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Disclosed is a polyamide resin composition which has excellent acid resistance and a light weight and can be used suitably for parts through which an exhaust gas passes in EGR. Specifically disclosed is a polyamide resin composition containing a polyamide resin (A) and a glass (C) and optionally containing a styrene polymer (B1) and a modified PPE (B2) wherein the sum total of the contents of the components (A) (B1) and (B2) is 40 to 95 wt% and the content of the component (C) is 60 to 5 wt% in the composition the content of the component (A) is 50 to 100 wt% and the sum total of the contents of the components (B1) and (B2) is 50 to 0 wt% relative to the sum total (i.e. 100 wt%) of the contents of the components (A) (B1) and (B2) the content of component (C1) is 60 to 5 wt% in the composition when the component (C) comprises a glass (C1) that does not contain boron oxide the component (A) is a polyoxamide resin or the content of the component (A) is 50 to 90 wt% and the sum total of the contents of the components (B1) and (B2) is 50 to 10 wt% relative to the sum total (i.e. 100 wt%) of the contents of the components (A) (B1) and (B2) when the component (C) does not comprise the component (C1) and the component (B1) has a deflection temperature under load of 140 to 280°C.
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SPECIFICATION POLY AMIDE RESIN COMPOSITION 5 FIELD OF THE INVENTION
OOOI
The present invention relates to a polyamide resin composition which is a thermoplastic resin composition having excellent acid resistance. I 0 BACKGROUND ART
[0002] Conventionally, in vehicles, such as automobiles, there may be employed an EGR (exhaust gas recirculation) system in which part ofthe exhaust gas from an engine mounted on an automobile is recirculated to an intake system and added to a mixed gas I5 in the intake system to lower the combustion temperature of the mixed gas. The employment of this system can reduce the amount ofNOx generated. Further, the regulation of fuels and the prevention of environmental problems demand the reduction of the weight of materials for the above system, and, for meeting such demands, a polyamide resin composition is widely used as a substitute material for 20 a metal (for example, patent document I). 25 These materials are required to be further improved in acid resistance.
[0003] As a method for improving the acid resistance, patent document 2 proposes a polyamide resin composition comprising a soft tluororesin and a polyamide resin. CITED REFERENCES Patent documents
[0004] Patent document I: Japanese Patent Application prior-to-examination Publication 30 (kohyo) No. 2007-530845 Patent document 2: Japanese Unexamined Patent Publication No. Hei 6-I72603 DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention 35 [0005] However, the polyamide resin composition disclosed in patent document I (for 2 example, paragraph 0046) is not satisfactory from the viewpoint of the improvement of acid resistance, and the polyamide resin composition disclosed in patent document 2 has an effect such that the acid resistance is improved, but has problems to be solved about mechanical strength and rigidity when taking the use ofthe composition in automobile 5 applications into consideration.
[0006] An object of the present invention is to provide a polyamide resin composition which has excellent acid resistance and is lightweight and hence can be advantageously used in applications of a part for exhaust gas passing therethrough by EGR, such as an 10 intake manifold, an EGR delivery pipe, or an EGR cooler part. 15 Means to Solve the Problems
[0007] The present invention has the following contents. (1) A polyamide resin composition comprising: a polyamide resin (component A), glass (component C), and optionally a styrene polymer (component Bl) and a modified polyphenylene ether (component B2), the component B 1 having a deflection temperature under load of 20 140 to 280°C the total amount of the components A, B 1, and B2 and the amount of the component C being, respectively, 40 to 95% by weight and 60 to 5% by weight, based on 100% by weight ofthe polyamide resin composition, the amount ofthe component A and the total amount ofthe components B1 and 25 B2 being, respectively, 50 to 100% by weight and 50 to 0% by weight, based on 100% by weight ofthe whole ofthe components A, Bl, and B2, 30 wherein when the component C contains glass containing no boron oxide (component C1), the amount of the component C1 is 60 to 5% by weight, based on 100% by weight ofthe polyamide resin composition, wherein when the component C does not contain the component C1, the component A is a polyoxamide resin, or the amount of the component A and the total amount ofthe components B1 and B2 are, respectively, 50 to 90% by weight and 50 to 10% by weight, based on 100% by weight ofthe whole ofthe components A, B1, and B2. 35 (2) A molded article comprising the polyamide resin composition according to item ( 1) above, which is for use in a part for exhaust gas passing therethrough by an 3 EGR system. (3) A part for exhaust gas passing therethrough by an EGR system, the part comprising the molded article according to item (2) above, which comprises the polyamide resin composition for use in a part for exhaust gas passing therethrough by 5 an EGR system. (4) A method for producing a part for exhaust gas passing therethrough by an EGR system, the method comprising shaping the polyamide resin composition according to item ( 1) above. (5) A method for producing an automobile, comprising incorporating a part for 10 exhaust gas passing therethrough by an EGR system, which is obtained by the method according to item ( 4) above. Effect of the Invention
[0008] 15 In the present invention, there can be provided a polyamide resin composition 20 that is a thermoplastic resin which has excellent acid resistance and is lightweight and hence can be advantageously used in applications of a part for exhaust gas passing therethrough by EGR, such as an intake manifold, an EGR delivery pipe, or an EGR cooler part. BRIEF DESCRIPTION OF THE ORA WINGS
[0009] [Fig. 1] Fig. 1 shows an example in which the result ofthe evaluation of resistance to acids and corrosion in the Example is 0. 25 [Fig. 2] Fig.2 shows an example in which the result ofthe evaluation of resistance to acids and corrosion in the Example is D.. [Fig. 3] Fig.3 shows an example in which the result ofthe evaluation of resistance to acids and corrosion in the Example is x. 30 BEST MODE FOR CARRYING OUT THE INVENTION
[0010] The polyamide resin composition of the present invention is a polyamide resin composition which comprises: a polyamide resin (component A), 35 glass (component C), and optionally a styrene polymer (component B 1) and a modified polyphenylene 4 ether (component B2), the component B 1 having a deflection temperature under load of 140 to 280°C the total amount ofthe components A, B 1, and B2 and the amount of the component C being, respectively, 40 to 95% by weight and 60 to 5% by weight, based 5 on 1 00% by weight of the polyamide resin composition, the amount ofthe component A and the total amount ofthe components B1 and B2 being, respectively, 50 to 100% by weight and 50 to 0% by weight, based on 100% by weight ofthe whole ofthe components A, B1, and B2, wherein when the component C contains glass containing no boron oxide 10 (component C 1 ), the amount ofthe component C 1 is 60 to 5% by weight, based on 100% by weight ofthe polyamide resin composition, wherein when the component C does not contain the component C1, the component A is a polyoxamide resin, or the amount of the component A and the total amount ofthe components B1 and B2 are, respectively, 50 to 90% by weight and 50 to 15 10% by weight, based on 100% by weight ofthe whole ofthe components A, B1, and B2.
