The present invention relates to the field of cards
such as microcircuit cards, and to fabricating said cards.
Microcircuit cards are used in a variety of fields,
such as banking for making debit or credit cards,
5 authenticating people in order to make identity documents,
or cellular telephony for making subscriber telephone cards
or subscriber identity module (SIM) cards.
In these fields, the thickness of cards has remained
unchanged since the invention and standardization of
10 microcircuit cards.
More particularly, in the field of telephony,
microcircuit cards or SIM cards have seen their format
become smaller as the size of terminals has become smaller.
Thus, cards initially presented a format known as IFF
15 that is substantially rectangular with dimensions of
54 millimeters (mm) x 8 5 . 6 mm with a thickness of 0 . 7 6 mm +
0.08 mrn. That format was then replaced by a smaller 2FF
format having dimensions of 15 mm x 25 mm, with the same
thickness. An even smaller 3FF format has recently been
20 created with dimensions of 12 mm x 15 mm and thickness that
is still unchanged.
A problem arises with a new 4FF format of dimensions
reduced to 8 . 8 mm x 1 2 . 3 mm, where the thickness is also
reduced and should lie in the range 0 . 6 7 rnrn
25 t 0 . 0 3 mm / -0.07 mm.
It should be observed that the overlap zone that is
common to both of these thickness ranges, namely [ 0 . 6 8 ,
0.701 presents a width of 20 micrometers m ) , which is too
small for it to be possible to envisage making a plate that
30 satisfies both formats in terms of thickness.
The usual practice is to deliver a detachable card in a
plate of IFF format and of large thickness, lying in the
range 0 . 7 6 mm rf: 0 . 0 8 mm. It is advantageous to be able to
continue using existing plates and above all the numerous
tools and fabrication means that already exist, even when
fabricating new 4FF format cards.
Furthermore, the various above-mentioned formats are
5 going to coexist, so it is appropriate to make at least one
format adapter between the new 4FF format and the older 3FF,
2FF, and IFF formats. Such an adapter presents an outer
format similar to one of the old formats. Once again, the
practice is to have one or more such adapters together with
10 a card in a single plate of IFF format. Such an adapter is
necessarily of large thickness, at least over a portion of
its surface area.
The small format card typically comprises a module
integrating a microcircuit and a contact plate. The contact
15 plate is an interface of the microcircuit, e.g. for
interfacing with a reader, which contact face is sometimes
wrongly referred to as a chip since it is the only visible
portion of the module. Regardless of whether the small
format card is used on its own, when detached from the plate
20 and in a reader using a small thickness format, or while
still secured to the plate and in a reader using a large
thickness format, the contact plate must remain flush with a
face of the card.
This means firstly that the thickness difference
25 between the large thickness and the small thickness, e.g.
provided in the form of a spotface, must necessarily be
arranged entirely against one of the faces of the plate and
that this face is necessarily the face opposite from the
face where the contact plate is flush.
Such an arrangement requires action to be taken from
one of the faces of the plate in order to make a spotface
and action can be taken from the opposite face of the plate
in order to put the module into place.
For various reasons that are described in greater
detail below, it is difficult or even impossible to act on
the face of the plate opposite from the face where the
contact plate is flush.
The problem that the present invention seeks to solve
is that of fabricating a thin plastics plate of large
thickness including a card of small format and of small
thickness that is detachable from the plate, while making
use only of action taken from a single face of the plate.
10 To do this, the invention proposes tooling for
fabricating a thin plastics plate of large format and of
large thickness including a card of small format and small
thickness that is detachable from the plate, comprising
spotfacing means suitable for making a spotface in a first
15 face of the plate, the spotface being of depth equal to the
difference between the large thickness and the small
thickness, a leveling punch suitable for performing leveling
punching step in the spotface zone in a leveling direction
facing a second face of the plate opposite from the first
20 face, through a leveling stroke equal to the depth of the
spotface, in order to bring the bottom of the spotface level
with the first face of the plate, and pre-cutting means
suitable for pre-cutting an outline of the card within the
leveled zone, in order to make the card detachable.
