FORM 2
THE PATENTS ACT, 1970 (39 of 1970) & THE PATENTS RULES, 2003
COMPLETE SPECIFICATION (See section 10, rule 13) 1. Title of the invention: PROCESSING GEMSTONES

TECHNICAL FIELD
[0001] The present subject matter relates to processing of unprocessed
gemstones, and, relates to planning of a batch of unprocessed gemstones.
BACKGROUND
[0002] Gemstone found in natural states, commonly known as rough
gemstones, are unfinished or unprocessed form of gemstones. Further, finished gemstones are obtained by processing the unprocessed form of gemstones. Unprocessed gemstone may refer to rough gemstones, sem-polished gemstone or polished gemstones. Various operations, such as planning, sawing, cutting, polishing, may be performed on the unprocessed gemstones to obtain a processed gemstone. The planning operation is a process in which the unprocessed gemstone may be mapped to develop a three-dimensional model depicting deformities and cavities on gemstone’s surface. Further, the 3D geometry of the unprocessed gemstone may be determined. Based on the 3D geometry, a planned unprocessed gemstone may be obtained. Based on the planning, the unprocessed gemstone may undergo a cutting operation, in which the unprocessed gemstone may be cut based on a determined geometry. Finally, the cut gemstone may be polished to obtain the processed gemstone.
BRIEF DESCRIPTION OF DRAWINGS
[0003] The detailed description is described with reference to the
accompanying figures. In the figures, the left-most digit(s) of a reference number identifies the figure in which the reference number first appears. The same numbers are used throughout the drawings to reference like features and components.

[0004] Fig. 1 illustrates a block diagram for a gemstone cutting apparatus,
in accordance with an example implementation of the present subject matter.
[0005] Fig. 2 illustrates the perspective view of a gemstone cutting
apparatus, in accordance with an example implementation of the present subject matter.
[0006] Fig. 3 illustrates the schematic view of a camera assembly, in
accordance with an example implementation of the present subject matter.
[0007] Fig. 4a and Fig. 4b illustrates the image quality of the gemstone
setting operation, in accordance with an example implementation of the present subject matter.
[0008] Fig. 5 illustrates the operation of a gemstone cutting apparatus, in
accordance with an example implementation of the present subject matter.
DETAILED DESCRIPTION
[0009] Gemstone processing may include various operation. In an
example, the operation can be either a gemstone planning operation or a gemstone cutting operation. The gemstone planning operation is performed by a gemstone planning apparatus, and the gemstone cutting operation is performed subsequent to the planning operation by a gemstone cutting apparatus when the gemstone is, generally, moved from the gemstone planning apparatus to the gemstone cutting apparatus. As part of planning, the unprocessed gemstone is placed in the gemstone planning apparatus and a three-dimensional (3D) geometry and other cutting parameters of unprocessed gemstone is generated. The 3D geometry and other cutting parameters, in one example, can be used to identify cutting planes along which the unprocessed gemstone is to be cut to obtain the processed, cut gemstone. In one example, markings may be made on the unprocessed gemstone based on the identified

cutting planes to facilitate during the gemstone cutting operation. After the
completion of the gemstone planning operation, the gemstone is taken to the
gemstone cutting apparatus for a setting operation and cutting operation. In
addition, the 3D geometry and other cutting parameters may also be provided
by the gemstone planning apparatus to the gemstone cutting apparatus for
facilitating the cutting operation. For cutting, the unprocessed gemstone may
be placed in the gemstone cutting apparatus and the unprocessed gemstone
may be set with respect to a cutting unit. In other words, the unprocessed
gemstone may be positioned in a predetermined orientation with respect to the
cutting unit so that the cutting operation may commence. The unprocessed
gemstone may be set automatically by capturing multiple images of the
unprocessed gemstone by an image capturing device, such as a camera,
installed inside the cutting unit and applying image processing technique to
identify the orientation of the unprocessed gemstone with respect to the
marking lines on the unprocessed gemstone. Accordingly, based on the
marking lines, the unprocessed gemstone can be positioned appropriately with
respect to the cutting unit to ensure that the gemstone is cut correctly. In
addition, the cutting unit may include a cutting laser which performs the cutting
operation of the unprocessed gemstone. In an example, the cutting laser may
pass through a lens in the image capturing device. The lens may have some
limited optical properties, such as low depth of focus so that the laser passes
through the lens and may focus on the gemstone without any disturbance.
[0010] Although the unprocessed gemstone may be aligned using
conventional image capturing device, there are various limitations associated with it. For instance, multiple images captured by the image capturing device of the cutting unit may not have a requisite resolution in order to efficiently apply imaging processing technique owing to the limited optical properties, such as low depth of focus of the lens in the image capturing device. As a result of the low quality of the multiple images, the setting of the unprocessed gemstone