[0011] The polyamide resin composition of the present invention (hereinafter, frequently referred to as "polyamide resin composition") includes: 20 the first embodiment wherein the component C contains glass containing no boron oxide (component C1), and the amount ofthe component C1 is 60 to 5% by weight, based on 100% by weight of the polyamide resin composition, the second embodiment wherein the component C does not contain the component C 1, and the component A is a polyoxamide resin, and 25 the third embodiment wherein the component C does not contain the 30 component C 1, and the amount ofthe component A and the total amount ofthe components B1 and B2 are, respectively, 50 to 90% by weight and 50 to 10% by weight, based on 100% by weight ofthe whole ofthe components A, B1, and B2.
[0012] From the viewpoint of achieving excellent acid resistance and the reduction of weight, the first embodiment and the second embodiment are more preferred, and the first embodiment is further preferred.
[0013] (1) Component A (Polyamide resin) 35 With respect to component A in the present invention, there can be mentioned polyamide comprised of a condensation polymerization product of a diamine and a 5 5 10 15 dicarboxylic acid (dibasic acid), a polyamide made from a lactam or an aminocarboxylic acid, or a polyamide comprised of a condensation polymerization product or a copolymer of two or more ofthem.
[0014] Examples of diamines include aliphatic diamines, such as tetramethylenediamine, hexamethylenediamine, octamethylenediamine, nonamethylenediamine, undecamethylenediamine, and dodecamethylenediamine, and diamines having an aromatic cyclic structure, such as metaxylenediamine.
[0015] Examples of dicarboxylic acids include aliphatic dicarboxylic acids, such as adipic acid, heptanedicarboxylic acid, octanedicarboxylic acid, nonanedicarboxylic acid, undecanedicarboxylic acid, and dodecanedicarboxylic acid, and dicarboxylic acids having an aromatic cyclic structure, such as terephthalic acid and isophthalic acid.
[0016] The lactam is a lactam having 6 to 12 carbon atoms, and the aminocarboxylic acid is an aminocarboxylic acid having 6 to 12 carbon atoms. Examples include 6-aminocaproic acid, 7-aminoheptanoic acid, 11-aminoundecanoic acid, 12-aminododecanoic acid, a-pyrrolidone, e-caprolactam, ro-laurolactam, and e-enanthlactam. 20 [0017] Component A has a role of a base material ofthe polyamide resin composition in surely causing the composition to collectively have mechanical strength, such as strength, heat resistance, and moldability, and, also from the viewpoint of reducing the cost, specific examples of component A, e.g., homopolymers, such as polyamide 6, 25 polyamide 11, polyamide 12, polyamide 66, polyamide 46, polyamide 610, polyamide 612, polyamide 912, polyamide 1010 and polyamide 1212, and copolymers, such as polyamide 6/66, polyamide 6/12 and polyamide 11/12, are preferably used. The above-mentioned names of specific examples of component A are based on JIS K6920-1: 2000 "Plastics-Polyamide (PA) molding and extrusion materials-Part 30 1 : Designation". From the viewpoint of the viscosity and water absorption of the resultant composition, polyamide 11 and polyamide 12 are desired. From the viewpoint of surely achieving stable mechanical strength, preferred are polyamide 6, polyamide 66, polyamide 6/66, polyamide 610, polyamide 612, 35 polyamide 1212, polyamide 1010, polyamide 912, polyamide 46, polyamide 6/12, and polyamide 11/12, and from the viewpoint of achieving both the stable mechanical 6 strength and the reduced cost, polyamide 6 and polyamide 66 are more preferred.
[0018] Further, from the viewpoint of achieving excellent acid resistance, component A is further preferably a polyoxamide resin made using oxalic acid as a dicarboxylic 5 acid component. As a source of oxalic acid for the polyoxamide resin, an oxalic acid diester is used, and, with respect to the oxalic acid diester, there is no particular limitation as long as it has a reactivity with an amino group, and examples include oxalic acid diesters of an aliphatic monohydric alcohol, such as dimethyl oxalate, diethyl oxalate, di-n-( or 10 i-)propyl oxalate, and di-n-( or i-, or t-)butyl oxalate; oxalic acid diesters of an alicyclic alcohol, such as dicyclohexyl oxalate; and oxalic acid diesters of an aromatic alcohol, such as diphenyl oxalate. Ofthese, an oxalic acid diester capable of forming an alcohol which can be completely removed at the temperature of the subsequent melt polymerization or solid phase polymerization is preferably used. Examples of such 15 oxalic acid diesters include dimethyl oxalate, diethyl oxalate, di-n-( or i-)propyl oxalate, and di-n-( or i-, or t-)butyl oxalate. Further, diethyl oxalate, di-n-( or i-)propyl oxalate, or di-n-( or i-, or t-)butyl oxalate, which is in a liquid state at room temperature and is easily mixed with a diamine by kneading, is especially preferably used. 20
[0019] As examples of diamines, which are a raw material for the polyoxamide resin as component A, there can be mentioned one member or mixtures of two or more arbitrary members selected from aliphatic diamines, such as ethylenediamine, propylenediamine, 1 ,4-butanediamine, 1 ,5-pentanediamine, 1 ,6-hexanediamine, 1, 7 -heptanediamine, 1, 8-octanediamine, 1 ,9-nonanediamine, 1, 1 0-decanediamine, 25 1, 12-dodecanediamine, 2-methyl-1 ,5-pentanediamine, 3-methyl-1 ,5-pentanediamine, 2,2,4-trimethyl-1 ,6-hexanediamine, 2,4,4-trimethyl-1 ,6-hexanediamine, 2-methyl-1,8-octanediamine, and 5-methyl-1,9-nonanediamine, alicyclic diamines, such as cyclohexanediamine, methylcyclohexanediamine, and isophoronediamine, and aromatic diamines, such as p-phenylenediamine, m-phenylenediamine, xylenediamine, 30 4,4' -diaminodiphenylmethane, 4,4' -diaminodiphenyl sulfone, and 4,4' -diaminodiphenyl ether.
[0020] In component A, in addition to the polyoxamide resin, a polyamide resin, such as an aromatic polyamide, an aliphatic polyamide, or an alicyclic polyamide, can be 35 mixed into component A.
[0021] 7 (2) Component B I (Styrene polymer) With respect to the styrene polymer, from the viewpoint of achieving excellent acid resistance, the polyamide resin composition preferably comprises a styrene polymer having a deflection temperature under load of 140 to 280°C, preferably 150 to 5 280°C, more preferably 160 to 280°C, further preferably 170 to 280°C.
