(Extracted from wipo)
Title of the invention: Power converter
Technical field
[0001]
　The present invention relates to a power conversion device in which a power semiconductor element is sealed in a housing with a resin member.
Background art
[0002]
　In recent years, vehicles using a motor as a driving force source, such as a hybrid vehicle and an electric vehicle, have been actively developed in the automobile industry. An inverter device that drives a motor supplies high-voltage driving power to the motor using a battery as a power supply. In addition, a resin-sealed power semiconductor device is used for the inverter device, and in the field of power electronics, the power conversion device is increasingly important as a key device.
[0003]
　Here, the power semiconductor element used for the inverter device is sealed with a resin together with other components. In such a power converter, when electronic components such as a power semiconductor element and a smoothing capacitor constituting a snubber circuit are short-circuited while power is supplied from a battery, an excessive short-circuit current flows. For example, when the upper and lower arms of the inverter are short-circuited due to a malfunction of the gate drive circuit in the inverter control circuit, an overcurrent flows through the power semiconductor element and a short-circuit fault occurs.
[0004]
　If a relay that connects the battery and the motor drive circuit is connected or kept connected in the short-circuit state, the power converter emits smoke and burns due to a large current. Also, it is conceivable that a battery connected to the inverter device for driving a motor may be damaged due to the flow of an overcurrent exceeding the rating. In order to avoid such a situation, a sensor for detecting an overcurrent is usually used to control the switching of the power semiconductor element at high speed to interrupt the current when the overcurrent flows. However, even when a short-circuit fault occurs in the power semiconductor element, it is desired to more reliably prevent the above-described failure mode such as smoking.
[0005]
　Specifically, for example, if an overcurrent cutoff fuse is inserted between the power semiconductor device and the battery, an overcurrent flowing between the motor driving inverter device and the battery can be prevented.
[0006]
　However, chip type overcurrent cutoff fuses are expensive. Therefore, there is a need for an overcurrent interrupting unit that is inexpensive and can reliably shut off an overcurrent that can flow to a battery when a short-circuit fault occurs in a power semiconductor element. For example, in Patent Literature 1 below, a fuse portion is formed by cutting off an external connection electrode protruding outside from a semiconductor device and reducing the cross-sectional area.
Prior art documents
Patent literature
[0007]
Patent Document 1: JP 2005-175439 A
Summary of the Invention
Problems to be solved by the invention
[0008]
　However, in the technique of Patent Document 1, the fuse portion provided on the external connection electrode is exposed outside the semiconductor device. Therefore, when the fuse section is blown by an overcurrent, smoke may flow out of the apparatus, and sparks may scatter around the apparatus, and the apparatus may be burned out by a combustion reaction using outside air. Further, the member of the blown fuse portion may be scattered around and the external connection electrode and the surrounding member may be short-circuited. Further, since the gas has a low thermal conductivity, heat generated in the fuse portion is not released to the outside air but is transmitted to the semiconductor element, which may damage the semiconductor element.
[0009]
　Therefore, there is a demand for a power conversion device that can suppress smoke, burnout, and short-circuit with surrounding members due to a fusing member even when the fuse portion is blown due to an overcurrent.
Means for solving the problem
[0010]
　A power converter according to the present invention includes a power semiconductor element, an electrode wiring member connected to a main electrode of the power semiconductor element, a housing, and a fuse formed on the electrode wiring member and serving as a fuse. Part, a fuse resin member that is a resin member disposed between the fuse part and the housing, and the power semiconductor element, the electrode wiring member, the fuse part, and the fuse resin member in the housing. And a sealing resin member which is a resin member to be sealed.
