DESC:FIELD OF THE INVENTION
[0001] The present disclosure pertains to the field of anti-counterfeit technology, particularly to a film comprising an anticounterfeit image for packaging.

BACKGROUND OF THE INVENTION
[0002] The background description includes information that may be useful in understanding the present invention. It is not an admission that any of the information provided herein is prior art or relevant to the presently claimed invention, or that any publication specifically or implicitly referenced is prior art.
[0003] Packed medicinal drugs are susceptible to tampering and counterfeiting and the same has been a great concern to the pharmaceutical industry as well as patient’s life. It is believed that 30 % of the drugs in the market are spurious. Medicines are usually packed in blister packaging. Anticounterfeit packaging serves as a guarantee of origin which enables the customer to recognise that the original product. An anticounterfeit packaging also in some cases be used as a means of tamper-proof packaging.
[0004] The conventional foils of the blister pack can be easily peeled off to replace the original tablets, or capsules in the plastic strip with fake ones, and thereafter a counterfeited foil can be used to seal the plastic strip. The duplicate foils resemble the original foils so closely that consumer cannot differentiate as such between the original and the fake pack. Such illegal piracy of the drug has been always the challenge to government, Food and Drug Administration (FDA), drug manufacturers and packaging technologists
[0005] There has been some amount of work done to avoid the piracy of the medicinal drug, however, there have been a one or the other challenges. For example, one of the approaches involving the direct embossing on the PVC film would be costlier and not be effective. In such approach of direct embossing, as known in the art the thickness of the film used for embossing is mostly around 25 microns to 250 microns. Ironically, the thickness of the PVC film less than 250 microns cannot give good rigidity after the thermoforming, hence packaging of medicines in such film would not be desired. Further, the method of direct embossing on the PVC film is energy intensive as it requires high usage of heat. Besides, productivity with such approach is observed to be low. Accordingly, there remains a need for providing a film suitable for packaging of pharmaceutical, nutraceutical, or food product provided with an image which makes it more unlikely to be counterfeited.

SUMMARY OF THE INVENTION
[0006] Accordingly, the present invention in one aspect provides a packaging film. The packaging film comprises at least one thermoformable substrate of polymer film coated with an adhesive coating capable of receiving a transfer anticounterfeit image and at least one carrier film with a low anchorage to the coating. Typically, the at least one carrier film comprises a coating of a wax system by using an acrylic resin.
[0007] The present invention in another aspect also discloses a process for providing an image on the packaging film. The process comprises coating a carrier film with a wax system with a thickness of about 0.01 GSM to about 1 GSM by using at least one acrylic resin to obtain a first layer with a composition comprising at least one resin and at least one cross linker in a defined ratio of 0.1:0.11 to 1.5:10, in a solvent system. This is followed by coating said first layer with a coating of polymeric resin in an organic solvent with solids between about 7% to about 25% and viscosity of about 50 cp to about 100 cp, followed by curing to obtain a cured first layer. Then the cured first layer is provided a second layer with a coating composition comprising at least one resin and at least one cross linker in a defined ratio of about 1:1:0.1 to about 4:5:1 in a solvent system and drying to obtain a coated carrier film, followed by providing an image by embossing on the coated carrier film followed by providing a coating of wax system to obtain a coated substrate film. Then the image is transferred from the carrier layer to a coated substrate layer by curing at a temperature of about 40 oC to about 60 oC for a duration of 12 hours to 72 hours and delaminating the carrier layer.

BRIEF DESCRIPTION OF THE DRAWINGS
[0008] The accompanying drawings, which are incorporated in and constitute a part of this disclosure, illustrate exemplary embodiments and, together with the description, serve to explain the disclosed principles:
FIG.1 illustrates an exemplary block diagram 100 of a process for manufacturing a packaging film, in accordance with some embodiments of the present disclosure.

DETAILED DESCRIPTION OF THE INVENTION
[0009] The following is a detailed description of embodiments of the present disclosure. The embodiments are in such detail as to clearly communicate the disclosure. However, the amount of detail offered is not intended to limit the anticipated variations of embodiments; on the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the present disclosure as defined by the appended claims.
[00010] Unless the context requires otherwise, throughout the specification which follow, the word “comprise” and variations thereof, such as, “comprises” and “comprising” are to be construed in an open, inclusive sense that is as “including, but not limited to.”