[0022] The styrene polymer means a polymer comprising structure units derived from a styrene monomer or a styrene based monomer having a substituted phenyl in which hydrogen in the phenyl group of styrene is further substituted. 10 [0023] The deflection temperature under load is a yardstick for the heat resistance of the styrene polymer, and, when the styrene polymer is preferably a styrene polymer having a syndiotactic structure (hereinafter, frequently referred to as "SPS"), the styrene polymer can achieve a deflection temperature under load in the above-mentioned 15 preferred range. The deflection temperature under load is defined as a temperature, as measured in accordance with ASTM D-648, at which a test piece having a size of length: 5 inches x width: 1/2 inch x thickness: 112 inch is deflected by 0.25 mm when the temperature of the test piece is elevated from room temperature at a temperature elevation rate of 20 2°C/min under conditions such that the mold temperature is 150°C and the load is 0.46 MPa.
[0024] SPS is commercially available, for example, from Idemitsu Kosan Co., Ltd. in the trade name of"XAREC". 25 [0025] In the styrene polymer having a syndiotactic structure, the term "syndiotactic structure" means a stereostructure of a syndiotactic structure, namely, a stereostructure in which side chains, such as a phenyl group and a substituted phenyl group, are positioned alternately in different directions with respect to the principal chain formed 30 from a carbon-carbon bond, and the tacticity is preferably quantitatively determined by a nuclear magnetic resonance method using isotopic carbon (13C-NMR method). The tacticity determined by a 13C-NMR method can be indicated by the ratio of a plurality of continuous units present in the polymer, for example, dyad for two units, triad for three units, or pentad for five units, and the term "styrene copolymer having a 35 syndiotactic structure" used in the present invention means polystyrene, poly(alkylstyrene ); poly(halogenated styrene), poly(halogenated alkyl styrene), 8 poly(alkoxystyrene), or poly( vinyl benzoate), a hydrogenated polymer thereof, a mixture thereof, or a copolymer comprised mainly of them, each having syndiotacticity which is generally racemic dyad in an amount of 75% or more, preferably 85% or more, or racemic pentad in an amount of 30% or more, preferably 50% or more. 5 Examples of poly( alkylstyrene) include poly(methylstyrene ), poly( ethylstyrene ), poly(isopropylstyrene ), poly(tert-butylstyrene ), poly(phenylstyrene ), poly(vinylnaphthalene), and poly(vinylstyrene), and examples ofpoly(halogenated styrene) include poly(chlorostyrene), poly(bromostyrene), and poly(fluorostyrene). Examples of poly(halogenated alkylstyrene) include poly( chloromethylstyrene ). 10 Examples ofpoly(alkoxystyrene) include poly(methoxystyrene) and poly( ethoxystyrene ).
[0026] More preferred examples of styrene polymers include polystyrene, poly(p-methylstyrene ), poly( m-methylstyrene ), poly(p-tert -butylstyrene ), 15 poly(p-chlorostyrene), poly(m-chlorostyrene), poly(p-fluorostyrene), hydrogenated polystyrene, and copolymers comprising structure units for these polymers. 20 The styrene polymers can be used individually or in combination oftwo or more of them.
[0027] With respect to the molecular weight of the styrene polymer, there is no particular limitation, and, from the viewpoint of obtaining a polyamide resin composition or a molded article thereof having thermal properties and mechanical properties in the preferred ranges, the weight average molecular weight of the styrene polymer is preferably 10,000 or more, more preferably 50,000 or more, and preferably 25 400,000 or less, more preferably 300,000 or less, further preferably 10,000 to 400,000, still further preferably 50,000 to 300,000. Further, the width of the molecular weight distribution of the styrene polymer is not limited, and various molecular weight distributions can be applied to the styrene polymer. The weight average molecular weight was determined by gel permeation 30 chromatography (GPC) using 1,2,4-trichlorobenzene as a solvent at 130°C.
[0028] The styrene polymer having a syndiotactic structure can be produced by, for example, polymerizing a styrene (based) monomer in an inert hydrocarbon solvent or without a solvent using as a catalyst a titanium compound and a condensation product 35 of water and a trialkylaluminum (Japanese Unexamined Patent Publication No. Sho 62-187708). 9 ~ I The poly(halogenated alkyl styrene) can be obtained by the method described in Japanese Unexamined Patent Publication No. Hei 1-46912, and the above-mentioned hydrogenated polymer can be obtained by, e.g., the method described in Japanese Unexamined Patent Publication No. Hei 1-178505. 5 [0029] (3) Component B2 (Modified polyphenylene ether) Component B2 causes component B I to be stably dispersed in the polyamide resin composition to improve the strength of the interface between component B I and the polyamide resin, making stable the mechanical properties and acid resistance of the I 0 polyamide resin composition. With respect to component B2, from the viewpoint of stabilizing the dispersibility of component B 1 and the mechanical properties and acid resistance of the polyamide resin composition, maleic anhydride-modified polyphenylene ether and/or fumaric acid-modified polyphenylene ether is preferred, and fumaric acid-modified 15 polyphenylene ether is more preferred.
[0030] From the viewpoint of causing component B 1 to be stably dispersed to improve the strength of the interface between component B I and the polyamide resin, making stable the mechanical properties and acid resistance ofthe polyamide resin composition, 20 the component B }/component B2 weight ratio (B1/B2) is preferably 5/95 to 90/10, more preferably 26/74 to 88/12, further preferably 76/24 to 85/15.
[0031] (4) Component C (Glass) The glass, which is component C used in the polyamide resin composition of 25 the present invention (hereinafter, frequently referred to as "polyamide resin composition"), indicates aluminoborosilicate glass which is general glass {e.g., E-glass (generally called non-alkali glass)}, more preferably glass containing no boron oxide (component C 1) as compared to E-glass from the viewpoint of achieving excellent acid resistance. The glass may be in the form of fibers, flakes, beads, or balloon, and, from 30 the viewpoint of obtaining a strength and the like, glass fibers are especially preferred.
[0032] The glass containing no boron oxide, which is component C I used in the present invention, indicates glass containing no boron oxide, as compared to E-glass which is general glass. Component C 1 may be in the form of fibers, flakes, beads, or 35 balloon, and, from the viewpoint of obtaining a strength and the like, glass fibers are especially preferred. 10
[0033] (5) Thermoplastic resin other than the polyamide resin In the polyamide resin composition, a thermoplastic resin which is other than polyamide resin component A and which has a low water absorption and a chemical 5 resistance may be added. As preferred examples, there can be mentioned at least one thermoplastic resin selected from a styrene resin, such as a polystyrene resin other than component B I or an ABS resin, a polyphenylene phenylene ether resin other than component B2, a polyester resin, a polyphenylene sulfide resin, a polyphenylene oxide resin, a polycarbonate resin, I 0 a poly lactic acid resin, a polyacetal resin, a polysulfone resin, a polyethylene tetrafluoride resin, a polyether imide resin, a polyamide-imide resin, a polyimide resin, a polyether sulfone resin, a polyether ketone resin, a polythioether ketone resin, a polyether ether ketone resin, a polyethylene resin, a polypropylene resin, a rubber polymer, and a polyalkylene oxide resin. I5 For improving the reactivity ofthe polyamide resin with a resin other than the polyamide resin, at least one resin other than the polyamide resin, which has a modified end group, is more preferably used.
