DESCRIPTION TITLE: POWER SEMICONDUCTOR MODULE AND POWER ONIT DEVICE
TECHNICAL FIELD
[0001] The present invention relates to power semiconductor
5 modules and, more particularly, relates to a power semiconductor module which constitutes a part of an inverter circuit and/or a relay circuit for a rotary electric machine, for example, a motor of a vehicular electric power steering device. 10 BACKGROUND ART
[0002) As a conventional power semiconductor module, for
example, one disclosed in Japanese Patent Gazette No. 4540884 (Patent Document 1) may be used. In such a module, a plurality of semiconductor devices are directly arranged on a conductive 15 heat dissipation substrate and these are integrally formed in a resin package by transfer mold molding together with a plurality of external connection electrodes electrically connected to the semiconductor devices.
A mold package of a portion on the opposite surface side to 20 the surface of the heat dissipation substrate on which the plurality of the semiconductor devices are arranged is thin; heat emitted from the semiconductor devices passes through the heat dissipation substrate and then passes through the thin

resin package; and after that, the heat is dissipated to a heat sink or the like attached to the outside of the power semiconductor module. Incidentally, the power semiconductor module and the heat sink are bonded via heat dissipating
5 insulation adhesive or the like.
Furthermore, power line connection between the semiconductor
devices is bonded by performing a plurality of wire bonding in
order to secure current capacity.
PRIOR ART DOCUMENT
10 PATENT DOCUMENT
(0003] Patent.Document 1: Japanese Patent Gazette No.4540884
DISCLOSURE OF THE INVENTION
PROBLEMS TO BE SOLVED BY THE INVENTION
[0004] However, in the thus configured power semiconductor
15 module, a plurality of external connection terminals and the heat dissipation substrate, which are respectively individually prepared, are bonded by soldering or the like; and therefore, a problem exists that the module increases additionally by bonding area and reduction in size is disturbed.
20 Furthermore, a structure is such that the heat emitted from the semiconductor device passes through the heat dissipation substrate and then passes through the mold package with low thermal conductivity; and therefore, this is disadvantageous

in respect of heat dissipation properties. As a result, heat
dissipation performance has to be secured by enlarging the area
of the heat dissipation substrate; and accordingly, the heat
dissipation properties andthe reduction in size of the module
5 are disturbed.
In addition, the power lines wired by the plurality of wire
bonding are performed in order to secure the current capacity;
however, there exists a constraint in view of workability and
reduction of internal resistance is limited. In addition, a
10 lot of wire bonding needs to be performed and a problem also exists in respect of reliability.
The present invention has been made.to solve the foregoing problem and is to provide a power semiconductor module in which reduction in size is possible, heat dissipation properties are 15 good, internal resistance is reduced, and reliability is high. Furthermore, in a connection structure with an actuator, the structure is made such that terminals of the power semiconductor module can be diverted, whereby it becomes possible to achieve reduction in size and reduction in cost. 20 MEANS FOR SOLVING THE PROBLEMS
[0005] According to the present invention, there is provided a power semiconductor module including: a plurality of first metal plates arranged in the same planar state; a power

semiconductor device (hereinafter, referred to as "power
semiconductor chip") mounted on the first metal plate; andan
overbridge-shaped second metal plate which is composed of
bridge frame sections andleg sections that support the bridge
5 frame sections, the leg sections being for appropriately
performing solder bonding between electrodes of the power
semiconductor chips and between the electrode of the power
semiconductor chip and the first metal plate, the power
semiconductor module being configured by a resin package in
10 which these members are sealed with electrically insulating
resin. In the power semiconductor module, the solder bonding
section of the leg section is farmed in a planar shape by bending
process and is provided at a position lower than the bridge frame
section.
15 Furthermore, according to the present invention, there is
provided a power unit device in which a power semiconductor module is placed on a heat sink portion, the power unit device including: a heat conductive member which is sandwiched between the power semiconductor module and the heat sink portion, the 20 heat conductive member being for dissipating heat from the power semiconductor module; and a pressing mechanism which presses the power semiconductor module against the heat sink portion via the heat conductive member.

