1. An oil submerged thermoelectric module enclosure based cooling system [100] for cooling electronic components [6A,6B], comprising: an enclosure [6] with its back panel [4] fused with a copper plate [1] to operate as heat sink [1] ; an oil chamber in contact with the inner side of the copper plate [1], wherein the oil chamber configured to absorb heat from the electronic components disposed within the oil chamber; and a thermoelectric module [2] which is in contact through one side with the outer side of the copper plate [1], and the other side the thermoelectric is having a heat sink with a fan, wherein the thermoelectric module is programmed through control board [3] using a thermostat [8] to operate on specific temperature range based on the temperature of the oil.

2. The oil submerged thermoelectric module enclosure based cooling system [100] for cooling electronic components as claimed in claim 1, the electronic components are fitted on one side dipped into the oil chamber. Page 16 of 18

3. The oil submerged thermoelectric module enclosure based cooling system [100] for cooling electronic components as claimed in claim 1, wherein the outer side of the U-shaped plate is fitted with a power supply unit.

4. The oil submerged thermoelectric module enclosure based cooling system [100] for cooling electronic components as claimed in claim 1, wherein the thermoelectric module operates on a DC power supply.

5. The oil submerged thermoelectric module enclosure based cooling system [100] for cooling electronic components as claimed in claim 1, wherein the electronic components are CPU, GPU, RAM, Motherboard, Storage, and such other types.

6. The oil submerged thermoelectric module enclosure based cooling system [100] for cooling electronic components as claimed in claim 1, wherein the hot plate of thermoelectric module have its own heat sink with at least a 2 x 120 MM fan mounted in push configuration to dissipate the heat generated into the surroundings.

Description:TITLE:
An Oil Submerged Thermoelectric Module Enclosure Cooling System for cooling
Electronic Components
FIELD OF INVENTION:
The present invention relates to oil submerged thermoelectric module enclosure
cooling system for cooling electronic components such as PC / Workstation &
Servers including CPU, GPU, Motherboard, Solid State Storage Modules and others.
The thermoelectric module of the system is programmed to provide cooling on
specific temperature range depending on temperature of the oil in the oil chamber
disposed with the electronic components to be cooled.
BACKGROUND OF INVENTION:
Electronic based setups requires cooling due to heat generated from operation of
electronic components which are put to work for long hours and intensive
applications. Traditional cooling such as Air Cooling, Liquid Cooling, Immersion
cooling of these electronic components and setups poses numerous challenges and
are no longer are preferred mode of cooling.
In the traditional Air cooling, electronic components are attached to Heat sinks of
varying heat dissipation capacity, and the cold air or room temperature air is used
to blow heat sink to dissipate heat. Such type of air cooling is incapable to give
custom cooling based on load of a system and incapable to provide precise
temperature control at component level. This method of cooling without considering
the load of the system is energy inefficient and therefore high cost is involved.
Page 1 of 18
Additionally, this type of air cooling exposes electronic components to dust and
humidity.
In the Liquid Cooling, the heat-sinks are connected using tubing to a pump
radiator setup wherein the liquid coolant is pumped through loop and as the
coolant moves / travels through the loop it absorbs heat from components and
dissipates the heat at radiator. This is better that the air cooling but comes with
problems of exposure of electronic components to dust and humidity which
contributes to increase in temperature and affects workability of the electronic
components, no precise temperature control at component level, very complex
setup involving setting up piping, pumps, radiators, and such complex setup is
costly requiring high maintenance. Also there continues risk of leakage of coolant
and chance of damaging the electronic components.
Further in Immersion cooling the electronic Components are dipped in oil chamber
where the cooling oil absorbs heat generated and throughout through the radiator.
This works similar to liquid cooling and also provides protection of electronic
components from dust and humidity. However, immersion cooling too does not
offer precise temperature control at component level and comes with complex setup
and maintenance as of a liquid cooling.
Thus there is a need for cooling system which is capable of providing precise
temperature control at the component level or based on load of a particular system.