25 According to another characteristic, the pre-cutting
means comprise a go punch presenting a solid shape
substantially identical to the outline of the card, and
suitable for punching the plate along a go direction, a die
presenting a hollow shape substantially identical to the
30 outline of the card, and in alignment with the go punch in
order to be capable of receiving the material pushed by the
go punch, and a return punch presenting a solid shape
substantially identical to the outline of the card, in
alignment with the go punch and suitable for punching the
35 plate in a return direction opposite to the go direction.
According to another characteristic, the leveling
direction is identical to the go direction, the go punch and
the leveling punch are the same punch, and a go stroke of
the go punch is substantially equal to a return stroke of
5 the return punch plus the leveling stroke.
According to an alternative characteristic, the
leveling direction is identical to the return direction, the
return punch and the leveling punch are the same punch, and
a return stroke of the return punch is substantially equal
10 to a go stroke of the go punch plus the leveling stroke.
According to another characteristic, the return punch
includes return means that are loaded when the return punch
is subjected to thrust along the go direction, and urging
the return punch along the return direction when the thrust
15 ceases.
According to another characteristic, the return means
at rest are such that the return punch projects from the die
in the leveling direction by a height equal to the leveling
stroke.
The invention also provides a method of fabricating a
thin plastics plate of large format and of large thickness
and including a card of small format and of small thickness
that is detachable from the plate, the method comprising the
steps of: making a spotface in a first face of the plate to
25 a depth equal to the difference between the large thickness
and the small thickness, leveling punching in the spotface
zone along a leveling direction facing a second face of the
plate opposite from the first face, through a leveling
stroke equal to the depth of the spotface, in order to bring
30 the bottom of the spotface level with the first face of the
plate, and pre-cutting an outline of the card within the
leveled zone, in order to make the card detachable.
According to another characteristic, the pre-cutting
step comprises the following steps: go punching the plate by
means of a go punch presenting a solid shape substantially
identical to the outline of the card, the punching taking
place along a go direction against a die presenting a hollow
shape substantially identical to the outline of the card and
5 in alignment with the go punch, in order to receive the
material pushed by the go punch, and return punching the
plate by means of a return punch presenting a solid shape
substantially identical to the outline of the card and in
alignment with the go punch, the return punching taking
10 place along a return direction opposite to the go direction.
According to another characteristic, the leveling
direction is identical to the go direction and the go
punching step and the leveling punching step are a single
punching step with a go stroke substantially equal to a
15 return stroke of the return punching step plus the leveling
stroke.
According to an alternative other characteristic, the
leveling direction is identical to the return direction, and
the return punching step and the leveling punching step
20 comprise a single punching step through a return stroke
substantially equal to a go stroke of the go punching step
plus the leveling stroke.
According to another characteristic, the method further
comprises a second pre-cutting step of pre-cutting a second
25 outline circumscribing the leveled zone in order to form a
detachable adapter.
According to another characteristic, the second precutting
step comprises the steps of: go punching the plate
by means of a second go punch presenting a solid shape
30 substantially identical to the second outline and performed
along a second go direction against a second die presenting
a hollow shape substantially identical to the second outline
and in alignment with the second go punch in order to be
capable of receiving the material pushed by the second go
35 punch, and return punching the plate by means of a second
return punch presenting a solid shape substantially
identical to the second outline and in alignment with the
second go punch, punching taking place along a second. return
direction opposite to the second go direction.
According to another characteristic, the second go
direction is identical to the go direction.
According to another characteristic, the second go
direction is identical to the return direction,
According to another characteristic, the card is of 4FF
10 format and the adapter is of 3FF format.
The invention also provides a product obtained by such
a method and/or tooling.