The invention's effect
[0011]
　According to the power conversion device of the present invention, since the fuse portion is formed in the electrode wiring member, an expensive chip-type fuse is not provided, and the cost of the fuse portion can be reduced. Since the sealing resin member covers the fuse portion and the fuse resin member, the blown fuse portion member can be prevented from scattering to the outside. In addition, since the fuse portion and the fuse resin member can be cut off from the outside air, it is possible to suppress the progress of the combustion reaction due to the arc discharge generated at the time of fusing, and to suppress the smoke generated at the time of fusing from leaking to the outside. it can. Since the fuse resin member is arranged between the fuse portion and the housing, the member of the blown fuse portion is prevented from contacting the housing, and the short circuit between the electrode wiring member and the housing is suppressed. it can. Further, the heat generated in the fuse portion when the fuse is blown can be transmitted to the housing via the fuse resin member and cooled, and damage to the power semiconductor element, the sealing resin member, and the like due to the generated heat can be suppressed. . Further, since a fuse resin member dedicated to the fuse portion is provided, a resin member made of a material suitable for fusing the fuse portion can be selected, and insulation performance and cooling performance at the time of fusing can be improved. Therefore, even if the fuse portion is blown due to an overcurrent, it is possible to suppress smoke, burnout, and short-circuit between the fuse member and surrounding members.
BRIEF DESCRIPTION OF THE FIGURES
[0012]
FIG. 1 is a plan view of a power converter according to Embodiment 1 of the present invention.
FIG. 2 is a cross-sectional view of the power conversion device taken along a line BB in FIG. 1 according to Embodiment 1 of the present invention.
FIG. 3 is a cross-sectional view of the power conversion device taken along a line AA in FIG. 1 according to Embodiment 1 of the present invention.
FIG. 4 is a schematic diagram for explaining a current density of a fuse section according to Embodiment 1 of the present invention.
FIG. 5 is a schematic diagram illustrating variations in the shape of the fuse section according to Embodiment 1 of the present invention.
FIG. 6 is a schematic diagram illustrating variations in the shape of the fuse section according to Embodiment 1 of the present invention.
7 is a cross-sectional view of the power conversion device taken along a line AA in FIG. 1 according to Embodiment 2 of the present invention.
FIG. 8 is a cross-sectional view of the power conversion device taken along a line AA in FIG. 1 according to Embodiment 3 of the present invention.
BEST MODE FOR CARRYING OUT THE INVENTION
[0013]
Embodiment 1 FIG.
　The power conversion device 1 according to Embodiment 1 will be described with reference to the drawings. FIG. 1 is a plan view of the power conversion device 1 as viewed from the opening side of the housing 30. In order to explain the arrangement of each component, the sealing resin member 25 is made transparent and is not shown. 2 is a cross-sectional view taken along the line BB in FIG. 1, and FIG. 3 is a cross-sectional view taken along the line AA in FIG. 1, 2 and 3 are schematic views, and the dimensions of each member do not completely match between the drawings.
[0014]
　The power converter 1 includes a power semiconductor element 14, an electrode wiring member 13 connected to a main electrode of the power semiconductor element 14, a housing 30, and components such as the power semiconductor element 14 in the housing 30. And a sealing resin member 25 which is a resin member to be sealed.
[0015]
The
　case 30 is formed in a bottomed cylindrical shape, and has a role of a frame for casting the sealing resin member 25. In the following, the terms “inside”, “inside”, “outside”, and “outside” simply mean the inside or outside of the housing 30. The “vertical direction” refers to the direction in which the cylindrical portion of the housing 30 extends, and the “horizontal direction” refers to the direction in which the bottom of the housing 30 extends.
[0016]
　The bottom of the housing 30 is constituted by the metal heat sink 12. The heat sink 12 has a role of radiating heat generated in the power semiconductor element 14 to the outside. For the heat sink 12, for example, a material having a thermal conductivity of 20 W / (m • K) or more, such as aluminum or an aluminum alloy, is used. The heat sink 12 is formed in a rectangular flat plate shape. An inner surface portion of the heat sink 12 facing the member on the side of the power semiconductor element 14 is provided with an inwardly protruding plate-shaped element opposing projection 12a, and the inner surface of the element opposing projection 12a is Abuts the member on the 14 side. As shown in FIG. 2, a plurality of flat fins 19 arranged at intervals from each other are provided on the outer surface of the heat sink 12. The fins 19 are in contact with the outside air, and the heat sink 12 radiates heat from these fins 19 to the outside air. Note that a water-cooled type may be used.
[0017]
　The cylindrical portion of the housing 30 is constituted by the insulating case 11. The insulating case 11 is formed using any resin material having high insulating properties and thermoplasticity, for example, a resin material such as polybutylene terephthalate (PBT), polyphenylene sulfide (PPS), and polyether ether ketone (PEEK). You.