[0034] Further, in the polyamide resin composition of the present invention, an 20 additional component, for example, a function imparting agent, such as a plasticizer, a high-impact material, a heat-resistant material, a foaming agent, a weathering agent, a nucleating agent, a crystallization accelerator, a release agent, a lubricant, a fluidity-improving agent, an antistatic agent, a flame retardant, an auxiliary for flame retardant, a pigment, or a dye, can be incorporated in such an appropriate amount that 25 the effects of the present invention are not sacrificed.
[0035] (6) Polyamide resin composition With respect to the amounts of components A, B I, B2, and C incorporated into the polyamide resin composition, the total amount of components A, B I, and B2 and the 30 amount of component C are, respectively, 40 to 95% by weight and 60 to 5% by weight, based on 100% by weight ofthe polyamide resin composition, and the amount of component A and the total amount of components B I and B2 are, respectively, 50 to IOO% by weight and 50 to 0% by weight, based on IOO% by weight ofthe whole ofthe components A, BI, and B2. 35 [0036] When the polyamide resin composition does not contain components B I and II B2, from the viewpoint of achieving excellent acid resistance and the reduction of weight, the amount of component (A) incorporated into the polyamide resin composition is 40 to 95% by weight, more preferably 55 to 90% by weight, further preferably 55 to 80% by weight, based on IOO% by weight ofthe polyamide resin 5 composition.
[0037] From the viewpoint of achieving excellent acid resistance and the reduction of weight, the total amount of component A and the thermoplastic resin other than component A incorporated into the polyamide resin composition is preferably 40 to I 0 95% by weight, more preferably 55 to 90% by weight, further preferably 55 to 80% by weight, based on IOO% by weight ofthe polyamide resin composition.
[0038] When the polyamide resin composition contains components B I and B2, from the viewpoint of achieving excellent acid resistance and the reduction of weight, the I5 amount of component A and the total amount of components B I and B2 are, respectively, 50 to I 00% by weight and 50 to 0% by weight (excluding 0% by weight), based on IOO% by weight of components A, BI, and B2; it is preferred that the amount of component A and the total amount of components BI and B2 are, respectively, 50 to 90% by weight and 50 to IO% by 20 weight, based on IOO% by weight ofthe whole of components A, BI, and B2; it is more preferred that the amount of component A and the total amount of components B I and B2 are, respectively, 60 to 80% by weight and 40 to 20% by weight, based on the IOO% by weight of the whole of components A, B I, and B2; and it is further preferred that the amount of component A and the total amount of 25 components B I and B2 are, respectively, 65 to 75% by weight and 35 to 25% by weight, based on I 00% by weight of the whole of components A, B I, and B2.
[0039] From the viewpoint of achieving excellent acid resistance, the reduction of weight, and excellent moldability, the amount of component C incorporated into the 30 polyamide resin composition is 60 to 5% by weight, preferably 50 to I 0% by weight, more preferably 45 to I 0% by weight, further preferably 40 to 20% by weight, further preferably 35 to 25% by weight, based on I 00% by weight of the polyamide resin composition.
[0040] 35 When component C contains component CI, from the viewpoint of achieving excellent acid resistance, the reduction of weight, and excellent moldability, the amount I2 of component C 1 incorporated into the polyamide resin composition is 60 to 5% by weight, preferably 50 to I 0% by weight, more preferably 45 to 10% by weight, further preferably 40 to 20% by weight, further preferably 35 to 25% by weight, based on 100% by weight ofthe polyamide resin composition. 5 [0041] From the viewpoint of achieving excellent acid resistance, component C 1 is preferably present in an amount of8.4 to 100% by weight, more preferably 16.7 to 100% by weight, further preferably 33.4 to 100% by weight, further preferably 41.7 to 100% by weight, further preferably 58.4 to 100% by weight, further preferably 66.7 to 10 100% by weight, further preferably 75.0 to 100% by weight, further preferably 84 to 100% by weight, further preferably 100% by weight, based on 100% by weight of component C.
[0042] (7) Polyamide resin composition of the first embodiment 15 In the polyamide resin composition of the first embodiment, component C contains component C 1, and the total amount of components A, B 1, and B2 or the amount of component A and the amount of component C1 are, respectively, 40 to 95% by weight and 60 to 5% by weight, based on 100% by weight ofthe polyamide resin composition, and the amount of component A and the total amount of components B 1 20 and B2 are, respectively, 50 to 100% by weight and 50 to 0% by weight, based on 100% by weight of the whole of components A, B 1, and B2.
[0043] In the more preferred first embodiment, the total amount of components A, B 1, and B2 and the amount of component C 1 are, respectively, 40 to 95% by weight and 60 25 to 5% by weight, based on 100% by weight of the whole of components A, B 1, B2, and C1; 30 it is preferred that the total amount of components A, B 1, and B2 and the amount of component C 1 are, respectively, 55 to 90% by weight and 45 to 10% by weight, based on 100% by weight ofthe whole of components A, B1, B2, and C1; it is more preferred that the total amount of components A, B 1, and B2 and the amount of component C 1 are, respectively, 55 to 80% by weight and 45 to 20% by weight, based on 100% by weight of the whole of components A, B1, B2, and C1; it is further preferred that the total amount of components A, B 1, and B2 and the amount of component C 1 are, respectively, 60 to 80% by weight and 40 to 20% by 35 weight, based on 100% by weight ofthe whole of components A, B1, B2, and C1; and it is further preferred that the total amount of components A, B 1, and B2 and 13 the amount of component CI are, respectively, 65 to 75% by weight and 35 to 25% by weight, based on 100% by weight ofthe whole of components A, BI, B2, and CI, or the amount of component A and the amount of component C I are, respectively, 40 to 95% by weight and 60 to 5% by weight, based on IOO% by weight ofthe whole of 5 components A and C; it is preferred that the amount of component A and the amount of component CI are, respectively, 55 to 90% by weight and 45 to IO% by weight, based on IOO% by weight of the whole of components A and C; it is more preferred that the amount of component A and the amount of IO component CI are, respectively, 55 to 80% by weight and 45 to 20% by weight, based on I 00% by weight of the whole of components A and C; I5 it is further preferred that the amount of component A and the amount of component CI are, respectively, 60 to 80% by weight and 40 to 20% by weight, based on I 00% by weight of the whole of components A and C; and it is further preferred that the amount of component A and the amount of component CI are, respectively, 65 to 75% by weight and 35 to 25% by weight, based on I 00% by weight of the whole of components A and C.
