Sign In to Follow Application
View All Documents & Correspondence

Novel Radiation Hardened By Design (Rhbd) 12 T Memory Cell For Aerospace Applications In Nanoscale Cmos Technology

Abstract: This work introduces the unique radiation-hardened-by-design (RHBD) 12T memory cell as the solution to endure single-node upset and multiple-node upset occurrences by using the thorough understanding of a underlying soft error processes and the thoroughly thought-out layout topology. A usefulness of a suggested 12T cell in providing great radiation tolerance has been confirmed by extensive testing and research. There are several benefits to using a proposed 12T cell instead of a 13T cell. It reduces space by 18.9%, power consumption by 23.8%, and read/write access time overheads by 171.6%, for the total improvement of 50.0%. Measurements of a hold static noise margin for a proposed 12T cell are likewise larger than those for a 13T cell, at 986.2 mV. This wider hold static noise margin provides more evidence for a superior stability of a proposed 12T cell, particularly with respect to fault tolerance. These findings provide support to a contention that a newly proposed 12T memory cell offers better radiation resistance while decreasing associated overheads, making it the competitive alternative for radiation-hardened memory architecture. Some of concepts that might be indexed are memory, multiple node upset, radiation hardened by design (RHBD), and soft errors. An increasing complexity of conforming to a stringent design requirements of Nano scale technologies makes it challenging to apply these layout-level protections. Two) a first circuit-level method for safeguarding memory or latches against SEUs was triple modular redundancy (TMR). In TMR, three copies of the memory cell are used, and a correct output was determined using the voting circuit. Due to the mechanism called voting, even if one cell fails, another two will keep a proper information stored. In contrast, TMR requires substantial additional room and results in significant energy loss.

Get Free WhatsApp Updates!
Notices, Deadlines & Correspondence

Patent Information

Application #
Filing Date
21 December 2023
Publication Number
02/2024
Publication Type
INA
Invention Field
ELECTRONICS
Status
Email
Parent Application

Applicants

N. RAMESH
Mother Theresa Institute of Engineering & Technology, Palamaner-517408
R. TEJASWI
Mother Theresa Institute of Engineering & Technology, Palamaner-517408
B SHAROUN
Mother Theresa Institute of Engineering & Technology, Palamaner-517408
Mr.S.K.LAKSHMI NARAYANA
Mother Theresa Institute of Engineering & Technology, Palamaner-517408
Mr.G. RAGHAVENDRA
Mother Theresa Institute of Engineering & Technology, Palamaner-517408
Mr.T. JAYAPRAKSH REDDY
Mother Theresa Institute of Engineering & Technology, Palamaner-517408

Inventors

1. N. RAMESH
Mother Theresa Institute of Engineering & Technology, Palamaner-517408
2. R. TEJASWI
Mother Theresa Institute of Engineering & Technology, Palamaner-517408
3. B SHAROUN
Mother Theresa Institute of Engineering & Technology, Palamaner-517408
4. Mr.S.K.LAKSHMI NARAYANA
Mother Theresa Institute of Engineering & Technology, Palamaner-517408
5. Mr.G. RAGHAVENDRA
Mother Theresa Institute of Engineering & Technology, Palamaner-517408
6. Mr.T. JAYAPRAKSH REDDY
Mother Theresa Institute of Engineering & Technology, Palamaner-517408