Other characteristics, details, and advantages of the
invention appear more clearly from the detailed description
15 given below by way of indication with reference to the
drawings, in which:
- Figures 1 and 2 show an expected product;
Figures 3 to 5 show the principle of a method of the
invention in three steps:
Figure 3: spotfacing;
Figures 4 and 5: leveling;
Figure 6: pre-cutting;
Figures 7 and 8 show two implementations of a method
of the invention;
- Figures 9 and 10 show an embodiment of tooling of the
invention;
Figures 11 and 12 show the principle of a method of
performing pre-cutting;
Figures 1 3 to 15 show a method combining pre-cutting
and leveling; and
Figures 16 and 17 show two alternative embodiments of
a pre-cut outline.
5 Figure 1 is a face view and Figure 2 is a section view
showing an embodiment of an expected product. It is desired
to make a thin plastics plate 1, e.g. a card in accordance
with the IS0 7816 standard. This plate 1 is of large
format, e.g. the ID-1 format of that standard. It presents
10 considerable thickness 6, e.g. lying in the range
680 micrometers (pm) to 840 pm in accordance with that
standard. The plate 1 includes a card 2 of small format,
e.g. of 4FF format according to that standard, and of small
thickness 5, e.g. lying in the range 600 pm to 700 pm,
15 according to that standard.
It may be observed that the above example is
significant in that the overlap between the range of large
thickness 6 and the range of small thickness 5, extending
from 680 pm to 700 pm and presenting a thickness of 20 pm is
20 too narrow to enable the plate/card to be fabricated with a
single thickness common to the plate 1 and the card 2.
The card 2 is secured to the plate 1 and, where
appropriate, it may be used in this way, e.g. in a reader
corresponding to the large format. The card 2 may also be
detached from the plate 1. For this purpose, the outline 10
of the card 2 is weakened by a pre-cutting operation. Such
weakening enables the cutting out of the outline 10 to be
finished off, typically manually, in order to detach the
card 2 from the plate 1. The card 2 can thus be used on its
own, e.g. in a reader corresponding to the small format.
Since the thickness cannot be the same for the plate 1
and for the card 2, it is appropriate to reduce the
thickness of the plate 1, at least in the zone where the
card 2 is defined. For this purpose, one solution consists
in making a spotface 8.
In certain applications, the card 2 is a microcircuit
card. Such a card 2 comprises a module integrating a
5 microcircuit and a contact plate 14. The contact plate 14
is an interface of the microcircuit, e.g. with a reader, and
is sometimes wrongly referred to as a "chip", since it is
the only visible portion of the module. Regardless of
whether the card 2 is used on its own, after being detached
10 from the plate 1 in a reader for a format of small
thickness, or whether it remains secured to the plate 1 in a
reader for a format of large thickness, the contact plate 14
must be flush with one of the faces of the card 2,
This means that the difference in thickness 7 between
15 the large thickness 6 and the small thickness 5 must
necessarily be located entirely beside one of the faces 3
and 4 of the plate 1. As shown in Figures 1 and 2, in the
embodiment where the thickness difference 7 is obtained by a
spotface 8 of depth equal to this thickness difference 7,
20 said spotface 8 needs to be made in one face 4 of the plate
1, the bottom face in Figure 2. This also means that the
face 4 is necessarily the face 4 opposite from the face 3
where the contact plate 14 is flush, i.e. the top face in
Figure 2.
25 Such an arrangement makes it necessary to act from a
face 4 of the plate 1 in order to make a spotface 8 and to
act from the opposite face 3 in order to put the module and
the contact plate 14 into place.
Unfortunately, it would appear to be difficult if not
30 impossible to act on the face 4 of the plate 1 opposite from
the face 3 where the contact plate 14 is flush.
It so happens that all machines for fabricating
plates/cards are designed to work on one face only. Thus,
the module is put into place from the first face 3. The
second face 4, opposite from the first face 3, serves as a
reference and a bearing point. The plate/card is pressed
via the second face 4 against the workplate of the machine.
That is why it is preferable to have a surface that is plane
5 and smooth, in order to avoid any risk of catching during
transfer operations.
