Abstract: Disclosed is a polyamide resin composition which has excellent acid resistance and a light weight and can be used suitably for parts through which an exhaust gas passes in EGR. Specifically disclosed is a polyamide resin composition containing a polyamide resin (A) and a glass (C) and optionally containing a styrene polymer (B1) and a modified PPE (B2) wherein the sum total of the contents of the components (A) (B1) and (B2) is 40 to 95 wt% and the content of the component (C) is 60 to 5 wt% in the composition the content of the component (A) is 50 to 100 wt% and the sum total of the contents of the components (B1) and (B2) is 50 to 0 wt% relative to the sum total (i.e. 100 wt%) of the contents of the components (A) (B1) and (B2) the content of component (C1) is 60 to 5 wt% in the composition when the component (C) comprises a glass (C1) that does not contain boron oxide the component (A) is a polyoxamide resin or the content of the component (A) is 50 to 90 wt% and the sum total of the contents of the components (B1) and (B2) is 50 to 10 wt% relative to the sum total (i.e. 100 wt%) of the contents of the components (A) (B1) and (B2) when the component (C) does not comprise the component (C1) and the component (B1) has a deflection temperature under load of 140 to 280°C.
SPECIFICATION
POLY AMIDE RESIN COMPOSITION
5 FIELD OF THE INVENTION
[OOOI]
The present invention relates to a polyamide resin composition which is a
thermoplastic resin composition having excellent acid resistance.
I 0 BACKGROUND ART
[0002]
Conventionally, in vehicles, such as automobiles, there may be employed an
EGR (exhaust gas recirculation) system in which part ofthe exhaust gas from an engine
mounted on an automobile is recirculated to an intake system and added to a mixed gas
I5 in the intake system to lower the combustion temperature of the mixed gas. The
employment of this system can reduce the amount ofNOx generated.
Further, the regulation of fuels and the prevention of environmental problems
demand the reduction of the weight of materials for the above system, and, for meeting
such demands, a polyamide resin composition is widely used as a substitute material for
20 a metal (for example, patent document I).
25
These materials are required to be further improved in acid resistance.
[0003]
As a method for improving the acid resistance, patent document 2 proposes a
polyamide resin composition comprising a soft tluororesin and a polyamide resin.
CITED REFERENCES
Patent documents
[0004]
Patent document I: Japanese Patent Application prior-to-examination Publication
30 (kohyo) No. 2007-530845
Patent document 2: Japanese Unexamined Patent Publication No. Hei 6-I72603
DISCLOSURE OF THE INVENTION
Problems to be Solved by the Invention
35 [0005]
However, the polyamide resin composition disclosed in patent document I (for
2
example, paragraph 0046) is not satisfactory from the viewpoint of the improvement of
acid resistance, and the polyamide resin composition disclosed in patent document 2 has
an effect such that the acid resistance is improved, but has problems to be solved about
mechanical strength and rigidity when taking the use ofthe composition in automobile
5 applications into consideration.
[0006]
An object of the present invention is to provide a polyamide resin composition
which has excellent acid resistance and is lightweight and hence can be advantageously
used in applications of a part for exhaust gas passing therethrough by EGR, such as an
10 intake manifold, an EGR delivery pipe, or an EGR cooler part.
15
Means to Solve the Problems
[0007]
The present invention has the following contents.
(1) A polyamide resin composition comprising:
a polyamide resin (component A),
glass (component C), and
optionally a styrene polymer (component Bl) and a modified polyphenylene
ether (component B2), the component B 1 having a deflection temperature under load of
20 140 to 280°C
the total amount of the components A, B 1, and B2 and the amount of the
component C being, respectively, 40 to 95% by weight and 60 to 5% by weight, based
on 100% by weight ofthe polyamide resin composition,
the amount ofthe component A and the total amount ofthe components B1 and
25 B2 being, respectively, 50 to 100% by weight and 50 to 0% by weight, based on 100%
by weight ofthe whole ofthe components A, Bl, and B2,
30
wherein when the component C contains glass containing no boron oxide
(component C1), the amount of the component C1 is 60 to 5% by weight, based on
100% by weight ofthe polyamide resin composition,
wherein when the component C does not contain the component C1, the
component A is a polyoxamide resin, or the amount of the component A and the total
amount ofthe components B1 and B2 are, respectively, 50 to 90% by weight and 50 to
10% by weight, based on 100% by weight ofthe whole ofthe components A, B1, and
B2.
35 (2) A molded article comprising the polyamide resin composition according to
item ( 1) above, which is for use in a part for exhaust gas passing therethrough by an
3
EGR system.
(3) A part for exhaust gas passing therethrough by an EGR system, the part
comprising the molded article according to item (2) above, which comprises the
polyamide resin composition for use in a part for exhaust gas passing therethrough by
5 an EGR system.
(4) A method for producing a part for exhaust gas passing therethrough by an
EGR system, the method comprising shaping the polyamide resin composition
according to item ( 1) above.
(5) A method for producing an automobile, comprising incorporating a part for
10 exhaust gas passing therethrough by an EGR system, which is obtained by the method
according to item ( 4) above.
Effect of the Invention
[0008]
15 In the present invention, there can be provided a polyamide resin composition
20
that is a thermoplastic resin which has excellent acid resistance and is lightweight and
hence can be advantageously used in applications of a part for exhaust gas passing
therethrough by EGR, such as an intake manifold, an EGR delivery pipe, or an EGR
cooler part.
BRIEF DESCRIPTION OF THE ORA WINGS
[0009]
[Fig. 1] Fig. 1 shows an example in which the result ofthe evaluation of resistance to
acids and corrosion in the Example is 0.
25 [Fig. 2] Fig.2 shows an example in which the result ofthe evaluation of resistance to
acids and corrosion in the Example is D..
[Fig. 3] Fig.3 shows an example in which the result ofthe evaluation of resistance to
acids and corrosion in the Example is x.
30 BEST MODE FOR CARRYING OUT THE INVENTION
[0010]
The polyamide resin composition of the present invention is a polyamide resin
composition which comprises:
a polyamide resin (component A),
35 glass (component C), and
optionally a styrene polymer (component B 1) and a modified polyphenylene
4
ether (component B2), the component B 1 having a deflection temperature under load of
140 to 280°C
the total amount ofthe components A, B 1, and B2 and the amount of the
component C being, respectively, 40 to 95% by weight and 60 to 5% by weight, based
5 on 1 00% by weight of the polyamide resin composition,
the amount ofthe component A and the total amount ofthe components B1 and
B2 being, respectively, 50 to 100% by weight and 50 to 0% by weight, based on 100%
by weight ofthe whole ofthe components A, B1, and B2,
wherein when the component C contains glass containing no boron oxide
10 (component C 1 ), the amount ofthe component C 1 is 60 to 5% by weight, based on
100% by weight ofthe polyamide resin composition,
wherein when the component C does not contain the component C1, the
component A is a polyoxamide resin, or the amount of the component A and the total
amount ofthe components B1 and B2 are, respectively, 50 to 90% by weight and 50 to
15 10% by weight, based on 100% by weight ofthe whole ofthe components A, B1, and
B2.
[0011]
The polyamide resin composition of the present invention (hereinafter,
frequently referred to as "polyamide resin composition") includes:
20 the first embodiment wherein the component C contains glass containing no
boron oxide (component C1), and the amount ofthe component C1 is 60 to 5% by
weight, based on 100% by weight of the polyamide resin composition,
the second embodiment wherein the component C does not contain the
component C 1, and the component A is a polyoxamide resin, and
25 the third embodiment wherein the component C does not contain the
30
component C 1, and the amount ofthe component A and the total amount ofthe
components B1 and B2 are, respectively, 50 to 90% by weight and 50 to 10% by
weight, based on 100% by weight ofthe whole ofthe components A, B1, and B2.
[0012]
From the viewpoint of achieving excellent acid resistance and the reduction of
weight, the first embodiment and the second embodiment are more preferred, and the
first embodiment is further preferred.