Specification

Description:1. Cell Schematic and Write/Read Timing: The supplied RHBD 12T memory cell was seen in Figure 1. Two access transistors, here pMOS transistors P5 and P6, govern a output nodes QN and Q through a bit-lines BLN and BL. These transistors will be activated or deactivated based on a WL. Remember that when the radiation particle interacts with the pMOS transistor, only the positive transient pulse (01 or 11 transient pulse) was generated.
2. When the radiation particle strikes the nMOS transistor, however, it only experiences the negative transient pulse (10 or 00 transient pulse) [2]. To combat radiation and prevent the negative transient pulse in a Q and QN nodes, pMOS transistors, namely transistors P6 and P5, are utilized as access transistors. Paraphrasing has been used to provide the new spin on this description while keeping its essential meaning and structure intact.
3. A memory cell's differential sensing amplifier then delivers a signal based on a voltage difference between BL and BLN. If bit line BLN was 1, then data 0 may be put into a proposed 12T cell, but only if both word-line WL and bit line BL are in a 0 state. As the result, node Q was lowered to the value of zero and node QN was raised to the value of one.
4. Recovery Statistics for SEUs: Using a state indicated in Figure 1, results of the SEU (Single Event Upset) recovery investigation for a proposed RHBD 12T memory cell are presented below. Node Q was not the sensitive node and stores the 1 since it was connected to a drain area of an off state of pMOS transistors P6 and P8. If radiation strikes node Q, only the positive pulse will be generated due to a disturbing physical process.
5. When simulating a electrical consequences of the SEU on the memory cell through SEU fault injection, we use a double current pulse source model.
6. Cells' ability to recover from the disruption at the single node was severely lacking.
7. Memory performance, timing, and fault resilience are all targeted for parity with a reference 6T memory cell, although space was sacrificed in a process. This trade-off in chip real estate was the consequence of the design choice taken to boost memory performance and dependability. Overall, a recommended 12T memory cell provides the trade-off in terms of space consumption in comparison to earlier memory cell designs due to a need for additional circuits for some cells to work effectively. A requirements and priorities of an application in question will determine a best course of action.
8. The proposed 12T memory cell was larger in footprint than a NS-10T and PS-10T variants. Our previous work has shown, however, that a protection offered by these memory cells may not be enough to withstand disturbances affecting numerous nodes.
9. An important metric for comparing memory cells was a ratio of a sensitive area (ASi) of a drain junctions of the specific node (marked as "i") to a overall layout area of a memory cell (Atotal). When designing an integrated circuit, it was essential to keep in mind that a sensitive zone was established by a drain area of OFF transistors.
10. Analyses of Comparative Stability: Static Noise Margins (SNMs) are crucial stability criteria in memory architecture.
11. For hold mode, a proposed RHBD 12T memory cell has a highest HSNM. This occurs because system stability improves with longer feedback channels during hold operations. This was noteworthy because it suggests that a proposed RHBD 12T memory cell offers protection against SEUs in addition to its enhanced stability. A other memory cell designs can't match this dual benefit. In conclusion, a suggested RHBD 12T memory cell achieves the sweet spot between SEU robustness and outstanding stability, making it the formidable contender for applications demanding both features.
, Claims:1. We claim that the Novel Radiation-Hardened-By-Design (RHBD) 12t Memory Cell For Aerospace Applications in Nano scale CMOS Technology used to Aerospace applications often involve missions into space where radiation exposure is high. RHBD memory cells are more resilient against radiation-induced errors, ensuring the reliability of critical systems in space missions, satellites, and other spacecraft
2. We claim that the Novel Radiation-Hardened-By-Design (RHBD) 12t Memory Cell used for Aerospace Applications in Nano scale CMOS Technology reliability advancement can lead to more successful and longer-lasting missions.
3. We Claim that the proposal utilized for the development and implementation of RHBD memory cells in aerospace applications hold the potential to significantly improve the reliability, safety, and longevity of electronic systems in critical environments.
4. We claim that the Novel Radiation-Hardened-By-Design (RHBD) 12t Memory Cell for Aerospace Applications in Nano scale CMOS Technology a RHBD 12T memory cell was an excellent design alternative. From a perspective of designers creating crucial applications, this memory cell performs better than other state-of-the-art radiation-hardened memory cell,
5. We claim that the Novel Radiation-Hardened-By-Design (RHBD) 12t Memory Cell for Aerospace Applications in Nano scale CMOS Technology to enhance a memory cell's temporal performance while also reducing its area overhead and keeping its radiation resistance intact.
6. We claim that the Novel Radiation-Hardened-By-Design (RHBD) 12t Memory Cell introduces the novel 12T Radiation-Hardened-by-Design (RHBD) memory cell, which was effective against soft errors in commercial 65 nm CMOS technology.
7. We claim that the Novel Radiation-Hardened-By-Design (RHBD) 12t Memory Cell In addition to its resistance to single-node upsets, this memory cell's distinctive feature was its resilience against multiple-node upsets. One thousand Monte Carlo simulations back up a paper's performance, demonstrating that it can withstand changes in a process while still performing well in a face of the Single Event Upset (SEU).
8. We claim that the Novel Radiation-Hardened-By-Design (RHBD) 12t Memory Cell and Nano scale CMOS Technology Radiation resistance was the benefit of a proposed 12T memory cell, however this comes at a cost of the longer read time. This might limit its use in fast-paced settings. When memory space, resistance, and durability are of a utmost importance, as they often are in mission-critical aerospace applications and other contexts.
9. 9. We claim that the Novel Radiation-Hardened-By-Design (RHBD) 12t Memory Cell and Nano scale CMOS Technology proposed 12T memory cell makes use of the smaller footprint compared to other memory cell designs it exactly gives the accurate result.

Documents

Application Documents

# Name Date
1 202341087683-REQUEST FOR EARLY PUBLICATION(FORM-9) [21-12-2023(online)].pdf 2023-12-21
2 202341087683-PROVISIONAL SPECIFICATION [21-12-2023(online)].pdf 2023-12-21
3 202341087683-FORM 1 [21-12-2023(online)].pdf 2023-12-21
4 202341087683-DRAWINGS [21-12-2023(online)].pdf 2023-12-21
5 202341087683-COMPLETE SPECIFICATION [21-12-2023(online)].pdf 2023-12-21