FORM-2
THE PATENTS ACT. 1970 (39 of 1970)
COMPLETE SPECIFICATION (Section 10, rule 13)
PADMA HEAT SINK
Dr. Mandar M. Lele, Dr. Pritee Purohit, Raviraj Gurav, Sanjay Gaikwad, Suvendu Das,
Chanchal Kumar Kushwaha, Younus Sheikh
Residing at
Flat No.-D-3/108, Gajalaxmi Society, Sahakarnagar-Phase 1, Pune, 411009,
Maharashtra, India.
THE FOLLOWING SPECIFICATION PARTICULARLY DESCRIBES THE NATURE OF THE INVENTION AND THE MANNER IN WHICH IT IS TO BE PERFORMED: -

FIELD OF THE INVENTION:
This invention relates to the field of Mechanical Engineering.
Particularly, this invention relates to Padma heat sink which is comparatively more
efficient as compared to conventional aluminium and copper parallel channel heat sink.
More particularly, this invention is associated with cooling of electronic equipments such
as desktop IC etc.
BACKGROUND OF THE INVENTION:
The problems in parallel channel heat sink are:
1. The fluid flowing through a parallel channel heat sink is not able to carry away the heat efficiently.
2. Sometimes electronic component failure occurs due to overheating because the parallel channel heat sink is not efficient in removing heat.
3. The range of operating temperature of electronic equipment employing parallel channel heat sink is low.
4. As we move along the flow of fluid in a parallel channel heat sink, the temperature of the floor keeps on increasing creating hotspots.
PRIOR ART:
According to the prior art it is observed that in the present invention parallel channel is used as a heat sink to transfer the heat .Due to low convective heat transfer coefficient getting in parallel channel, the heat removal from electronic equipment is less and hence the chances of failure of these equipments due to overheating are more. As we move along the flow of fluid in a parallel channel heat sink, the temperature of the floor keeps

on increasing creating hotspots. The range of operating temperature of electronic
components is less in existing parallel channel.
It is observed that there is a need of development of a new type of heat sink which is
having same size as that of the parallel channel heat sink but can remove heat more
efficiently.
In Prior art it is observed that no such work on this type of heat sink has been done.
Patent no.US 4884631A is related to a high efficiency forced air heat sink assembly employs a split feed transverse flow configuration to minimize the length of the air flow path through at least two separated fin structures.
Patent no.US 20070053168A1 is related to a heat sink assembly for an electronic device or a heat generating device(s) is constructed from an ultra-thin graphite layer. Patent no. US 20090145581A1 is related to a non-linear fin heat sink is provided for dissipating/removing heat uniformly from a device, where the heat generation is non-uniform over that device, while also providing a small and relatively lightweight heat sink.
Patent no.US 3437132A is related to a heat sink comprising a unitary main body, said main body being an extrusion of a heat conductive metal having a longitudinally extending extrusion axis.
Patent no.US 5829516A is related to liquid cooled heat sink for cooling heat generating components.
Patent no.US 6827131 Bl is related to apparatus of water-cooled heat sink. Patent no.US 20160165754 Al is related to water cooling heat sink unit includes a base contacting an electronic part with its outside, and the inside of the base has a first groove, a second groove, a main inlet and a main outlet.
Patent no.US 20130105135 A1 is related to the CMOS compatible polymer microchannel heat sink for electronic cooling applications.
Patent no.US 5099311A is related to the microchannel heat sink with a thermal range from cryogenic temperatures to several hundred degrees centigrade.