[0018]
In the
　present embodiment, the power semiconductor element 14 and the electrode lead frame 13 as the electrode wiring member 13 are sealed with the element molding resin 20 which is a resin member. , And a packaged semiconductor element module 29. The control lead frame 21 connected to the control terminal of the power semiconductor element 14 is also sealed with the element molding resin 20. The electrode lead frame 13 and the control lead frame 21 project outward from the element mold resin 20. As the element mold resin 20, a hard resin having a Young's modulus of several GPa is preferably used in order to protect the internal elements and wiring, and for example, an epoxy resin is used.
[0019]
　As the power semiconductor element 14, a power MOSFET (Metal Oxide Semiconductor Field Effect Transistor) is used. The power semiconductor element 14 may be another type of switching element such as a power IGBT (Insulated Gate Bipolar Transistor) in which diodes are connected in anti-parallel. The power semiconductor element 14 is used for, for example, an inverter circuit and a converter circuit for driving a device such as a motor for driving a vehicle, and controls a rated current of several amps to several hundred amps. As a material of the power semiconductor element 14, silicon (Si), silicon carbide (SiC), gallium nitride (GaN), or the like may be used.
[0020]
　The power semiconductor element 14 is formed in a rectangular flat chip shape, a drain terminal as a main electrode is provided on a surface on the heat sink 12 side, and a main electrode is formed on a surface of the housing 30 opposite to the heat sink 12. Are provided. Further, a gate terminal as a control terminal is provided on a surface of the housing 30 opposite to the heat sink 12. Note that a sensor terminal or the like for detecting a current flowing between the main electrodes may be provided as a control terminal.
[0021]
　The drain terminal is connected to the positive electrode lead frame 13a, and the source terminal is connected to the negative electrode lead frame 13b via an electrode wiring member 15a. Since a large current flows through the electrode wiring member 15a, the electrode wiring member 15a is formed by, for example, processing a plate material of gold, silver, copper, or aluminum, or by wire bonding or ribbon bonding. The gate terminal and the sensor terminal are connected to the control lead frame 21 via the control wiring member 15b. The control wiring member 15b can be formed by, for example, a wire bond of gold, copper, aluminum, or the like, or a ribbon bond of aluminum.
[0022]
　The electrode lead frames 13a and 13b on the positive and negative electrode sides are formed in a flat plate shape. The electrode connection portions of the electrode lead frames 13a and 13b connected to the main electrodes of the power semiconductor element 14 are arranged closer to the heat sink 12 than the power semiconductor element 14 is. The surface of the electrode connection portion of the electrode lead frame 13a on the positive electrode side opposite to the heat sink 12 is joined to the drain terminal on the heat sink 12 side of the power semiconductor element 14 by a conductive joining material 17. The surface of the electrode connection portion of the electrode lead frame 13b on the negative electrode side opposite to the heat sink 12 is joined to one end of an L-shaped electrode wiring member 15a by a conductive joining material 17. The source terminal of the power semiconductor element 14 on the side opposite to the heat sink 12 is joined to the other end of the electrode wiring member 15 a by a conductive joining material 17. The conductive bonding material 17 is made of a material having good conductivity and high thermal conductivity, such as solder, silver paste, or a conductive adhesive.
[0023]
　The surfaces of the electrode lead frames 13a and 13b on the heat sink 12 side of the electrode connection portions are not covered with the element molding resin 20 and are exposed outside the semiconductor element module 29. The exposed portions of the electrode lead frames 13a and 13b are in contact with the inner surface of the element facing projecting portion 12a of the heat sink 12 via an insulating member 18 formed in a sheet shape. Heat generated by the power semiconductor element 14 is transmitted to the heat sink 12 via the electrode connection portions of the electrode lead frames 13a and 13b and the insulating member 18. The insulating member 18 is made of a material having high thermal conductivity and high electrical insulation. Therefore, the insulating member 18 has, for example, a thermal conductivity of several W / (m • K) to several tens W / (m • K) and has insulating properties such as a silicon resin, an epoxy resin, and a urethane resin. , Grease, or an insulating sheet. Further, the insulating member 18 can be configured by combining another material having a low thermal resistance such as a ceramic substrate or a metal substrate and having an insulating property with a resin material.
