1. An oil submerged refrigerant cooling system [120] for cooling electronic components, comprising: a glass box oil chamber [11] filled with electronic cooling oil; a refrigerant system [100] fitted on a first dual sided U plate [7] and operatively connected to the glass box oil chamber [11], wherein the refrigerant system comprising an evaporator coil [6] and a thermostat sensor both fitted on one (front) side [1A] of the first dual sided U plate with the side submerged in glass box oil chamber [11], wherein the refrigerant system further comprising a DC Compressor [12], a Condenser with Cooling Fan [3], a programmable Driver Board[4] and a Thermostat along with piping of a cooling circuit, all fitted on the other (rear) side [1B] of the first dual sided U plate; a component system [110] fitted on a second dual sided U plate [7 ] and operatively connected to the glass box oil chamber [11], wherein the component system comprising electronic components fitted on one (front) side [7A] of the second dual sided U plate hosting the component system [110 ] with the side submerged in glass box oil chamber [11], wherein the component system further comprising a computer power supply unit [8] on the other (rear) side [7B] of the second dual sided plate hosting the component system; and a glass box enclosure stand [12] configured to host the glass box oil chamber [11], the refrigeration system [100] and the component system [110]. The oil submerged refrigerant cooling system [120] for cooling electronic components as claimed in claim 1, wherein the refrigerant system [100] is a modular system. The oil submerged refrigerant cooling system [120] for cooling electronic components as claimed in claim 1, wherein the electronic components may be motherboard, central processing unit, graphic processing unit, random access modules, solid state drives. The oil submerged refrigerant cooling system [120] for cooling electronic components as claimed in claim 1, wherein the component system [110] is a modular system.

5. The oil submerged refrigerant cooling system [120] for cooling electronic components as claimed in claim 1, wherein the DC Compressor [2] is of dimension 235x180x160 MM, of weight 0.9 kg and having specification of motor type BLDCM, displacement of 1.9CC, with a Rotary Speed of 1700 - 6500 RPM, cooling capacity of 130 - 455(W), operating voltage DC 35-38, refrigerant R134a, Coefficient of performance (COP) 1.2-3 (W/W).

6. The oil submerged refrigerant cooling system [120] for cooling electronic components as claimed in claim 1, wherein the electronic cooling oil is odourless liquid or having a very mild petroleum like smell, clear and bright colour, with a Pour point -42°C, flash point 185°C as per ASTM D-93, with a relative density 0.8328 kg/L at 15 °C, of viscosity 9.66 cSt at 40ºC and 2.60 cSt at 100°C

7. The oil submerged refrigerant cooling system [120] for cooling electronic components as claimed in claim 1, wherein the programmable driver board [4] have adjustment provision to set cooling temperature depending on load, system configuration, and on placement parameters like location and environmental factors.

8. A method for cooling electronic components using oil submerged refrigerant cooling system comprising: immersion of one (front) side [1A] of a first dual sided U plate [1] fitted with a refrigerant system into a glass box oil chamber [11] filled with electronic cooling oil; immersion of one (front) [7A] side of a second dual sided U plate hosting the component system [110] and fitted with electronic components into a glass box oil chamber [11] filled with electronic cooling oil; absorption of heat generated from electronic components by electronic cooling oil of the glass box oil chamber [11]; cooling of heated oil of glass box oil chamber by the refrigeration system; and dissipation of heat through the condenser of the refrigeration system.

9. The method for cooling electronic components using oil submerged refrigerant cooling system as claimed in claim 8, the programmable driver board fitted on the rear side of the first dual sided U plate hosting the refrigeration system, is used to set the cooling temperature of the OSRCS depending on system load, system configuration, placement parameters and environmental factors.

FIELD OF INVENTION:
The present invention relates to OSRCS, a hybrid cooling system providing
refrigeration cooling to immersion chamber where compute components are
submerged at enclosure level.
BACKGROUND OF INVENTION:
Enterprise Grade Data Centres or large scale electronic based setups
requires cooling due to heat generated from operation of electronic
components which are put to work for long hours. In this type setups,
traditionally, the cooling is achieved using air conditioners running
constantly, thereby consuming a huge amount of electricity and also
involves high cost. This traditional cooling setups such as air conditioners is
incapable of making custom cooling based on load of a system. For example
a storage server can operate at 45C max load, where as a Compute Server
recommendation will be 35C Max Load. In traditional cooling setup using
air conditioners both systems will be cooled at 35C. This is highly
inefficient. Thus there is a need for cooling system which can cool down a
system based on load of the system in an energy efficient manner.