Patent no.US 5548605A is related to silicon wafer has slots sawn in it that allow diode
laser bars to be mounted in contact with the silicon.
Patent no.US 8120915B2 is related to heat sink provided for directly cooling at least one
electronic device package having an upper contact surface and a lower
contact surface.
Patent no.WO2016059547A2 is related to a method of manufacturing an object with
microchannel provides there through, and more particularly, but not exclusively, to a
method of manufacturing a micro heat exchanger with microchannel provided there
through.
OBJECTS OF THE INVENTION:
An object of invention is to remove the heat generated from electronic equipment
effectively.
Another object of invention is to avoid overheating of electronic equipments.
Yet another object of invention is to increase the operating temperature range of
electronic equipments.
Still another object of invention is for the same size and same hydraulic diameter of both
of the heat sinks we get much more effective heat transfer in present invention and also
remove the hotspot problem.
SUMMARY OF INVENTION:
According to this invention, there is provided a heat sink which is more efficient as
compared to parallel channel heat sink.
The system comprises of:
Two aluminium heat sinks, one is parallel channel heat sink and other is the Padma heat sink, which we have designed.
RTD sensors used for measuring temperature at inlet, outlet and wall of channel.

Holes in the side walls at a depth of 6.5 mm from the top to accommodate
thermocouples to measure wall temperature.
The two heat sinks fitted in two different manifolds and from the top the manifold
is covered with the acrylic sheet.
The manifold which has passages for inlet and outlet.
Four sensors to measure sidewall temperature, inlet temperature, outlet
temperature. From these sensors two are for measuring sidewall temperature, one
for inlet and one for outlet.
Variable frequency pump used to pump the fluid into the channel at different
mass flow rates.
A data logger used to display temperature measured by RTD. IF DESCRIPTION OF THE ACCOMPANYING DRAWINGS: lvention will now be described in relation to the accompanying drawings, in which: 31 and 2 illustrates heat sinks. SJLED DESCRIPTION OF THE ACCOMPANYING DRAWINGS:
The Figure 1 is the CAD model of Padma heat sink. The Padma heat sink is
having a diameter of 15mm and a total depth of 6.5mm.
There are total 10 channels in Padma heat sink but every two channel meet with
each other after some distance from the center, so for calculation purpose ,5
channels considered.
These channels are up to the depth of 5mm.
Below the depth of 6.5mm, RTDs are attached to measure the wall temperature.
Padma heat sink is having its inlet from the centre and outlet from the sides.

There are 5 pair of channels and in each pair of channel there is obstruction which
creates vortex. This vortex helps in enhancement of heat transfer.
Considering 5 channels (combination of two channels) we have measured width
at three different locations because the width of the channel is varying and have
taken its mean and calculated the hydraulic diameter which is 3.66514mm.
The figure 2 is the CAD model of parallel channel heat sink which is of the size
of 15mm x 15mm and a total depth of 6.5mm.
There are total 5 channels having rectangular cross-section and up to the depth of
6mm from the top surface and having a width of 2.64mm.
The hydraulic diameter in parallel channel heat sink is same as Padma heat sink.
Table 1 is showing experimental results in which at approximately same Reynolds
number and at same mass flow rates, convective heat transfer coefficient and Nusselt number of Padma heat sink and parallel channel heat sink is given. The novel features include:
-To avoid the electronic system failure due to overheating.
-To increase the operating temperature of the electronic system.
-To avoid the hot spot problem as in case parallel channel heat sink.

We claim,
1. A system relates to Padma heat sink for effective heat removal from electronic
equipments and avoid their failure.
2. A system as claimed in claim 1 ,the heat transfer coefficient for Padma heat sink for same mass flow rate varies from 2.26 to 5 times the heat transfer coefficient of parallel channel heat sink which is beneficial for effective heat removal.
3. A system as claimed in claim 1, though both of the heat sinks are having same size and same hydraulic diameter but the Padma heat sink is more efficient in heat removal process.
4. A system as claimed in claim 1, the temperature of the floor of Padma heat sink at centre is low as compared to parallel channel heat sink because inlet is at the centre due to which hot spot problem created at the center is eliminated in Padma heat sink.
5. A system as claimed in claim 1, Padma heat sink will increase the operating temperature range of the electronic equipments .
6. A system as claimed in claim 1, Chances of failure of electronic equipment due to overheating will reduce.