[0024]
　Further, in order to regulate the thickness of the insulating member 18, a projection 20 a is provided on the heat sink 12 side of the element molding resin 20. By pressing the protrusion 20a of the element mold resin 20 against the heat sink 12, the thickness of the insulating member 18 can be regulated by the height of the protrusion 20a, and the insulating property and the heat transfer property of the insulating member 18 can be controlled. it can. For example, in a low-voltage automobile using a 12V battery, the creepage distance required to secure a predetermined dielectric strength is about 10 μm. Therefore, in the case of a low-withstand-voltage vehicle, the thickness required for insulation can be reduced, so that the protrusion 20a of the element mold resin 20 can be shortened, and the power converter 1 can be made thinner. If the insulating member 18 is made of a material having rigidity and a change in thickness due to pressing is small, the thickness of the insulating member 18 can be controlled, and therefore the projection 20a of the element mold resin 20 may not be provided.
[0025]
　The protrusions 20a allow the distance between the electrode lead frames 13a and 13b sealed in the element mold resin 20 and the heat sink 12 to be managed, and are formed on the positive electrode lead frame 13a to be described later. The thickness of the fuse resin member 26 disposed between the fuse portion 16 and the heat sink 12 can be controlled, and the thermal conductivity and insulation between the two can be controlled.
[0026]
　After the lead frame 13a for the positive electrode protrudes from the element mold resin 20, the lead frame 13a extends laterally along the inner surface of the heat sink 12 while being spaced from the inner surface of the heat sink 12, and then bends. It extends in the vertical direction on the side away from 12 (opening side of the housing 30). The portion extending in the horizontal direction at a distance from the inner surface of the heat sink 12 is referred to as a positive-side lateral extension 13a1, and the portion extending in the vertical direction away from the heat sink 12 is referred to as a positive electrode. The vertical extension 13a2 on the side. The distance between the laterally extending portion 13a1 on the positive electrode side and the heat sink 12 corresponds to the total distance of the thickness of the insulating member 18 and the height of the element facing protrusion 12a of the heat sink 12. A fuse portion 16 described later is formed in the laterally extending portion 13a1 on the positive electrode side.
[0027]
　The positive extension 13a2 on the positive electrode side is joined to the external connection terminal 10a on the positive electrode inserted and outsert into the insulating case 11 by welding or soldering. The external connection terminal 10a on the positive electrode side has a portion extending in the vertical direction, which is joined to the vertical extension portion 13a2 on the positive electrode side, and a portion extending in the horizontal direction toward the outside of the housing 30. have. The part protruding outside from the housing 30 is connected to another device such as a positive electrode of a DC power supply.
[0028]
　The negative electrode-side electrode lead frame 13b also protrudes from the element mold resin 20, is spaced apart from the inner surface of the heat sink 12, and extends along the inner surface of the heat sink 12, and a laterally extending portion 13b1 on the negative electrode side, And a vertical extension 13b2 on the negative electrode side extending to a side away from the heat sink 12. The length of the laterally extending portion 13a1 on the positive electrode side is longer than that of the laterally extending portion 13b1 on the negative electrode side to form the fuse portion 16.
[0029]
　The negative electrode-side vertical extension portion 13b2 is joined to the external connection terminal 10b on the negative electrode inserted and outsert into the insulating case 11 by welding or soldering. The external connection terminal 10b on the negative electrode side is connected to the vertical extension 13b2 on the negative electrode side, and has a portion extending in the vertical direction and a portion extending in the horizontal direction toward the outside of the housing 30. have. The portion protruding from the housing 30 to the outside is connected to another device such as a negative electrode of a DC power supply.
[0030]
　For the electrode lead frames 13a and 13b and the external connection terminals 10a and 10b, a metal such as copper or a copper alloy having good conductivity and high thermal conductivity is used, and a large current of several amps to several hundred amps flows. . The surfaces of the electrode lead frames 13a and 13b may be plated with a metal material such as Au, Ni, or Sn.
