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Nozzle For Soldering Apparatus
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Nozzle For Soldering Apparatus
Sony Corporation
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Nozzle For Soldering Apparatus
Abstract: NA
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Patent Information
Application #
Filing Date
28 November 1996
Publication Number
36/2016
Publication Type
INA
Invention Field
ELECTRICAL
Status
Withdrawn
Email
Parent Application
Applicants
Country: Japan
SONY CORPORATION
7-35 KITASHINAGAWA6-CHOME, SHINAGAWA-KU TOKYO JAPAN
Inventors
Country: Japan
1. ARATA TSURUSAKI
SONY CORPORATION 7-35 KITASHINAGAWA6-CHOME, SHINAGAWA-KU TOKYO JAPAN
Specification
NA
Documents
Application Documents
#
Name
Date
1
2614-del-1996.pdf
2011-08-21