[00011] Reference throughout this specification to “one embodiment” or “an embodiment” means that a particular feature, structure or characteristic described in connection with the embodiment is included in at least one embodiment. Thus, the appearances of the phrases “in one embodiment” or “in an embodiment” in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
[00012] As used in the description herein and throughout the claims that follow, the meaning of “a,” “an,” and “the” includes plural reference unless the context clearly dictates otherwise. Also, as used in the description herein, the meaning of “in” includes “in” and “on” unless the context clearly dictates otherwise.
[00013] In some embodiments, the numbers expressing quantities of ingredients, properties such as concentration, and so forth, used to describe and claim certain embodiments of the invention are to be understood as being modified in some instances by the term “about.” Accordingly, in some embodiments, the numerical parameters set forth in the written description are approximations that can vary depending upon the desired properties sought to be obtained by a particular embodiment. In some embodiments, the numerical parameters should be construed in light of the number of reported significant digits and by applying ordinary rounding techniques. Notwithstanding that the numerical ranges and parameters setting forth the broad scope of some embodiments of the invention are approximations, the numerical values set forth in the specific examples are reported as precisely as practicable.
[00014] The recitation of ranges of values herein is merely intended to serve as a shorthand method of referring individually to each separate value falling within the range. Unless otherwise indicated herein, each individual value is incorporated into the specification as if it were individually recited herein.
[00015] All methods described herein can be performed in suitable order unless otherwise indicated herein or otherwise clearly contradicted by context. The use of any and all examples, or exemplary language (e.g., “such as”) provided with respect to certain embodiments herein is intended merely to better illuminate the invention and does not pose a limitation on the scope of the invention otherwise claimed. No language in the specification should be construed as indicating any non-claimed element essential to the practice of the invention.
[00016] The headings and abstract of the invention provided herein are for convenience only and do not interpret the scope or meaning of the embodiments.
[00017] Various terms are used herein. To the extent a term used in a claim is not defined below, it should be given the broadest definition persons in the pertinent art have given that term as reflected in printed publications and issued patents at the time of filing.
[00018] The present disclosure relates to a packaging film provided with an image as an anticounterfeit measure to render the film suitable for packaging of pharmaceutical, nutraceutical, or food product, of desired strength.
[00019] In an embodiment of the present disclosure provides a packaging film comprising at least one thermoformable substrate of polymer film coated with an adhesive coating capable of receiving a transfer anticounterfeit image and at least one carrier film with a low anchorage to the coating. The at least one carrier film comprises a coating of a wax system by using an acrylic resin. Typically, the at least one thermoformable substrate film is selected from the group consisting of polyvinyl chloride (PVC), Polyvinylidene chloride (PVDC), Polyethylene, amorphous polyethylene terephthalate (APET) and Polychlorotrifluoroethylene (PCTFE). PVC, PE and PVDC. PVC film has a thickness in the range of 100 to 350 microns. PE film has a thickness range 100 to 200 microns and PCTFE film has a thickness in the range of 15 to 152 microns. APET film has a thickness in the range of 150 to 250 microns. PVdC Film has GSM ranging from 20 to 200 GSM.
[00020] In another embodiment of the present disclosure, the substrate film can be a suitable thermoformable polymeric film. In an exemplary embodiment, the substrate film is a PVC film ranging from about 100 microns to about 350 microns with predetermined shades, colours, transparency or other desired characteristics.
[00021] In yet another embodiment of the present disclosure the adhesive coating is provided by at least one of water-based acrylate system or polyurethane based two component system. The adhesive coating has a thickness in the range of 1.5 GSM to 4.5 GSM. The PVC film is coated with an adhesive coating amenable to receive the transfer image. The adhesive coating is provided by water-based acrylate system and / or polyurethane based two component system. The thickness of the adhesive coating can be varied between about 1.5 GSM to about 4.5 GSM, preferably from about 2.2 GSM to about 3.5 GSM.
[00022] In still another embodiment of the present disclosure provides a carrier film with a low anchorage to the coating, layers of coating resistant to high temperature, having characteristics of providing anchorage during embossing to receive transfer image and faster release image on the substrate and image formed thereon.