[0031]
　The control lead frame 21 protrudes from the sealing resin member 25 on the opening side of the housing 30 and is connected to a control device that controls on / off of the power semiconductor element 14.
[0032]

　A fuse 16 functioning as a fuse is formed on the electrode wiring member 13. In the present embodiment, the fuse portion 16 is formed in a portion of the electrode lead frame 13 that protrudes outward from the element mold resin 20 (in this example, the laterally extending portion 13a1 on the positive electrode side). By forming the fuse portion 16 on the electrode lead frame 13, no additional member is required, and the cost can be reduced. In this example, since the fuse portion 16 is formed in the laterally extending portion of the electrode lead frame 13, the electrode lead frame 13 is separated from the heat sink 12 (height direction) for the formation of the fuse portion 16. And the height of the power conversion device 1 can be suppressed. Further, since the fuse portion 16 is formed in the electrode lead frame 13a on the positive electrode side, the current can be interrupted on the upstream side of the power semiconductor element 14. Therefore, even when a circuit abnormality of the power semiconductor element 14 has occurred, such as a short circuit between the power semiconductor element 14 and the housing 30, the current can be interrupted upstream of the power semiconductor element 14 so that no overcurrent occurs.
[0033]
　The fuse portion 16 is configured by a portion of the electrode wiring member 13 having a smaller cross-sectional area than portions before and after the current flow direction. That is, the fuse section 16 has a smaller cross-sectional area than the front (upstream) and rear (downstream) portions of the fuse 16 in the direction of current flow. As shown in FIG. 4, when an overcurrent flows through the electrode lead frame 13, the current density of the fuse portion 16 having a smaller sectional area than before and after becomes large, and the fuse portion 16 locally rises in temperature and melts. This shuts off the overcurrent. The fuse section 16 is made of gold, silver, copper, or aluminum having high electric conductivity. The fuse portion 16 may be made of the same material as the other portions of the electrode lead frame 13, or a different material may be used. Although not limited to this, the fuse portion 16 is formed by punching a flat plate made of copper or a copper alloy having a thickness of about 0.5 mm to 1.5 mm, similarly to other portions of the electrode lead frame 13. Can be formed.
[0034]
　The shape of the fuse portion 16 may be any shape as long as the shape reduces the cross-sectional area. For example, as shown in FIGS. 5 and 6, notches may be provided on one or both sides, or through holes may be provided on the inside to reduce the cross-sectional area. The shape of the notch or the through hole may be any shape such as a triangle, a pentagon, a trapezoid, a rhombus, a parallelogram, a circle, an ellipse, etc., in addition to a rectangle. The number of notches or through holes is not limited to one, and a plurality of notches or through holes may be provided. In addition, a plurality of notches or through holes may be staggered, staggered, or irregularly arranged at different positions in the length direction of the wiring. The plurality of through holes may be arranged in either the width direction or the length direction of the wiring.
[0035]
A fuse resin member 26,
　which is a resin member, is disposed between the fuse portion 16 and the housing 30 (in this example, the heat sink 12). As shown in FIGS. 1 and 3, the fuse resin member 26 is arranged in an area larger than the area of the fuse portion 16 when viewed in the vertical direction. That is, when viewed in the vertical direction, the area where the fuse resin member 26 is arranged covers the area where the fuse portion 16 is formed. The fuse resin member 26 is in contact with the surface of the fuse portion 16 on the heat sink 12 side and is in contact with the surface of the heat sink 12 on the fuse portion 16 side.
[0036]
　Before the sealing resin member 25 is filled in the housing 30, the fuse resin member 26 is disposed between the fuse portion 16 and the housing 30. The fuse resin member 26 is formed of an adhesive, grease, or an insulating sheet having a high electrical insulation property and made of a resin material such as a silicon resin, an epoxy resin, or a urethane resin. Further, the fuse resin member 26 can be configured by combining another resin material having a low thermal resistance such as a ceramic substrate or a metal substrate and having an insulating property with those resin materials. As long as the fuse resin member 26 is a material having high electrical insulation, for example, a material having a high thermal conductivity of 1 W / (m • K) to several tens W / (m • K) may be used.