may not be proper. In an example, due to low depth of focus of the lens in the
image capturing device, the marking lines on the unprocessed gemstone may
not be detected properly. As a result, the marking lines on the side surfaces of
the unprocessed gemstone may get defocused. Further, to detect those lines
and obtain high quality image, the image capturing device may be moved along
a vertical axis or along Z-axis to capture the images at different positions on
the Z-axis. Thus, stack of images are generated that may help in detecting the
marking lines using image processing techniques. However, due to the above
operation the process may slow down due to the travel time taken for moving
the image capturing device in the vertical direction or along Z-axis.
[0011] One of the ways to obtain the high quality of image for the purpose
of setting the unprocessed gemstone is to adjust relative positioning between the unprocessed gemstone by moving the cutting unit with respect to the unprocessed gemstone in order to capture an image of requisite detailed. However, moving the cutting unit may disturb the calibration of the cutting unit. As a result, the cutting unit may be required to be re-calibrated after setting the unprocessed gemstone. This adds to the down time of the gemstone cutting apparatus thereby limiting throughput of the gemstone cutting apparatus. Moreover, repeated calibration may not be accurate, and the unprocessed gemstone cut by non-calibrated laser cutting unit may result in the poor quality of the cut gemstone.
[0012] Examples of gemstone cutting apparatus are described which
address the aforementioned issues related to the conventional techniques of processing gemstones. The gemstone cutting apparatus for performing material removal operation on an unprocessed gemstone, based on the present subject matter, efficiently sets the unprocessed gemstone without disturbing the calibration of the cutting unit.

[0013] In one example, the gemstone cutting apparatus may include a
platform to mount a unprocessed gemstone thereon and may include a cutting unit that may be employed to perform a cutting or material removal operation. The cutting unit may further include a cutting laser and a first image capturing device integrated with the cutting laser. The cutting laser generates a laser beam for removing material from the unprocessed gemstone. According to an aspect, the first image capturing device may facilitate in cutting the unprocessed gemstone. The first image capturing device includes a low depth of focus (DOF) focusing mechanism, such as a low DOF lens. The low DOF focusing mechanism facilitates in focusing the laser beam of the cutting laser at an appropriate location on a surface of the unprocessed gemstone. The first image capturing device is configured to provide feedback during the removal of material from the unprocessed gemstone. In addition, the gemstone cutting apparatus may include a setting unit that may include a second image capturing device having a high DOF focusing mechanism, such as a high DOF lens, which allows to capture detailed image of the unprocessed gemstone. The detailed image of the unprocessed gemstone includes identifying markings on the unprocessed gemstone. The high DOF focusing mechanism allows to capture a detailed view of the top surface of the gemstone in only one image thereby eliminating the need of capturing multiple images of the unprocessed gemstone to perform the gemstone setting operation. Further, the gemstone cutting apparatus may include a processing unit which is operably coupled to the cutting unit and the setting unit. The processing unit processes the imagecaptured by the second image capturing device so that an instantaneous or current orientation of the unprocessed gemstone may be determined. Based on the determined instantaneous orientation, the processing unit may determine adjustments to be made so as to orient the unprocessed gemstone to a predetermined orientation. In one example, the predetermined orientation is an orientation at which the material removal or cutting operation of the

unprocessed gemstone may be initiated. Further, the unprocessed gemstone may be re-oriented by imparting motion to the platform so that the unprocessed gemstone attains the predetermined orientation. According to an example, once the unprocessed gemstone is re-oriented, the unprocessed gemstone may be aligned with respect to the cutting unit and the processing unit is configured to control the the cutting laser to remove material along the identified markings on the unprocessed gemstone.
[0014] According to the present subject matter, the unprocessed
gemstone is oriented without moving the cutting unit thereby doing away a need of re-calibrating the laser cutting unit thereby reducing the downtime and increasing the throughput of the gemstone cutting apparatus. For instance, the re-orientation of the unprocessed gemstone is performed by the setting unit which is different from the use of the first image capturing device of the cutting unit. Moreover, due to high DOF of the second image capturing device, all the marking lines are focused in one go. Therefore, only single image is required to be captured and image processing is performed on that image to detect the markings and other cutting parameters accurately and identify the unprocessed gemstone easily from the database based on the marking lines information stored earlier. Hence, the tedious process of moving the image capturing device to capture multiple images and creating the stack of images is eliminated. As a result, the image processing technique is accurate and efficient. The present subject matter by incorporating two image capturing devices having different DOF further inhibits a situation where the laser cutting unit needs frequent calibration in case the laser cutting unit is provided with a image capturing device having multiple DOF. In a case where image capturing device has multiple DOF, the focus of the image capturing device will have to be changed while performing the seting operation and the cutting operation. There is a possibility that by continuously interchanging the focus of the image capturing device, an accurate DOF for performing either of setting operation or