[0013]
(1) Component A (Polyamide resin)
35 With respect to component A in the present invention, there can be mentioned
polyamide comprised of a condensation polymerization product of a diamine and a
5
5
10
15
dicarboxylic acid (dibasic acid), a polyamide made from a lactam or an
aminocarboxylic acid, or a polyamide comprised of a condensation polymerization
product or a copolymer of two or more ofthem.
[0014]
Examples of diamines include aliphatic diamines, such as
tetramethylenediamine, hexamethylenediamine, octamethylenediamine,
nonamethylenediamine, undecamethylenediamine, and dodecamethylenediamine, and
diamines having an aromatic cyclic structure, such as metaxylenediamine.
[0015]
Examples of dicarboxylic acids include aliphatic dicarboxylic acids, such as
adipic acid, heptanedicarboxylic acid, octanedicarboxylic acid, nonanedicarboxylic
acid, undecanedicarboxylic acid, and dodecanedicarboxylic acid, and dicarboxylic acids
having an aromatic cyclic structure, such as terephthalic acid and isophthalic acid.
[0016]
The lactam is a lactam having 6 to 12 carbon atoms, and the aminocarboxylic
acid is an aminocarboxylic acid having 6 to 12 carbon atoms. Examples include
6-aminocaproic acid, 7-aminoheptanoic acid, 11-aminoundecanoic acid,
12-aminododecanoic acid, a-pyrrolidone, e-caprolactam, ro-laurolactam, and
e-enanthlactam.
20 [0017]
Component A has a role of a base material ofthe polyamide resin composition
in surely causing the composition to collectively have mechanical strength, such as
strength, heat resistance, and moldability, and, also from the viewpoint of reducing the
cost, specific examples of component A, e.g., homopolymers, such as polyamide 6,
25 polyamide 11, polyamide 12, polyamide 66, polyamide 46, polyamide 610, polyamide
612, polyamide 912, polyamide 1010 and polyamide 1212, and copolymers, such as
polyamide 6/66, polyamide 6/12 and polyamide 11/12, are preferably used.
The above-mentioned names of specific examples of component A are based
on JIS K6920-1: 2000 "Plastics-Polyamide (PA) molding and extrusion materials-Part
30 1 : Designation".
From the viewpoint of the viscosity and water absorption of the resultant
composition, polyamide 11 and polyamide 12 are desired.
From the viewpoint of surely achieving stable mechanical strength, preferred
are polyamide 6, polyamide 66, polyamide 6/66, polyamide 610, polyamide 612,
35 polyamide 1212, polyamide 1010, polyamide 912, polyamide 46, polyamide 6/12, and
polyamide 11/12, and from the viewpoint of achieving both the stable mechanical
6
strength and the reduced cost, polyamide 6 and polyamide 66 are more preferred.
[0018]
Further, from the viewpoint of achieving excellent acid resistance, component
A is further preferably a polyoxamide resin made using oxalic acid as a dicarboxylic
5 acid component.
As a source of oxalic acid for the polyoxamide resin, an oxalic acid diester is
used, and, with respect to the oxalic acid diester, there is no particular limitation as long
as it has a reactivity with an amino group, and examples include oxalic acid diesters of
an aliphatic monohydric alcohol, such as dimethyl oxalate, diethyl oxalate, di-n-( or
10 i-)propyl oxalate, and di-n-( or i-, or t-)butyl oxalate; oxalic acid diesters of an alicyclic
alcohol, such as dicyclohexyl oxalate; and oxalic acid diesters of an aromatic alcohol,
such as diphenyl oxalate. Ofthese, an oxalic acid diester capable of forming an
alcohol which can be completely removed at the temperature of the subsequent melt
polymerization or solid phase polymerization is preferably used. Examples of such
15 oxalic acid diesters include dimethyl oxalate, diethyl oxalate, di-n-( or i-)propyl oxalate,
and di-n-( or i-, or t-)butyl oxalate. Further, diethyl oxalate, di-n-( or i-)propyl oxalate,
or di-n-( or i-, or t-)butyl oxalate, which is in a liquid state at room temperature and is
easily mixed with a diamine by kneading, is especially preferably used.
20
[0019]
As examples of diamines, which are a raw material for the polyoxamide resin
as component A, there can be mentioned one member or mixtures of two or more
arbitrary members selected from aliphatic diamines, such as ethylenediamine,
propylenediamine, 1 ,4-butanediamine, 1 ,5-pentanediamine, 1 ,6-hexanediamine,
1, 7 -heptanediamine, 1, 8-octanediamine, 1 ,9-nonanediamine, 1, 1 0-decanediamine,
25 1, 12-dodecanediamine, 2-methyl-1 ,5-pentanediamine, 3-methyl-1 ,5-pentanediamine,
2,2,4-trimethyl-1 ,6-hexanediamine, 2,4,4-trimethyl-1 ,6-hexanediamine,
2-methyl-1,8-octanediamine, and 5-methyl-1,9-nonanediamine, alicyclic diamines, such
as cyclohexanediamine, methylcyclohexanediamine, and isophoronediamine, and
aromatic diamines, such as p-phenylenediamine, m-phenylenediamine, xylenediamine,
30 4,4' -diaminodiphenylmethane, 4,4' -diaminodiphenyl sulfone, and 4,4' -diaminodiphenyl
ether.
[0020]
In component A, in addition to the polyoxamide resin, a polyamide resin, such
as an aromatic polyamide, an aliphatic polyamide, or an alicyclic polyamide, can be
35 mixed into component A.
[0021]
7
(2) Component B I (Styrene polymer)
With respect to the styrene polymer, from the viewpoint of achieving excellent
acid resistance, the polyamide resin composition preferably comprises a styrene
polymer having a deflection temperature under load of 140 to 280°C, preferably 150 to
5 280°C, more preferably 160 to 280°C, further preferably 170 to 280°C.
[0022]
The styrene polymer means a polymer comprising structure units derived from
a styrene monomer or a styrene based monomer having a substituted phenyl in which
hydrogen in the phenyl group of styrene is further substituted.
10 [0023]
The deflection temperature under load is a yardstick for the heat resistance of
the styrene polymer, and, when the styrene polymer is preferably a styrene polymer
having a syndiotactic structure (hereinafter, frequently referred to as "SPS"), the styrene
polymer can achieve a deflection temperature under load in the above-mentioned
15 preferred range.
The deflection temperature under load is defined as a temperature, as measured
in accordance with ASTM D-648, at which a test piece having a size of length: 5 inches
x width: 1/2 inch x thickness: 112 inch is deflected by 0.25 mm when the temperature of
the test piece is elevated from room temperature at a temperature elevation rate of
20 2°C/min under conditions such that the mold temperature is 150°C and the load is 0.46
MPa.
[0024]
SPS is commercially available, for example, from Idemitsu Kosan Co., Ltd. in
the trade name of"XAREC".
25 [0025]
In the styrene polymer having a syndiotactic structure, the term "syndiotactic
structure" means a stereostructure of a syndiotactic structure, namely, a stereostructure
in which side chains, such as a phenyl group and a substituted phenyl group, are
positioned alternately in different directions with respect to the principal chain formed
30 from a carbon-carbon bond, and the tacticity is preferably quantitatively determined by
a nuclear magnetic resonance method using isotopic carbon (13C-NMR method).
The tacticity determined by a 13C-NMR method can be indicated by the ratio of
a plurality of continuous units present in the polymer, for example, dyad for two units,
triad for three units, or pentad for five units, and the term "styrene copolymer having a
35 syndiotactic structure" used in the present invention means polystyrene,
poly(alkylstyrene ); poly(halogenated styrene), poly(halogenated alkyl styrene),
8
poly(alkoxystyrene), or poly( vinyl benzoate), a hydrogenated polymer thereof, a
mixture thereof, or a copolymer comprised mainly of them, each having syndiotacticity
which is generally racemic dyad in an amount of 75% or more, preferably 85% or more,
or racemic pentad in an amount of 30% or more, preferably 50% or more.
5 Examples of poly( alkylstyrene) include poly(methylstyrene ),
poly( ethylstyrene ), poly(isopropylstyrene ), poly(tert-butylstyrene ), poly(phenylstyrene ),
poly(vinylnaphthalene), and poly(vinylstyrene), and examples ofpoly(halogenated
styrene) include poly(chlorostyrene), poly(bromostyrene), and poly(fluorostyrene).