[00023] In yet another embodiment of the present disclosure the carrier film comprises the following:
a. coating of a wax system having thickness in the range of 0.01 GSM to 1 GSM by using acrylic resin;
b. a first layer of coating with a composition comprising resin(s) and a cross linker in a defined ratio of 0.1:0.11 to 1.5:10;
c. a coating of polymeric resin;
d. a second layer of coating with a coating composition comprising resin(s) and cross linker in a defined ratio of 0.1:0.11 to 1.5:10;
and
e. an image embossed on the coated carrier film.
[00024] Typically, the resin is selected from the group consisting of acrylic resin, polyester resin, polyvinyl resin and poly vinyl butyral resin and the crosslinker is selected from the group consisting of polyester based cross-linker and polyurethane based cross-linker.
[00025] In still another embodiment of the present disclosure, the at least one carrier film is selected from the group consisting of a biaxial oriented film, a monoaxial oriented film, a non-oriented film and a combination thereof.
[00026] In yet another embodiment of the present disclosure the at least one carrier film is selected from the group consisting of polyester (APET), oriented polyamide (OPA), biaxially oriented polypropylene (BOPP), biaxially oriented polyethylene (BOPE), biaxially-oriented polyethylene terephthalate (BOPET), polylactic acid (PLA) film and combinations thereof.
[00027] In still another embodiment of the present disclosure, the carrier film is biaxially-oriented polyethylene terephthalate (BOPET), preferably 12 Mic BOPET film, which is designed to low anchorage to the coating.
[00028] In an exemplary embodiment of the present invention, the wax system is a coating of carnova based wax system with thickness ranging from about 0.01 to 1 GSM by using acrylic resin. The resin forming the first layer or the second layer on the carrier film can be selected from but not limited to acrylic resin, polyester resin, polyvinyl resin, poly vinyl butyral resin or the like. Typically, the cross-linker that can be used in the present invention can be selected from but not limited to polyester based cross-linker, polyurethane based cross-linker, or the like cross linker.
[00029] In still another embodiment of the present disclosure, the first layer coating composition comprises acrylic resin, polyester resin and cross linker in a defined ratio of 0.1:0.11 to 1.5:10.
[00030] In yet another embodiment of the present disclosure, the second layer coating composition comprises acrylic resin, polyester resin and cross linker in a defined ratio of 0.1:0.11 to 1.5:10.
[00031] In still another embodiment of the present disclosure, the optional coating of polymeric resin on the carrier film is selected from polyester resin, poly vinyl butyral resin, or the like.
[00032] In yet another embodiment of the present disclosure, the coating of polymer resin on the carrier film is of polyester resin of thickness ranging from about 0.5 GSM to about 2 GSM, preferably from about 0.8 GSM to about 1.4 GSM.
[00033] In another aspect of the present disclosure, disclosed is a process for providing an image on the packaging film. The process comprises the following steps:
a. coating a carrier film with a wax system with a thickness of about 0.01 GSM to about 1 GSM by using at least one acrylic resin to obtain a first layer with a composition comprising at least one resin and at least one cross linker in a defined ratio of 0.1:0.11 to 1.5:10, in a solvent system;
b. coating said first layer with a coating of polymeric resin in an organic solvent with solids between about 7% to about 25% and viscosity of about 50 cp to about 100 cp, followed by curing to obtain a cured first layer;
c. providing on said cured first layer, a second layer with a coating composition comprising at least one resin and at least one cross linker in a defined ratio of about 1:1:0.1 to about 4:5:1 in a solvent system and drying to obtain a coated carrier film;
d. providing an image by embossing on the coated carrier film followed by providing a coating of wax system to obtain a coated substrate film; and
e. transferring the image from the carrier layer to a coated substrate layer by curing at a temperature of about 40 oC to about 60 oC for a duration of 12 hours to 72 hours and delaminating the carrier layer.
[00034] In another embodiment of the present disclosure, the process comprises:
a. providing on a carrier film coated with a wax system with a thickness of 0.01 GSM to about 1 GSM, by using acrylic resin, a first layer with a composition comprising resin(s) and a cross linker in a defined ratio of 0.1:0.11 to 1.5:10, in a solvent system to adjust a total solid content from about 5% to about 30% and viscosity of about 10 cp to about 70 cp to provide thickness of about 0.5 GSM to about 5 GSM;
b. optionally providing on the carrier film with the first layer, a coating of polymeric resin in an organic solvent with solids between about 7% to about 25% and viscosity of about 50 cp to about 100 cp to provide thickness of about 0.01 GSM to about 1.2 GSM and curing the coating;
c. providing on the optionally coated carrier film with the first layer, a second layer with a coating composition comprising resin(s) and cross linker in a defined ratio of about 1:1:0.1 to about 4:5:1 in a solvent system to adjust a total solid content from about 5% to about 30% and viscosity of about 5 cp to about 50 cp to provide thickness of about 0.5 GSM to about 1.2 GSM and drying;
d. providing an image by embossing on the coated carrier film;
e. providing a coating of adhesive on a substrate film; and
f. transferring the image from the carrier layer to a coated substrate layer by curing at a temperature of about 40 oC to about 60 oC for a duration of about 12 hours to about 72 hours and delaminating the carrier layer.