the cutting operation may not be achieved. As a result, the focusing mechanism of the cutting unit will have to be re-calibrated frequently which adds to the down time of the gemstone cutting apparatus thereby limiting throughput of the gemstone cutting apparatus. Moreover, repeated calibration may not be accurate, and the unprocessed gemstone cut by non-calibrated laser cutting unit may result in the poor quality of the cut gemstone. Therefore, the present subject matter provides an efficient and accurate image processing technique and at the same time does not require re-calibration of the laser cutting unit.
[0015] The above aspects are further described in conjunction with the
figures, and in the associated description below. It should be noted that the description and figures merely illustrate the principles of the present subject matter. Therefore, various assemblies that encompass the principles of the present subject matter, although not explicitly described or shown herein, may be devised from the description and are included within its scope.
[0016] Fig. 1 illustrates a block diagram for a gemstone cutting apparatus
100 for cutting a unprocessed gemstone, according to an example of the present subject matter. The gemstone cutting apparatus 100 may either be a part of a gemstone planning apparatus or a separate unit. In an example, the gemstone cutting apparatus 100 includes a platform 102 for mounting the unprocessed gemstone. Generally, the unprocessed gemstone maybe mounted on a dope and the dope maybe placed on the platform 102. According to an example, the platform 102 may include an actuator 104 that may impart motion the platform 102 to move the unprocessed gemstone. The gemstone cutting apparatus 100 may include a cutting unit 108. The cutting unit 108 may further include a a cutting laser 112.and first image capturing device 110 integrated with the cutting laser 112 Furthermore, the cutting unit 108 may include a low degree of freedom (DOF) focussing mechanism, such as a low DOF lens, which is used to focus the cutting laser 112 on the unprocessed

gemstone. In one example, a reflected light from the unprocessed gemstone may pass through the low DOF focussing mechanism towards the first image capturing device 110. Accordingly, the first image capturing device 110 may capture images of the unprocessed gemstone while the unprocessed gemstone is cut in order to provide a feedback of the material removal operation to regulate the cutting of the unprocessed gemstone. Further, the gemstone cutting apparatus 100 includes a setting unit 114. In an example, the setting unit 114 may include a second image capturing device 116 which includes a high DOF focusing mechanism, such as a high DOF lens, which allows to capture detailed image of the unprocessed gemstone. The high DOF focusing mechanism of the second image capturing device allows to capture a detailed view of the top surface of the gemstone in only one image thereby eliminating the need of capturing multiple images of the unprocessed gemstone. In operation, the setting unit 114 may be used for setting the unprocessed gemstone before the cutting operation.
[0017] In one example, the gemstone cutting apparatus 100 may also
include a processing unit 106 which is responsible for controlling the actuator 104. Further, the processing unit 106 may control the operation of the gemstone cutting apparatus 100. The processing unit 106 is operably coupled to the setting unit 114 and the cutting unit 108. In one example, the processing unit 106 can be implemented as a microcontroller, a microcomputer, and/or any device that manipulates signals based on operational instructions. According to said embodiment, the processing unit 106 can include a processor and a device memory. The processor can be a single processing unit or a number of units, all of which could include multiple computing units. The processor may be implemented as one or more microprocessors, microcomputers, microcontrollers, digital signal processors, central processing units, state machines, logic circuitries, and/or any devices that manipulate signals, based on operational instructions. Among other capabilities, the processor(s) is