[0037]
　By providing the fuse resin member 26 between the fuse part 16 and the housing 30, the member of the blown fuse part 16 is prevented from contacting the heat sink 12, and the electrode wiring member 13 and the heat sink 12 are short-circuited. Can be suppressed. Further, the heat generated in the fuse portion 16 during the fusing can be transmitted to the heat sink 12 through the fuse resin member 26 and cooled, and the heat generated by the power semiconductor element 14, the sealing resin member 25, etc. Damage can be suppressed. Further, since the fuse resin member 26 dedicated to the fuse portion 16 is provided, a resin member of a material suitable for fusing the fuse portion 16 can be selected, and the insulation performance and cooling performance at the time of fusing can be improved. it can.
[0038]
　In the present embodiment, a resin member having a lower Young's modulus than sealing resin member 25 is used as fuse resin member 26. For example, the Young's modulus of the fuse resin member 26 is on the order of several tens of MPa (megapascal) (for example, a value between 10 MPa and 30 MPa), and for example, a rubber material, silicone rubber, or silicone gel may be used. According to this configuration, when the fuse portion 16 is blown, a plurality of spherical lump-shaped splattered melt members are sunk into the soft fuse resin member 26 having a lower Young's modulus than the sealing resin member 25. Instead, it can be dispersed and held in the fuse resin member 26. Therefore, after the fusing, the current path can be prevented from being maintained by the melted member, and the current path can be rapidly cut. Further, it is possible to prevent the sealing resin member 25 having a high Young's modulus from being cracked by the melted member.
[0039]
　As the fuse resin member 26, it is preferable to use a silicon resin having an arc extinguishing action of an arc discharge generated when the fuse portion 16 is blown. According to this configuration, it is possible to suppress the continuation of current supply by arc discharge even after the fuse is blown, and to cut off the current immediately after the blow. Therefore, damage to the power semiconductor element 14, the sealing resin member 25, and the like can be suppressed.
[0040]
The
　sealing resin member 25 is a resin member that seals the power semiconductor element 14, the electrode wiring member 13, the fuse portion 16, and the fuse resin member 26 in the housing 30. In the present embodiment, the sealing resin member 25 is configured to seal the semiconductor element module 29 in the housing 30. The sealing resin member 25 also seals other components such as the insulating member 18 and the external connection terminals 10a and 10b in the housing 30. As the sealing resin member 25, for example, a resin material having high rigidity and high thermal conductivity is used. The sealing resin member 25 may be made of, for example, epoxy resin, silicone resin, urethane resin, PPS, PEEK, or ABS containing a thermally conductive filler. The sealing resin member 25 preferably has a Young's modulus of 1 MPa to 50 GPa and a thermal conductivity of 0.1 W / (m • K) to 20 W / (m • K). By sealing each component with the sealing resin member 25, vibration resistance and environmental resistance can be improved.
[0041]
　Since the fuse portion 16 and the fuse resin member 26 are covered with the sealing resin member 25, the blown-out member of the fuse portion 16 can be prevented from scattering outside. Since the fuse portion 16 and the fuse resin member 26 can be cut off from the outside air, it is possible to suppress the progress of the combustion reaction due to the arc discharge generated at the time of fusing, and to suppress the smoke generated at the time of fusing from leaking to the outside. it can.
[0042]
Embodiment 2 FIG.
　Next, the power conversion device 1 according to Embodiment 2 will be described. The description of the same components as those in the first embodiment is omitted. The basic configuration of power converter 1 according to the present embodiment is the same as that of the first embodiment, but the configuration of fuse resin member 26 is partially different. FIG. 7 is a cross-sectional view of the power conversion device 1 according to the present embodiment, taken along a line AA in FIG.
[0043]
　As in the first embodiment, the fuse resin member 26 is disposed between the fuse portion 16 and the housing 30 (in this example, the heat sink 12). Unlike the first embodiment, the fuse resin member 26 is also arranged on the side of the fuse portion 16 opposite to the side of the housing 30 (the side of the heat sink 12). That is, the fuse resin members 26 are arranged on both sides of the fuse portion 16 on the housing 30 side and on the opposite side to the housing 30 side. Here, the side opposite to the housing 30 side is the side away from the heat sink 12 and the opening side of the housing 30. According to this configuration, it is possible to suppress the member of the blown fuse portion 16 from coming into contact with the sealing resin member 25 and to prevent the sealing resin member 25 from being damaged.