The present invention provides accurate cooling at a preset programmed
temperature acting as threshold temperature/ reference temperature at enclosure
Page 2 of 18
level with environmental protection for electronic components used in high end
PCs, Workstations & Servers.
OBJECTS OF THE INVENTION
The basic objective of the present invention is to provide a system which offers
precise temperature control at the component level or cooling based on load of the
system.
Another objective of the present invention is to provide cooling of electronic systems
and components at enclosure level through programmable temperature control.
Yet another objective of the present invention is to provide low cost cooling system
which is easily integrable, configurable temperature as per load in the server.
It is further an objective of the present invention to achieve highly energy efficient
environmental friendly cooling system.
It is an objective of the present invention to protect the electronic components from
dust and humidity.
It is a further objective of present invention to provide low cost and low
maintenance cooling system.
It is another objective of the present invention to provide cooli ng and heating
through reversal of current.
It is another object of the present invention to provide cooling system which is less
susceptible to temperature fluctuations of outer environment which a compressor
based cooling system is prone to and other disadvantages of a compressed based
cooling system.
Page 3 of 18
Yet it is another object of the present invention to make the cooling system less
susceptible to variation of the AC line voltages which is different in different region.
SUMMARY OF THE INVENTION:
The present invention relates to an oil submerged thermoelectric module enclosure

for cooling of electronic components immersed into oil chamber within the
enclosure. The back panel of the enclosure of the present invention is fitted with a
copper heat sink. An oil chamber is connected to an inner side of the enclosure
back panel, and wherein the oil chamber is configured to cool electronic
components by absorbing the heat dissipated from those components. A
thermoelectric module with at least a two plate arrangement with a cold plate
operatively connected to an outer side of the enclosure back panel, and a hot plate
connected to a heat sink with a fan; and this thermoelectric module i s programmed
to a specific temperature based on temperature of the oil which varies on absorbing
the heat generated by the electronic components.
In an aspect of the present invention the electronic components are fitted on one
side of a U-shaped plate which is dipped into the oil chamber.
In another aspect of the present invention the oil chamber absorbs the heat
generated by the electronic component and there is a variation
of the oil in the oil chamber.
In one other aspect of the present invention, a control board is fitted with the
enclosure back panel which provides cooling on specific temperature range using
thermostat to measure the temperature of the oil.
Page 4 of 18
The electronic components are one or more of components that require cooling like
as PC / Workstation & Servers including CPU, GPU, Motherboard, Solid State
Storage Modules and others.
BRIEF DESCRIPTION OF DRAWINGS
Figure 1 - Oil Submerged Thermoelectric Module Enclosure
cooling system.
Figure 2 - Exploded view of different parts of OSTME based cooling system.
Figure 3 - Enclosure Back Panel of OSTME Cooling System.
Figure 4 - Top view of OSTME Cooling System
Figure 5- Comparative between cooling of Thermoelectric based Cooling System and
Compressor Based Cooling System
DETAILED DESCRIPTION
The present disclosure is best understood with reference to the detailed figures and
description set forth herein. Various embodiments have been discussed with
reference to the figures. However, those skilled in the art will readily appreciate that
the detailed descriptions provided herein with respect to the figures are merely for
explanatory purposes, as the methods and systems may extend beyond the
described embodiments. For instance, the teachings presented and the needs of a
particular application may yield multiple alternative and suitable approaches to
implement the functionality of any detail described herein. Therefore, any approach
may extend beyond certain implementation choices in the following embodiments.
Page 5 of 18
References to “one embodiment,” “at least one embodiment,” “an embodiment,”
“one example,” “an example,” “for example,” and so on indicate that the
embodiment
characteristic, property, element, or limitation but that not every embodiment or
example necessarily includes that particular feature, structure, characteristic,
property, element, or limitation. Further, repeated use of the phrase “in an
embodiment” does not necessarily refer to the same embodiment.
Figure 1 shows Oil Submerged Thermoelectric Module Enclosure
cooling system [100] with an enclosure [6] therein fitted on the back panel [4] of
enclosure [6] a copper heat sink [1] operatively connected to thermoelectric cooling
module [2] which is controlled by a Control Board [3] and a computer power supply
unit [5].