Examples of poly(halogenated alkylstyrene) include poly( chloromethylstyrene ).
10 Examples ofpoly(alkoxystyrene) include poly(methoxystyrene) and
poly( ethoxystyrene ).
[0026]
More preferred examples of styrene polymers include polystyrene,
poly(p-methylstyrene ), poly( m-methylstyrene ), poly(p-tert -butylstyrene ),
15 poly(p-chlorostyrene), poly(m-chlorostyrene), poly(p-fluorostyrene), hydrogenated
polystyrene, and copolymers comprising structure units for these polymers.
20
The styrene polymers can be used individually or in combination oftwo or
more of them.
[0027]
With respect to the molecular weight of the styrene polymer, there is no
particular limitation, and, from the viewpoint of obtaining a polyamide resin
composition or a molded article thereof having thermal properties and mechanical
properties in the preferred ranges, the weight average molecular weight of the styrene
polymer is preferably 10,000 or more, more preferably 50,000 or more, and preferably
25 400,000 or less, more preferably 300,000 or less, further preferably 10,000 to 400,000,
still further preferably 50,000 to 300,000. Further, the width of the molecular weight
distribution of the styrene polymer is not limited, and various molecular weight
distributions can be applied to the styrene polymer.
The weight average molecular weight was determined by gel permeation
30 chromatography (GPC) using 1,2,4-trichlorobenzene as a solvent at 130°C.
[0028]
The styrene polymer having a syndiotactic structure can be produced by, for
example, polymerizing a styrene (based) monomer in an inert hydrocarbon solvent or
without a solvent using as a catalyst a titanium compound and a condensation product
35 of water and a trialkylaluminum (Japanese Unexamined Patent Publication No. Sho
62-187708).
9
~ I
The poly(halogenated alkyl styrene) can be obtained by the method described in
Japanese Unexamined Patent Publication No. Hei 1-46912, and the above-mentioned
hydrogenated polymer can be obtained by, e.g., the method described in Japanese
Unexamined Patent Publication No. Hei 1-178505.
5 [0029]
(3) Component B2 (Modified polyphenylene ether)
Component B2 causes component B I to be stably dispersed in the polyamide
resin composition to improve the strength of the interface between component B I and
the polyamide resin, making stable the mechanical properties and acid resistance of the
I 0 polyamide resin composition.
With respect to component B2, from the viewpoint of stabilizing the
dispersibility of component B 1 and the mechanical properties and acid resistance of the
polyamide resin composition, maleic anhydride-modified polyphenylene ether and/or
fumaric acid-modified polyphenylene ether is preferred, and fumaric acid-modified
15 polyphenylene ether is more preferred.
[0030]
From the viewpoint of causing component B 1 to be stably dispersed to improve
the strength of the interface between component B I and the polyamide resin, making
stable the mechanical properties and acid resistance ofthe polyamide resin composition,
20 the component B }/component B2 weight ratio (B1/B2) is preferably 5/95 to 90/10,
more preferably 26/74 to 88/12, further preferably 76/24 to 85/15.
[0031]
(4) Component C (Glass)
The glass, which is component C used in the polyamide resin composition of
25 the present invention (hereinafter, frequently referred to as "polyamide resin
composition"), indicates aluminoborosilicate glass which is general glass {e.g., E-glass
(generally called non-alkali glass)}, more preferably glass containing no boron oxide
(component C 1) as compared to E-glass from the viewpoint of achieving excellent acid
resistance. The glass may be in the form of fibers, flakes, beads, or balloon, and, from
30 the viewpoint of obtaining a strength and the like, glass fibers are especially preferred.
[0032]
The glass containing no boron oxide, which is component C I used in the
present invention, indicates glass containing no boron oxide, as compared to E-glass
which is general glass. Component C 1 may be in the form of fibers, flakes, beads, or
35 balloon, and, from the viewpoint of obtaining a strength and the like, glass fibers are
especially preferred.
10
[0033]
(5) Thermoplastic resin other than the polyamide resin
In the polyamide resin composition, a thermoplastic resin which is other than
polyamide resin component A and which has a low water absorption and a chemical
5 resistance may be added.
As preferred examples, there can be mentioned at least one thermoplastic resin
selected from a styrene resin, such as a polystyrene resin other than component B I or an
ABS resin, a polyphenylene phenylene ether resin other than component B2, a polyester
resin, a polyphenylene sulfide resin, a polyphenylene oxide resin, a polycarbonate resin,
I 0 a poly lactic acid resin, a polyacetal resin, a polysulfone resin, a polyethylene
tetrafluoride resin, a polyether imide resin, a polyamide-imide resin, a polyimide resin,
a polyether sulfone resin, a polyether ketone resin, a polythioether ketone resin, a
polyether ether ketone resin, a polyethylene resin, a polypropylene resin, a rubber
polymer, and a polyalkylene oxide resin.
I5 For improving the reactivity ofthe polyamide resin with a resin other than the
polyamide resin, at least one resin other than the polyamide resin, which has a modified
end group, is more preferably used.
[0034]
Further, in the polyamide resin composition of the present invention, an
20 additional component, for example, a function imparting agent, such as a plasticizer, a
high-impact material, a heat-resistant material, a foaming agent, a weathering agent, a
nucleating agent, a crystallization accelerator, a release agent, a lubricant, a
fluidity-improving agent, an antistatic agent, a flame retardant, an auxiliary for flame
retardant, a pigment, or a dye, can be incorporated in such an appropriate amount that
25 the effects of the present invention are not sacrificed.
[0035]
(6) Polyamide resin composition
With respect to the amounts of components A, B I, B2, and C incorporated into
the polyamide resin composition, the total amount of components A, B I, and B2 and the
30 amount of component C are, respectively, 40 to 95% by weight and 60 to 5% by weight,
based on 100% by weight ofthe polyamide resin composition, and the amount of
component A and the total amount of components B I and B2 are, respectively, 50 to
IOO% by weight and 50 to 0% by weight, based on IOO% by weight ofthe whole ofthe
components A, BI, and B2.
35 [0036]
When the polyamide resin composition does not contain components B I and
II
B2, from the viewpoint of achieving excellent acid resistance and the reduction of
weight, the amount of component (A) incorporated into the polyamide resin
composition is 40 to 95% by weight, more preferably 55 to 90% by weight, further
preferably 55 to 80% by weight, based on IOO% by weight ofthe polyamide resin
5 composition.
[0037]
From the viewpoint of achieving excellent acid resistance and the reduction of
weight, the total amount of component A and the thermoplastic resin other than
component A incorporated into the polyamide resin composition is preferably 40 to
I 0 95% by weight, more preferably 55 to 90% by weight, further preferably 55 to 80% by
weight, based on IOO% by weight ofthe polyamide resin composition.
[0038]
When the polyamide resin composition contains components B I and B2, from
the viewpoint of achieving excellent acid resistance and the reduction of weight, the
I5 amount of component A and the total amount of components B I and B2 are,
respectively, 50 to I 00% by weight and 50 to 0% by weight (excluding 0% by weight),
based on IOO% by weight of components A, BI, and B2;
it is preferred that the amount of component A and the total amount of
components BI and B2 are, respectively, 50 to 90% by weight and 50 to IO% by
20 weight, based on IOO% by weight ofthe whole of components A, BI, and B2;
it is more preferred that the amount of component A and the total amount of
components B I and B2 are, respectively, 60 to 80% by weight and 40 to 20% by
weight, based on the IOO% by weight of the whole of components A, B I, and B2; and
it is further preferred that the amount of component A and the total amount of
25 components B I and B2 are, respectively, 65 to 75% by weight and 35 to 25% by
weight, based on I 00% by weight of the whole of components A, B I, and B2.
[0039]
From the viewpoint of achieving excellent acid resistance, the reduction of
weight, and excellent moldability, the amount of component C incorporated into the
30 polyamide resin composition is 60 to 5% by weight, preferably 50 to I 0% by weight,
more preferably 45 to I 0% by weight, further preferably 40 to 20% by weight, further
preferably 35 to 25% by weight, based on I 00% by weight of the polyamide resin
composition.