ADVANTAGEOUS EFFECT OF THE INVENTION
[0006] According to a power semiconductor module of the present invention, a bonding section with a semiconductor chip and a bonding section with a first metal plate, which are configured S by means of a second metal plate, are formed to be lower than other sections, whereby solder of the bonding sections of the second metal plate is not run off from electrodes and bonding can be stably performed. Furthermore, solder fillets around the bonding section are stably formed, whereby connection 10 becomes stable. In addition, the second metal plate is of a bent structure at the bonding section, whereby thermal stress canberelaxed andreliability is improved. Further, the second metal plate canbe configured to be substantially the same width as the electrode of the semiconductor chip and internal 15 resistance can also be reduced.
Besides, according to a power unit device of the present invention, it becomes easy to suppress variation in thermal resistance between a power semiconductor module and a heat sink portion, and heat dissipation properties are stabilized. 20 BRIEF DESCRIPTION OF THE DRAWINGS
(0007] Fig. 1 is a perspective view showing a power semiconductor module according to Embodiment 1 of the present invention;

Figs. 2A and 2B each shows the power semiconductor module
according to Embodiment 1 of the present invention, Fig. 2A is
a plan view, and Fig. 2B is an enlarged sectional view taken
along the line A-A in Fig. 2A;
5 Fig. 3 is a perspective view of the power semiconductor chip
according to Embodiment 1 of the present invention; Fig. 4 shows a relevant part of the power semiconductor module according to Embodiment 1 of the present invention, and is an enlarged view of a section Bin Fig. 1; 10 Figs. SA and 5B each shows a relevant part of the power semiconductor module according to Embodiment 1 of the present invention, Fig. SA is a plan view in which a resin mold package is seen from a back surface, and Fig. SB is an enlarged sectional view taken along the line B-B in Fig. 5A; 1S Fig. 6 is a plan view of a device which incorporates a power semiconductor module according to Embodiment 2 of the present invention; and
Fig. 7 is a sectional view taken along the line C-C in Fig. 6. MODE FOR CARRYING OUT THE INVENTION 20 [0008] A power semiconductor module according to the present invention is not one which limits internal circuit configuration; however, as an example, a three-phase bridge inverter circuit having a power circuit that uses a power metal

oxide semiconductor field effect transistor (power MOSFET) will be described in Embodiment L
H reinaf ter, respective embodiments of the present invention
will be described with reference to drawings.
5 Incidentally, the same reference numerals as those in
respective drawings represent the same or corresponding elements.
[0009] Embodiment 1.
Hereinafter, Embodiment 1 of the present invention will be
10 described with reference to Fig. 1 to Fig. 4.
Fig. 1 is a perspective view showing the configuration of a power semiconductor module 100 according to Embodiment 1, and is the perspective view in which a resin mold package 7 is omitted
and only the inside is shown. Fig. 2A is a plan view of the 15 power semiconductor module 100; and Fig. 2B is an enlarged
sectional view taken along the line A-A.
Fig. 3 is a perspective view showing an electrode section of
a power semiconductor chip 3 shown in Fig. 1 and Figs. 2A and
2B. Fig. 4 is an enlarged view of a section B in Fig. 1. Fig.
20 5A is a plan view in which the resin mold package 7 is seen from
the back surface side; andFig. SB is an enlarged sectional view
taken along the line B-B.
[0010] As shown in Fig. 1 and Figs. 2A and 2B, total five first

metal plates 1 are arranged in the same planar state; andthree
of the five first metal plates 1 are each mounted with one power
semiconductor chip 3 (total three power semiconductor chips).
Thepower semiconductor chip 3 is a MOSFET chip andhas a source
S electrode 3a and a gate electrode 3bon one surface thereof as
shown in Fig. 3; andthe power semiconductor chip 3 has a drain
electrode on the opposite surface thereof.
The drain electrode of the power semiconductor chip 3 and the first metal plate 1 are mechanically and electrically connected 10 by solder Ba. Even a conductive connection member such as conductive adhesive may be permissible as a connection member. [0011] Figs. 2A and 2B each shows a structure in which the second metal plate 2 connects between the source electrodes 3a of the power semiconductor chips and to the first metal plate 1. 15 Hereinafter, a detailed description will bemade with reference to the enlarged sectional view of Fig. 2B.
The second metal plate 2 is substantially the same width as the electro9:e on the upper surface of the power semiconductor chip; and the second metal plate 2 is composed of bridge frame 20 sections 2b and leg sections 2c that support the bridge frame sections. The second metal plate 2 is made of metal- plate material having• good thermal conductivity and electrical conductivity such as copper alloy; and tin plating process,