Figure 2 shows Exploded view of different parts of OSTME based cooling system
with an enclosure [6] whose back panel [4] is fitted with copper heat sink [1]
operatively connected to Thermoelectric cooling module [2] with temperature
controlled by a control board [3] and immersed into the enclosure containing oil
chamber a plate [7] fitted with electronic components [6A, 6B] and PC power supply
[5]
Figure 3 shows back panel [4] of enclosure of OSTME based cooling system is fitted
with copper heat sink [1] operatively connected to Thermoelectric cooling module
[2] with temperature controlled by a control board [3] and PC power supply [5].
Page 6 of 18
Figure 4 shows the Top view of OSTME based Cooling System with thermostat [8]
fitted which senses the temperature of the oil in the oil chamber and based on it
the control board provides cooling of the specific temperature range through the
TEM module.
The present invention disclosed an oil submerged thermoelectric module enclosure
based cooling system [100] for cooling electronic components [6A,6B], with the
enclosure [6] fused with a copper plate to operate as heat sink on the back panel
[4].
The oil chamber disposed inside the enclosure is configured to absorb heat from
the electronic components disposed within the oil chamber and is in, contact with
the inner side of the copper plate [1].
The other side of the copper plate [1] is fitted with the cold plate of a thermoelectric
module [2] which is programmed to operate on specific temperature range. This
TEM operates through control board [3] using a thermostat [8] which senses the
temperature of the oil on absorbing the heat of the electronic components. The
other side
The electronic components which cooled in this system are fitted on one side of a
U-shaped plate which is then immersed into the oil chamber; while the other side
of the U-shaped plate is fitted with a power supply.
In a preferred embodiment the present invention provides accurate cooling at a
preset programmed temperature acting as threshold temperature/ reference
temperature at enclosure level with environmental protection for electronic
Page 7 of 18
components used in high end PCs, Workstations & Servers, that is, through
programmable temperature control.
In another preferred embodiment, the thermostat is connected to control board of
thermoelectric cooler through wiring. The core electronic components
CPU, GPU, Ram, Motherboard, Storage
using a U-Shaped Plate, and the outer section of U-plate will house power supply
unit.
In another preferred embodiment, the Thermoelectric module has at least two
plates arrangements, one is cold plate and other is hot Plate, wherein the cold plate
is in contact with outer side of copper heat sink fused in enclosure, while the Hot
Plate have its own heat sink with at least a 2 x 120 MM fan mounted in push
configuration to dissipate the heat generated into the surroundings.
While in another preferred embodiment, a Liquid Metal Thermal Paste is used to
provide better thermal conductivity between two plates and also removes air as
cooling medium improving thermal conductivity compared to traditional air
conditioning room cooling systems.
In the present invention the Thermoelectric module is programmed through a
control board to provide cooling on specific temperature range using thermostat as
measurement of oil temperature, hence providing cooling on system load scenarios
only.
Page 8 of 18
In the present invention the electronic components dipped inside the oil chamber is
protected from any environmental impact like dust, humidity etc. and no need for
any specialized thermal compounds on components like CPU / GPU etc..
The preferred embodiment disclosed here eliminates the need of periodic servicing
like thermal re-paste / dust clean up. Also no harmful refrigerant, chemicals are
used compared to traditional air conditioning / liquid cooling method. The present
invention uses Dielectric Specialized Electronic Cooling Oil which is bio degradable,
bacterial / fungi resistant and fire resistant. Further there is no need of any
specialized equipments like piping, pump, reservoirs etc. for oil immersion.
The present system has been tested against Compressor based cooling system at
enclosure level. In a conventional compressor based system comprises three
fundamental parts: the evaporator, the compressor and the condenser. In the
evaporator
valve and expands, boils, and evaporates. During this change of state from liquid to
gas, energy
compresses the gas into a liquid. The condenser expels both the heat absorbed at
the evaporator and heat produced during compression into the ambient
environment.