[0044] In the first embodiment, from the viewpoint of achieving excellent acid 20 resistance, the reduction of weight, and excellent moldability, the amount of component C I incorporated into the polyamide resin composition is 60 to 5% by weight, preferably 50 to I 0% by weight, more preferably 45 to I 0% by weight, further preferably 40 to 20% by weight, further preferably 35 to 25% by weight, based on 100% by weight of the polyamide resin composition, preferably based on 100% by weight ofthe whole of 25 components A, B I, B2, and C or I 00% by weight of the whole of components A and c. Further, from the viewpoint of achieving excellent acid resistance, component C I is preferably present in an amount of 8.4 to I 00% by weight, more preferably I6. 7 to IOO% by weight, further preferably 33.4 to IOO% by weight, further preferably 41.7 to 30 IOO% by weight, further preferably 58.4 to IOO% by weight, further preferably 66.7 to I 00% by weight, further preferably 75.0 to I 00% by weight, further preferably 84 to 35 I 00% by weight, further preferably I 00% by weight, based on I 00% by weight of component C.
[0045] The polyamide resin composition of the first embodiment may contain or may not contain component B I and component B2, and, from the viewpoint of achieving I4 excellent acid resistance and the reduction of weight, the composition preferably contains component B I and component B2, and, in such a case, the amount of component A and the total amount of components B I and B2 are, respectively, 50 to IOO% by weight and 50 to 0% by weight (excluding 0% by weight), based on IOO% by 5 weight ofthe whole of components A, BI, and B2; it is preferred that the amount of component A and the total amount of components BI and B2 are, respectively, 50 to 90% by weight and 50 to 10% by weight, based on I 00% by weight of the whole of components A, B I, and B2; it is more preferred that the amount of component A and the total amount of IO components BI and B2 are, respectively, 60 to 80% by weight and 40 to 20% by weight, based on 100% by weight ofthe whole of components A, BI, and B2; and it is further preferred that the amount of component A and the total amount of components B I and B2 are, respectively, 65 to 75% by weight and 35 to 25% by weight, based on IOO% by weight ofthe whole of components A, BI, and B2. I5 [0046] In the first embodiment, component A may contain or may not contain a polyoxamide resin, and, from the viewpoint of achieving excellent acid resistance and the reduction of weight, component A preferably contains a polyoxamide resin, and, in such a case, the amount ofthe polyoxamide resin incorporated into the polyamide resin 20 composition is preferably 2 to 95% by weight, more preferably 3 to 90% by weight, further preferably 3 to 80% by weight, further preferably 3 to 75% by weight, based on IOO% by weight ofthe polyamide resin composition. The polyoxamide resin is preferably present in an amount of 5 to I 00% by weight, more preferably 30 to I 00% by weight, further preferably 60 to I 00% by 25 weight, further preferably I 00% by weight, based on I 00% by weight of component A.
[0047] 30 (8) Polyamide resin composition of the second embodiment In the polyamide resin composition ofthe second embodiment, component C does not contain component C I and component A is a polyoxamide resin. In the second embodiment, component A is a polyoxamide resin, and, from the viewpoint of achieving excellent acid resistance and the reduction ofweight, the amount ofthe polyoxamide resin incorporated into the polyamide resin composition is preferably 40 to 95% by weight, more preferably 55 to 90% by weight, further preferably 55 to 80% by weight, based on IOO% by weight ofthe polyamide resin 35 composition.
[0048] I5 In the more preferred second embodiment, it is preferred that the amount of the polyoxamide resin and the amount of component C are, respectively, 40 to 95% by weight and 60 to 5% by weight, based on 100% by weight of the whole of the polyoxamide resin and component C; 5 it is more preferred that the amount of the polyoxamide resin and the amount of component C are, respectively, 55 to 90% by weight and 45 to 10% by weight, based on 100% by weight ofthe whole ofthe polyoxamide resin and component C; it is further preferred that the amount of the polyoxamide resin and the amount of component C are, respectively, 55 to 80% by weight and 45 to 20% by weight, based 10 on 100% by weight ofthe whole ofthe polyoxamide resin and component C; it is further preferred that the amount ofthe polyoxamide resin and the amount of component C are, respectively, 60 to 80% by weight and 40 to 20% by weight, based on 100% by weight ofthe whole ofthe polyoxamide resin and component C; and it is further preferred that the amount of the polyoxamide resin and the amount 15 of component Care, respectively, 65 to 75% by weight and 35 to 25% by weight, based on 100% by weight ofthe whole ofthe polyoxamide resin and component C.
[0049] In the second embodiment, the composition may contain or may not contain component B 1 and component B2, and, from the viewpoint of achieving excellent acid 20 resistance and the reduction of weight, the composition preferably contains component B 1 and component B2, and, in such a case, the amount of component A and the total amount of components B 1 and B2 are, respectively, 50 to 100% by weight and 50 to 0% by weight (excluding 0% by weight}, based on 100% by weight of the whole of components A, B1, and B2; 25 it is preferred that the amount of component A and the total amount of components B 1 and B2 are, respectively, 50 to 90% by weight and 50 to 10% by weight, based on 100% by weight ofthe whole of components A, B1, and B2; it is more preferred that the amount of component A and the total amount of components B 1 and B2 are, respectively, 60 to 80% by weight and 40 to 20% by 30 weight, based on 100% by weight of the whole of components A, B 1, and B2; and it is further preferred that the amount of component A and the total amount of components B 1 and B2 are, respectively, 65 to 75% by weight and 35 to 25% by weight, based on 100% by weight ofthe whole of components A, B1, and B2.
[0050] 35 (9) Polyamide resin composition of the third embodiment In the polyamide resin composition of the third embodiment, component C 16 5 does not contain component C I, and the amount of component A and the total amount of components B I and B2 are, respectively, 50 to 90% by weight and 50 to I 0% by weight, based on I 00% by weight of the whole of components A, B I, and B2. [005I] In the third embodiment, from the viewpoint of achieving excellent acid resistance and the reduction of weight, it is preferred that the amount of component A and the total amount of components B I and B2 are, respectively, 60 to 80% by weight and 40 to 20% by weight, based on IOO% by weight ofthe whole of components A, BI, and B2; and it is more preferred that the amount of component A and the total amount IO of components BI and B2 are, respectively, 65 to 75% by weight and 35 to 25% by weight, based on IOO% by weight ofthe whole of components A, BI, and B2.
[0052] In the more preferred third embodiment, the total amount of components A, B I, and B2 and the amount of component Care, respectively, 40 to 95% by weight and I5 60 to 5% by weight, based on IOO% by weight ofthe whole of components A, BI, B2, 20 and C; it is preferred that the total amount of components A, B I, and B2 and the amount of component C are, respectively, 55 to 90% by weight and 45 to I 0% by weight, based on IOO% by weight ofthe whole of components A, BI, B2, and C; it is more preferred that the total amount of components A, B I, and B2 and the amount of component C are, respectively, 55 to 80% by weight and 45 to 20% by weight, based on I 00% by weight ofthe whole of components A, B I, B2, and C; it is further preferred that the total amount of components A, B I, and B2 and the amount of component C are, respectively, 60 to 80% by weight and 40 to 20% by 25 weight, based on 100% by weight ofthe whole of components A, BI, B2, and C; and 30 it is further preferred that the total amount of components A, B I, and B2 and the amount of component C are, respectively, 65 to 75% by weight and 35 to 25% by weight, based on I 00% by weight of the whole of components A, B I, B2, and C.
