formed in a region corresponding to a position
where the electronic component 10 is disposed.
[0077] That is, in the first embodiment, as illustrated
in FIGS. 1 and 2, the two pieces of the electronic
substrates 43 are disposed so as to sandwich the heat
15 dissipation component 20 and the electronic component 10 in
the in-plane direction of the one surface 31 of the metal
plate 30. Also, in the first embodiment, as illustrated in
FIGS. 1 and 2, the two pieces of the substrate holders 44
are disposed so as to sandwich the heat dissipation
20 component 20 and the electronic component 10 in the inplane direction of the one surface 31 of the metal plate
30.
[0078] On the other hand, in the electronic component
mounting structure 75, as illustrated in FIGS. 10 and 11,
25 one piece of the substrate holder 44 is disposed above the
one surface 31 of the metal plate 30. Also, in the
electronic component mounting structure 75, as illustrated
in FIGS. 10 and 11, one piece of the electronic substrate
43 is held by the one piece of the substrate holder 44.
30 [0079] In addition, in the electronic substrate 43, an
opening 43b is formed in the region corresponding to the
position where the electronic component 10 is disposed in
the in-plane direction of the one surface 31 of the metal
31
plate 30. Likewise, in the substrate holder 44, an opening
44a is formed in the region corresponding to the position
where the electronic component 10 is disposed in the inplane direction of the one surface 31 of the metal plate
5 30.
[0080] The opening 43b of the electronic substrate 43 is
formed at the position containing the opening 44a of the
substrate holder 44 in the in-plane direction of the one
surface 31 of the metal plate 30. Also, the opening 44a of
10 the substrate holder 44 and the opening 43b of the
electronic substrate 43 are formed at the positions
containing the core 11 of the electronic component 10 in
the in-plane direction of the one surface 31 of the metal
plate 30.
15 [0081] Also, in the electronic component mounting
structure 75, as with the electronic component mounting
structure 74 according to the fifth embodiment described
above, the heat dissipation component 20 is also disposed
between the substrate holder 44, which fixes and holds the
20 electronic substrate 43, and the metal plate 30 in the inplane direction of the one surface 31 of the metal plate
30. The electronic component 10 is disposed while
protruding upward from the opening 44a of the substrate
holder 44 and the opening 43b of the electronic substrate
25 43. Moreover, a part of the heat dissipation component 20
is exposed from the opening 44a of the substrate holder 44
and the opening 43b of the electronic substrate 43.
[0082] In the electronic component mounting structure 75
having the configuration described above, the electronic
30 component 10 is disposed inside the opening 44a formed in
the substrate holder 44 and the opening 43b formed in the
electronic substrate 43 in the in-plane direction of the
one surface 31 of the metal plate 30, whereby the
32
electronic component 10 and the electronic substrate 43 can
be attached closer to each other. As a result, the
electronic component mounting structure 75 can realize the
mounting structure of the electronic component 10 in a
5 small size and at a low cost.
[0083] Note that the above description has described the
case where the opening 44a is formed in the substrate
holder 44 and the opening 43b is formed in the electronic
substrate 43, but the structure that allows the electronic
10 component 10 and the electronic substrate 43 to be attached
close to each other as described above is not limited to
the structure in which the opening 44a and the opening 43b
are formed.
[0084] For example, in the electronic component mounting
15 structure 70 illustrated in FIG. 1 and FIG. 2 of the first
embodiment described above, a case will be considered in
which the electronic component 10 is brought closer to the
substrate holders 44 and the electronic substrates 43 in a
way that the electronic substrates 43 and the substrate
20 holders 44 do not overlap with the electronic component 10
in the in-plane direction of the one surface 31 of the
metal plate 30.
[0085] FIG. 12 is a side view illustrating another
electronic component mounting structure 76 according to the
25 sixth embodiment. FIG. 13 is a top view illustrating the
another electronic component mounting structure 76
according to the sixth embodiment. The another electronic
component mounting structure 76 according to the sixth
embodiment is different from the electronic component
30 mounting structure 75 according to the sixth embodiment
described above in that the electronic substrate 43 and the
substrate holder 44 each include a cutout formed in the
region corresponding to the position where the electronic
33
component 10 is disposed.
[0086] As illustrated in FIGS. 12 and 13, in the another
electronic component mounting structure 76, one piece of
the substrate holder 44 is disposed above the one surface
5 31 of the metal plate 30 as with the electronic component
mounting structure 75 according to the sixth embodiment
described above. Also, as illustrated in FIGS. 12 and 13,
in the another electronic component mounting structure 76,
one piece of the electronic substrate 43 is held by the one
10 piece of the substrate holder 44 as with the electronic
component mounting structure 75 according to the sixth
embodiment described above.
