Photosensitive Adhesive Composition Photosensitive Adhesive Sheet And Semiconductor Device Using The Same

Abstract: Disclosed is a photosensitive adhesive composition including: (A) an epoxy compound, (B) a soluble polyimide having a residue of the diamine represented by the general formula (2), (C) a photopolymerizable compound, and (D) a photopolymerization initiator, wherein the epoxy compound (A) contains an epoxy compound represented by the general formula (1), and also the soluble polyimide (B) has a residue of diamine represented by the general formula (2): [Chemical Formula 1] wherein m and n in the general formula (1) are integers of 0 or more, which satisfy the relationship: 1 ≤ m + n ≤ 10, x is an integer of 1 or more and 5 or less, y is an integer of 1 or more and 10 or less, and y = 2x; and [Chemical Formula 2] wherein R1 to R8 in the general formula (2) may be respectively the same or different, and selected from the group consisting of a hydrogen atom, an alkyl group having 1 to 30 carbon atoms, an alkoxy group having 1 to 30 carbon atoms, a halogen, a sulfone group, a nitro group and a cyano group. The present invention provides a photosensitive adhesive composition which can be developed with an alkali developing solution after exposure, and exhibits high adhesive strength in case of thermocompression bonding on a substrate, and is also excellent in insulation stability.

Patent Information

Applicants

Inventors

Specification

Documents

Application Documents

Search Strategy