[0040]
35 When component C contains component CI, from the viewpoint of achieving
excellent acid resistance, the reduction of weight, and excellent moldability, the amount
I2
of component C 1 incorporated into the polyamide resin composition is 60 to 5% by
weight, preferably 50 to I 0% by weight, more preferably 45 to 10% by weight, further
preferably 40 to 20% by weight, further preferably 35 to 25% by weight, based on
100% by weight ofthe polyamide resin composition.
5 [0041]
From the viewpoint of achieving excellent acid resistance, component C 1 is
preferably present in an amount of8.4 to 100% by weight, more preferably 16.7 to
100% by weight, further preferably 33.4 to 100% by weight, further preferably 41.7 to
100% by weight, further preferably 58.4 to 100% by weight, further preferably 66.7 to
10 100% by weight, further preferably 75.0 to 100% by weight, further preferably 84 to
100% by weight, further preferably 100% by weight, based on 100% by weight of
component C.
[0042]
(7) Polyamide resin composition of the first embodiment
15 In the polyamide resin composition of the first embodiment, component C
contains component C 1, and the total amount of components A, B 1, and B2 or the
amount of component A and the amount of component C1 are, respectively, 40 to 95%
by weight and 60 to 5% by weight, based on 100% by weight ofthe polyamide resin
composition, and the amount of component A and the total amount of components B 1
20 and B2 are, respectively, 50 to 100% by weight and 50 to 0% by weight, based on 100%
by weight of the whole of components A, B 1, and B2.
[0043]
In the more preferred first embodiment, the total amount of components A, B 1,
and B2 and the amount of component C 1 are, respectively, 40 to 95% by weight and 60
25 to 5% by weight, based on 100% by weight of the whole of components A, B 1, B2, and
C1;
30
it is preferred that the total amount of components A, B 1, and B2 and the
amount of component C 1 are, respectively, 55 to 90% by weight and 45 to 10% by
weight, based on 100% by weight ofthe whole of components A, B1, B2, and C1;
it is more preferred that the total amount of components A, B 1, and B2 and the
amount of component C 1 are, respectively, 55 to 80% by weight and 45 to 20% by
weight, based on 100% by weight of the whole of components A, B1, B2, and C1;
it is further preferred that the total amount of components A, B 1, and B2 and
the amount of component C 1 are, respectively, 60 to 80% by weight and 40 to 20% by
35 weight, based on 100% by weight ofthe whole of components A, B1, B2, and C1; and
it is further preferred that the total amount of components A, B 1, and B2 and
13
the amount of component CI are, respectively, 65 to 75% by weight and 35 to 25% by
weight, based on 100% by weight ofthe whole of components A, BI, B2, and CI, or
the amount of component A and the amount of component C I are, respectively,
40 to 95% by weight and 60 to 5% by weight, based on IOO% by weight ofthe whole of
5 components A and C;
it is preferred that the amount of component A and the amount of component
CI are, respectively, 55 to 90% by weight and 45 to IO% by weight, based on IOO% by
weight of the whole of components A and C;
it is more preferred that the amount of component A and the amount of
IO component CI are, respectively, 55 to 80% by weight and 45 to 20% by weight, based
on I 00% by weight of the whole of components A and C;
I5
it is further preferred that the amount of component A and the amount of
component CI are, respectively, 60 to 80% by weight and 40 to 20% by weight, based
on I 00% by weight of the whole of components A and C; and
it is further preferred that the amount of component A and the amount of
component CI are, respectively, 65 to 75% by weight and 35 to 25% by weight, based
on I 00% by weight of the whole of components A and C.
[0044]
In the first embodiment, from the viewpoint of achieving excellent acid
20 resistance, the reduction of weight, and excellent moldability, the amount of component
C I incorporated into the polyamide resin composition is 60 to 5% by weight, preferably
50 to I 0% by weight, more preferably 45 to I 0% by weight, further preferably 40 to
20% by weight, further preferably 35 to 25% by weight, based on 100% by weight of
the polyamide resin composition, preferably based on 100% by weight ofthe whole of
25 components A, B I, B2, and C or I 00% by weight of the whole of components A and
c.
Further, from the viewpoint of achieving excellent acid resistance, component
C I is preferably present in an amount of 8.4 to I 00% by weight, more preferably I6. 7 to
IOO% by weight, further preferably 33.4 to IOO% by weight, further preferably 41.7 to
30 IOO% by weight, further preferably 58.4 to IOO% by weight, further preferably 66.7 to
I 00% by weight, further preferably 75.0 to I 00% by weight, further preferably 84 to
35
I 00% by weight, further preferably I 00% by weight, based on I 00% by weight of
component C.
[0045]
The polyamide resin composition of the first embodiment may contain or may
not contain component B I and component B2, and, from the viewpoint of achieving
I4
excellent acid resistance and the reduction of weight, the composition preferably
contains component B I and component B2, and, in such a case, the amount of
component A and the total amount of components B I and B2 are, respectively, 50 to
IOO% by weight and 50 to 0% by weight (excluding 0% by weight), based on IOO% by
5 weight ofthe whole of components A, BI, and B2;
it is preferred that the amount of component A and the total amount of
components BI and B2 are, respectively, 50 to 90% by weight and 50 to 10% by
weight, based on I 00% by weight of the whole of components A, B I, and B2;
it is more preferred that the amount of component A and the total amount of
IO components BI and B2 are, respectively, 60 to 80% by weight and 40 to 20% by
weight, based on 100% by weight ofthe whole of components A, BI, and B2; and
it is further preferred that the amount of component A and the total amount of
components B I and B2 are, respectively, 65 to 75% by weight and 35 to 25% by
weight, based on IOO% by weight ofthe whole of components A, BI, and B2.
I5 [0046]
In the first embodiment, component A may contain or may not contain a
polyoxamide resin, and, from the viewpoint of achieving excellent acid resistance and
the reduction of weight, component A preferably contains a polyoxamide resin, and, in
such a case, the amount ofthe polyoxamide resin incorporated into the polyamide resin
20 composition is preferably 2 to 95% by weight, more preferably 3 to 90% by weight,
further preferably 3 to 80% by weight, further preferably 3 to 75% by weight, based on
IOO% by weight ofthe polyamide resin composition.
The polyoxamide resin is preferably present in an amount of 5 to I 00% by
weight, more preferably 30 to I 00% by weight, further preferably 60 to I 00% by
25 weight, further preferably I 00% by weight, based on I 00% by weight of component A.
[0047]
30
(8) Polyamide resin composition of the second embodiment
In the polyamide resin composition ofthe second embodiment, component C
does not contain component C I and component A is a polyoxamide resin.
In the second embodiment, component A is a polyoxamide resin, and, from the
viewpoint of achieving excellent acid resistance and the reduction ofweight, the amount
ofthe polyoxamide resin incorporated into the polyamide resin composition is
preferably 40 to 95% by weight, more preferably 55 to 90% by weight, further
preferably 55 to 80% by weight, based on IOO% by weight ofthe polyamide resin
35 composition.
[0048]
I5
In the more preferred second embodiment, it is preferred that the amount of the
polyoxamide resin and the amount of component C are, respectively, 40 to 95% by
weight and 60 to 5% by weight, based on 100% by weight of the whole of the
polyoxamide resin and component C;
5 it is more preferred that the amount of the polyoxamide resin and the amount of
component C are, respectively, 55 to 90% by weight and 45 to 10% by weight, based on
100% by weight ofthe whole ofthe polyoxamide resin and component C;
it is further preferred that the amount of the polyoxamide resin and the amount
of component C are, respectively, 55 to 80% by weight and 45 to 20% by weight, based
10 on 100% by weight ofthe whole ofthe polyoxamide resin and component C;
it is further preferred that the amount ofthe polyoxamide resin and the amount
of component C are, respectively, 60 to 80% by weight and 40 to 20% by weight, based
on 100% by weight ofthe whole ofthe polyoxamide resin and component C; and
it is further preferred that the amount of the polyoxamide resin and the amount
15 of component Care, respectively, 65 to 75% by weight and 35 to 25% by weight, based
on 100% by weight ofthe whole ofthe polyoxamide resin and component C.