[0087] In addition, in the electronic substrate 43, a
cutout 43c is formed in the region corresponding to the
15 position where the electronic component 10 is disposed in
the in-plane direction of the one surface 31 of the metal
plate 30. Likewise, in the substrate holder 44, a cutout
44b is formed in the region corresponding to the position
where the electronic component 10 is disposed in the in20 plane direction of the one surface 31 of the metal plate
30.
[0088] The cutout 43c of the electronic substrate 43 is
formed at a position containing the cutout 44b of the
substrate holder 44 except for a part of the side on which
25 the cutout 43c is open in the in-plane direction of the one
surface 31 of the metal plate 30. Also, the cutout 44b of
the substrate holder 44 and the cutout 43c of the
electronic substrate 43 are formed at positions containing
the core 11 of the electronic component 10 in the in-plane
30 direction of the one surface 31 of the metal plate 30.
[0089] As with the electronic component mounting
structure 75 according to the sixth embodiment described
above, in the another electronic component mounting
34
structure 76, the heat dissipation component 20 is also
disposed between the substrate holder 44, which fixes and
holds the electronic substrate 43, and the metal plate 30
in the in-plane direction of the one surface 31 of the
5 metal plate 30. The electronic component 10 is disposed
while protruding upward from the cutout 44b of the
substrate holder 44 and the cutout 43c of the electronic
substrate 43. Moreover, a part of the heat dissipation
component 20 is exposed from the cutout 44b of the
10 substrate holder 44 and the cutout 43c of the electronic
substrate 43.
[0090] In the another electronic component mounting
structure 76 having the configuration described above, the
electronic component 10 is disposed inside the cutout 44b
15 formed in the substrate holder 44 and the cutout 43c formed
in the electronic substrate 43 in the in-plane direction of
the one surface 31 of the metal plate 30, whereby the
electronic component 10 and the electronic substrate 43 can
be attached closer to each other as with the electronic
20 component mounting structure 75 according to the sixth
embodiment described above. As a result, the another
electronic component mounting structure 76 can realize the
mounting structure of the electronic component 10 in a
small size and at a low cost, as with the electronic
25 component mounting structure 75 according to the sixth
embodiment described above.
[0091] Therefore, in the sixth embodiment, the
electronic component mounting structure is realized in
which the opening or the cutout is formed in each of the
30 the electronic substrate 43 and the substrate holder 44 at
the position where the electronic component 10 is disposed
in the in-plane direction of the metal plate 30.
[0092] The structure with the opening 44a formed in the
35
substrate holder 44 and the opening 43b formed in the
electronic substrate 43, or the structure with the cutouts
formed in the substrate holder 44 and the electronic
substrate 43 may be selected at will.
5 [0093] Seventh Embodiment.
FIG. 14 is a block diagram illustrating a
configuration of an air conditioner 80 according to a
seventh embodiment. FIG. 15 is a refrigerant circuit
diagram illustrating a refrigeration cycle 110 of the air
10 conditioner 80 according to the seventh embodiment. As
illustrated in FIGS. 14 and 15, the air conditioner 80
according to the seventh embodiment includes an indoor unit
80a installed indoors and an outdoor unit 80b installed
outdoors. Note that, in the drawings, common elements are
15 assigned the same reference numerals, and redundant
description will be omitted.
[0094] In the air conditioner 80, the indoor unit 80a,
refrigerant piping 152, the outdoor unit 80b, and
refrigerant piping 151 form a refrigerant circulation
20 circuit. Also, in the air conditioner 80, a compressor
132, a four-way valve 131, an outdoor heat exchanger 133,
an expansion valve 123, and an indoor heat exchanger 121
are sequentially connected in a loop using the refrigerant
piping 151 and the refrigerant piping 152 to form the
25 refrigeration cycle 110. The refrigerant piping 151 and
the refrigerant piping 152 are piping for connecting the
indoor heat exchanger 121 of the indoor unit 80a and the
outdoor heat exchanger 133 of the outdoor unit 80b and
circulating the refrigerant, and serve as a part of a
30 refrigerant circuit in the refrigeration cycle 110 of the
air conditioner 80.
[0095] Moreover, in the indoor unit 80a, an indoor
blower 122 is installed for forming an airflow that passes
36
through the indoor heat exchanger 121. The indoor blower
122 operates when an indoor propeller 122a is driven by an
indoor motor 122b.