Furthermore, the traditional cooling setups may be use to cool large
systems but cannot be scaled down to cool smaller setups such as
telecommunications and networking equipments. Thus there is a need of
a cooling system which can be used to cool for both large systems and
smaller systems by varying scalability without affecting the working
efficiency.
The traditional air cooling setups fails to provide environmental protection
and comes with high infrastructure costs in dense deployment scenarios like
data centre, server farm, etc. The traditional liquid cooling also comes with
complex setup, high infrastructure cost, and high probability of liquid
leakage causing system damage. The traditional immersion cooling too
suffers from problems like requirement of high volume of coolant oil, huge
space to accommodate setup, complex setup, high infrastructure costs.
The present invention Oil Submerged Refrigerant Cooling System (OSRCS)
provides solution to all the above stated problems. The present invention is
an enclosed hybrid cooling system which is a combination of immersion
cooling with refrigeration mechanism, having self cooling ability. OSRCS
largely reduces operational costs compared to traditional cooling setup, and
is suitable for varied range of systems and components, is scalable as per
need of the system to be cooled without compromising its working efficiency,
and because of ease of portability the OSRCS can be used at various
location. OSRCS being an enclosed system also protects the target system

to be cooled from external environmental factors like Dust, Humidity etc.
and eliminates risk of overheating due to dust accumulation and further
eliminates need for humidifiers, dust filters etc.
SUMMARY OF THE INVENTION:
The present invention relates to Oil Submerged Refrigeration Cooling System
(OSRCS) is a hybrid cooling system which provides refrigeration cooling to
immersion chamber and by submerging compute components in the
immersion chamber at enclosure level.
The present invention discloses an oil submerged refrigerant cooling system
(OSRCS) for cooling electronic components, comprising a glass box oil
chamber filled with electronic cooling oil; a refrigerant system fitted on a
first dual sided U plate; and a component system fitted on a second dual
sided U plate wherein both the refrigeration system and the component
system are operatively connected to the glass box oil chamber.
One side (Front side) of the first dual sided U plate fitted with refrigeration
system hosts an evaporator coil and a thermostat sensor with this Front
side immersed in the glass box oil chamber. While the other side (Rear side)
of the first dual side U plate is fitted with a DC Compressor, a Condenser

coil with a Cooling Fan, a programmable Driver Board and a Thermostat
along with piping of a cooling circuit.
One side (Front side) of the second dual sided U plate fitted with component
system comprising electronic components which dissipates heat and this
Front side of the second dual sided U plate is immersed in the glass box oil
chamber. While the other side (Rear Side) of the second dual sided U plate is
fitted with a computer power supply and necessary cable arrangements.
The glass box oil chamber, the refrigeration system and the component
system all are held together by a glass box enclosure stand thereby forming
a portable unit of OSRCS.
Both the refrigerant system and the component system are modular in
structure enabling easy immersion and can be taken out without
dissembling the core components.
The electronic components are one or more of components that requires
cooling like computer motherboard, central processing unit, graphic
processing unit, random access modules, solid state drives etc.
In the system of the present invention, when the electronic components
fitted with the second dual sided U plate generates heat, the heat gets

absorbed by the oil of the glass box oil chamber. The heated oil is then
cooled by the refrigeration system and the heat is dissipated through the
condenser of the refrigeration system.
The OSRCS system of the present invention works in energy efficient
manner and based on the load of the system to be cooled. The OSRCS
system comprise programmable driver boards where the cooling
temperature is adjusted and set depending on the load of the system
including parameters like location whether indoor or outdoor,
environmental factors of the place, and likewise.
BRIEF DESCRIPTION OF DRAWINGS
Figure 1 Rear Side Structure of Refrigeration System.
Figure 1A Rear Side Structure of the Refrigeration System
Figure 2 Front Side Structure of Refrigeration System.
Figure 3 Perspective Representation of Structure of Refrigeration System.
Figure 4 Rear Side Structure of Component System.
Figure 5 Perspective Representation of Structure of Component System.
Figure 6 Front Side Structure of Component System.
Figure 7 Perspective Representation of Structure of Component System.
Figure 8 Sidewise Representation of Structure of the OSRCS