provided to fetch and execute computer-readable instructions stored in the device memory. The device memory may be coupled to the processor and can include any computer-readable medium known in the art including, for example, volatile memory, such as Static-Random Access Memory (SRAM) and Dynamic-Random Access Memory (DRAM), and/or non-volatile memory, such as Read Only Memory (ROM), erasable programmable ROM, flash memories, hard disks, optical disks, and magnetic tapes.
[0018] According to an aspect, the processing unit 106 may be coupled to
the actuator 104. In an example, the actuator 104 is responsible for the rotation
and movement of the platform 102. According to an aspect, the actuator 104
may also control the cutting laser 112 for the gemstone cutting operation. In an
example, the actuator 104 may control the intensity of the cutting laser 112. In
an example, as the unprocessed gemstone is placed on the platform 102, the
actuator 104 may get actuated by the processing unit 106 and rotate the
unprocessed gemstone so as to align the unprocessed gemstone with respect
to the setting unit 114, Further, once the unprocessed gemstone is positioned,
the setting unit 114 may be used to perform the gemstone setting operation.
[0019] Fig. 2 illustrates the perspective view of a gemstone cutting
apparatus 100. The gemstone cutting apparatus 100 may include a housing 200 that may house all the components of the gemstone cutting apparatus 100 described with respect to Fig 1. In one example, the housing 200 may include an access window 202, and a lid 204 covering the lid 204. The access window 202, in one example, may be used to access the platform 102 to mount and dismount the dope on the platform 102. In addition, the lid 204 may be used to cover the access window 202 while the cutting operation is being performed to prevent any intervention to the cutting operation. Further, the platform 102 may be movable with respect to a base of the housing 200 to reposition the unprocessed gemstone so that the unprocessed gemstone can be selectively aligned either with respect to the cutting unit 108 or the setting unit 114. In one

example, the housing 200 may include a lid support 206 which performs the opening and closing of the lid 204. Further, the gemstone cutting apparatus 100 may include a control panel 208. In an aspect, the control panel 208 may be in an exterior portion of the housing 200. The control panel 208 may be responsible for controlling the operation of the gemstone cutting apparatus 100. Further, the gemstone cutting apparatus 100 includes the cutting unit 108, as described in Fig.1. The cutting unit 108 includes the first image capturing device 110 and the cutting laser 112 (both shown in Fig. 1). Further, the setting unit 114 may include the second image capturing device 116 (shown in Fig.1). In an example, the cutting laser 112 may direct the laser beam to perform the material removal operation on the gemstone. In one example, direction and intensity of the laser beam can be adjusted based on the region and amount of material to be removed from the unprocessed gemstone. In one example, the processing unit 106 is configured to control the cutting laser 112. For instance, the processing unit 106 adjusts the direction and inetensity of the laser beam generated from the cutting laser 112. A manner by which the cutting unit operates is explained in subsequent embodiments.
[0020] According to an example, the gemstone cutting apparatus 100
includes the setting unit 114. In operation, the processing unit 106 may control the setting unit 114 to perform the setting operation of the unprocessed gemstone in which the unprocessed gemstone is re-oriented so that the unprocessed gemstone may attain a predetermined orientation calculated by a gemstone planning apparatus before the initiation of the cutting operation. In an example, the predetermined orientation may be in the form of 3D coordinates of the unprocessed gemstone. According to an aspect, the gemstone cutting apparatus 100 may include a support mechanism 210. In an example, the support mechanism 210 may perform the upward and downward movement of the cutting unit 108 and the setting unit 114. In another example,

the support mechanism 210 may be used to calibrate the cutting unit 108 before initiating the material removal opeartion.
[0021] Fig. 3 illustrates an arrangement 300 which includes the cutting
unit 108 and the setting unit 114 as explained in Fig. 1. In the illustrated example, the cutting unit 108 and the setting unit 114 may be positioned adjacent to each other. As mentioned before, the cutting unit 108 includes the first image capturing device 110 and the cutting laser 112. Further, the setting unit 114 may include the second image capturing device 116. In the illustrated example, the first image capturing device 110 and the second image capturing device 116 may have different optical properties. For instance, the first image capturing device 110 may include a a low DOF focussing mechanism, such as a low DOF lens. The low depth of focus helps the cutting laser 112 to accurately focus on the unprocessed gemstones thereby allowing precise material removal of the unprocessed gemstones. While the second image capturing device 116 may include a high DOF foxussing mechanism, such as a high DOF lens. The high depth of focus helps the second image capturing device 116 to capture a single image with a detailed view and perform the gemstone setting operation accurately. In an example, due to high DOF of the second image capturing device 116, all the marking lines are focused in one go. Therefore, only single image is required to be captured and image processing is performed on that image to detect the marking lines accurately and identify the unprocessed gemstone easily from the database based on the marking lines information stored earlier. Hence, the tedious process of moving the image capturing device to capture multiple images and creating the stack of images is eliminated. In another example, the cutting unit 108 may be overhead the platform 102 in an initial homing position. Thereafter, the setting unit 114 may perform the setting operation by detecting the marking lines and reorienting the gemstone.