In Figure 1, it can be seen that for a 4FF format, as
shown for the outline 10 of the card 2, the residual surface
area of the card 2 that does not include the contact plate
10 14 is very small, corresponding to 17% of the surface area
of the card 2. Thus, any marking or inscription, such as an
identity number or a logo of the manufacturer cannot be
placed on the first face 3 of the card 2. Consequently, the
second face 4 of the card is dedicated to such marking. The
15 marking is preferably made at the same time as the plate 1
is made. It is not possible to make the spotface by
machining if such a spotface is made in the second face 4
since that would destroy the marking.
It is thus appropriate to propose some other technique
20 of obtaining the product shown in Figures 1 and 2 without
performing an operation on the second face 4 opposite from
the first face 3, and in particular without an operation of
machining said second face 4.
This technique, as proposed in the present
25 specification, is shown in Figures 3 to 6. The method of
the invention comprises three main steps, sequenced as shown
in Figure 7.
In a first step 31, shown in Figure 3, a spotface 8 is
made in the first face 3 of the plate 1. This spotface 8
30 may be made by spotfacing means 21. This may involve
machining, e.g. by means of a milling cutter.
Alternatively, it is also possible to make the spotface 8 by
stamping/punching the plate 1 with a punch 21 that is
complementary to the spotface 8. Alternatively, it is also
35 possible to make the spotface 8 by molding the plate 1,
using a mold having a shape that is complementary to the
spotface 8.
Under all circumstances, the spotface 8 is such that it
presents a depth 7 equal to the difference between the large
5 thickness 6 of the plate 1 and the small thickness 5 desired
for the card 2.
With a microcircuit card, the module is arranged in the
first face 3 where the spotface 8 is made. The module is
placed in the spotface 8 in such a manner that its contact
10 plate 14 is flush with the bottom 9 of the spotface 8.
Advantageously, the spotface 8 may be made by machining
associated jointly with machining a housing for receiving
the module.
In this context, at least two embodiments may be
15 considered. Either the module is put into place in the
spotface 8 during or after making said spotface 8. Or else
the module is put into place after the leveling step that is
described below.
In a second step 32, shown in Figures 4 and 5, a
20 leveling operation 32 is then performed, with Figure 4
showing the state before the leveling operation and Figure 5
showing the state after. This leveling 32 seeks to move the
material of the plate 1 in register with the spotface 8 in a
leveling direction Dn facing the second face 4 of the plate
25 1, in other words the leveling direction D, goes from the
second face 4 towards the first face 3 of the plate 1. This
movement of material is such that the bottom 9 of the
spotface 8 comes up to the level of the first face 3.
By way of example, this may be done with a leveling
30 punch 22 that performs a leveling punching step 32 in
register with the zone including the spotface 8, or spotface
zone. In this example, the leveling punching step 22
punches the second face 4 and pushes it back towards the
first face 3 through a leveling stroke en equal to the depth
7 of the spotface 8. Thus, after the leveling step 32, the
surface of the bottom 9 of the spotface 8 coincides with or
is flush with the first face 3. The result of the leveling
step 32 is shown in Figure 5.
In a third step 33, producing a result as shown in
Figure 6, the plate 1 is then subjected to pre-cutting 33 in
the previously leveled zone. This pre-cutting 33 may be
performed using pre-cutter means and the pre-cut forms an
outline 10 for the card 2 that is inscribed in the leveled
-0 zone. This pre-cutting step 33 shapes the card 2 and makes
it detachable from the plate 1.
The pre-cutting step 33 is described above as being
subsequent to the leveling step 32. Alternatively, the precutting
step 33 may be performed prior to the leveling step
15 32, or even, as explained in greater detail below, together
therewith.
It should be understood from the above description that
the outline 10 of the card 2 lies in the leveled zone, and
that the leveled zone itself lies in the spotface zone,
Several techniques are possible for pre-cutting the
outline 10 of the card 2 in the plate 1.
