Polyamide Compositions Having High Adhesion To Metal And Use Thereof

Abstract: The present invention relates to the use of a composition comprising: a) 35 to 100 wt% of at least a semi-crystalline aliphatic polyamide and/or a polyamide of formula MXDZ in which MXD is metaxylylene diamine and Z is a C6 to C12 aliphatic dicarboxylic acid, the semi-crystalline aliphatic polyamide and/or the polyamide of formula MXDZ having a total acidity of between 70 and 180 µeq/g and a total basicity of less than 100 µeq/g; b) 0 to 25 wt%, in particular 10 to 25 wt% of polyolefins; c) 0 to 60 wt%, in particular 25 to 60 wt% of glass fibres; d) 0 to 2 wt% of at least one additive; e) 0 to 30 wt% of at least one flame retardant, in particular 10 to 30 wt%; the sum of a) + b) + c) + d) + e) being equal to 100%, the semi-crystalline aliphatic polyamide and/or the polyamide of formula MXDZ having a melt-flow index (MFI) of between 4 and 50 g/10 min, as measured according to standard ISO 1133:2011 under a weight of 2.16 kg at 210°C, in order to increase the adhesion of the composition to a metal part after deposition thereof by injection onto the metal part, compared to the adhesion obtained after injection onto the part with a composition comprising a semi-crystalline aliphatic polyamide and/or a polyamide of formula MXDZ having a different MFI, and/or a different total acidity and/or total basicity.

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