[0044]
　When a resin member having a Young's modulus lower than that of the sealing resin member 25 is used as the fuse resin member 26, the melting member may be held in the soft fuse resin member 26 on the side opposite to the housing 30. Accordingly, the energization path can be more reliably cut, and the melting of the sealing resin member 25 having a high Young's modulus can be more reliably suppressed.
[0045]
　Further, when a silicon resin having an arc extinguishing function is used for the fuse resin member 26, the arc extinguishing function of the arc discharge can be further enhanced by disposing the fuse resin member 26 on the side opposite to the housing 30 side. After the fusing, the current can be cut off more quickly.
[0046]
　In the present embodiment, the fuse resin members 26 are also arranged on both lateral sides of the fuse portion 16 and are arranged so as to cover the entire periphery of the fuse portion 16. According to this configuration, it is possible to further enhance the effect of suppressing the damage of the sealing resin member 25 by the fuse resin member 26, the reliability of cutting the current path, the arc extinguishing effect, and the like.
[0047]
Embodiment 3 FIG.
　Next, the power conversion device 1 according to Embodiment 3 will be described. The description of the same components as those in the first embodiment is omitted. The basic configuration of the power converter 1 according to the present embodiment is the same as that of the first embodiment, but the configurations of the heat sink 12 and the fuse resin member 26 are partially different. FIG. 8 is a cross-sectional view of the power conversion device 1 according to the present embodiment, taken along the line AA in FIG.
[0048]
　As in the first embodiment, the fuse resin member 26 is disposed between the fuse portion 16 and the housing 30 (in this example, the heat sink 12). However, unlike the first embodiment, a fuse-facing protrusion, which is a protrusion protruding toward the fuse portion 16 (inward), is provided on the inner surface of the housing 30 (in this example, the heat sink 12) facing the fuse portion 16. A portion 12b is provided. The fuse-facing protrusion 12b is formed in a flat plate shape. The fuse-facing protrusion 12b is formed to have an area equivalent to the area of the fuse resin member 26 when viewed in the vertical direction. Therefore, the interval between the fuse portion 16 where the fuse resin member 26 is arranged and the heat sink 12 is narrowed by the projecting height of the fuse facing projecting portion 12b. Therefore, the thickness of the fuse resin member 26 can be reduced, the heat conduction from the fuse portion 16 to the heat sink 12 via the fuse resin member 26 can be further improved, and the power semiconductor element 14 due to the heat generated by fusing can be sealed. The effect of suppressing damage to the resin stopper 25 and the like can be further enhanced. Further, by adjusting the protrusion height of the fuse-facing protrusion 12b, it is possible to balance thermal conductivity and insulation.
[0049]
　Note that, similarly to the third embodiment, the fuse resin member 26 may be disposed on the opposite side of the fuse portion 16 from the housing 30 side (the heat sink 12 side). It may be arranged to cover over.
[0050]
[Other Embodiments]
　Finally, other embodiments of the present invention will be described. Note that the configuration of each embodiment described below is not limited to being applied independently, and can be applied in combination with the configuration of another embodiment as long as no contradiction occurs.
[0051]
(1) In each of the above embodiments, the semiconductor element module 29 in which the power semiconductor element 14 and the electrode lead frame 13 as the electrode wiring member 13 are sealed with the element molding resin 20 which is a resin member. The above description has been made by way of example. However, embodiments of the present invention are not limited to this. That is, the power semiconductor element 14 and the electrode wiring member 13 may not be sealed with the element molding resin 20 and may not be packaged. That is, the power semiconductor element 14, the electrode wiring member 13, and the like that are not sealed with the element molding resin 20 may be sealed in the housing 30 by the sealing resin member 25. In this case, the electrode wiring member 13 may be a bus bar or the like, and the fuse portion 16 may be formed in a portion of the electrode wiring member on the positive electrode side or the negative electrode side sealed with the sealing resin member 25.
