Sign In to Follow Application
View All Documents & Correspondence
View All Documents & Correspondence
Power Semiconductor Module
Abstract: A power semiconductor module (100) is provided with: electrode plates (2) having an integrated body (2a) and an external connection terminal (2b) the bodies (2a) being in a coplanar arrangement; a semiconductor element (1) carried on one surface (carrying surface) (2c) of the body (2a); and a resin package (3) in which the other surface (radiating surface) (2d) of the body (2a) is exposed and the semiconductor element (1) and the body (2a) of the electrode plates (2) are sealed using a resin. The radiating surface (2d) and a bottom surface (3a) of the resin package (3) are coplanar. It is thereby possible to improve heat radiating performance and reliability as well as to reduce size.
Get Free WhatsApp Updates!
Notices, Deadlines & Correspondence
Notices, Deadlines & Correspondence
Patent Information
Application #
Filing Date
23 August 2013
Publication Number
39/2014
Publication Type
INA
Invention Field
ELECTRICAL
Status
Email
patent@depenning.com
Parent Application
Patent Number
Legal Status
Grant Date
2021-03-22
Renewal Date
Applicants
Mitsubishi Electric Corporation
7 3 Marunouchi 2 chome Chiyoda ku Tokyo
1008310
Inventors
1. ASADA Shinsuke
c/o Mitsubishi Electric Corporation 7 3 Marunouchi 2 chome Chiyoda ku Tokyo
1008310
2. NAGAO Kenjiro
c/o Mitsubishi Electric Corporation 7 3 Marunouchi 2 chome Chiyoda ku Tokyo
1008310
3. NAKAJIMA Dai
c/o Mitsubishi Electric Corporation 7 3 Marunouchi 2 chome Chiyoda ku Tokyo
1008310
4. WATANABE Yuetsu
c/o Mitsubishi Electric Corporation 7 3 Marunouchi 2 chome Chiyoda ku Tokyo
1008310
5. ASAO Yoshihito
c/o Mitsubishi Electric Corporation 7 3 Marunouchi 2 chome Chiyoda ku Tokyo
1008310
6. OGA Takuya
c/o Mitsubishi Electric Corporation 7 3 Marunouchi 2 chome Chiyoda ku Tokyo
1008310
7. KATO Masaki
c/o Mitsubishi Electric Corporation 7 3 Marunouchi 2 chome Chiyoda ku Tokyo
1008310
Specification
Documents
Application Documents
| # | Name | Date |
|---|---|---|
| 1 | 6807-CHENP-2013-RELEVANT DOCUMENTS [20-09-2023(online)].pdf | 2023-09-20 |
| 1 | 6807-CHENP-2013.pdf | 2013-08-26 |
| 2 | GPA.pdf | 2013-09-03 |
| 2 | 6807-CHENP-2013-RELEVANT DOCUMENTS [15-09-2022(online)].pdf | 2022-09-15 |
| 3 | FORM-5.pdf | 2013-09-03 |
| 3 | 6807-CHENP-2013-IntimationOfGrant22-03-2021.pdf | 2021-03-22 |
| 4 | FORM-3.pdf | 2013-09-03 |
| 4 | 6807-CHENP-2013-PatentCertificate22-03-2021.pdf | 2021-03-22 |
| 5 | 6807-CHENP-2013-FORM 3 [20-03-2020(online)].pdf | 2020-03-20 |
| 5 | 4068-2013-COMPLETE SPECIFICATION.pdf | 2013-09-03 |
| 6 | 6807-CHENP-2013-ABSTRACT [14-09-2018(online)].pdf | 2018-09-14 |
| 6 | 6807-CHENP-2013 FORM-3 19-02-2014.pdf | 2014-02-19 |
| 7 | 6807-CHENP-2013-CLAIMS [14-09-2018(online)].pdf | 2018-09-14 |
| 7 | 6807-CHENP-2013 FORM-1 19-02-2014.pdf | 2014-02-19 |
| 8 | 6807-CHENP-2013-COMPLETE SPECIFICATION [14-09-2018(online)].pdf | 2018-09-14 |
| 8 | 6807-CHENP-2013 CORRESPONDENCE OTHERS 19-02-2014.pdf | 2014-02-19 |
| 9 | abstract6807-CHENP-2013.jpg | 2014-08-20 |
| 9 | 6807-CHENP-2013-DRAWING [14-09-2018(online)].pdf | 2018-09-14 |
| 10 | 6807-CHENP-2013-FER.pdf | 2018-03-15 |
| 10 | 6807-CHENP-2013-FER_SER_REPLY [14-09-2018(online)].pdf | 2018-09-14 |
| 11 | 6807-CHENP-2013-FORM 3 [14-09-2018(online)].pdf | 2018-09-14 |
| 11 | 6807-CHENP-2013-OTHERS [14-09-2018(online)].pdf | 2018-09-14 |
| 12 | 6807-CHENP-2013-FORM 3 [14-09-2018(online)].pdf | 2018-09-14 |
| 12 | 6807-CHENP-2013-OTHERS [14-09-2018(online)].pdf | 2018-09-14 |
| 13 | 6807-CHENP-2013-FER.pdf | 2018-03-15 |
| 13 | 6807-CHENP-2013-FER_SER_REPLY [14-09-2018(online)].pdf | 2018-09-14 |
| 14 | 6807-CHENP-2013-DRAWING [14-09-2018(online)].pdf | 2018-09-14 |
| 14 | abstract6807-CHENP-2013.jpg | 2014-08-20 |
| 15 | 6807-CHENP-2013 CORRESPONDENCE OTHERS 19-02-2014.pdf | 2014-02-19 |
| 15 | 6807-CHENP-2013-COMPLETE SPECIFICATION [14-09-2018(online)].pdf | 2018-09-14 |
| 16 | 6807-CHENP-2013 FORM-1 19-02-2014.pdf | 2014-02-19 |
| 16 | 6807-CHENP-2013-CLAIMS [14-09-2018(online)].pdf | 2018-09-14 |
| 17 | 6807-CHENP-2013 FORM-3 19-02-2014.pdf | 2014-02-19 |
| 17 | 6807-CHENP-2013-ABSTRACT [14-09-2018(online)].pdf | 2018-09-14 |
| 18 | 4068-2013-COMPLETE SPECIFICATION.pdf | 2013-09-03 |
| 18 | 6807-CHENP-2013-FORM 3 [20-03-2020(online)].pdf | 2020-03-20 |
| 19 | FORM-3.pdf | 2013-09-03 |
| 19 | 6807-CHENP-2013-PatentCertificate22-03-2021.pdf | 2021-03-22 |
| 20 | FORM-5.pdf | 2013-09-03 |
| 20 | 6807-CHENP-2013-IntimationOfGrant22-03-2021.pdf | 2021-03-22 |
| 21 | GPA.pdf | 2013-09-03 |
| 21 | 6807-CHENP-2013-RELEVANT DOCUMENTS [15-09-2022(online)].pdf | 2022-09-15 |
| 22 | 6807-CHENP-2013.pdf | 2013-08-26 |
| 22 | 6807-CHENP-2013-RELEVANT DOCUMENTS [20-09-2023(online)].pdf | 2023-09-20 |
Search Strategy
| 1 | Searchstrategy_15-02-2018.pdf |