Figure 9 Sidewise Representation of Structure of the OSRCS
Figure 10 Structural Representation of OSRCS from Top
Figure 11 Structural Representation of OSRCS from Rear
Figure 12 Perspective Representation of OSRCS
DETAILED DESCRIPTION
The present disclosure is best understood with reference to the detailed
figures and description set forth herein. Various embodiments have been
discussed with reference to the figures. However, those skilled in the art will
readily appreciate that the detailed descriptions provided herein with respect
to the figures are merely for explanatory purposes, as the methods and
systems may extend beyond the described embodiments. For instance, the
teachings presented and the needs of a particular application may yield
multiple alternative and suitable approaches to implement the functionality
of any detail described herein. Therefore, any approach may extend beyond
certain implementation choices in the following embodiments.
References to “one embodiment,” “at least one embodiment,” “an
embodiment,” “one example,” “an example,” “for example,” and so on
indicate that the embodiment(s) or example(s) may include a particular
feature, structure, characteristic, property, element, or limitation but that
not every embodiment or example necessarily includes that particular

feature, structure, characteristic, property, element, or limitation. Further,
repeated use of the phrase “in an embodiment” does not necessarily refer to
the same embodiment.
Figure 1 shows the Rear Side Structure of Refrigeration System within a
OSRCS comprising a first dual sided U plate [1] fitted with a DC compressor
[ 2 ], Condenser coil with cooling Fan [3], programmable Driver Board [4]
and Refrigeration System power supply unit [5].
Figure 1A shows the Rear Side Structure of the Refrigeration System of
OSRCS fitted with compressor [2], condenser coil with cooling fan [3],
programmable driver board [4], refrigeration system power supply unit [5].
Figure 2 shows the Front Side Structure of Refrigeration System within a
OSRCS comprising the first dual sided U plate [1] fitted with a Evaporator
coil [6].
Figure 3 shows a Perspective Representation of Structure of Refrigeration
System within the OSRCS with the evaporation coil [6] fitted on the Front
side of the first dual sided U plate [1] and with Condenser coil with cooling
Fan [3] and Refrigeration System power supply unit [5] fitted on the Rear
side [1B] of the first dual sided u plate.

Figure 4 shows a Rear Side Structure of Component System [ ] within the
OSRCS [ ] where the rear side [7B] of the second dual sided u plate [7] is
fitted with computer power supply unit [8].
Figure 5 shows a Perspective Representation of Structure of Component
System within the OSRCS where the front side [7A] of the second dual sided
u plate [7] is fitted with computer system motherboard [9] and rear side [7B]
is fitted with computer power supply unit [8].
Figure 6 shows Front Side Structure of Component System within the
OSRCS where the front side [7A] of the second dual sided U plate [7] is fitted
with computer system motherboard [9] and graphical procession Unit [10].
Figure 7 shows Perspective Representation of Structure of Component
System within the OSRCS where the Front side [7A] of the second dual sided
U plate [7] is fitted with Computer System Motherboard [9] and Graphical
Processing Unit [10] and the rear side [7B] is fitted with computer power
supply unit [8]
Figure 8 shows Sidewise Representation Structure of the OSRCS wherein
the glass box enclosure stands [12] hold together the computer power
supply unit [8], glass box oil chamber [11], refrigeration system and the
component system.

Figure 9 shows Sidewise Representation of Structure of the OSRCS wherein
the glass box enclosure stands [12] from this view shows the DC compressor
[2], glass box oil chamber [11], refrigeration system and first dual sided U
plate [1].
Figure 10 shows Structural Representation of OSRCS from Top wherein the
enclosure stands [12] holds the glass box oil chamber [11], first [1] and
second [7] dual sided U plate, computer power supply unit [8], DC
compressor [2], condenser with cooling fan [3], computer system
motherboard [9], computer system graphic processing unit [10 ].
Figure 11 shows Structural Representation of OSRCS from Rear comprising
the First [1] and the Second [7] dual sided U plate, computer power supply
unit [8], DC compressor [2], condenser with cooling fan [3], programmable
Driver Board [4], refrigeration system power supply unit [5], and the glass
box oil chamber [11].
Figure 12 shows the Perspective Representation of the OSRCS comprising
First and the Second dual sided U plate, computer power supply unit [8],
condenser with cooling fan [3], computer system graphic processing
unit[10], computer system motherboard [9] all in the glass box enclosure
stand [12].