The present system which is a thermoelectric-based system is comprised of both p-
and n- type materials brought in contact to form a junction where simple reversal
of current provides both cooling and heating.
Page 9 of 18
The power supply used in the present system is DC power supply. These TEM can
be configured to run on a variety of DC voltages by selecting a series or parallel
configuration of the internal construction of a thermoelectric cooler. The most
common voltages are 24 and 48 VDC. Since they require DC, a power supply is
often used to convert AC to DC.
Using of DC power supply offers several advantages over the AC. Thermoelectric
coolers will pump heat at a rate proportional to the power applied and so when
cooling needs are low, the thermoelectric cooler will consume less power to
maintain control of the temperature compare to that when additional cooling is
required. This control allows for efficient use of power, while reducing the power
cycling inherent in on-off type controllers.
It is advantageous to use thermoelectric coolers as these can heat or cool
dependent upon the direction of current flow, eliminates overshooting of the set
point temperature and more precise temperature control can be achieve.
Moreover, various line power levels across different geographic regions require AC
compressors and fans to run on specific voltages and frequencies. This increases
the number of components required to support each region and makes the unit
susceptible to the possibility of brown-outs. DC power supplies, however, can
operate on a universal range of input voltages and frequencies. This enables the
cooling system to run efficiently in geographic areas that have limited reliable
output power and can maintain operation of a thermoelectric cooler during a
brown-out
Page 10 of 18
TEM based cooling system is advantageous over the compressor based system
when operates in enclosure applications, especially those in remote or outdoor
environments, have environmental conditions that fluctuate throughout the day
and over the course of a season. Compressor systems are either entirely “ON” or
“OFF”. There is no proportional control, so full power must be applied at all times.
Furthermore, the start-up current for a compressor system is often three times the
steady state operating current and the circuit must be sized to handle it.
Combining the non-proportionality, repeated ON-OFF control with the high-power
draw at start-up and those efficiency gains at steady-state are reduced.
The present invention discloses a TEM based cooling system which is highly
reliable as it do not involve compressor, motor or refrigerants and the fans are
rated for enormous working hours of 70K hours, again which can be controlled at
lower speeds to extend the life span further. TEM coolers with a Proportional
Integral Derivative
stop-start power surges or temperature overshoot variations. Therefore, the higher
reliability of steady-state conditions is maintained. TEM based cooling system
which wear and tears that a compressor based system may be subjected to due to
it having moving parts and flow of coolants and temperature fluctuations that
affects latter and leakage of coolants from seals occurs due to this continuous
operation resulting in wear and tear, and also affects the electronic components
adversely in critical manner.
Below is a graphical representation of efficiency of TEM based and Compressor
based cooling system under conditions mentioned. The graph below compares the
cooling capacity of a thermoelectric cooler assembly to a compressor based air
Page 11 of 18
conditioner from a manufacturer’s datasheet. The initial interpretation is that the
compressor appears to have more cooling power than a thermoelectric cooler
assembly
actual application conditions
similar
Typical Enclosure Application for Telecom Battery Back-Up System
For reliability and maximizing useful life, the batteries require temperature control
from an ambient environment that can fluctuate above and below battery
temperature limits.
Cooling/Heating Conditions
Ambient Temperature: -33 to +50°C
Control Temperature: +10 to +30°C
Page 12 of 18
Heat leak rate through cabinet walls: 5W/°C
Active Internal heat load: 20 Watts
Model Comparison
AA-250-48-44-00-XX
Ratings:
Useful Cooling @ L35, L35
Useful Cooling @ L35, L50
Rated Voltage: 48 to 56VDC
Power Usage @ L35, L35
Power Usage @ L35, L50
Dimensions W x H x D: 153 x 400 x 204 mm
Weight: 6.3 kg
Leading Compressor-based Air Conditioner
Ratings:
Useful Cooling @ L 35, L 35
Useful Cooling @ L 35, L 50
Rated Voltage: 115VAC, 60Hz
Power Usage @ L 35, L 35
Page 13 of 18
Power Usage @ L 35, L 50
Dimensions: W x H x D: 525 x 340 x 135 mm
Weight: 17 kg
This comparison demonstrates the performance and efficiency of the best matched,
commercially available thermoelectric and compressor-based models. The data
used in this study comes from both manufacturers’ data sheets and modeling
software; power usage was confirmed with manufacturers’ representatives. The rate
of heat leaking into and out of the cabinet is determined by the surface area and
insulation value. In this comparison, the heat leak rate was 5W/°C.