[0022] Fig.4a and 4b illustrate the quality of images captured for gemstone
setting operation. Fig. 4a depicts the image of a unprocessed gemstone 400 during the setting operation. The image of the unprocessed gemstone 400 is captured by an image capturing device with low depth of focus. Fig. 4b depicts the image of a unprocessed gemstone 402 during the setting operation. Further, the image of the unprocessed gemstone 402 is captured by a setting device with a lens of high depth of focus. In an example, the unprocessed gemstone 402 may include reference lines 404 for the purpose of the aligning the unprocessed gemstone 402.
[0023] Fig. 5 illustrates a method 500 of the gemstone cutting operation,
in accordance with one implementation of the present subject matter. The method(s) may be described in the general context of computer executable instructions. Generally, computer executable instructions can include routines, programs, objects, components, data structures, procedures, engines, functions, etc., that perform particular functions or employ particular abstract data types. The method 500 may also be practiced in a distributed computing environment where functions are performed by remote processing devices that are linked through a communications network. In a distributed computing environment, computer executable instructions may be located in both local and remote computer storage media, including memory storage devices.
[0024] The order in which the method 500 is described is not intended to
be construed as a limitation, and any number of the described method blocks can be combined in any order or can be performed in parallel to employ the method 500, or an alternative method. Additionally, individual blocks may be deleted from the method 500 without departing from the spirit and scope of the subject matter described herein. Furthermore, the method 500 can be employed in any suitable hardware, software, firmware, or combination thereof.

The method 500 is explained with reference to the gemstone cutting apparatus 100, however, the method 500 can be employed in other systems as well.
[0025] Referring to block 502, mounting of the unprocessed gemstone is
performed. In operation of the gemstone cutting apparatus 100, the unprocessed gemstone may be mounted on the dope. Further, the dope is placed on the platform 102, and the platform 102 may be aligned with cutting unit 108. In an example, the platform 102 may be initially at the homing position which is aligned with cutting unit 108.
[0026] Referring to block 504, rotation of the platform 102 is performed. In
one example, the processing unit 106 actuates the actuator 104 so that the platform 102 may be rotated and the dope is aligned with respect the setting unit 114.
[0027] Thereafter, at block 506, the gemstone setting operation is
performed. The setting unit 114 may perform the gemstone setting operation by re-orienting the unprocessed gemstone appropriately by detecting the marking lines. The marking lines may be detected by capturing images of the unprocessed gemstone by the second image capturing device 116. In one example, the setting unit 114 may facilitate in aligning the center of the unprocessed gemstone with the point of intersection of the reference lines 404. Thereafter, the captured image is processed by image processing, and the 3D coordinates of the unprocessed gemstone are generated and compared with the 3D coordinates of a reference image received from the gemstone planning operation earlier. Thereafter, based on the comparison between the 3D coordinates of the reference image and 3D coordinates of the unprocessed gemstone, the setting unit 114 may re-orient the gemstone in a predetermined orientation.

[0028] Referring to block 508, second rotation of the platform 102 is
performed. The processing unit 106 may initiate the rotation of the platform 102 to the initial position where the platform 102 may get aligned with the cutting unit 108.
[0029] Referring to block 510, gemstone cutting operation is performed.
In an example, the processing unit 106, based on the corresponding 3D geometry and other cutting parameters of the unprocessed gemstone, may identify the coordinates of a cutting plane on the unprocessed gemstone. Accordingly, the processing unit 106 may propagate the cutting laser 112 of the cutting unit 108 by focussing the laser beam generated from then cutting laser 112 though the low DOF focussing mechanism and towards the unprocessed gemstone. Thereafter, the reflected light from the unprocessed gemstone may be captured by the first image capturing device 110. During the gemstone cutting operation, the first image capturing device 110 further provides a feedback of the gemstone cutting operation, thereby regulating the cutting of the unprocessed gemstone. In another example, the laser in the gemstone cutting operation may be controlled by the processing unit 106. The processing unit 106 may control the intensity and direction of the laser beam generated from the cutting laser 112 while performing the cutting operation on the unprocessed gemstone. After the completion of the cutting operation, the processed gemstone may be obtained.
[0030] Although examples for the gemstone cutting apparatus 100 have
been described in language specific to structural features and/or methods, it is to be understood that the appended claims are not limited to the specific features described. Rather, the specific features are disclosed as examples of the gemstone cutting apparatus 100.

