WE CLAIM:
1. A package, comprising:
a package body including a receiving cavity for receiving a cavity item;
a sheet sealing said receiving cavity;
a conducting wire formed on said sheet so as to pass above an opening portion of said receiving cavity, said opening portion being sealed; and
a wireless communication device formed on said sheet so as to be connected to said conducting wire, wherein said wireless communication device transmits a signal including information which differs between before and after said conducting wire together with said sheet is cut as a result of opening said receiving cavity.
2. The package according to claim 1,
wherein said package body has a plurality of said receiving cavities;
wherein said conducting wire is formed on said sheet so as to correspond to each of said plurality of said receiving cavities; and
wherein at least one said wireless communication device is formed on said sheet.
3. The package according to claim 1,
wherein said package body has a plurality of said receiving cavities; and
wherein said conducting wires and said wireless communication devices are each formed on said sheet so as to correspond to each of said plurality of said receiving cavities.
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4. The package according to any one of claims 1 to 3,
wherein said wireless communication device has a
memorizing method;
wherein said memorizing method has at least one memory element;
wherein said conducting wire is connected to said memory element;
wherein said information is read out of said memory element in such a manner that said information differs between before and after said conducting wire is cut; and
wherein said conducting wire comprises a bit line connected to at least one said memory element.
5. The package according to any one of claims 1 to 4,
wherein said wireless communication device has a
memorizing method;
wherein said memorizing method has a memory array formed by arranging a plurality of memory elements;
wherein said conducting wire is connected to at least one of said plurality of memory elements; and
wherein said information is read out of said memory array in such a manner that said information differs between before and after said conducting wire is cut.
6. The package according to claim 5,
wherein said memory array comprises:
a plurality of first wires;
at least one second wire intersecting said plurality of first wires; and
said plurality of memory elements which are each provided so as to correspond to each of the intersections between said plurality of first wires and said at least one second wire and which each have: a first electrode and a
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second electrode which are spaced from each other; a third electrode connected to one of said at least one second wire; and an insulating layer electrically insulating said first electrode and said second electrode from said third electrode;
wherein one of said first electrode and said second electrode is connected to one of said plurality of first wires;
wherein at least one of said plurality of memory elements has a semiconductor layer in a region between said first electrode and said second electrode;
wherein said plurality of memory elements are composed of memory elements of two different kinds having different inter-electrode electrical characteristics of the first electrode and the second electrode; and
wherein information recorded in said memory array is determined by an arrangement obtained by any combination of said memory elements of two kinds.
7. The package according to claim 6,
wherein, of said memory elements of two kinds, the
memory element(s) of one kind has/have said semiconductor layer, and the memory element(s) of the other kind does/do not have said semiconductor layer; and
wherein said memory element(s) of one kind and said memory element(s) of the other kind each record information which differs between each other according to whether said memory elements of two kinds each have the semiconductor layer.
8. The package according to claim 6 or 7, wherein said
semiconductor layer contains one or more selected from the
group consisting of carbon nanotubes, graphene, and
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fullerene.
9. The package according to any one of claims 6 to 8,
wherein said semiconductor layer contains a carbon nanotube
composite in which a conjugated polymer is adhered to at
least a part of the surface of a carbon nanotube.
10. The package according to any one of claims 1 to 3,
wherein said wireless communication device has a
modulation circuit;
wherein said conducting wire is connected to said modulation circuit; and
wherein said signal including information is modulated by said modulation circuit in such a manner that said information differs between before and after said conducting wire is cut.
11. The package according to claim 10,
wherein said modulation circuit comprises:
a switch circuit; and
a plurality of resistance elements connected to said switch circuit;
wherein said conducting wire is connected to at least one of said plurality of resistance elements.
12. The package according to claim 11,
wherein said switch circuit comprises a transistor having a semiconductor layer; and
wherein said semiconductor layer contains a carbon nanotube composite in which a conjugated polymer is adhered to at least a part of the surface of a carbon nanotube.
