Claims
[Claim 1]
A photosensitive colored resin composition comprising an alkali-soluble resin (a), a
photosensitive compound (b), and a compound (c) having an absorption maximum in the
wavelength range of 400 nm or more and less than 490 nm, the photosensitive compound
(b) containing a photosensitive compound (b1), the photosensitive compound (b1) being
such that its maximum absorption wavelength in the range of 350 nm or more and 450 nm or
less is located within the wavelength range of 350 nm or more and 390 nm or less.
[Claim 2]
A photosensitive colored resin composition as set forth in claim 1, wherein the
photosensitive compound (b1) accounts for 5 parts by mass or more of the total quantity,
which accounts for 100 parts by mass, of the photosensitive compound (b).
[Claim 3]
A photosensitive colored resin composition as set forth in either claim 1 or 2, wherein the
photosensitive compound (b1) is a 4-naphthoquinone diazide sulfonyl ester compound.
[Claim 4]
A photosensitive colored resin composition as set forth in any one of claims 1 to 3, wherein
the alkali-soluble resin (a) is at least one alkali-soluble resin selected from the group
consisting polyimides, polyimide precursors, polybenzoxazoles, polybenzoxazole precursors,
phenol resins, polymers containing a radical polymerizable monomer having an
alkali-soluble group, siloxane polymers, cyclic olefin polymers, and cardo resins, or a
copolymer thereof.
[Claim 5]
A photosensitive colored resin composition as set forth in any one of claims 1 to 4, wherein
the alkali-soluble resin (a) has a structural unit as represented by general formula (1) or
general formula (2):
[Chemical compound 1]
wherein R1 is a tetravalent to decavalent organic group, R2 being a divalent to octavalent organic group, R3 and R4 each being a phenolic hydroxyl group, carboxy group, sulfonic group, or thiol group that may be a single group or a combination of different ones thereof,

and p and q each being an integer of 0 to 6. [Chemical compound 2]
wherein, R5 is a divalent to octavalent organic group, R6 being a divalent to octavalent
organic group, R7 and R8 each being a phenolic hydroxyl group, sulfonic group, thiol group,
or COOR9 that may be present as a single group or a combination of different ones thereof,
R9 being a hydrogen atom or a monovalent hydrocarbon group containing 1 to 20 carbon
atoms, and r and s each being an integer of 0 to 6 and meeting the relation of r + s > 0.
[Claim 6]
A photosensitive colored resin composition as set forth in any one of claims 1, 2, 4, and 5,
wherein the photosensitive compound (b1) is photopolymerization initiator and further
contains a radical polymerizable compound (f).
[Claim 7]
A photosensitive colored resin composition as set forth in any one of claims 1 to 6, further
comprising a compound (d) having an absorption maximum in the wavelength range 490 nm
or more and less than 580 nm and a compound (e) having an absorption maximum in the
wavelength range 580 nm or more and less than 800 nm.
[Claim 8]
A photosensitive colored resin composition as set forth in any one of claims 1 to 7, wherein
the compound (c) having an absorption maximum in the wavelength range of 400 nm or
more and less than 490 nm, the compound (d) having an absorption maximum in the
wavelength range 490 nm or more and less than 580 nm, and the compound (e) having an
absorption maximum in the wavelength range 580 nm or more and less than 800 nm are
dyes.
[Claim 9]
A photosensitive colored resin composition as set forth in claim 9, wherein the compound (c)
having an absorption maximum in the wavelength range of 400 nm or more and less than
490 nm is a yellow or orange dye; the compound (d) having an absorption maximum in the
wavelength range 490 nm or more and less than 580 nm is a red or violet dye; and the
compound (e) having an absorption maximum in the wavelength range 580 nm or more and
less than 800 nm is a blue or green dye.
[Claim 10]
A production method for heat resistant colored resin films comprising a coating step for
coating a substrate with a photosensitive colored resin composition as set forth in any one of

claims 1 to 9 to form a coating film, a drying step for drying the coating film to form a
photosensitive colored resin film, a light exposure step for exposing the dried photosensitive
colored resin film to light, a development step for developing the exposed photosensitive
colored resin film, and a heat treatment step for heat-treating the developed photosensitive
colored resin film.
[Claim 11]
A production method for heat resistant colored resin films as set forth in claim 10, wherein
the coating step contains a step for coating a substrate with the photosensitive colored resin
composition by the slit nozzle coating method to form a coating film and the drying step
contains a step for drying the coating film under reduced pressure to form a photosensitive
colored resin film.
[Claim 12]
A production method for heat resistant colored resin films as set forth in either claim 10 or 11,
wherein the light exposure step contains a step for performing exposure to broadband light.
[Claim 13]
A display device comprising a first electrode formed on a substrate, an insulation layer
formed to cover the periphery of the first electrode, and a second electrode located so as to
face the first electrode, the insulation layer being a cured film produced by curing a
photosensitive colored resin composition as set forth in any one of claims 1 to 9.
[Claim 14]
A display device comprising a thin film transistor (TFT) having wiring formed on a substrate,
a planarizing film provided so as to cover irregularities on the TFT having wiring, and a
display element formed on the planarizing film, the planarizing film being a cured film formed
by curing a photosensitive colored resin composition as set forth in any one of claims 1 to 9.
[Claim 15]
A display device as set forth in either claim 13 or 14 having a resolution of 50 ppi or more.