g. The carrier film preferably BOPET film designed to have low anchorage to the coating is coated with carnova based wax system with thickness ranging 0.01 GSM to about 1 GSM, by using acrylic resin.
[00035] The coating with such wax system enhances the film forming characteristics and reduces the brittleness during the transfer process.
[00036] A suitable technique is used to apply the coating of wax system on BOPET carrier film coating, preferably the technique is reverse gravure coating method. The machine used to do the coating comprises more than 7 array heating zones ranging from 40 oC to 200 oC. The viscosity of the solution is adjusted between 15 and 30 seconds on B4 cup using the solvent comprising water and iso propyl alcohol. The speed of the machine is maintained between 75 MPM to 150 MPM. The parameters including temperature, coating thickness, viscosity, solid content can be adjusted in such way that the coating has desired release properties and the carrier film is devoid of sticking characteristic.
[00037] As per one embodiment, on a carrier film coated with a wax system with a thickness of about 0.01 GSM to 1 GSM by using acrylic resin, a coating of a first layer with a composition comprising resin(s) and a cross linker in a defined ratio of 0.1:0.11 to 1.5:10 is provided. For providing the first layer over the coated carrier film, acrylic resin, polyester resin and cross linker are dispersed in a solvent system to adjust a total solid content from about 7% to about 25 %. The viscosity of the coating solution was adjusted between 15 to 25 seconds by B4 cup. The solvent system used can comprise solvents selected from but not limiting to methyl ethyl ketone, ethyl acetate and 2-ethoxyethanol in suitable combinations so as to achieve desire property of film forming, to further to improve anti-static effect and reduce the brittle ness of the film. For forming the first layer coating after applying the coating composition, the carrier film was cured in the oven and the speed of the hot air was varied respectively 70 oC to 200 oC and 75 MPM to 150 MPM. Forming of such first layer of coating over the wax coated carrier film, improves the quality of the image of the art work transferred and renders the image resistant to high temperature.
[00038] In one embodiment, the carrier film is optionally coated a polymeric resin for example polyester resin of thickness not more than 1.2 GSM by the reverse gravure coating method. For coating the total solid content of the polymeric resin was adjusted to between about 10% to about 20 %, viscosity 15 to 20 seconds by B4 cup with solvent methyl ethyl ketone. The coating can be cured using the combination of temperature of oven and speed of the coating machine. The temperature can be adjusted at 40 oC to 200 oC with the speed of 75 MPM to 150 MPM. Such coating helps to increase the bond between substrate and second layer of carrier film coated with the second coating composition.
[00039] As per one embodiment, the final layer deposition of the second layer is carried out before creating the embossed image of the art work, which defines the quality of the image. While applying the second layer with the composition comprising acrylic resin, polyester resin, and cross linker, the pH of the coating solution is maintained at about 7.0. The total solid content of the composition is varied between about 10% to about 20 % and viscosity on B 4 cup is maintained between 12 to 18 seconds using the combination of solvents methyl ethyl ketone, ethyl acetate and 2-ethoxyethanol so as to render the film amenable to superior effect of embossing when the film is embossed. The total thickness of the coating may be maintained between 1+/- 0. 2 GSM. The solvents used are evaporated and the coating is dried using the combination of oven temperature and fan speed. The temperature can be maintained between 100 oC to 160 oC and speed is maintained between 100 to 120 MPM.
[00040] The embossing of the image is carried out for example by using the standard holographic machine and nickel metal base shim by preheating it at temperature of about 130 oC to about 140 oC and embossing is carried out at 150 oC by adjusting the machine speed between about 30 MPM to about 50 MPM.
[00041] In certain embodiment, in order to create the good pattern of the holographic effect of the art work, the vacuum metallization may be carried out on the embossed side with optical density between 2.0 and 2.2.
