WE CLAIM:
[Claim 1] A negative-type photosensitive resin composition comprising an (A1) first resin, a (A2) second resin, a (C) photopolymerization initiator, and a (D) coloring agent,
wherein the (A1) first resin is an (A1-1) polyimide and/or an (A1-2) polybenzo-oxazole, and
wherein the (A2) second resin is one or more species selected from a (A2-1) polyimide precursor, a (A2-2) polybenzo-oxazole precursor, a (A2-3) polysiloxane, a (A2-4) cardo based resin, and an (A2-5) acrylic resin, and
wherein a content ratio of the (A1) first resin in a total of 100 mass% of the (A1) first resin and the (A2) second resin is within a range of 25 to 90 mass%.
[Claim 2] The negative-type photosensitive resin composition according to Claim 1, wherein the content ratio of the (A1) first resin in 100 mass% of a sum of the (A1) first resin and the (A2) second resin is within a range of 51 to 90 mass%.
[Claim 3] The negative-type photosensitive resin composition according to Claim 1 or 2, comprising a (B) radical polymerizable compound, wherein the content ratio of the (B) radical polymerizable compound in a total of 100 mass parts of the (A1) first resin, the (A2) second resin, the (B) radical polymerizable compound is 15 to 65 mass parts.
[Claim 4] The negative-type photosensitive resin composition according to any one of Claims 1 to 3,
wherein one or more species selected from the (A1-1) polyimide, the (A1-2) polybenzo-oxazole, the (A2-1) polyimide precursor, and the (A2-2) polybenzo-oxazole precursor contain

a structural unit originating from a diamine that has a fluorine atom and/or a structural unit originating from a diamine derivative that has a fluorine atom, and
wherein the content ratio of the structural unit originating from a diamine that has a fluorine atom and/or the structural unit originating from a diamine derivative that has a fluorine atom in a structural unit originating from entire amines and their derivatives in a resin of one or more species selected from the (A1-1) polyimide, the (A1-2) polybenzo-oxazole, the (A2-1) polyimide precursor, and the (A2-2) polybenzo-oxazole precursor is within a range of 30 to 100 mol%.
[Claim 5] The negative-type photosensitive resin composition according to any one of Claims 1 to 4,
wherein one or more species selected from the (A1-1) polyimide, the (A1-2) polybenzo-oxazole, the (A2-1) polyimide precursor, and the (A2-2) polybenzo-oxazole precursor contain a structural unit originating from a carboxylic acid that has a fluorine atom and/or a structural unit originating from a carboxylic acid derivative that has a fluorine atom, and
wherein the content ratio of a structural unit originating from a carboxylic acid that has a fluorine atom and/or a structural unit originating from a carboxylic acid derivative that has a fluorine atom in a structural unit originating from the entire carboxylic acids and their derivatives in a resin of one or more species selected from the (A1-1) polyimide, the (A1-2) polybenzo-oxazole, the (A2-1) polyimide precursor, and the (A2-2) polybenzo-oxazole precursor is within a range of 30 to 100 mol%.

[Claim 6] The negative-type photosensitive resin composition according to any one of Claims 1 to 5, wherein the content ratio of the (D) coloring agent is within a range of 5 to 70 mass% in an entire solid content.
[Claim 7] The negative-type photosensitive resin composition according to any one of Claims 1 to 6, wherein the (D) coloring agent contains a (Da) black coloring agent.
[Claim 8] The negative-type photosensitive resin composition according to Claim 7, wherein the (Da) black coloring agent is constituted by a (D1a) black pigment that is made up of one or more species selected from a (D1a-1) black organic pigment, a
(D1a-2) black inorganic pigment, and a (D1a-3) mixture of two or more coloring pigments.
[Claim 9] The negative-type photosensitive resin composition according to Claim 8, wherein the (D1a-1) black organic pigment is a (D1a-1a) benzofuranone based black pigment and/or a (D1a-1b) perylene based black pigment.
[Claim 10] A cured film obtained by curing the negative-type photosensitive resin composition according to any one of Claims 1 to 9.
[Claim 11] The cured film according to Claim 10, wherein an
optical density per 1 |jm of film thickness is within a range of 0.3 to 5.0.
[Claim 12] The cured film according to Claim 10 or 11, comprising a cured pattern, wherein a taper angle of an inclined side of a sectional surface of the cured pattern is within a range of 1 to 60°.
[Claim 13] An element comprising the cured film according to

any one of Claims 10 to 12.
[Claim 14] A display apparatus comprising the cured film
according to any one of Claims 10 to 12.
[Claim 15] The display apparatus according to Claim 14, further
comprising a transparent electrode, wherein the transparent
electrode is an oxide that has one or more species selected from
indium, tin, zinc, aluminum, and gallium.
[Claim 16] The display apparatus according to Claim 14 or 15,
being a display apparatus that does not comprises a liquid
crystal layer, wherein light output from a display surface of
the display apparatus is non-polarized light.
[Claim 17] The display apparatus according to Claim 14 or 15,
being a display apparatus that comprises a liquid crystal layer,
wherein light output from a display surface of the display
apparatus is polarized light output from the liquid crystal
layer.
[Claim 18] The display apparatus according to any one of Claims
14 to 17, comprising a structure stacked on a flexible substrate,
wherein a carbon atom content ratio in a material that forms
the flexible substrate is within a range of 20 to 100 mass%.
[Claim 19] The display apparatus according to any one of Claims
14 to 18, wherein the display apparatus is an organic EL display
or a liquid crystal display.
[Claim 20] An organic EL display comprising the cured film
according to any one of Claims 10 to 12 in at least one of a
planarization layer on a drive circuit and an electrically
insulating layer on a first electrode.
[Claim 21] A production method for a display apparatus,

comprising:
(1) a step of forming a coating film of the negative-type photosensitive resin composition according to any one of Claims 1 to 9 on a substrate;
(2) a step of irradiating the resin composition with a chemical active ray via a photomask;
(3) a step of performing development with an alkali solution
so that a pattern of the resin composition is formed; and
(4) a step of heating the pattern so that a cured pattern
of the resin composition is obtained.