An advantageous technique, constituting the subject
matter of a parallel patent application in the name of the
Applicant, is a technique making use of tooling 20 shown in
25 Figures 9 and 10 and a method involving two punching steps,
a go step 34 and a return step 35 based on principles shown
in Figures 11 and 12.
Said tooling 20 is described below with reference to
Figure 9 which shows an embodiment in face view, together
30 with Figure 10 which shows a view in section on B-B.
The tooling 20 comprises a substantially horizontal
workplate suitable for receiving the plate 1 and having a
die 26 cut out therein.
The tooling 20 has a go punch 24. As can be seen in
Figure 10, this go punch 24 presents a solid shape 29 that
is substantially identical to the shape of the pre-cut that
is to be made, and thus substantially identical to the
5 outline 10 of the card 2. The outline 10 is shown in dotted
lines since it does not exist in the plate 1 before the precutting
step 33,
The go punch 24 is suitable for punching the plate 1 in
a go direction D,, e.g. a vertically downward direction in
this example, as shown in the figure. The go punching step
34 thus presses the plate 1 against the die 26 that presents
a recess of shape 29 that is substantially identical to the
shape of the go punch 24 and thus substantially to the
outline 10 of the card 2. The die 26 is in alignment with
the go punch 24 along the punching axis 28 and is thus
suitable for receiving the material 13 that is pushed by the
go punch 24 during the go punching step 34.
The tooling 20 also has a return punch 25 presenting a
solid shape 29 substantially identical to the outline 10 of
20 the card 2. The return punch 25 is in alignment with the go
punch 24 on the punching axis 28. The return punch 25 is
suitable for punching the plate 1 in a return direction D,,
opposite to the go direction D,. Thus, if the go punch 24
punches the plate 1 on its first face 3, then the return
25 punch 25 punches the plate 1 on its second face 4 that is
opposite the first face 3.
With reference to Figures 11 and 12, there follows a
description of how this tooling 20 is used for making a precut
along the outline 10 of the card 2.
After the plate 1 has been put into place in the
tooling 20, the go punching step 34 is performed by moving
the go punch 24 along the go direction D,. This produces the
result shown in Figure 11, where the plate 1 has been
punched via its face 3 against which the go punch 24 comes
35 into contact. As a result, the go punch 24 pushes the
material 13 so that it penetrates into the die 26. The go
punching step 34 is performed with a go stroke e,.
In a second step, the return punching step 35 is
performed by moving the return punch 35 along the return
5 direction D, opposite to the go direction D,. This produces
the result shown in Figure 12, where the plate 1 is punched
via the other face 4, opposite from the first face 3 and
engaging the return punch 25. As a result, the return punch
25 pushes back the material 13 that was previously pushed
10 into the die 26 so as to replace it substantially in the
thickness 6 of the plate 1. The return punching step 35 is
performed with a return stroke e,.
The go punching step 34 and the return punching step 35
in succession put the material substantially back into
15 place. Nevertheless, these steps have created notches 17 in
the faces 3 and 4 of the plate 1 that are of depth
substantially equal to the go stroke e, and to the return
stroke e,, respectively. The go and return punches 24 and
25, and also the die 26 are advantageously of a shape 29
20 identical to the shape desired for the outline 10 of the
card 2, these notches 17 being arranged along said outline
10. These notches constitute weakening that thus provides
pre-cutting of the card 2 along the profile 10.
It may be observed that the respective go and return
25 strokes e, and e, are of similar orders of magnitude.
Nevertheless, it is acceptable for them to be different
without going against the principle of weakening by forming
notches 17.
Thus, according to an advantageous characteristic of
30 the invention, the leveling step 32 may advantageously be
combined with the pre-cutting step 33 by performing the
leveling punching step 32, either during the go punching
step 34, or else during the return punching step 35. The
sequencing of the method 30 as modified in this way is shown
35 in Figure 8. The pre-cutting step 33 comprises a go
punching step 34 and a return punching step 35. One or the
other of these two punching steps 34 and 35 also performs
the leveling step 32.