nickel plating process, or the like is appropriately applied totally or partially.
[0012] The second metal plate 2 connects between the respective source electrodes 3a of the power semiconductor chips 3; and the second metal plate 2 further extends at the bridge frame section 2b and its leg section 2c is connected to other first metal plate l (the left side in the drawing).
In this case, each bonding section corresponding to the leg section 2c of the second metal plate 2 is formed in a planar
shape by bending so as to be lower than other section (bridge frame section 2b) and solder 8 is filled to only the bonding section. Furthermore, the second metal plate 2 is bent; and consequently, stress on the solder section due to thermal contraction of the first metal plate 1 and the resin mold package
7 is relaxed, heat cycle properties are improved, and durability is also improved against thermal stress due to self-heating. (0013) Furthermore, a protrusion 2a is fo:c:med toward a solder surface (downward in the drawing) at the solder bonding section of the second metal plate 2 and a constant gap can be secured at the solder bonding section. The height of the protrusion 2a is appropriately adjusted; and consequently, the amount of the solder 8 of the bonding section can be controlled and durability can be improved.

Incidentally, in Figs. 2A and 2B, the protrusion 2a is formed on all the solder bonding sections of the second metal plate 2 {both the bonding surface with the electrode of the power semiconductor chip and the bonding surface with the first metal plate); however, the protrusion 2a may be formed on only either oneof the bonding surfaces.
The gate electrode 3b of the power semiconductor chip 3 is similarly connected to a different signal terminal 4 by solder; andafter a shunt resistor 5andcapacitors 6 are bonded by solder on the first metal plate 1, the whole is sealed as the resin mold package 7.
At this time, a part of the first metal plate 1 and a part
of the signal terminals 4 are extended outside the mold package
and are used as terminals for electrical connection.
[0014) Fig. 4 is a view in which the section B of Fig. 1 is
enla ged and shows a section where the first metal plate 1 is drawn out from the resin mold package 7.
A configuration is made such that an external end section of the first metal plate 1 forms an external connection terminal, the external end section being drawn out from the resin mold package 7; a base section onthe inside of the resin mold package, which is a boundary line section with the mold of the first metal plate 1, is formed slimmer than other section andin a narrowed

shape; and this narrowed section 16 is filled with resin of the resin mold package.
The resin runs round to the narrowed section; andconsequently, strength is increased in the case where horizontal stress is applied to the first metal plate 1 serving as the terminal and breakdown tolerance against external stress canbe improved. This causes the narrowed configuration section to play a role of an anchor even when the horizontal stress is applied to the external connection terminal, strength is enhanced, peeling off
of the resin can be prevented, and reliability is improved. [0015] Furthermore, the base section onthe inside of the resin mold package of the external connection terminal is formed with oneor more through holes 15in the thickness direction thereof; andresin is filled in thethrough hole section. Consequently, as in the narrowed configuration, breakdown tolerance against stress on the terminal can be improved, a section embedded in the through hole 15 serves as an anchor, strength is enhanced, peeling off of the resin can be prevented, and reliability is improved.
[0016] As is apparent from the sectional view of Fig. 2B, molding is performed such that the back surface of the first metal plate 1, that is, a back surface la onthe opposite side to the surface on which the power semiconductor chip 3 is mounted is exposed-