[00042] The carrier film having formed the image thereon is then laminated with the substrate film for example PVC film coated with the adhesive such as poly urethane based two component system. The laminate is cured between 40 oC to 50 oC for example is in hot room for a duration between 24 hours to 72 hours.
[00043] The carrier film after curing is carried out is then removed by carrying out the delamination thereby obtain the substrate film with the image transferred thereon.
[00044] The substrate film with the image transferred thereon can be then utilized for forming the blisters. Blisters can be formed for example by rotary forming blister machine or a flatbed blister machine and the forming can be carried out by applying the temperature between 160 oC and 180 oC with speed ranging from 15 blisters/ minute to 50 blisters / minute.
[00045] The present invention provides a substrate with the image transferred thereon which can be suitably used for blister forming of thermoforming for products like medicine, nutraceuticals, food or any other products for human use or any other products required to be packaged to avoid counterfeiting.
EXAMPLES
Packaging films comprising anticounterfeit image were manufactured by the process as mentioned hereinabove. The coating speed was maintained at 90mpm, total GSM at 5.22 to 6.22, residence time at 8 seconds and thickness of Primer 1 at 0.5 to 1.5 GSM. Table 1 below summarises the effect of changes in temperature while manufacturing the films was studied in the detail.
Sr. No. Application of Embossing at Metallization O.D Lamination at
Primer 1 at Lacquer 1 at Primer 2 at Lacquer 2 at
1 135 °C 150 °C 130 °C 160 °C 160 °C 0.9 100 °C
2 135 °C 155 °C 135 °C 165 °C 165 °C 1.5 105 °C
3 135 °C 165 °C 140 °C 170 °C 175 °C 2.25 110 °C
4 135 °C 170 °C 145 °C 175 °C 170 °C 2.45 115 °C
5 135 °C 150 °C 130 °C 160 °C 160 °C 0.9 100 °C
6 135 °C 155 °C 135 °C 165 °C 165 °C 1.5 105 °C
7 135 °C 165 °C 140 °C 170 °C 175 °C 2.25 110 °C
8 135 °C 170 °C 145 °C 175 °C 170 °C 2.45 115 °C
9 135 °C 150 °C 130 °C 160 °C 160 °C 0.9 100 °C
10 135 °C 155 °C 135 °C 165 °C 165 °C 1.5 105 °C
11 135 °C 165 °C 140 °C 170 °C 175 °C 2.25 110 °C
12 135 °C 170 °C 145 °C 175 °C 170 °C 2.45 115 °C
13 140 °C 150 °C 130 °C 160 °C 160 °C 0.9 100 °C
14 140 °C 155 °C 135 °C 165 °C 165 °C 1.5 105 °C
15 140 °C 165 °C 140 °C 170 °C 175 2.25 110 °C
16 140 °C 170 °C 145 °C 175 °C 170 °C 2.45 115 °C
17 140 °C 150 °C 130 °C 160 °C 160 °C 0.9 100 °C
18 140 °C 155 °C 135 °C 165 °C 165 °C 1.5 105 °C
19 140 °C 165 °C 140 °C 170 °C 175 °C 2.25 110 °C
20 140 °C 170 °C 145 °C 175 °C 170 °C 2.45 115 °C
21 140 °C 150 °C 130 °C 160 °C 160 °C 0.9 100 °C
22 140 °C 155 °C 135 °C 165 °C 165 °C 1.5 105 °C
23 140 °C 165 °C 140 °C 170 °C 175 °C 2.25 110 °C
24 140 °C 170 °C 145 °C 175 °C 170 °C 2.45 115 °C
25 145 °C 150 °C 130 °C 160 °C 160 °C 0.9 100 °C
26 145 °C 155 °C 135 °C 165 °C 165 °C 1.5 105 °C
27 145 °C 165 °C 140 °C 170 °C 175 °C 2.25 110 °C
28 145 °C 170 °C 145 °C 175 °C 170 °C 2.45 115 °C
29 145 °C 150 °C 130 °C 160 °C 160 °C 0.9 100 °C
30 145 °C 155 °C 135 °C 165 °C 165 °C 1.5 105 °C
31 145 °C 165 °C 140 °C 170 °C 175 °C 2.25 110 °C
32 145 °C 170 °C 145 °C 175 °C 170 °C 2.45 115 °C
33 145 °C 150 °C 130 °C 160 °C 160 °C 0.9 100 °C
34 145 °C 155 °C 135 °C 165 °C 165 °C 1.5 105 °C
35 145 °C 165 °C 140 °C 170 °C 175 °C 2.25 110 °C
36 145 °C 170 °C 145 °C 175 °C 170 °C 2.45 115 °C

It was observed that the film formed in serial no. 19 showed stable cross linking in Lacquer 1 and Primer 2, showed normal metallisation with proper holographic effect. Other variations depicted at least one of unstable crosslinking, low or high metallisation, opaqueness and impaired holographic effect.