[0049]
In the second embodiment, the composition may contain or may not contain
component B 1 and component B2, and, from the viewpoint of achieving excellent acid
20 resistance and the reduction of weight, the composition preferably contains component
B 1 and component B2, and, in such a case, the amount of component A and the total
amount of components B 1 and B2 are, respectively, 50 to 100% by weight and 50 to 0%
by weight (excluding 0% by weight}, based on 100% by weight of the whole of
components A, B1, and B2;
25 it is preferred that the amount of component A and the total amount of
components B 1 and B2 are, respectively, 50 to 90% by weight and 50 to 10% by
weight, based on 100% by weight ofthe whole of components A, B1, and B2;
it is more preferred that the amount of component A and the total amount of
components B 1 and B2 are, respectively, 60 to 80% by weight and 40 to 20% by
30 weight, based on 100% by weight of the whole of components A, B 1, and B2; and
it is further preferred that the amount of component A and the total amount of
components B 1 and B2 are, respectively, 65 to 75% by weight and 35 to 25% by
weight, based on 100% by weight ofthe whole of components A, B1, and B2.
[0050]
35 (9) Polyamide resin composition of the third embodiment
In the polyamide resin composition of the third embodiment, component C
16
5
does not contain component C I, and the amount of component A and the total amount
of components B I and B2 are, respectively, 50 to 90% by weight and 50 to I 0% by
weight, based on I 00% by weight of the whole of components A, B I, and B2.
[005I]
In the third embodiment, from the viewpoint of achieving excellent acid
resistance and the reduction of weight, it is preferred that the amount of component A
and the total amount of components B I and B2 are, respectively, 60 to 80% by weight
and 40 to 20% by weight, based on IOO% by weight ofthe whole of components A, BI,
and B2; and it is more preferred that the amount of component A and the total amount
IO of components BI and B2 are, respectively, 65 to 75% by weight and 35 to 25% by
weight, based on IOO% by weight ofthe whole of components A, BI, and B2.
[0052]
In the more preferred third embodiment, the total amount of components A,
B I, and B2 and the amount of component Care, respectively, 40 to 95% by weight and
I5 60 to 5% by weight, based on IOO% by weight ofthe whole of components A, BI, B2,
20
and C;
it is preferred that the total amount of components A, B I, and B2 and the
amount of component C are, respectively, 55 to 90% by weight and 45 to I 0% by
weight, based on IOO% by weight ofthe whole of components A, BI, B2, and C;
it is more preferred that the total amount of components A, B I, and B2 and the
amount of component C are, respectively, 55 to 80% by weight and 45 to 20% by
weight, based on I 00% by weight ofthe whole of components A, B I, B2, and C;
it is further preferred that the total amount of components A, B I, and B2 and
the amount of component C are, respectively, 60 to 80% by weight and 40 to 20% by
25 weight, based on 100% by weight ofthe whole of components A, BI, B2, and C; and
30
it is further preferred that the total amount of components A, B I, and B2 and
the amount of component C are, respectively, 65 to 75% by weight and 35 to 25% by
weight, based on I 00% by weight of the whole of components A, B I, B2, and C.
[0053]
In the third embodiment, component A may contain or may not contain a
polyoxamide resin, and, from the viewpoint of achieving excellent acid resistance and
the reduction of weight, component A preferably contains a polyoxamide resin, and, in
such a case, the amount of the polyoxamide resin incorporated into the polyamide resin
composition is preferably 2 to 95% by weight, more preferably 3 to 90% by weight,
35 further preferably 3 to 80% by weight, further preferably 3 to 75% by weight, based on
100% by weight ofthe polyamide resin composition.
17
5
The polyoxamide resin is preferably present in an amount of 5 to 100% by
weight, more preferably 30 to 100% by weight, further preferably 60 to 100% by
weight, further preferably 100% by weight, based on 100% by weight of component A.
[0054]
Further, in the polyamide resin composition according to the first to third
embodiments ofthe present invention, an additional component, for example, a function
imparting agent, such as a plasticizer, a high-impact material, a heat-resistant material, a
foaming agent, a weathering agent, a nucleating agent, a crystallization accelerator, a
release agent, a lubricant, a fluidity-improving agent, an antistatic agent, a flame
1 0 retardant, an auxiliary for flame retardant, a pigment, or a dye, can be incorporated in
such an appropriate amount that the effects aimed at by the present invention are not
sacrificed.
[0055]
With respect to the method for producing the polyamide resin composition of
15 the present invention, for example, the following method can be used.
Component A or C, and, if necessary, a polyoxamide, B1 and B2 and/or C1 are
melt-kneaded using a generally known melt-kneader, such as a single-screw or
twin-screw extruder, a Banbury mixer, a kneader, or a mixing roll. For example, using
a twin-screw extruder, there may be used any of a method in which all the raw materials
20 are mixed together and then melt-kneaded, a method in which part of the raw materials
are mixed together and then melt-kneaded, and the remaining raw materials are mixed
into the resultant mixture and melt-kneaded together, and a method in which part ofthe
raw materials are mixed together and then, the remaining raw materials are mixed using
a side feeder into the mixture being melt-kneaded.
25 [0056]
With respect to the method for producing a molded article from the polyamide
resin composition ofthe present invention, using a molding machine generally used for
thermoplastic resin, e.g., an extruding machine, a blow molding machine, a compression
molding machine, or an injection molding machine, a molded article in various forms
30 can be produced.
[0057]
The polyamide resin composition ofthe present invention is advantageously
used in a part for exhaust gas passing therethrough by EGR (EGR part), which is
required to have an acid resistance, such as an intake manifold, an EGR delivery pipe,
35 an EGR pipe, an EGR valve, or an EGR cooler part. In applications ofEGR parts, for
example, parts for automobile are preferred, and, of these, preferred are EGR part
18
applications, such as an intake manifold, an EGR delivery pipe, an EGR cooler part, an
EGR pipe, and an EGR valve, and engine room parts including related peripheral parts,
such as an air cleaner, a resonator, a fuel rail, a throttle body and valve, an air flow
meter, a cylinder head cover, a vapor canister, a fuel strainer, a battery, and a terminal
5 cover.
[0058]
These parts for exhaust gas passing therethrough by an EGR system can be
obtained by a method for producing a part, which comprises shaping the polyamide
resin composition of the present invention, and further an automobile comprising a part
10 for exhaust gas passing therethrough by an EGR system can be produced by
incorporating the obtained part for exhaust gas passing therethrough by an EGR system
into, e.g., an engine room.
Examples
15 (0059]
Hereinbelow, the present invention will be described in more detail with
reference to the following Examples and Comparative Examples, which should not be
construed as limiting the scope of the present invention.
Methods for measuring physical properties of the resins and molded articles
20 used in the Examples and Comparative Examples are shown below.
(1) Tensile strength and tensile strain at break: A test was conducted in accordance
with ISO 527-1, 2 using a test specimen having a thickness of 4 mm at room
temperature at a rate of pulling of5 mm/min (an average of measurements for n = 5 was
determined).
25 (2) Modulus in tension: A test was conducted in accordance with ISO 527-1, 2 using a
test specimen having a thickness of 4 mm at room temperature at a rate of pulling of 1
mm/min (an average of measurements for n = 5 was determined).
A tensile test was conducted in accordance with ISO 11403-3 at a rate of
pulling of 1 mm/min.
30 (3) Charpy impact strength: An edgewise impact test was conducted in accordance
with ISO 179-1 using an A-notched specimen having a thickness of 4 mm at room
temperature (an average of measurements for n = 10 was determined).
(4) Resistance to acids and corrosion: An ISO Type-C specimen described in ISO
294-2 was subjected to immersion treatment under the five conditions shown below,
35 i.e., treatment condition-A, treatment condition-D. treatment condition-E, treatment
condition-S, and treatment condition-C.