[0053] In the third embodiment, component A may contain or may not contain a polyoxamide resin, and, from the viewpoint of achieving excellent acid resistance and the reduction of weight, component A preferably contains a polyoxamide resin, and, in such a case, the amount of the polyoxamide resin incorporated into the polyamide resin composition is preferably 2 to 95% by weight, more preferably 3 to 90% by weight, 35 further preferably 3 to 80% by weight, further preferably 3 to 75% by weight, based on 100% by weight ofthe polyamide resin composition. 17 5 The polyoxamide resin is preferably present in an amount of 5 to 100% by weight, more preferably 30 to 100% by weight, further preferably 60 to 100% by weight, further preferably 100% by weight, based on 100% by weight of component A.
[0054] Further, in the polyamide resin composition according to the first to third embodiments ofthe present invention, an additional component, for example, a function imparting agent, such as a plasticizer, a high-impact material, a heat-resistant material, a foaming agent, a weathering agent, a nucleating agent, a crystallization accelerator, a release agent, a lubricant, a fluidity-improving agent, an antistatic agent, a flame 1 0 retardant, an auxiliary for flame retardant, a pigment, or a dye, can be incorporated in such an appropriate amount that the effects aimed at by the present invention are not sacrificed.
[0055] With respect to the method for producing the polyamide resin composition of 15 the present invention, for example, the following method can be used. Component A or C, and, if necessary, a polyoxamide, B1 and B2 and/or C1 are melt-kneaded using a generally known melt-kneader, such as a single-screw or twin-screw extruder, a Banbury mixer, a kneader, or a mixing roll. For example, using a twin-screw extruder, there may be used any of a method in which all the raw materials 20 are mixed together and then melt-kneaded, a method in which part of the raw materials are mixed together and then melt-kneaded, and the remaining raw materials are mixed into the resultant mixture and melt-kneaded together, and a method in which part ofthe raw materials are mixed together and then, the remaining raw materials are mixed using a side feeder into the mixture being melt-kneaded. 25 [0056] With respect to the method for producing a molded article from the polyamide resin composition ofthe present invention, using a molding machine generally used for thermoplastic resin, e.g., an extruding machine, a blow molding machine, a compression molding machine, or an injection molding machine, a molded article in various forms 30 can be produced.
[0057] The polyamide resin composition ofthe present invention is advantageously used in a part for exhaust gas passing therethrough by EGR (EGR part), which is required to have an acid resistance, such as an intake manifold, an EGR delivery pipe, 35 an EGR pipe, an EGR valve, or an EGR cooler part. In applications ofEGR parts, for example, parts for automobile are preferred, and, of these, preferred are EGR part 18 applications, such as an intake manifold, an EGR delivery pipe, an EGR cooler part, an EGR pipe, and an EGR valve, and engine room parts including related peripheral parts, such as an air cleaner, a resonator, a fuel rail, a throttle body and valve, an air flow meter, a cylinder head cover, a vapor canister, a fuel strainer, a battery, and a terminal 5 cover.
[0058] These parts for exhaust gas passing therethrough by an EGR system can be obtained by a method for producing a part, which comprises shaping the polyamide resin composition of the present invention, and further an automobile comprising a part 10 for exhaust gas passing therethrough by an EGR system can be produced by incorporating the obtained part for exhaust gas passing therethrough by an EGR system into, e.g., an engine room. Examples 15 (0059] Hereinbelow, the present invention will be described in more detail with reference to the following Examples and Comparative Examples, which should not be construed as limiting the scope of the present invention. Methods for measuring physical properties of the resins and molded articles 20 used in the Examples and Comparative Examples are shown below. (1) Tensile strength and tensile strain at break: A test was conducted in accordance with ISO 527-1, 2 using a test specimen having a thickness of 4 mm at room temperature at a rate of pulling of5 mm/min (an average of measurements for n = 5 was determined). 25 (2) Modulus in tension: A test was conducted in accordance with ISO 527-1, 2 using a test specimen having a thickness of 4 mm at room temperature at a rate of pulling of 1 mm/min (an average of measurements for n = 5 was determined). A tensile test was conducted in accordance with ISO 11403-3 at a rate of pulling of 1 mm/min. 30 (3) Charpy impact strength: An edgewise impact test was conducted in accordance with ISO 179-1 using an A-notched specimen having a thickness of 4 mm at room temperature (an average of measurements for n = 10 was determined). (4) Resistance to acids and corrosion: An ISO Type-C specimen described in ISO 294-2 was subjected to immersion treatment under the five conditions shown below, 35 i.e., treatment condition-A, treatment condition-D. treatment condition-E, treatment condition-S, and treatment condition-C. 19 5 Treatment condition-A: The specimen was immersed in a 0.1 N aqueous solution of sulfuric acid for 120 hours. Treatment condition-0: The specimen was immersed in a 0.1 N aqueous solution of sulfuric acid for 240 hours. Treatment condition-E: The specimen was immersed in a 0.5 N aqueous solution of sulfuric acid for 40 hours. Treatment condition-B: The specimen was immersed in a 0.5 N aqueous solution of sulfuric acid for 120 hours. Treatment condition-e: The specimen was immersed in a 0.5 N aqueous 10 solution of sulfuric acid for 240 hours. The specimen obtained after the immersion was washed with distilled water, and dried in a vacuum dryer at 80°C so that the moisture content of the specimen became 0.2% or less, and the resultant specimen was observed in respect ofthe 15 appearance and subjected to tensile test to determine a tensile strength maintaining ratio. The resistance to acids and corrosion was evaluated in accordance with the following criteria: 0: No change is found in the appearance ofthe specimen (the surface state of the ISO Type-C specimen has no change accompanied by whitening) (see, for example, 20 Fig. 1); 25 30 l::.: The surface ofthe specimen is slightly roughened (the surface gloss of the ISO Type-C specimen is slightly reduced, and a change accompanied by slight whitening is recognized in the appearance of the specimen) (see, for example, Fig. 2); and x: The surface of the specimen is roughened (the surface gloss of the ISO Type-C specimen is markedly reduced, and a marked change accompanied by collective whitening is recognized in the appearance of the specimen) (see, for example, Fig. 3).