[00046] While the foregoing description discloses various embodiments of the disclosure, other and further embodiments of the invention may be devised without departing from the basic scope of the disclosure.

,CLAIMS:1.) A packaging film comprising at least one thermoformable substrate of polymer film coated with an adhesive coating capable of receiving a transfer anticounterfeit image and at least one carrier film with a low anchorage to the coating;
wherein said at least one carrier film comprises a coating of a wax system by using an acrylic resin.
2.) The film as claimed in claim 1, wherein said at least one thermoformable substrate film is selected from the group consisting of polyvinyl chloride (PVC), Polyvinylidene chloride (PVDC), Polyethylene, amorphous polyethylene terephthalate (APET) and Polychlorotrifluoroethylene (PCTFE).
3.) The film as claimed in claim 1, wherein said PVC, PE and PVDC film has a thickness in the range of 100 to 350 microns.
4.) The film as claimed in claim 1, wherein said PCTFE has a thickness in the range of 15 to 152 microns and said APET film has a thickness in the range of 150 to 250 microns.
5.) The film as claimed in claim 1, wherein said adhesive coating is provided by at least one of water-based acrylate system or polyurethane based two component system.
6.) The film as claimed in claim 1, wherein said adhesive coating has a thickness in the range of 1.5 GSM to 4.5 GSM.
7.) The film as claimed in claim 1, wherein said carrier film comprises:
a. coating of a wax system having thickness in the range of 0.01 GSM to 1 GSM by using acrylic resin;
b. a first layer of coating with a composition comprising resin(s) and a cross linker in a defined ratio of 0.1:0.11 to 1.5:10;
c. a coating of polymeric resin;
d. a second layer of coating with a coating composition comprising resin(s) and cross linker in a defined ratio of 0.1:0.11 to 1.5:10;
wherein said resin is selected from the group consisting of acrylic resin, polyester resin, polyvinyl resin and poly vinyl butyral resin;
wherein said crosslinker is selected from the group consisting of polyester based cross-linker and polyurethane based cross-linker;
and
e. an image embossed on the coated carrier film.
8.) The film as claimed in claim 1, wherein said at least one carrier film is selected from the group consisting of a biaxial oriented film, a monoaxial oriented film, a non-oriented film and a combination thereof.
9.) The film as claimed in claim 8, wherein said at least one carrier film is selected from the group consisting of polyester (PET), oriented polyamide (OPA), biaxially oriented polypropylene (BOPP), biaxially oriented polyethylene (BOPE), biaxially-oriented polyethylene terephthalate (BOPET), polylactic acid (PLA) film and combinations thereof.
10.) The film as claimed in claim 1, wherein said wax system is a coating of carnova based wax system with thickness ranging from about 0.01 to 1 GSM by using acrylic resin.
11.) A process for providing an image on the packaging film, said process comprising:
f. coating a carrier film with a wax system with a thickness of about 0.01 GSM to about 1 GSM by using at least one acrylic resin to obtain a first layer with a composition comprising at least one resin and at least one cross linker in a defined ratio of 0.1:0.11 to 1.5:10, in a solvent system;
g. coating said first layer with a coating of polymeric resin in an organic solvent with solids between about 7% to about 25% and viscosity of about 50 cp to about 100 cp, followed by curing to obtain a cured first layer;
h. providing on said cured first layer, a second layer with a coating composition comprising at least one resin and at least one cross linker in a defined ratio of about 1:1:0.1 to about 4:5:1 in a solvent system and drying to obtain a coated carrier film;
i. providing an image by embossing on the coated carrier film followed by providing a coating of wax system to obtain a coated substrate film; and
j. transferring the image from the carrier layer to a coated substrate layer by curing at a temperature of about 40 oC to about 60 oC for a duration of 12 hours to 72 hours and delaminating the carrier layer.