19
5
Treatment condition-A: The specimen was immersed in a 0.1 N aqueous
solution of sulfuric acid for 120 hours.
Treatment condition-0: The specimen was immersed in a 0.1 N aqueous
solution of sulfuric acid for 240 hours.
Treatment condition-E: The specimen was immersed in a 0.5 N aqueous
solution of sulfuric acid for 40 hours.
Treatment condition-B: The specimen was immersed in a 0.5 N aqueous
solution of sulfuric acid for 120 hours.
Treatment condition-e: The specimen was immersed in a 0.5 N aqueous
10 solution of sulfuric acid for 240 hours.
The specimen obtained after the immersion was washed with distilled water,
and dried in a vacuum dryer at 80°C so that the moisture content of the specimen
became 0.2% or less, and the resultant specimen was observed in respect ofthe
15 appearance and subjected to tensile test to determine a tensile strength maintaining ratio.
The resistance to acids and corrosion was evaluated in accordance with the
following criteria:
0: No change is found in the appearance ofthe specimen (the surface state of
the ISO Type-C specimen has no change accompanied by whitening) (see, for example,
20 Fig. 1);
25
30
l::.: The surface ofthe specimen is slightly roughened (the surface gloss of the
ISO Type-C specimen is slightly reduced, and a change accompanied by slight
whitening is recognized in the appearance of the specimen) (see, for example, Fig. 2);
and
x: The surface of the specimen is roughened (the surface gloss of the ISO
Type-C specimen is markedly reduced, and a marked change accompanied by collective
whitening is recognized in the appearance of the specimen) (see, for example, Fig. 3).
[0060]
Component A: Polyamide resin
Component AI: Polyamide 92 (product made on an experimental basis)
Component A2: Polyamide 6 (UBE Nylon 10 15B, manufactured by Ube
Industries, Ltd.)
Component A3: Polyamide 66 (UBE Nylon 2020B, manufactured by Ube
Industries, Ltd.)
35 [0061]
Polyamide 92 is a polyoxamide resin and was produced by the following
20
method.
Into an autoclave having an internal capacity of 150 liters and being equipped
with an agitator, a thermometer, a torque meter, a pressure meter, a raw material inlet
directly connected to a diaphragm pump, a nitrogen gas inlet, a pressure release port, a
5 pressure controller, and a polymer withdrawal outlet was charged 28.40 kg (140.4 mol)
of dibutyl oxalate, and the autoclave was purged with nitrogen gas, and then the
temperature in the system was elevated under a pressure while stirring. After the
temperature of dibutyl oxalate reached 100°C, a mixture of 18.89 kg (119.3 mol) of
1 ,9-nonanediamine and 3.34 kg (21.1 mol) of 2-methyl-1 ,8-octanediamine (wherein the
10 1 ,9-nonanediamine:2-methyl-1 ,8-octanediamine molar ratio was 85: 15) was fed into the
reactor by means ofthe diaphragm pump simultaneously with the temperature
elevation.
Immediately after feeding the mixture, the internal pressure of the autoclave
was increased to 0.35 MPa due to butanol formed by a condensation polymerization
15 reaction, and the temperature ofthe condensation polymerization product was increased
to about 170°C.
20
Then, the temperature was increased to 235°C over one hour, whereupon the
internal pressure was adjusted to 0.5 MPa while withdrawing the formed butanol
through the pressure release port.
Immediately after the temperature ofthe condensation polymerization product
reached 235°C, butanol was withdrawn through the pressure release port so that the
internal pressure became atmospheric pressure. After the internal pressure reached
atmospheric pressure, the temperature elevation was started while flowing nitrogen gas
through the autoclave, and the temperature ofthe condensation polymerization product
25 was elevated to 260°C over about one hour to effect a reaction at 260°C for 4.5 hours.
Then, the stirring was stopped, and the system was under a pressure at 1 MPa
using nitrogen and allowed to stand for about 10 minutes, and then the internal pressure
was reduced to 0.5 MPa, and the resultant condensation polymerization product was
withdrawn in the form of a string through the withdrawal outlet at the lower portion of
30 the autoclave.
The polymerization product in a string form was immediately cooled with
water, and the cooled resin in a string form was pelletized using a pelletizer.
The obtained polyamide was a white tough polymer and had a relative
viscosity (llr) of 3.20.
35 [0062]
Component Bl: Syndiotactic polystyrene resin (deflection temperature under
21
load: 189°C; weight average molecular weight: 190,000; XAREC 130ZC, manufactured
by Idemitsu Kosan Co., Ltd.; this resin is indicated by "SPS" in Table I)
Component B2: Modified polyphenylene ether resin (CX-1, manufactured by
Idemitsu Kosan Co., Ltd.; this resin is indicated by "m-PPE" in Table I)
5 [0063]
Component C: Glass fibers
Component Cl: Glass 1 containing no boron oxide (CS 983-10P 4MM
2406#GBB ADV, manufactured by Owens Coming Japan Ltd.)
Component C1: Glass 2 containing no boron oxide (CSE3J-459, manufactured
10 by Nitto Boseki Co., Ltd.)
Component C2: E-glass (CS3J-454, manufactured by Nitto Boseki Co., Ltd.)
Component C3: E-glass (ECS03T-289H, manufactured by Nippon Electric
Glass Co., Ltd.)
[0064]
15 [Example 1]
The polyamide resin (component A2) and the glass fibers comprising glass 1
containing no boron oxide (component C1) shown in Table 1 were melt-kneaded using
a twin-screw kneader TEX44HCT to prepare pellets of a desired polyamide resin
composition.
20 Then, the obtained pellets were subjected to injection molding under conditions
such that the temperature of the molten resin was 290°C, the mold temperature was
80°C, the average injection speed in the mold was 250 mm/sec, and the pressure was
maintained at 60 MPa x 20 sec to prepare specimens for the respective tests, and the
measurement of various physical properties and the evaluation of resistance to acids and
25 corrosion were performed with respect the prepared specimens.
[0065]
[Example 2]
A test was performed under substantially the same conditions as in Example 1
except that the polyamide resin (component A3) shown in Table I was used.
30 [0066]
[Example 3]
A test was performed under substantially the same conditions as in Example 1
except that the glass fibers comprising glass 2 containing no boron oxide (component
C 1) shown in Table 1 were used.
35 [0067]
[Example 4]
22
5
A test was performed under substantially the same conditions as in Example 3
except that the polyamide resin (component A3) shown in Table I was used.
[0068]
[Example 5]
The polyoxamide resin (polyamide 92) (component AI) and the glass fibers
comprising glass I containing no boron oxide (component C I) shown in Table I were
melt-kneaded using a twin-screw kneader TEX44HCT to prepare pellets of a desired
polyoxamide resin composition.
Then, the obtained pellets were subjected to injection molding under conditions
IO such that the temperature of the molten resin was 290°C, the mold temperature was
80°C, the average injection speed in the mold was 250 mm/sec, and the pressure was
maintained at 60 MPa x 20 sec to prepare specimens for the respective tests, and the
measurement of various physical properties and the evaluation of resistance to acids and
corrosion were performed with respect the prepared specimens.
I5 [0069]
[Example 6]
The respective predetermined amounts of the polyamide resin (component A2),
the syndiotactic polystyrene resin (component B I), the modified polyphenylene ether
resin (component B2), and the glass fibers comprising glass I containing no boron
20 oxide (component C I) shown in Table I were melt-kneaded using a twin-screw kneader
TEX44HCT to prepare pellets of a desired polyamide resin composition.
Then, the obtained pellets were subjected to injection molding under conditions
such that the temperature of the molten resin was 290°C, the mold temperature was
80°C, the average injection speed in the mold was 250 mm/sec, and the pressure was
25 maintained at 60 MPa x 20 sec to prepare specimens for the respective tests, and the
measurement of various physical properties and the evaluation of resistance to acids and
corrosion were performed with respect the prepared specimens.
[0070]
[Example 7]
30 A test was performed under substantially the same conditions as in Example 6
except that the predetermined amount ofthe polyamide resin (component A3) shown in
Table I was used.