For example, a 20°C temperature difference between the ambient and internal
temperature results in a 100W heat loss/gain
and heating solution must offset these losses or gains.
Cooling Mode: Demonstrates the power usage required to maintain the enclosure
temperature to specification
Heating Mode: Demonstrates the power usage required to maintain the enclosure
temperature to specification
within the cabinet.
Thus comparison of Cooling Mode between TEM based and Compressor based
cooling systems results TEM based to be up to two times more efficient than the
compressor-based unit with proportional control in all test conditions. Also overall
Page 14 of 18
power requirement of the thermoelectric based unit is less than the power to
maintain the specified set point temperature than a compressor based unit.
Thus comparison of Heating Mode between TEM based and the Compressor based
cooling results TEM based to be up to 20 times more efficient across test condition
ranges. This is because both the input power to the thermoelectric cooler assembly,
plus the heat pumped by the thermoelectric cooler assembly is provided as heat.
The efficiencies are most notable when the temperature differential
TEM based system can both cool and heat by reversal of current, offering more
precise temperature control than a compressor-based unit and is more energy
efficient throughout the temperature range of the application, by 25% to over 90%
in cooling mode and up to 400% in heating mode.
Therefore the Oil submerged thermoelectric module enclosure cooling systems are
assemblies of solid-state construction and provides advantages in reliability,
installation, vibration, and low cost of maintenance. Additionally, its compact form
factor and lighter weight allows for easier installation and occupies less space than
a compressor-based unit. Utilizing a thermoelectric cooler assembly in climate-
controlled electronic enclosures provides an attractive alternative solution because
of its efficiency, reliability, accuracy, compact design, negligible noise level s, and
ease of installation.
Page 15 of 18
, Claims:CLAIMS
WE CLAIM:
1. An oil submerged thermoelectric module enclosure based cooling system
[100] for cooling electronic components [6A,6B], comprising:
an enclosure [6] with its back panel [4] fused with a copper plate [1] to
operate as heat sink [1] ;
an oil chamber in contact with the inner side of the copper plate [1], wherein
the oil chamber configured to absorb heat from the electronic components
disposed within the oil chamber; and
a thermoelectric module [2] which is in contact through one side
with the outer side of the copper plate [1], and the other side
the thermoelectric is having a heat sink with a fan, wherein the
thermoelectric module is programmed through control board [3] using a
thermostat [8] to operate on specific temperature range based on the
temperature of the oil.
2. The oil submerged thermoelectric module enclosure based cooling system
[100] for cooling electronic components as claimed in claim 1, the electronic
components are fitted on one side
dipped into the oil chamber.
Page 16 of 18
3. The oil submerged thermoelectric module enclosure based cooling system
[100] for cooling electronic components as claimed in claim 1, wherein the
outer side of the U-shaped plate is fitted with a power supply unit.
4. The oil submerged thermoelectric module enclosure based cooling system
[100] for cooling electronic components as claimed in claim 1, wherein the
thermoelectric module operates on a DC power supply.
5. The oil submerged thermoelectric module enclosure based cooling system
[100] for cooling electronic components as claimed in claim 1, wherein the
electronic components are CPU, GPU, RAM, Motherboard, Storage, and such
other types.
6. The oil submerged thermoelectric module enclosure based cooling system
[100] for cooling electronic components as claimed in claim 1, wherein the
hot plate of thermoelectric module have its own heat sink with at least a 2 x
120 MM fan mounted in push configuration to dissipate the heat generated
into the surroundings.