[0096] Also, in the outdoor unit 80b, an outdoor blower
5 134 is installed for forming an airflow that passes through
the outdoor heat exchanger 133. The outdoor blower 134
operates when an outdoor propeller 134a is driven by an
outdoor motor 134b.
[0097] FIG. 16 is a first conceptual diagram
10 illustrating a configuration of the outdoor unit 80b of the
air conditioner 80 to which the electronic component
mounting structure according to any one of the first
embodiment to the sixth embodiment is attached. FIG. 16
illustrates the conceptual diagram when the outdoor unit
15 80b is viewed from above. FIG. 17 is a second conceptual
diagram illustrating the configuration of the outdoor unit
80b of the air conditioner 80 to which the electronic
component mounting structure according to any one of the
first embodiment to the sixth embodiment is attached. FIG.
20 17 illustrates the conceptual diagram when the outdoor unit
80b is viewed from the side. FIG. 18 is a third conceptual
diagram illustrating the configuration of the outdoor unit
80b of the air conditioner 80 to which the electronic
component mounting structure according to any one of the
25 first embodiment to the sixth embodiment is attached. FIG.
18 illustrates the conceptual diagram when the outdoor unit
80b is viewed obliquely from above. FIGS. 16 to 18
illustrate a part of the structure of the outdoor unit 80b
seen when a part of a housing 61 of the outdoor unit 80b is
30 removed.
[0098] The outdoor unit 80b of the air conditioner 80
has a structure in which the metal plate 30 of the
electronic component mounting structure according to any
37
one of the first embodiment to the sixth embodiment serves
as a partition, and the inside of the housing 61 having the
shape of a rectangular parallelepiped box is divided into a
machine chamber 63 and a blower chamber 64. In the case
5 where the metal plate 30 serves as the partition, reference
characters “30, 62” in FIGS. 16 to 18 are to be understood
as reference character “30”. Inside the housing 61, the
electronic component 10 is disposed in the machine chamber
63, and the outdoor blower 134 is disposed in the blower
10 chamber 64. Also, the compressor 132 is disposed in the
machine chamber 63. Moreover, the outdoor heat exchanger
133 is disposed in the blower chamber 64.
[0099] In the outdoor unit 80b configured as described
above, heat generated in the electronic component 10 and
15 transferred to the metal plate 30 via the heat dissipation
component 20 is discharged to the air on the side of the
blower chamber 64, whereby the performance of dissipating
the heat of the electronic component 10 or the metal plate
30 is greatly improved, and the electronic component 10 can
20 be efficiently cooled. Note that a heat radiator may be
attached to the metal plate 30. The heat radiator
includes, for example, a metal heat sink.
[0100] Moreover, in the outdoor unit 80b of the air
conditioner 80, the another surface 32 side of the metal
25 plate 30 may be attached to an attachment plate 62, and the
attachment plate 62 may serve as a partition to divide the
inside of the housing 61 having the shape of the
rectangular parallelepiped box into the machine chamber 63
and the blower chamber 64. In the case where the
30 attachment plate 62 serves as the partition, reference
characters “30, 62” in FIGS. 16 to 18 are to be understood
as reference character “62”.
[0101] In the outdoor unit 80b configured as described
38
above, the another surface 32 side of the metal plate 30 is
attached to the attachment plate 62, so that the electronic
component mounting structure can be detachably attached to
the outdoor unit 80b more easily, and assemblability of the
5 outdoor unit 80b and maintenance service performance of the
outdoor unit 80b can be improved.
[0102] The structure of attaching the another surface 32
of the metal plate 30 to the attachment plate 62 includes
screwing and the like, but the structure of attaching the
10 another surface 32 of the metal plate 30 to the attachment
plate 62 is not limited. The structure of attaching the
another surface 32 of the metal plate 30 to the attachment
plate 62 can be changed as appropriate without departing
from the essence and scope of the effect of the structure
15 of attaching the another surface 32 of the metal plate 30
to the attachment plate 62.
[0103] The configurations illustrated in the above
embodiments each illustrate an example so that another
known technique can be combined, the embodiments can be
20 combined together, or the configurations can be partially
omitted and/or modified without departing from the scope of
the present disclosure.