from the resin mold package 7 that is low in heat dissipation properties.
Heat generated due to carrying current through the power semiconductor chip 3 spreads to the first metal plate 1 andthe heat is dissipated into the air through the resin mold package 7. Ordinarily, since thermal resistance of mold is relatively large, heat dissipation from the mold is not much expected. However, the back surf ace la of the first metal plate 1 is exposed as described above; and consequently, as to be described later in Fig. 7, when the power semiconductor module 100 is disposed on an aluminum heat sink portion 10 that is sufficiently low in thermal resistance, there canbeconstructed a structure that is good in heat dissipation efficiency bysandwiching a material, which is a heat conductive material that is sufficiently low in thermal resistance andanelectrically insulating material, between the back surface la of the first metal plate 1 exposed from the resin mold package 7 and the aluminum heat sink portion 10.
[0017) Fig. SA is a plan view in which the resin mold package 7 is seen from the back surface; andFig. SB is a sectional view taken along the line B-B.
In Figs. 5A and 5B, the back surfaces la of the first metal plates 1 are exposed from the resin mold package 7 as described

before, a plurality of mold resin protrusions 9 are formed on the outer surface of a resin mold package 7a excluding the
exposed surfaces la of the first metal plates 1, the resin protrusion. 9 being protruded from between the plurality of first metal plates 1. The resin protrusion 9 is formed to secure a clearance between the power semiconductor module 100 and the aforementioned aluminum heat sink portion 10 and to also secure clearance accuracy thereof.
The resin protrusion 9 is integrally formed in a transfer mold and securement of height accuracy thereof is easy in the production of manufacturing dies. Furthermore, the plurality of resin protrusions 9 are preferable to be formed uniformly on the back surface of the power semiconductor module 100; however, a design may be appropriately made according to the structure of the first metal plate 1.
According to such a configuration, when the power semiconductor module 100 is placed on the heat sink portion 10, the clearance between the heat sink portion 10 and the heat dissipation surface of the power semiconductor module 100 can be easily secured by the height of the resin protrusion 9, heat dissipation performance is stabilized, and reliability against an electrical short-circuit to the heat sink is improved. [0018] Embodiment 2.

Fig. 6 shows a structural example (a device in which power
semiconductor modules are incorporated) in which power
semiconductor modules 100 are disposed on a heat sink portion
10 and power lines are connected, as Embodiment 2 according to
the present invention. Furthermore, Fig. 7 shows a sectional
view taken along the line c-c in Fig. 6. Incidentally, the same reference numerals are given to those corresponding to constitutional elements in Embodiment 1 shown in Fig. 1 to Fig. 4.
[0019] Fig. 6 is a power unit device that drives, for example, a three-phase brushless motor; and the heat sink portion 10 which is for dissipating heat emitted from a power section is formed into a shape to be attached to a motor. Furthermore, a heat dissipation surface is formed on the flat surface of the heat sink portion 10 so that the power semiconductor module 100 described in Embodiment 1 can be mounted.
As shown in Figs. SA and SB and Fig. 7, the power semiconductor
module 100 is formed into a shape capable of being mounted on
the heat sink portion 10. Although not shown in the drawing,
as described in Embodiment 1, the thermally conductive,
electrically insulating member (for example, fluid thermally
conductive, electrically insulating resin member) that
dissipates the heat from the power semiconductor module 100 is

filled (sandwiched) between the power semiconductor module 100 and the heat sink portion 10, and the thickness the=eof is secured by the aforementioned resin protrusion 9.
[0020] The power semiconductor module 100 is structured to be sandwiched by a resin-made frame 11 and the heat sink portion 10, and the frame 11 is fixed to the heat sink portion 10 by fastening screws 14. When the frame 11 is fixed to the heat sink portion 10, the power semiconductor module 100 needs to be pressed against the heat sink portion 10 bya constant force; and therefore, when the fastening screws 14 are fastened, the frame 11 is designed so as to be deflected a constant amount as shown by thick solid lines in Fig.?.
[0021] When fastened by the fastening screws 14, a fulcrum point
that presses the power semiconductor module 100 is misaligned;
and accordingly, there is a concern that the power semiconductor
module 100 is inclined and fixed with respect to the heat sink
portion 10. In order to avoid this concern, a pressing .
mechanism that presses the power semiconductor module 100
again t the heat sink portion 10 is disposed on the upper surface
of the power semiconductor module 100. Furthermore, in this
example, three power semiconductor modules 100 are disposed on the circumference ,as shown in Fig. 6.
More specifically, the pressing mechanism is composed of the