Thus, in a first implementation, the leveling step 32
5 is performed during the go punching step 34 of the precutting
step 33. In this implementation, the leveling
direction Dn is identical to the go direction D,. The go
punch 24 and the leveling punch 22 constitute a single
punch, performing a go punching step 34 that is also the
10 leveling punching step 32. In this implementation, not
shown in the figures, the go punching step 34 is performed
from the face 4 that is opposite from the spotface 8, In
this implementation, the go stroke e, of the go/leveling
punch 24/22 is substantially equal to a return stroke e, of
15 the return punch 25 plus the leveling stroke en. Since the
leveling stroke en is equal to the difference 7 between the
large thickness 6 and the small thickness 5, the go punching
step 34 of the pre-cutting step 33 is "extended". Thus,
after the return punching step, the bottom 9 of the spotface
20 8 is leveled with the first face 3.
In an alternative, second implementation, the leveling
32 is performed during the return punching step 35 of the
pre-cutting step 33. In this implementation, the leveling
direction Dn is identical to the return direction Dr. The
25 return punch 25 and the leveling punch 22 constitute a
single punch, performing a return punching step 35 that
coincides with the leveling punching step 32. In this
implementation, as shown in Figures 13 to 15, the return
punching step 35 is performed from the face 4 that is
30 opposite from the spotface 8. In this implementation, the
return stroke er of the return and leveling punch 25 and 22
is substantially equal to a go stroke e, of the go punch 24
plus the leveling stroke en. Since the leveling stroke en is
equal to the difference 7 between the large thickness 6 and
35 the small thickness 5, the return punching step 35 of the
pre-cutting step 33 is "extended" in order to level the
bottom 9 of the spotface 8 with the first face 3.
The two implementations differ in the orientation of
the plate 1 relative to the punches 24 and 25. The common
5 principle consists in taking advantage of the two punching
steps in opposite directions, the go step and the return
step, in order to "extend" that one of the two punching
steps, either the go step or the return step, that acts in
the opposite direction to the spotface 8 in order to perform
10 the leveling punching step 32.
As shown in Figures 13 to 15, the complete method in
the second implementation where leveling 32 is performed
during the return punching step 35 is as follows.
The method begins in Figure 13. The plate 1 has been
15 put into place in the tooling 20. The first step 31
consists in making the spotface 8 using spotfacing means 21,
such as a milling cutter. Said spotface 8 is such that its
depth 7 is equal to the difference between the large
thickness 6 of the plate 1 and the small thickness 5 desired
20 for the card 2,
Thereafter, the go punching step 34 is performed, as
shown in Figure 14. The go punch 24 is moved along the go
direction D, and punches the plate 1 via its first face 3
against the die 26 arranged facing and against the opposite
face 4 of the plate 1. This moves the material of the plate
1 and a fraction 13 thereof is pushed into the die 26. The
go punching step 34 is performed with a go stroke e, that is
measured relative to the bottom 9 of the spotface 8.
Thereafter, the return punching step 35 is performed,
30 as shown in Figure 15. The return punch 25 is moved along
the return direction D, and punches the plate 1 via its
second face 4. This substantially replaces the material of
the plate 1 in the thickness 6 of the plate 1. The two
punching steps, the go step 34 and then the return step 35,
also make it possible in passing to provide the weakening
along the outline 10, thereby pre-cutting the card 2. The
return punching step 35 is made to a return stroke era The
return punching step 35 is advantageously used
5 simultaneously to perform the leveling step 32. For this
purpose, the return stroke er is taken to be equal, in
absolute value, to the go stroke e, plus the leveling stroke
en needed for placing the bottom 9 of the spotface 8 in the
plane of the first face 3.
