WE CLAIM:
[Claim 1] A negative-type photosensitive resin composition comprising an (A) alkali-soluble resin, a (B) radical polymerizable compound, and a (C) photo initiator,
the negative-type photosensitive resin composition being characterized in that the (A) alkali-soluble resin contains one or more species of resins selected from a (A-1) polyimide, a (A-2) polybenzoxazole, a (A-3) polyimide precursor, a (A-4) polybenzoxazole precursor, a (A-5) polysiloxane, and a (A-6) cardo based resin, and
that the (B) radical polymerizable compound contains a compound having five ethylenic unsaturated bond groups in a (B-1) molecule, in an amount within a range of 51 to 99 mass%. [Claim 2] The negative-type photosensitive resin composition according to Claim
1, further comprising a (D) coloring agent, wherein the (D) coloring agent contains
a (Da) black coloring agent.
[Claim 3] The negative-type photosensitive resin composition according to Claim
2, wherein the (Da) black coloring agent is constituted by one or more species
selected from a (D1a-1) black organic pigment, a (D1a-2) black inorganic pigment,
and a (D1a-3) mixture of two or more coloring pigments.
[Claim 4] The negative-type photosensitive resin composition according to Claim
3, wherein the (D1a-1) black organic pigment is a (D1a-1a) benzofuranone based
black pigment and/or a (D1a-1b) perylene based black pigment.
[Claim 5] The negative-type photosensitive resin composition according to any one of Claims 1 to 4, wherein a content ratio of a total of one or more species of resins selected from the (A-1) polyimide, (A-2) polybenzoxazole, (A-3) polyimide precursor, (A-4) polybenzoxazole precursor, (A-5) polysiloxane, and (A-6) cardo based resin in a total of 100 mass% of the (A) alkali-soluble resin is within a range of 50 to 100mass%.

[Claim 6] The negative-type photosensitive resin composition according to any
one of Claims 1 to 5, wherein the (B) radical polymerizable compound further
contains a compound having 6 to 10 ethylenic unsaturated bond groups in a (B-2)
molecule, in an amount within a range of 1 to 49 mass%.
[Claim 7] The negative-type photosensitive resin composition according to Claim
6,
wherein the compound having five ethylenic unsaturated bond groups in the (B-1) molecule is a compound represented by general formula (5) mentioned below, and
wherein the compound having 6 to 10 ethylenic unsaturated bond groups in the (B-2) molecule is a compound represented by general formula (7) mentioned below.

(In general formula (5), X3 represents a bivalent organic group. Z13 to Z17 each independently represent a direct bond, a carbonyl group, an alkylene group having a carbon number of 1 to 10, or an arylene group having a carbon number of 6 to 15. P13 to P17 each independently represent a substituent represented by general formula (6) mentioned below. Q2 represents hydrogen, an alkyl group having a carbon number of 1 to 10, or an aryl group having a carbon number of 6 to 15. In general formula (6), R7 to R9 each independently represent hydrogen, an alkyl group having a carbon number of 1 to 10, or an aryl group having a carbon number of 6 to 15.) [CHEM. 2]


(In general formula (7), X4 represents a bivalent organic group. Z19 to Z24 each
independently represent a direct bond, a carbonyl group, an alkylene group having
a carbon number of 1 to 10, or an arylene group having a carbon number of 6 to
15. P19 to P24 each independently represent a substituent represented by general
formula (8). In general formula (8), R10 to R12 each independently represent
hydrogen, an alkyl group having a carbon number of 1 to 10, or an aryl group
having a carbon number of 6 to 15.)
[Claim 8] The negative-type photosensitive resin composition according to any
one of Claims 1 to 7, wherein the (B) radical polymerizable compound contains the
compound having five ethylenic unsaturated bond groups in the (B-1) molecule, in
an amount within a range of 71 to 99 mass%.
[Claim 9] The negative-type photosensitive resin composition according to any
one of Claims 1 to 8, wherein the (A-1) polyimide, the (A-2) polybenzoxazole, the
(A-3) polyimide precursor, and the (A-4) polybenzoxazole precursor in the (A)
alkali-soluble resin contain a structural unit having a fluorine atom, in an amount of
30 to 100 mol% of entire structural units.
[Claim 10] A cured film obtained by curing the negative-type photosensitive
resin composition according to any one of Claims 1 to 9.
[Claim 11] The cured film according to Claim 10, wherein an optical density
per 1 (am of film thickness is within a range of 0.3 to 5.0.
[Claim 12] A display device comprising the cured film according to Claim 10 or
11.
[Claim 13] A display device comprising a cured pattern obtained by curing the

negative-type photosensitive resin composition according to any one of Claims 1
to 9, wherein a taper angle of an inclined side of a cross section of the cured
pattern is within a range of 1 to 60°.
[Claim 14] The display device according to Claim 13, comprising a display unit
having a curved surface, wherein a radius of curvature of the curved surface is
within a range of 0.1 to 10 mm.
[Claim 15] The display device according to any one of Claims 12 to 14, which
is an organic EL display or a liquid crystal display.
[Claim 16] A production method for a display device, comprising:
(1) a step of forming a film of the negative-type photosensitive resin composition according any one of Claims 1 to 9 on a substrate;
(2) a step of irradiating the negative-type photosensitive resin composition formed as the film with a chemical active ray via a photomask and then forming a pattern by using an alkali solution; and
(3) a step of forming a cured pattern by heating the pattern.