frame 11, a pressing section 17 of a fan-like raised section in cross-section (sphere-shaped protruded section) formed on the frame 11, and the fastening screw 14 as shown in Fig. 7. A substantially central point on the upper surface of the power semiconductor module is pressed by the pressing section 17, and this causes the power semiconductor module 100 to be constantly perpendicularly pressed against the heat sink portion 10. [0022] As described above, the structure is made to be pressed at the substantially central point on the upper surface of the
power semiconductor module 100; and therefore, vertical force is constantly exerted on the heat sink portion 10 also with respect to deformation of an upper surface support structure, the power semiconductor module 100 can be constantly perpendicularly pressed against the heat sink portion 10, the
power semiconductor module 100 can be stably disposed without inclining with respect to the heat sink portion 10, suppression of variation in thermal resistance between the heat sink portions 10 due to the inclination of the power semiconductor module 100 can be easily achieved, and heat dissipation properties are stabilized.
[0023] In Fig. 7, the first metal plate 1 of the power semiconductor module 100 extends outside from the resin mold package to be bent in an L shape, and passes through a guide

of the frame 11 to be drawn out to an upper portion.
On the other hand, a terminal of an actuator 12 and a terminal of the three-phase brushless motor (not shown in this embodiment) extend from opposite directions, and these terminals are arranged so as to be overlapped at a screw 13 section.
The respective terminals are each formed with a screw hole (not shown in the drawing) and are fastened by the screw 13. An electric power signal from the power unit is transmitted to the three-phase brushless motor through these terminals and power can be generated. A shape is preliminarily designed so that a terminal 4 of a first metal plate 1 can be used as a connection terminal to the outside; and consequently, connection to the actuator becomes easy and it becomes possible to achieve reduction in size of the device.
The first metal plate 1 is of a structure that doubles as the
connection terminal to the actuator such as a motor and the
nwnber of connection points to external devices is reduced; and
consequently, reduction in the nwnber of components, reduction
in size, reduction in manufacturing processes, and reduction
in cost can be achieved.
[00241 Incidentally, in the above embodiment, the description
has been made on the case where the power semiconductor module

100 is mounted on and pressed against the heat sink portion 10
only through the thermally conductive, electrically insulating
member; however, in order to further improve insulation
properties, anelectrically insulating member may be sandwiched between the heat sink portion 10 and the power semiconductor module 100. For example, alumite treatment and/or insulation coating may be performed on the surface of the heat sink portion 10 on which the power semiconductor module 100 is mounted, or an insulating ceramic plate and/or a polyimide sheet may be sandwiched therebetween.
In this case, insulation properties are reliably secured by
the sandwiching electrically insulating member. Therefore,
insulation properties of the heat conductive member to be sandwiched are not required, and it is possible to select a material with high thermal conductivity at the risk of the insulation properties andto configure by a material with thin film thickness of a several µm level. Further, an electrically insulating member with high thermal conductivity is applied to the sandwiching electrically insulating member; and consequently, thermal resistance between the heat sink portion 10 and the power semiconductor module 100 can be considerably reduced.
Compared to the above embodiment, the electrically insulating

member is increased in addition to the heat conductive member; however, the function of electrical insulation properties and thermal conductivity are divided; andconsequently, it becomes possible to select a wide range of member and it becomes possible to support higher heat dissipation properties and insulation properties at the same time. [0025] (Other Embodiment)
The above-described embodiments are merely exemplifications of the embodiments of the present invention, and alterations may be appropriately made or respective elements of Embodiment 1 and Embodiment 2 may be independent without departing from the scope of the present invention.
Furthermore, Embodiment 1 is the three-phase bridge inverter
circuit that uses the power MOSFET device as the semiconductor
device; however, a power semiconductor module having a
different circuit function may be permissible. For example,
a relay circuit may be permissible or a power semiconductor module that constitutes a part thereof may be permissible. [0026] Furthermore, the semiconductor device is not limited to he power MOSFET device, but a power semiconductor device such as an insulated gate bipolar transistor (IGBT) device may be permissible.
Moreover, a device to be disposed on the module is not limited