[007I]
[Example 8]
35 A test was performed under substantially the same conditions as in Example 5
except that the glass fibers (component C2) shown in Table I were used.
23
[0072]
[Example 9]
A test was performed under substantially the same conditions as in Example 5
except that the glass fibers (component C3) shown in Table 1 were used.
5 [0073]
[Examples 10 to 13]
The respective predetermined amounts of the polyamide resin (component A2),
the syndiotactic polystyrene resin (component B 1 ), the modified polyphenylene ether
resin (component B2), and the glass fibers (component C2) shown in Table 1 were
10 melt-kneaded using a twin-screw kneader TEX44HCT to prepare pellets of a desired
polyamide resin composition.
Then, the obtained pellets were subjected to injection molding under conditions
such that the temperature ofthe molten resin was 290°C, the mold temperature was
80°C, the average injection speed in the mold was 250 mm/sec, and the pressure was
15 maintained at 60 MPa x 20 sec to prepare specimens for the respective tests, and the
measurement of various physical properties and the evaluation of resistance to acids and
corrosion were performed with respect the prepared specimens.
[0074]
[Comparative Example 1]
20 A test was performed under substantially the same conditions as in Example 1
except that the polyamide.resin (component A2) and the glass fibers (component C2)
shown in Table 1 were melt-kneaded using a twin-screw kneader TEX44HCT to
prepare pellets of a desired polyamide resin composition.
[0075]
25 [Comparative Example 2]
A test was performed under substantially the same conditions as in Example 1
except that the polyamide resin (component A2) and the glass fibers (component C3)
shown in Table 1 were melt-kneaded using a twin-screw kneader TEX44HCT to
prepare pellets of a desired polyamide resin composition.
30 [0076]
[Table 1]
24
N
VI
A1
Component A A2
A3
81
Component B
82
C1
Component C
C2
C3
A/B
A+B
Acid resistance
(Tensile strength %
maintaining ratio)
Surface appearance
Tensile strength MPe
Modulus in tension MPe
Tensile strain %
Flexural strength MPe
Modulus in flexure MPa
~_;narpy Impact
'-----KJ/m2
~I]Qth -
Example
1
Polyamide 92
Polyamide6 70.0
Polyamide 66
SPS
m-PPE
Glass 1 containing no boron oxide 30.0
Glass 2 containing no boron oxide
E-glass (CS3J-454)
E-glass (ECS03T-2B9H)
wt%/Wt% 100/0
wt% 70
Treatment condition-A 103
Treatment condition-S 103
Treatment condnion-C 105
Treatment condttion-A 0
Treatment condition-0 0
Treatment condttion-E 0
Treatment condrtion-8 0
Treatment condition-e 0
185
180527-1.2
(Rate of testing: 5 mm/min) 10200
3.5
180178 275
(Rate of testing: 2 mm/min)
6800
Notched 4J 12.5
L_ - -
Example Example Example Example Example
2 3 4 5 6
70.0
70.0 50.0
70.0 70.0
15.0
5.0
30.0 30.0 30.0
30.0 30.0
t00/0 100/0 t00/0 t00/0 71.4/28.6
70 70 70 70 70
102 102 103 101 t02
104 102 t04 t03 100
103 105 101 101 102
0 0 0 0 0
0 0 0 0 0
0 0 0 0 0
0 0 0 0 0
0 0 0 0 0
t90 186 t9t 175 175
10300 10300 10400 8900 t0900
3.5 3.5 3.5 3.5 2.5
290 283 288 255 250
9500 8900 9200 7900 9300
13.0 12.0 12.8 10.5 10.5
~
Example c%~~~!ve Example Example C%~C~~~~ve Example Example Example Example I
7 1 8 9 2 10 11 12 13
70.0 70.0
70.0 70.0 50.0 50.0 45.0 40.0
50.0
15.0 5.0 15.0 20.0 25.0
5.0 15.0 5.0 5.0 5.0
30.0
30.0 30.0 30.0 30.0 30.0 30.0
30.0 30.0
71.4/28.6 100/0 100/0 100/0 t00/0 7t .4/28.6 71.4/28.6 64.3/35.7 57.1/42.9
70 70 70 70 70 70 70 70 70
103 98 104 103 97 104 102 103 105
t02 95 t03 101 95 100 99 tOO 103
101 92 105 99 94 99 98 103 105
0 t:. 0 0 t:. 0 0 0 0
0 X 0 0 X t:. t:. 0 0
0 X 0 0 X t:. t:. t:. 0
0 X 0 0 X X X t:. 0
0 X 0 0 X X X X t:.
180 t90 180 t80 195 175 t90 t80 170
10800 10300 9200 9100 10400 tt500 11300 11400 1t600
2.5 3.5 4.0 3.5 3.0 2.5 3.0 2.5 2.0
255 280 260 260 280 240 280 265 230
9400 8900 8200 8000 8850 9800 9300 9600 9900
11.0 13.5 12.0 11.0 13.0 12.0 13.5 12.0 10.0
- --· -- --- -- --
[0077]
As is apparent from Table I, the polyamide resin composition of the present
invention has excellent acid resistance while exhibiting excellent mechanical properties,
and further is lightweight and, hence, can be advantageously used in applications of a
5 part for exhaust gas passing therethrough by EGR, such as an intake manifold, an EGR
delivery pipe, or an EGR cooler part.
26
CLAIMS
1. A polyamide resin composition comprising:
a polyamide resin (component A),
5 glass (component C), and
optionally a styrene polymer (component Bl) and a modified polyphenylene
ether (component B2), the component Bl having a deflection temperature under load of
140 to 280°C,
the total amount of the components A, Bl, and B2 and the amount of the
10 component C being, respectively, 40 to 95% by weight and 60 to 5% by weight, based
on 100% by weight of the polyamide resin composition,
the amount of the component A and the total amount of the components Bl and
B2 being, respectively, 50 to 100% by weight and 50 to 0% by weight, based on 100%
by weight of the whole of the components A, Bl, and B2 ,
15 wherein when the component C contains glass containing no boron oxide
(component CI), the amount of the component CI is 60 to 5% by weight, based on
100% by weight of the polyamide resin composition, and
wherein when the component C does not contain the component CI, the
component A is a polyoxamide resin, or the amount of the component A and the total
20 amount of the components Bl and B2 are, respectively, 50 to 90% by weight and 50 to
10% by weight, based on 100% by weight of the whole of the components A, Bl, and
B2.
2. The polyamide resin composition according to claim 1, wherein the amount of
25 the component Bl and the amount of the component B2 are, respectively, 5 to 90% by
weight and 95 to 10% by weight, based on 100% by weight of the whole of the
components Bl and B2.
3. The polyamide resin composition according to claim 1 or 2, wherein the
30 component A is at least one polyamide resin selected from the group consisting of
polyamide 6, polyamide 66, and polyamide 92.
4. The polyamide resin composition according to any one of claims 1 to 3,
wherein the component A is a polyoxamide resin.
35
5. The polyamide resin composition according to any one of claims 1 to 4,
27
wherein the component C is the component CI.
6. The polyamide resin composition according to any one of claims 1 to 5,
wherein the component Bl is a styrene polymer having a syndiotactic structure.
5
7. The polyamide resin composition according to any one of claims 1 to 6, which
is for use in a part for exhaust gas passing therethrough by an EGR system.
8. A molded article comprising the polyamide resin composition according to
10 claim 7, which is for use in a part for exhaust gas passing therethrough by an EGR
system.
9. A part for exhaust gas passing therethrough by an EGR system, the part
comprising the molded article according to claim 8, which comprises the polyamide
15 resin composition for use in a part for exhaust gas passing therethrough by an EGR
system.
10. The part according to claim 9, which is for use in an automobile.
20 11. The part according to claim 9 or 10, which is for use in an engine room.
12. A method for producing a part for exhaust gas passing therethrough by an EGR
system, the method comprising shaping the polyamide resin composition according to
any one of claims 1 to 6.