13. A method of producing a package including: a package
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body having at least one receiving cavity for receiving a cavity item; and a sheet sealing said at least one receiving cavity; said method comprising:
a functional portion formation step wherein a conductive wire and at least one wireless communication device are formed on a substrate constituting said sheet, wherein said conducting wire passes above an opening portion of said receiving cavity, said opening portion being sealed, and wherein said wireless communication device is connected to said conducting wire and transmits a signal including information which differs between before and after said conducting wire together with said sheet is cut as a result of opening said receiving cavity; and
an adhering step wherein said sheet is adhered to said package body in such a manner that said receiving cavity of said package body is sealed by the adhered sheet, wherein said package body has said cavity item received in said receiving cavity, and wherein said sheet has at least one said conducting wire and said at least one wireless communication device formed on said substrate,
wherein said wireless communication device has a memory array including, on said substrate, a plurality of first wires, at least one second wire intersecting said plurality of first wires, and a plurality of memory elements which are each provided to correspond to each of the intersections between said plurality of first wires and said at least one second wire;
wherein said plurality of memory elements each have: a first electrode and a second electrode which are spaced from each other; a third electrode connected to one of said at least one second wire; and an insulating layer electrically insulating said first electrode and said second electrode from said third electrode;
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wherein, in said functional portion formation step, a coating layer is formed, by a coating method, in a region between said first electrode and said second electrode in at least one of said plurality of memory elements, and said memory arrays having recorded information which differs between/among said plurality of said receiving cavities are each produced for each of said plurality of said wireless communication devices; and
wherein said coating method is one selected from the group consisting of an inkjet method, a dispenser method, and a spray method.
14. A sense-of-disconnection device, comprising:
a conducting wire formed on a substrate: and
a wireless communication device formed on said substrate so as to be connected to said conducting wire, wherein said wireless communication device transmits a signal including information which differs between before and after said conducting wire is cut;
wherein said wireless communication device has a memorizing method;
wherein said memorizing method has a memory array formed by arranging a plurality of memory elements;
wherein said conducting wire is connected to at least one of said plurality of memory elements;
wherein said information is read out of said memory array in such a manner that said information differs between before and after said conducting wire is cut;
wherein said memory array comprises: a plurality of first wires; at least one second wire intersecting said plurality of first wires; and
said plurality of memory elements which are each
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provided so as to correspond to each of the intersections between said plurality of first wires and said at least one second wire and which each have: a first electrode and a second electrode which are spaced from each other; a third electrode connected to one of said at least one second wire; and an insulating layer electrically insulating said first electrode and said second electrode from said third electrode;
wherein one of said first electrode and said second electrode is connected to one of said plurality of first wires;
wherein at least one of said plurality of memory elements has a semiconductor layer in a region between said first electrode and said second electrode;
wherein said plurality of memory elements are composed of memory elements of two different kinds having different inter-electrode electrical characteristics of the first electrode and the second electrode; and
wherein information recorded in said memory array is determined by an arrangement obtained by any combination of said memory elements of two kinds.
15. A sense-of-disconnection device, comprising: a conducting wire formed on a substrate: and a wireless communication device formed on said
substrate so as to be connected to said conducting wire,
wherein said wireless communication device transmits a
signal including information which differs between before
and after said conducting wire is cut;
wherein said wireless communication device has a
modulation circuit;
wherein said conducting wire is connected to said
modulation circuit; and
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wherein said signal including said information is modulated by said modulation circuit in such a manner that said information differs between before and after said conducting wire is cut.
16. A sense-of-opening label, comprising:
a sense-of-disconnection device according to claim 14;
wherein said sense-of-disconnection device is
configured to be attached to an openable article; and
wherein said conducting wire together with said substrate is cut as a result of opening said openable article.
17. A sense-of-opening label, comprising:
a sense-of-disconnection device according to claim 15;
wherein said sense-of-disconnection device is
configured to be attached to an openable article; and
wherein said conducting wire together with said substrate is cut as a result of opening said openable article.
Dated this 01 day of April 2020
- Digitally signed -
(Sathya Menon)
Reg. No.: IN/PA – 973
Of De Penning & De Penning
Agent for the Applicants
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