[0060] Component A: Polyamide resin Component AI: Polyamide 92 (product made on an experimental basis) Component A2: Polyamide 6 (UBE Nylon 10 15B, manufactured by Ube Industries, Ltd.) Component A3: Polyamide 66 (UBE Nylon 2020B, manufactured by Ube Industries, Ltd.) 35 [0061] Polyamide 92 is a polyoxamide resin and was produced by the following 20 method. Into an autoclave having an internal capacity of 150 liters and being equipped with an agitator, a thermometer, a torque meter, a pressure meter, a raw material inlet directly connected to a diaphragm pump, a nitrogen gas inlet, a pressure release port, a 5 pressure controller, and a polymer withdrawal outlet was charged 28.40 kg (140.4 mol) of dibutyl oxalate, and the autoclave was purged with nitrogen gas, and then the temperature in the system was elevated under a pressure while stirring. After the temperature of dibutyl oxalate reached 100°C, a mixture of 18.89 kg (119.3 mol) of 1 ,9-nonanediamine and 3.34 kg (21.1 mol) of 2-methyl-1 ,8-octanediamine (wherein the 10 1 ,9-nonanediamine:2-methyl-1 ,8-octanediamine molar ratio was 85: 15) was fed into the reactor by means ofthe diaphragm pump simultaneously with the temperature elevation. Immediately after feeding the mixture, the internal pressure of the autoclave was increased to 0.35 MPa due to butanol formed by a condensation polymerization 15 reaction, and the temperature ofthe condensation polymerization product was increased to about 170°C. 20 Then, the temperature was increased to 235°C over one hour, whereupon the internal pressure was adjusted to 0.5 MPa while withdrawing the formed butanol through the pressure release port. Immediately after the temperature ofthe condensation polymerization product reached 235°C, butanol was withdrawn through the pressure release port so that the internal pressure became atmospheric pressure. After the internal pressure reached atmospheric pressure, the temperature elevation was started while flowing nitrogen gas through the autoclave, and the temperature ofthe condensation polymerization product 25 was elevated to 260°C over about one hour to effect a reaction at 260°C for 4.5 hours. Then, the stirring was stopped, and the system was under a pressure at 1 MPa using nitrogen and allowed to stand for about 10 minutes, and then the internal pressure was reduced to 0.5 MPa, and the resultant condensation polymerization product was withdrawn in the form of a string through the withdrawal outlet at the lower portion of 30 the autoclave. The polymerization product in a string form was immediately cooled with water, and the cooled resin in a string form was pelletized using a pelletizer. The obtained polyamide was a white tough polymer and had a relative viscosity (llr) of 3.20. 35 [0062] Component Bl: Syndiotactic polystyrene resin (deflection temperature under 21 load: 189°C; weight average molecular weight: 190,000; XAREC 130ZC, manufactured by Idemitsu Kosan Co., Ltd.; this resin is indicated by "SPS" in Table I) Component B2: Modified polyphenylene ether resin (CX-1, manufactured by Idemitsu Kosan Co., Ltd.; this resin is indicated by "m-PPE" in Table I) 5 [0063] Component C: Glass fibers Component Cl: Glass 1 containing no boron oxide (CS 983-10P 4MM 2406#GBB ADV, manufactured by Owens Coming Japan Ltd.) Component C1: Glass 2 containing no boron oxide (CSE3J-459, manufactured 10 by Nitto Boseki Co., Ltd.) Component C2: E-glass (CS3J-454, manufactured by Nitto Boseki Co., Ltd.) Component C3: E-glass (ECS03T-289H, manufactured by Nippon Electric Glass Co., Ltd.)
[0064] 15 [Example 1] The polyamide resin (component A2) and the glass fibers comprising glass 1 containing no boron oxide (component C1) shown in Table 1 were melt-kneaded using a twin-screw kneader TEX44HCT to prepare pellets of a desired polyamide resin composition. 20 Then, the obtained pellets were subjected to injection molding under conditions such that the temperature of the molten resin was 290°C, the mold temperature was 80°C, the average injection speed in the mold was 250 mm/sec, and the pressure was maintained at 60 MPa x 20 sec to prepare specimens for the respective tests, and the measurement of various physical properties and the evaluation of resistance to acids and 25 corrosion were performed with respect the prepared specimens.
[0065]
Example 2
A test was performed under substantially the same conditions as in Example 1 except that the polyamide resin (component A3) shown in Table I was used. 30 [0066]
Example 3
A test was performed under substantially the same conditions as in Example 1 except that the glass fibers comprising glass 2 containing no boron oxide (component C 1) shown in Table 1 were used. 35 [0067]
Example 4
22 5 A test was performed under substantially the same conditions as in Example 3 except that the polyamide resin (component A3) shown in Table I was used.
[0068]
Example 5
The polyoxamide resin (polyamide 92) (component AI) and the glass fibers comprising glass I containing no boron oxide (component C I) shown in Table I were melt-kneaded using a twin-screw kneader TEX44HCT to prepare pellets of a desired polyoxamide resin composition. Then, the obtained pellets were subjected to injection molding under conditions IO such that the temperature of the molten resin was 290°C, the mold temperature was 80°C, the average injection speed in the mold was 250 mm/sec, and the pressure was maintained at 60 MPa x 20 sec to prepare specimens for the respective tests, and the measurement of various physical properties and the evaluation of resistance to acids and corrosion were performed with respect the prepared specimens. I5 [0069]
Example 6
The respective predetermined amounts of the polyamide resin (component A2), the syndiotactic polystyrene resin (component B I), the modified polyphenylene ether resin (component B2), and the glass fibers comprising glass I containing no boron 20 oxide (component C I) shown in Table I were melt-kneaded using a twin-screw kneader TEX44HCT to prepare pellets of a desired polyamide resin composition. Then, the obtained pellets were subjected to injection molding under conditions such that the temperature of the molten resin was 290°C, the mold temperature was 80°C, the average injection speed in the mold was 250 mm/sec, and the pressure was 25 maintained at 60 MPa x 20 sec to prepare specimens for the respective tests, and the measurement of various physical properties and the evaluation of resistance to acids and corrosion were performed with respect the prepared specimens.
[0070]
Example 7
30 A test was performed under substantially the same conditions as in Example 6 except that the predetermined amount ofthe polyamide resin (component A3) shown in Table I was used. [007I]
Example 8
35 A test was performed under substantially the same conditions as in Example 5 except that the glass fibers (component C2) shown in Table I were used. 23
[0072]
Example 9
A test was performed under substantially the same conditions as in Example 5 except that the glass fibers (component C3) shown in Table 1 were used. 5 [0073]
Examples 10 to 13
The respective predetermined amounts of the polyamide resin (component A2), the syndiotactic polystyrene resin (component B 1 ), the modified polyphenylene ether resin (component B2), and the glass fibers (component C2) shown in Table 1 were 10 melt-kneaded using a twin-screw kneader TEX44HCT to prepare pellets of a desired polyamide resin composition. Then, the obtained pellets were subjected to injection molding under conditions such that the temperature ofthe molten resin was 290°C, the mold temperature was 80°C, the average injection speed in the mold was 250 mm/sec, and the pressure was 15 maintained at 60 MPa x 20 sec to prepare specimens for the respective tests, and the measurement of various physical properties and the evaluation of resistance to acids and corrosion were performed with respect the prepared specimens.