Reference Signs List
25 [0104] 10 electronic component; 10a lower surface; 11
core; 12 winding; 20 heat dissipation component; 20a, 43a
upper surface; 20b lower surface; 21 first heat
dissipation component; 22 second heat dissipation
component; 23 recess; 30 metal plate; 31 one surface; 32
30 another surface; 41 connection terminal; 42 terminal
block; 43 electronic substrate; 43b, 44a opening; 43c,
44b cutout; 44 substrate holder; 45 column; 46 screw;
50, 51 gap; 61 housing; 62 attachment plate; 63 machine
39
chamber; 64 blower chamber; 70, 71, 72, 73, 74, 75
electronic component mounting structure; 76 another
electronic component mounting structure; 80 air
conditioner; 80a indoor unit; 80b outdoor unit; 110
5 refrigeration cycle; 121 indoor heat exchanger; 122
indoor blower; 122a indoor propeller; 122b indoor motor;
123 expansion valve; 131 four-way valve; 132 compressor;
133 outdoor heat exchanger; 134 outdoor blower; 134a
outdoor propeller; 134b outdoor motor; 151, 152
10 refrigerant piping; C central axis.

We Claim :
[Claim 1] An electronic component mounting structure
comprising:
an electronic component;
5 a metal plate including one surface and another
surface; and
a heat dissipation component having flexibility and
elasticity, wherein
the heat dissipation component is sandwiched between
10 the one surface of the metal plate and the electronic
component with a region of the heat dissipation component
that faces the electronic component being deformed along a
shape of the electronic component and being in intimate
contact with the electronic component, and the heat
15 dissipation component being in intimate contact with the
one surface of the metal plate, and
the electronic component and the metal plate are
thermally connected via the heat dissipation component.
20 [Claim 2] The electronic component mounting structure
according to claim 1, wherein
the electronic component is a coil including a core
made of a magnetic material and a winding wound around the
core.
25
[Claim 3] The electronic component mounting structure
according to claim 1 or 2, comprising:
a substrate holder disposed above the one surface of
the metal plate; and an electronic substrate held on the
30 substrate holder, wherein
the electronic component and the electronic substrate
are electrically connected via a connector between the
electronic component and the electronic substrate.
41
[Claim 4] The electronic component mounting structure
according to any one of claims 1 to 3, wherein
the electronic component has an annular shape in an
5 in-plane direction of the metal plate, and is disposed in a
state in which a lower surface of the electronic component
orthogonal to a central axis of the annular shape of the
electronic component faces and is in contact with an upper
surface of the heat dissipation component.
10
[Claim 5] The electronic component mounting structure
according to claim 4, wherein
the heat dissipation component has a disk shape along
the shape of the electronic component in the in-plane
15 direction of the metal plate.
[Claim 6] The electronic component mounting structure
according to any one of claims 1 to 5, wherein
the heat dissipation component includes a recess
20 formed along a shape of a contact portion in which the
electronic component is in contact with the heat
dissipation component.
[Claim 7] The electronic component mounting structure
25 according to any one of claims 1 to 6, wherein
the heat dissipation component includes, as two types
of heat dissipation components having different flexibility
and elasticity, a first heat dissipation component having
relatively high flexibility and a second heat dissipation
30 component having relatively high elasticity, and
the first heat dissipation component is disposed on a
surface in contact with the electronic component.
42
[Claim 8] The electronic component mounting structure
according to claim 3, wherein
the substrate holder is provided above and away from
the one surface of the metal plate,
5 a part of the heat dissipation component is sandwiched
between the one surface of the metal plate and a lower
surface of the electronic substrate that protrudes from the
substrate holder in an in-plane direction of the metal
plate or a lower surface of the substrate holder in the in10 plane direction of the metal plate, is deformed by a force
applied downward from the substrate holder, and is in
intimate contact with the one surface of the metal plate,
and
the electronic component and the electronic substrate
15 are electrically connected via a part of the heat
dissipation component.
[Claim 9] The electronic component mounting structure
according to claim 3, wherein
20 the electronic substrate and the substrate holder each
include
an opening or a cutout formed at a position at which
the electronic component is disposed in an in-plane
direction of the metal plate.
25
[Claim 10] An outdoor unit of an air conditioner, the
outdoor unit comprising:
a housing; and
the electronic component mounting structure according
30 to any one of claims 1 to 9 accommodated in the housing,
wherein
a blower chamber and a machine chamber partitioned by
the metal plate of the electronic component mounting
43
structure are formed inside the housing,
the electronic component is disposed in the machine
chamber, and
a blower is disposed in the blower chamber.
5
[Claim 11] An outdoor unit of an air conditioner, the
outdoor unit comprising:
a housing;
the electronic component mounting structure according
10 to any one of claims 1 to 9 accommodated in the housing;
and
an attachment plate to which the metal plate of the
electronic component mounting structure is attached,
wherein
15 a blower chamber and a machine chamber partitioned by
the attachment plate are formed inside the housing,
the electronic component is disposed in the machine
chamber, and
a blower is disposed in the blower chamber.