The present invention relates to Oil Submerged Refrigeration Cooling System
(OSRCS) is a hybrid cooling system which provides refrigeration cooling to
immersion chamber used to submerge compute components at enclosure
level.
The present invention discloses an oil submerged refrigerant cooling system
for cooling electronic components, comprising a glass box oil chamber [11]
filled with electronic cooling oil; a refrigerant system fitted on a first dual
sided U plate [1]; and a component system fitted on a second[7] dual sided U
plate wherein both the refrigeration system and the component system are
operatively connected to the glass box oil chamber [11].
One side (Front side) [1A] of the first dual sided U plate fitted with
refrigeration system hosts an evaporator [6] and a thermostat sensor with
this Front side submerged in glass box oil chamber[11]. While the other side
(Rear side) [1B] of the first dual sided U plate is fitted with a DC Compressor
[2], a Condenser with a Cooling Fan [3], a Programmable Driver Board[4]
and a Thermostat along with piping of a cooling circuit.
One side (Front side ) [7A] of the second[7] dual sided U plate fitted with
component system is fitted with electronic components which dissipates
heat and this Front [7A] side of the second dual sided U plate is immersed in
the glass box oil chamber [11]. While the other side (Rear Side) [7B] of the

second dual sided U plate is fitted with a computer power supply [8] and
necessary cable arrangements.
The glass box oil chamber [11], the refrigeration system and the component
system all are held together by a glass box enclosure stand [12] thereby
forming a single portable unit of OSRCS.
Both the refrigerant system and the component system are modular in
structure enabling easy immersion and can be taken out without
dissembling the core components.
The electronic components are one or more of components that requires
cooling like motherboard, central processing unit, graphic processing unit,
random access modules, solid state drives etc.
In OSRCS, when the electronic components fitted with the second dual
sided U plate generates heat, the heat gets absorbed by the oil of the glass
box oil chamber. The heated oil is then cooled by the refrigeration system
and the heat is dissipated through the condenser of the refrigeration system.
The OSRCS works in energy efficient manner and based on the load of the
system to be cooled. The OSRCS comprise programmable driver boards [4]
where the cooling temperature is adjusted and set depending on the load

of the system including parameters like location whether indoor/ outdoor,
environmental factors of the place, and likewise. The working of OSRCS
will remain the same and target cooling can be achieved just by
reprogramming the driver board without any further modifications
required.
In one embodiment of the present invention OSRCS the electronic oil used is
of following specification:
Physical State: pLiquid
Color:Clear and Bright
Odor:Odorless or very mild petroleum like
Pour Point: -42°C (-44°F)
Flash Point [Method]: 185°C (365°F) [ASTM D-93]
Flammability (Solid, Gas): Not applicable
Relative Density (at 15 °C): 0.8328 kg/L
Solubility(ies): Water - Negligible
Viscosity: 9.66 cSt at 40ºC | 2.60 cSt at 100°C
Explosive Properties: None

Oxidizing Properties: None
In another embodiment of the present invention, deionised water may be
used to as coolant liquid in glass box oil chamber with the PCB coated with
nano water resistant compounds.
In the present invention, the compressor capacity is varied based on
electronic board form factor. In one embodiment of the present invention the
DC compressor is of following specification:
Power Supply - DC 48V
Displacement (CC) - 1.9
Rotary Speed (RPM)- 1700 - 6500
Cooling Capacity (W) - 130 - 455
COP (W/W) - 1.2~3
Operating Voltage - DC 35-58
Refrigerant - R134a

Motor Type - BLDCM
Net Weight - 09 KG
Dimension - 235x180x160 MM
OSRCS have been tested to showcase efficiency.
Under No Load condition, the ideal temperature is
CPU-15° C and GPU-33° C
Test Result using the OSRCS with load is as follow:
Load Temperature Comparison
I Air Cooling OSRCS
CPU 85° C 22°C
GPU 90° C 42° C
The OSRCS of the present invention can have multiple embodiments based
on the system load and end usage requirements.