[0074]
Comparative Example 1
20 A test was performed under substantially the same conditions as in Example 1 except that the polyamide.resin (component A2) and the glass fibers (component C2) shown in Table 1 were melt-kneaded using a twin-screw kneader TEX44HCT to prepare pellets of a desired polyamide resin composition.
[0075] 25 [Comparative Example 2] A test was performed under substantially the same conditions as in Example 1 except that the polyamide resin (component A2) and the glass fibers (component C3) shown in Table 1 were melt-kneaded using a twin-screw kneader TEX44HCT to prepare pellets of a desired polyamide resin composition. 30 [0076]
Table 1
24 N VI A1 Component A A2 A3 81 Component B 82 C1 Component C C2 C3 A/B A+B Acid resistance (Tensile strength % maintaining ratio) Surface appearance Tensile strength MPe Modulus in tension MPe Tensile strain % Flexural strength MPe Modulus in flexure MPa ~_;narpy Impact '-----KJ/m2 ~I]Qth - Example 1 Polyamide 92 Polyamide6 70.0 Polyamide 66 SPS m-PPE Glass 1 containing no boron oxide 30.0 Glass 2 containing no boron oxide E-glass (CS3J-454) E-glass (ECS03T-2B9H) wt%/Wt% 100/0 wt% 70 Treatment condition-A 103 Treatment condition-S 103 Treatment condnion-C 105 Treatment condttion-A 0 Treatment condition-0 0 Treatment condttion-E 0 Treatment condrtion-8 0 Treatment condition-e 0 185 180527-1.2 (Rate of testing: 5 mm/min) 10200 3.5 180178 275 (Rate of testing: 2 mm/min) 6800 Notched 4J 12.5 L_ - - Example Example Example Example Example 2 3 4 5 6 70.0 70.0 50.0 70.0 70.0 15.0 5.0 30.0 30.0 30.0 30.0 30.0 t00/0 100/0 t00/0 t00/0 71.4/28.6 70 70 70 70 70 102 102 103 101 t02 104 102 t04 t03 100 103 105 101 101 102 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 t90 186 t9t 175 175 10300 10300 10400 8900 t0900 3.5 3.5 3.5 3.5 2.5 290 283 288 255 250 9500 8900 9200 7900 9300 13.0 12.0 12.8 10.5 10.5 ~ Example c%~~~!ve Example Example C%~C~~~~ve Example Example Example Example I 7 1 8 9 2 10 11 12 13 70.0 70.0 70.0 70.0 50.0 50.0 45.0 40.0 50.0 15.0 5.0 15.0 20.0 25.0 5.0 15.0 5.0 5.0 5.0 30.0 30.0 30.0 30.0 30.0 30.0 30.0 30.0 30.0 71.4/28.6 100/0 100/0 100/0 t00/0 7t .4/28.6 71.4/28.6 64.3/35.7 57.1/42.9 70 70 70 70 70 70 70 70 70 103 98 104 103 97 104 102 103 105 t02 95 t03 101 95 100 99 tOO 103 101 92 105 99 94 99 98 103 105 0 t:. 0 0 t:. 0 0 0 0 0 X 0 0 X t:. t:. 0 0 0 X 0 0 X t:. t:. t:. 0 0 X 0 0 X X X t:. 0 0 X 0 0 X X X X t:. 180 t90 180 t80 195 175 t90 t80 170 10800 10300 9200 9100 10400 tt500 11300 11400 1t600 2.5 3.5 4.0 3.5 3.0 2.5 3.0 2.5 2.0 255 280 260 260 280 240 280 265 230 9400 8900 8200 8000 8850 9800 9300 9600 9900 11.0 13.5 12.0 11.0 13.0 12.0 13.5 12.0 10.0 - --· -- --- -- --
[0077] As is apparent from Table I, the polyamide resin composition of the present invention has excellent acid resistance while exhibiting excellent mechanical properties, and further is lightweight and, hence, can be advantageously used in applications of a 5 part for exhaust gas passing therethrough by EGR, such as an intake manifold, an EGR delivery pipe, or an EGR cooler part. 26
CLAIMS 1. A polyamide resin composition comprising: a polyamide resin (component A), 5 glass (component C), and optionally a styrene polymer (component Bl) and a modified polyphenylene ether (component B2), the component Bl having a deflection temperature under load of 140 to 280°C, the total amount of the components A, Bl, and B2 and the amount of the 10 component C being, respectively, 40 to 95% by weight and 60 to 5% by weight, based on 100% by weight of the polyamide resin composition, the amount of the component A and the total amount of the components Bl and B2 being, respectively, 50 to 100% by weight and 50 to 0% by weight, based on 100% by weight of the whole of the components A, Bl, and B2 , 15 wherein when the component C contains glass containing no boron oxide (component CI), the amount of the component CI is 60 to 5% by weight, based on 100% by weight of the polyamide resin composition, and wherein when the component C does not contain the component CI, the component A is a polyoxamide resin, or the amount of the component A and the total 20 amount of the components Bl and B2 are, respectively, 50 to 90% by weight and 50 to 10% by weight, based on 100% by weight of the whole of the components A, Bl, and B2. 2. The polyamide resin composition according to claim 1, wherein the amount of 25 the component Bl and the amount of the component B2 are, respectively, 5 to 90% by weight and 95 to 10% by weight, based on 100% by weight of the whole of the components Bl and B2. 3. The polyamide resin composition according to claim 1 or 2, wherein the 30 component A is at least one polyamide resin selected from the group consisting of polyamide 6, polyamide 66, and polyamide 92. 4. The polyamide resin composition according to any one of claims 1 to 3, wherein the component A is a polyoxamide resin. 35 5. The polyamide resin composition according to any one of claims 1 to 4, 27 wherein the component C is the component CI. 6. The polyamide resin composition according to any one of claims 1 to 5, wherein the component Bl is a styrene polymer having a syndiotactic structure. 5 7. The polyamide resin composition according to any one of claims 1 to 6, which is for use in a part for exhaust gas passing therethrough by an EGR system. 8. A molded article comprising the polyamide resin composition according to 10 claim 7, which is for use in a part for exhaust gas passing therethrough by an EGR system. 9. A part for exhaust gas passing therethrough by an EGR system, the part comprising the molded article according to claim 8, which comprises the polyamide 15 resin composition for use in a part for exhaust gas passing therethrough by an EGR system. 10. The part according to claim 9, which is for use in an automobile. 20 11. The part according to claim 9 or 10, which is for use in an engine room. 12. A method for producing a part for exhaust gas passing therethrough by an EGR system, the method comprising shaping the polyamide resin composition according to any one of claims 1 to 6. 25 13. A method for producing an automobile, comprising incorporating a part for exhaust gas passing therethrough by an EGR system, which is obtained by the method according to claim 12.