25
13. A method for producing an automobile, comprising incorporating a part for
exhaust gas passing therethrough by an EGR system, which is obtained by the method
according to claim 12.
| # | Name | Date |
|---|---|---|
| 1 | 7985-DELNP-2012-Correspondence-110923.pdf | 2023-10-16 |
| 1 | 7985-DELNP-2012.pdf | 2012-09-27 |
| 2 | 7985-delnp-2012-Form-3-(04-02-2013).pdf | 2013-02-04 |
| 2 | 7985-DELNP-2012-GPA-110923.pdf | 2023-10-16 |
| 3 | 7985-DELNP-2012-Others-110923.pdf | 2023-10-16 |
| 3 | 7985-delnp-2012-Correspondence-Others-(04-02-2013).pdf | 2013-02-04 |
| 4 | 7985-DELNP-2012-RELEVANT DOCUMENTS [18-09-2023(online)].pdf | 2023-09-18 |
| 4 | 7985-delnp-2012-GPA.pdf | 2013-08-20 |
| 5 | 7985-DELNP-2012-PROOF OF ALTERATION [24-08-2023(online)].pdf | 2023-08-24 |
| 5 | 7985-delnp-2012-Form-5.pdf | 2013-08-20 |
| 6 | 7985-DELNP-2012-RELEVANT DOCUMENTS [24-08-2023(online)].pdf | 2023-08-24 |
| 6 | 7985-delnp-2012-Form-3.pdf | 2013-08-20 |
| 7 | 7985-DELNP-2012-RELEVANT DOCUMENTS [23-09-2022(online)].pdf | 2022-09-23 |
| 7 | 7985-delnp-2012-Form-2.pdf | 2013-08-20 |
| 8 | 7985-DELNP-2012-RELEVANT DOCUMENTS [11-08-2021(online)].pdf | 2021-08-11 |
| 8 | 7985-delnp-2012-Form-1.pdf | 2013-08-20 |
| 9 | 7985-delnp-2012-Drawings.pdf | 2013-08-20 |
| 9 | 7985-DELNP-2012-RELEVANT DOCUMENTS [03-03-2020(online)].pdf | 2020-03-03 |
| 10 | 7985-delnp-2012-Description(Complete).pdf | 2013-08-20 |
| 10 | 7985-DELNP-2012-RELEVANT DOCUMENTS [21-02-2019(online)].pdf | 2019-02-21 |
| 11 | 7985-delnp-2012-Correspondence-others.pdf | 2013-08-20 |
| 11 | 7985-DELNP-2012-IntimationOfGrant04-09-2018.pdf | 2018-09-04 |
| 12 | 7985-delnp-2012-Claims.pdf | 2013-08-20 |
| 12 | 7985-DELNP-2012-PatentCertificate04-09-2018.pdf | 2018-09-04 |
| 13 | 7985-delnp-2012-Abstract.pdf | 2013-08-20 |
| 13 | 7985-DELNP-2012-CLAIMS [04-04-2018(online)].pdf | 2018-04-04 |
| 14 | 7985-DELNP-2012-COMPLETE SPECIFICATION [04-04-2018(online)].pdf | 2018-04-04 |
| 14 | 7985-delnp-2012-Correspondence-Others-(30-06-2014).pdf | 2014-06-30 |
| 15 | 7985-DELNP-2012-CORRESPONDENCE [04-04-2018(online)].pdf | 2018-04-04 |
| 15 | 7985-DELNP-2012-FER.pdf | 2017-12-07 |
| 16 | 7985-DELNP-2012-FER_SER_REPLY [04-04-2018(online)].pdf | 2018-04-04 |
| 16 | 7985-DELNP-2012-Form-18.pdf | 2017-12-18 |
| 17 | 7985-DELNP-2012-OTHERS [04-04-2018(online)].pdf | 2018-04-04 |
| 17 | 7985-DELNP-2012-Information under section 8(2) (MANDATORY) [27-02-2018(online)].pdf | 2018-02-27 |
| 18 | 7985-DELNP-2012-FORM 3 [27-02-2018(online)].pdf | 2018-02-27 |
| 18 | 7985-DELNP-2012-PETITION UNDER RULE 137 [04-04-2018(online)].pdf | 2018-04-04 |
| 19 | 7985-DELNP-2012-FORM 3 [27-02-2018(online)].pdf | 2018-02-27 |
| 19 | 7985-DELNP-2012-PETITION UNDER RULE 137 [04-04-2018(online)].pdf | 2018-04-04 |
| 20 | 7985-DELNP-2012-Information under section 8(2) (MANDATORY) [27-02-2018(online)].pdf | 2018-02-27 |
| 20 | 7985-DELNP-2012-OTHERS [04-04-2018(online)].pdf | 2018-04-04 |
| 21 | 7985-DELNP-2012-FER_SER_REPLY [04-04-2018(online)].pdf | 2018-04-04 |
| 21 | 7985-DELNP-2012-Form-18.pdf | 2017-12-18 |
| 22 | 7985-DELNP-2012-CORRESPONDENCE [04-04-2018(online)].pdf | 2018-04-04 |
| 22 | 7985-DELNP-2012-FER.pdf | 2017-12-07 |
| 23 | 7985-delnp-2012-Correspondence-Others-(30-06-2014).pdf | 2014-06-30 |
| 23 | 7985-DELNP-2012-COMPLETE SPECIFICATION [04-04-2018(online)].pdf | 2018-04-04 |
| 24 | 7985-delnp-2012-Abstract.pdf | 2013-08-20 |
| 24 | 7985-DELNP-2012-CLAIMS [04-04-2018(online)].pdf | 2018-04-04 |
| 25 | 7985-delnp-2012-Claims.pdf | 2013-08-20 |
| 25 | 7985-DELNP-2012-PatentCertificate04-09-2018.pdf | 2018-09-04 |
| 26 | 7985-delnp-2012-Correspondence-others.pdf | 2013-08-20 |
| 26 | 7985-DELNP-2012-IntimationOfGrant04-09-2018.pdf | 2018-09-04 |
| 27 | 7985-delnp-2012-Description(Complete).pdf | 2013-08-20 |
| 27 | 7985-DELNP-2012-RELEVANT DOCUMENTS [21-02-2019(online)].pdf | 2019-02-21 |
| 28 | 7985-delnp-2012-Drawings.pdf | 2013-08-20 |
| 28 | 7985-DELNP-2012-RELEVANT DOCUMENTS [03-03-2020(online)].pdf | 2020-03-03 |
| 29 | 7985-delnp-2012-Form-1.pdf | 2013-08-20 |
| 29 | 7985-DELNP-2012-RELEVANT DOCUMENTS [11-08-2021(online)].pdf | 2021-08-11 |
| 30 | 7985-DELNP-2012-RELEVANT DOCUMENTS [23-09-2022(online)].pdf | 2022-09-23 |
| 30 | 7985-delnp-2012-Form-2.pdf | 2013-08-20 |
| 31 | 7985-DELNP-2012-RELEVANT DOCUMENTS [24-08-2023(online)].pdf | 2023-08-24 |
| 31 | 7985-delnp-2012-Form-3.pdf | 2013-08-20 |
| 32 | 7985-DELNP-2012-PROOF OF ALTERATION [24-08-2023(online)].pdf | 2023-08-24 |
| 32 | 7985-delnp-2012-Form-5.pdf | 2013-08-20 |
| 33 | 7985-DELNP-2012-RELEVANT DOCUMENTS [18-09-2023(online)].pdf | 2023-09-18 |
| 33 | 7985-delnp-2012-GPA.pdf | 2013-08-20 |
| 34 | 7985-DELNP-2012-Others-110923.pdf | 2023-10-16 |
| 34 | 7985-delnp-2012-Correspondence-Others-(04-02-2013).pdf | 2013-02-04 |
| 35 | 7985-DELNP-2012-GPA-110923.pdf | 2023-10-16 |
| 35 | 7985-delnp-2012-Form-3-(04-02-2013).pdf | 2013-02-04 |
| 36 | 7985-DELNP-2012-Correspondence-110923.pdf | 2023-10-16 |
| 36 | 7985-DELNP-2012.pdf | 2012-09-27 |
| 1 | 7985_DELNP_2012_28-11-2017.pdf |