CLAIMS
WE CLAIM:
1. An oil submerged refrigerant cooling system [120] for cooling
electronic components, comprising:
a glass box oil chamber [11] filled with electronic cooling oil;
a refrigerant system [100] fitted on a first dual sided U plate [7] and
operatively connected to the glass box oil chamber [11],
wherein the refrigerant system comprising an evaporator coil [6] and
a thermostat sensor both fitted on one (front) side [1A] of the first
dual sided U plate with the side submerged in glass box oil chamber
[11],
wherein the refrigerant system further comprising a DC Compressor
[12], a Condenser with Cooling Fan [3], a programmable Driver
Board[4] and a Thermostat along with piping of a cooling circuit, all
fitted on the other (rear) side [1B] of the first dual sided U plate;
a component system [110] fitted on a second dual sided U plate [7 ]
and operatively connected to the glass box oil chamber [11],

wherein the component system comprising electronic components
fitted on one (front) side [7A] of the second dual sided U plate hosting
the component system [110 ] with the side submerged in glass box
oil chamber [11],
wherein the component system further comprising a computer power
supply unit [8] on the other (rear) side [7B] of the second dual sided
plate hosting the component system; and
a glass box enclosure stand [12] configured to host the glass box oil
chamber [11], the refrigeration system [100] and the component
system [110].
The oil submerged refrigerant cooling system [120] for cooling
electronic components as claimed in claim 1, wherein the refrigerant
system [100] is a modular system.
The oil submerged refrigerant cooling system [120] for cooling
electronic components as claimed in claim 1, wherein the electronic
components may be motherboard, central processing unit, graphic
processing unit, random access modules, solid state drives.
The oil submerged refrigerant cooling system [120] for cooling
electronic components as claimed in claim 1, wherein the component
system [110] is a modular system.

5. The oil submerged refrigerant cooling system [120] for cooling
electronic components as claimed in claim 1, wherein the DC
Compressor [2] is of dimension 235x180x160 MM, of weight 0.9 kg
and having specification of motor type BLDCM, displacement of
1.9CC, with a Rotary Speed of 1700 - 6500 RPM, cooling capacity of
130 - 455(W), operating voltage DC 35-38, refrigerant R134a,
Coefficient of performance (COP) 1.2-3 (W/W).
6. The oil submerged refrigerant cooling system [120] for cooling
electronic components as claimed in claim 1, wherein the electronic
cooling oil is odourless liquid or having a very mild petroleum like
smell, clear and bright colour, with a Pour point -42°C, flash point
185°C as per ASTM D-93, with a relative density 0.8328 kg/L at 15
°C, of viscosity 9.66 cSt at 40ºC and 2.60 cSt at 100°C
7. The oil submerged refrigerant cooling system [120] for cooling
electronic components as claimed in claim 1, wherein the
programmable driver board [4] have adjustment provision to set
cooling temperature depending on load, system configuration, and on
placement parameters like location and environmental factors.

8. A method for cooling electronic components using oil submerged
refrigerant cooling system comprising:
immersion of one (front) side [1A] of a first dual sided U plate [1] fitted
with a refrigerant system into a glass box oil chamber [11] filled with
electronic cooling oil;
immersion of one (front) [7A] side of a second dual sided U plate
hosting the component system [110] and fitted with electronic
components into a glass box oil chamber [11] filled with electronic
cooling oil;
absorption of heat generated from electronic components by
electronic cooling oil of the glass box oil chamber [11];
cooling of heated oil of glass box oil chamber by the refrigeration
system; and
dissipation of heat through the condenser of the refrigeration system.
9. The method for cooling electronic components using oil submerged
refrigerant cooling system as claimed in claim 8, the programmable
driver board fitted on the rear side of the first dual sided U plate
hosting the refrigeration system, is used to set the cooling
temperature of the OSRCS depending on system load, system
configuration, placement parameters and environmental factors.