I/We Claim:
1. A gemstone cutting apparatus (100) for performing material removal
operation on an unprocessed gemstone, the gemstone cutting apparatus (100) comprising;
a cutting unit (108) having:
a cutting laser (112) to generate a laser beam for removing material from the unprocessed gemstone; and
a first image capturing device (110) integrated with the cutting laser (112), the first image capturing device (110) having a low depth of focus (DOF) focussing mechanism, wherein the low DOF focussing mechanism is to focus the laser beam of the cutting laser (112) on a surface of the unprocessed gemstone, the first image capturing device (110) provides feedback during removal of the material;
a setting unit (114) including a second image capturing device (116) having a high DOF focussing mechanism, wherein the second image capturing device (116) is to identify markings on the unprocessed gemstone; and
a processing unit (106) operably coupled to the cutting unit (108) and the setting unit (114), wherein the processing unit (106) is to:
determine an instantaneous orientation of the
unprocessed gemstone based on the captured image of the unprocessed gemstone from the second image capturing device (116);

adjust the unprocessed gemstone on the cutting unit from the instantaneous orientation based on the captured image of the unprocessed gemstone from the second image capturing device (116); and
control the cutting laser (112) of the cutting unit (108) to remove material along the identified markings on the unprocessed gemstone.
2. The gemstone cutting apparatus (100) as claimed in claim 1, wherein the low DOF focussing mechanism is a low DOF lens and the high DOF focussing mechanism is a high DOF lens.
3. The gemstone cutting apparatus (100) as claimed in claim 1, wherein the markings on the unprocessed gemstone are generated based on cutting planes determined by a gemstone planning apparatus.
4. The gemstone cutting apparatus (100) as claimed in claim 3, wherein the cutting planes are based on a three-dimensional (3D) geometry of the unprocessed gemstone.
5. The gemstone cutting apparatus (100) as claimed in claim 1, wherein the processing unit (106) is configured to adjust an intensity of the laser beam generated by the cutting laser (112) according to an amount of material to be removed from the unprocessed gemstone.
6. The gemstone cutting apparatus (100) as claimed in claim 1, wherein the processing unit (106) is configured to adjust a direction of the laser beam

generated by the cutting laser (112) according to a region of the unprocessed gemstone where the material is to be removed from.
7. The gemstone cutting apparatus (100) as claimed in claim 1, comprising a platform (102) for fixedly mounting the unprocessed gemstone and an actuator (104) operably coupled to the platform (102) to impart motion to the platform (102), wherein the unprocessed gemstone is moved from the instantaneous orientation upon imparting motion to the platform (102).
8. The gemstone cutting apparatus (100) as claimed in claim 1, further comprising a supporting mechanism (210) to calibrate the cutting unit (108) before initiating the material removal operation.
9. A method for removing material from an unprocessed gemstone, the method comprising:
mounting the unprocessed gemstone on a setting unit (114);
capturing a first image of the unprocessed gemstone using a high depth of focus (DOF) focussing mechanism to identify a plurality of markings on the unprocessed gemstone;
determining an instantaneous orientation of the unprocessed gemstone based on the first image of the unprocessed gemstone;
mounting the unprocessed gemstone on a cutting unit (108) for removing the material therefrom, wherein the unprocessed gemstone is re-oriented on the cutting unit (108) from the instantaneous orientation based on the first image of the unprocessed gemstone;
removing material from the unprocessed gemstone along the plurality of markings on the unprocessed gemstone by a laser beam generated by a cutting laser (112) of the cutting unit (108) using a low DOF focussing mechanism, wherein the low DOF focussing mechanism is to:

focus the laser beam of the cutting laser (112) on a surface of the unprocessed gemstone; and
provide a feedback during removal of the material from the unprocessed gemstone;
wherein the high DOF focussing mechanism and the low DOF focussing mechanism are provided in two different image capturing devices.
10. The method as claimed in claim 9, wherein the low DOF focussing
mechanism is a low DOF lens and the high DOF focussing mechanism is a high DOF lens.