[0052]
(2) In each of the above-described embodiments, the case where the fuse portion 16 is formed on the positive electrode lead frame 13a (laterally extending portion 13a1) has been described as an example. However, embodiments of the present invention are not limited to this. That is, the fuse portion 16 may be formed at any position as long as it is connected to the main electrode of the power semiconductor element 14 and is the portion of the electrode wiring member 13 sealed with the sealing resin member 25. For example, the fuse portion 16 includes a horizontal extension 13b1 of the negative electrode lead frame 13b, a vertical extension 13a2 of the positive electrode, a vertical extension 13b2 of the negative electrode, or a positive electrode or a negative electrode. May be formed on the external connection terminals 10a and 10b.
[0053]
(3) In each of the above embodiments, the case where the power converter 1 is provided with one power semiconductor element 14 (switching element) has been described as an example. However, embodiments of the present invention are not limited to this. That is, the power converter 1 may be provided with a plurality of power semiconductor elements. For example, two switching elements may be connected in series between the electrode wiring member on the positive electrode side and the electrode wiring member on the negative electrode side, and the fuse portion 16 may be formed on the electrode wiring member on the positive electrode side or the negative electrode side. Further, a series circuit of two switching elements is formed as a bridge circuit in which a plurality of sets are connected in parallel between the electrode wiring member on the positive electrode side and the electrode wiring member on the negative electrode side. , A fuse section 16 may be provided. Further, a part or all of the power semiconductor element 14 may be a diode.
[0054]
　In the present invention, each embodiment can be freely combined, or each embodiment can be appropriately modified or omitted within the scope of the invention.
Explanation of reference numerals
[0055]
DESCRIPTION OF REFERENCE NUMERALS 1 power conversion device, 12b fuse-facing protrusion, 13 electrode wiring member, 14 power semiconductor element, 16 fuse section, 20 element molding resin, 25 sealing resin member, 26 fuse resin member, 29 semiconductor element module, 30 housing
The scope of the claims
[Claim 1]
　A power semiconductor element,
　an electrode wiring member connected to a main electrode of the power semiconductor element, a
　housing,
　a fuse part formed on the electrode wiring member and functioning as a fuse, the
　fuse part and the housing A fuse resin member that is a resin member disposed between the
　body and a sealing member that is a resin member that seals the power semiconductor element, the electrode wiring member, the fuse portion, and the fuse resin member in the housing; A power conversion device comprising: a resin stopper.
[Claim 2]
　The power semiconductor element and the electrode lead frame as the electrode wiring member are a semiconductor element module sealed with an element molding resin as a resin member, and the
　fuse portion projects outward from the element molding resin. The power converter according to claim 1, wherein the power converter is formed in a portion of the electrode lead frame.
[Claim 3]
　3. The power converter according to claim 1, wherein the fuse portion is configured by a portion of the electrode wiring member having a smaller cross-sectional area than portions before and after the current flow direction. 4.
[Claim 4]
　The power converter according to any one of claims 1 to 3, wherein the fuse resin member is also arranged on a side of the fuse portion opposite to the housing.
[Claim 5]
　The power converter according to any one of claims 1 to 4, wherein the fuse resin member is disposed so as to cover the entire periphery of the fuse section.
[Claim 6]
　The power converter according to claim 1, wherein the fuse resin member has a lower Young's modulus than the sealing resin member.
[Claim 7]
　The power converter according to any one of claims 1 to 6, wherein the fuse resin member has a Young's modulus on the order of several tens of megapascals.
[Claim 8]
　The power converter according to any one of claims 1 to 7, wherein the fuse resin member is made of a silicon resin having an arc extinguishing action of an arc discharge generated when the fuse portion is blown.
[Claim 9]
　9. The power conversion device according to claim 1, wherein the housing is provided with a fuse-facing protrusion, which is a protrusion protruding toward the fuse portion, on an inner surface portion facing the fuse portion. 10. apparatus.
[Claim 10]
　10. The case according to claim 1, wherein the housing is formed in a bottomed cylindrical shape having a bottom portion formed of a metal heat sink, and the
　fuse resin member is disposed between the fuse member and the heat sink. The power converter according to claim 1.