to only the semiconductor device, but a chip capacitor element and a resistance element may be simultaneously disposed and embedded in the resin package.
In addition, a wire bond may be partially adopted to the electrical connection to the semiconductor device and the metal plate.
We Claim:
1. A power semiconductor module (100) comprising:
a plurality of first metal plates (1) arranged in the same planar state;
a power semiconductor chip (3) mounted on said first metal plate; and
5 an overbridge-shaped second metal plate (2) which is composed of bridge
frame sections (2b) and leg sections (2c) configured to support the bridge frame
sections, the leg sections being for appropriately performing solder bonding
between electrodes of said power semiconductor chips and between said electrode
of said power semiconductor chip and said first metal plate,
10 a resin mold package (7) in which these members are sealed with
electrically insulating resin,
wherein the solder (8) bonding section of the leg section is formed in a
planar shape by bending process and is provided at a position lower than the
bridge frame section,
15 wherein an external end section of first metal plates forms an external
connection terminal, the external end section being drawn out from said resin mold package,
a base section on the inside of said resin mold package forming a
boundary line section with a mold of said external connection terminal is formed
20 slimmer than other sections and in a narrowed configuration (16),
the narrowed configuration section is filled with the resin, and
the base section on the inside of said resin mold package of said external

connection terminal is formed with one or more through holes (15) therein, and the through hole section is filled with the resin.
2. The power semiconductor module according to claim 1,
5 wherein said overbridge-shaped second metal plate is formed with a
protrusion (2a), which controls an amount of solder (8), on both of or on either one of a bonding surface with said electrode of said power semiconductor chip and a bonding surface with said first metal plate.
10 3. The power semiconductor module according to any one of claim 1 to
claim 2,
wherein the back surface of said first metal plate on the opposite side to
the surface on which said power semiconductor chip is mounted is exposed from
said resin mold package to form a heat dissipation surface. 15
4. The power semiconductor module according to any one of claim 1 to
claim 3,
wherein said external connection terminal doubles as a connection terminal with an actuator. 20
5. The power semiconductor module according to claim 3,
wherein a plurality of mold resin protrusions (9) are formed on the outer

surface of the resin mold package (7) excluding the exposed surface (1a) of the first metal plates and the resin protrusion being protruded from between the plurality of the first metal plates.
5 6. The power semiconductor module according to claim 5,
wherein the resin protrusions (9) are formed to secure a clearance and clearance accuracy between the power semiconductor module and an aluminum heat sink portion (10) the power semiconductor module is connectable to.
10 7. A power unit device in which a power semiconductor module as set forth
in any one of claim 1 to claim 6 is placed on a heat sink portion (10),
said power unit device comprising:
a heat conductive member which is sandwiched between said power
semiconductor module and said heat sink portion, said heat conductive member
15 being for dissipating heat from said power semiconductor module; and
a pressing mechanism (11,14,17) which presses said power semiconductor module against said heat sink portion via said heat conductive member.
8. The power unit device according to claim 7,
20 further comprising an electrically insulating member which is sandwiched
both of or either one of between said heat conductive member and said power semiconductor module and between said heat conductive member and said heat

sink portion.
9. The power unit device according to claim 7 or claim 8,
wherein said pressing mechanism has a sphere-shaped pressing section
5 (17) which presses said power semiconductor module, and
the sphere-shaped pressing section is disposed at a substantially central section of an upper portion of said power semiconductor module.
10. The power unit device according to any one of claim 7 to claim 9,
10 wherein said resin mold package is formed with a plurality of protrusions,
which secures a clearance between said power semiconductor module and said heat sink portion, on an outer surface excluding an exposed surface of said first metal plate, the plurality of protrusions being integrally formed with said resin mold package.