In an advantageous embodiment of the tooling 20, as
shown in Figures 9, and 11 to 15, the return punch 25
includes return means 27. The return means 27 are arranged
so as to be loaded when the return punch 25 is subjected to
thrust in the go direction D,, and to return the return punch
15 25 along the return direction D, when go thrust ceases,
Thus, as shown in Figures 11 or 14, during the go punching
step 34, the go punch 24 moves the pushed material 13 into
the die 26. Said pushed material 13 then exerts thrust on
the return punch 25 along the go direction D,. Under the
20 effect of this thrust, the return punch 25 is moved against
the return means 27, thereby loading them. When the thrust
is interrupted, e.g. when the go punch 24 is withdrawn, the
return means 27 are released and urge the return punch 25
along the return direction Dr. This urging serves to perform
25 the return punching step 35. Thus, and advantageously, only
the go punch 24 needs to be actively controlled. The return
punch 25 reacts to the go punching step 34, while the return
punching step 35 together with the simultaneous leveling
punching step 32, takes place passively, in response to the
30 go punching step 34. This is advantageous since no
operation is actively performed from the second face 4 of
the plate 1.
In the configuration shown, which corresponds to the
second implementation, and as described above, the return
35 punching step 35 also performs the leveling punching step
32. As a result, the return stroke e, is greater than the go
stroke e,. As a result the go stroke e, on its own is not
sufficient to load the return means 37 in order to produce
the return stroke e, equal to the go stroke e, plus the
leveling stroke en.
In order to remedy this problem, and according to an
advantageous characteristic, the return means 27 are
prestressed. For this purpose, the return means 27 at rest
are such that the return punch 25 projects beyond the die 26
and thus beyond the plane on which the card 1 is laid, the
10 punch projecting along the leveling direction Dn by a height
that is equal to the leveling stroke en.
The initial configuration of the return punch 25 is
thus identical to that at the end of the method, as shown in
Figure 15. The return punch 25, pressed against the return
15 means 27 at rest, projects in the leveling direction D,,
which in this example coincides with the return direction D,,
by a height equal to the leveling stroke en, or indeed equal
to the difference 7 between the large thickness 6 and the
small thickness 5. As a result, when putting a plate 1 into
20 position on the worktable, and then performing the go
punching step 34, the return punch 25 and the return means
27 are initially loaded to a depth equal to the height by
which the return punch 25 projects, and equal to the
leveling stroke en, when the plate 1 comes into contact with
25 the worktable. Thereafter, when the go punch 24 actually
punches into the material of the plate 1, said material
moves down through the go stroke e, and entrains the return
punch 25 and the return means 27 therewith through the same
depth. In total, the return punch 25 and the return means
30 2'7 are loaded by a movement equal to the leveling stroke en
plus the go stroke e,. The release of the return means 27
then allows the return punch. 25 to perform the return
punching step 35 through the return stroke e,, which is equal
to the sum of the leveling stroke en plus the go stroke e,.
Other pre-cutting techniques are also possible. Two of
them are shown with reference to Figure 16, which shows a
plate 1 in face view, and with reference to Figure 17, which
shows the same plate 1 in section view. The plate 1 of
5 large thickness 6 includes a format adapter 15 arranged
around a card 2 of small format and of small thickness 5.
The adapter 15 is detachable from the plate 1 by means
of pre-cutting performed using a first technique. In that
technique, the pre-cutting is performed by cutting the
10 outline of the adapter 15 by using slots 18, These slots 18
cut through the entire thickness of the plate 1 but cut
through the profile over only a fraction of its length. The
adapter 15 can be detached from the plate 1 by breaking the
bridges that remain between the slots 18.
15 The card 2 is detachable from the adapter 15 by means
of pre-cutting performed using a second technique. In this
technique, the pre-cutting is performed by cutting the
outline 10 of the card 2 by means of a notch 17 starting
from one of the faces or by means of two facing notches 17,
20 each starting from a respective one of the faces of the
plate 1. These notches 17 cut through the plate 1 over a
fraction only of its thickness, Advantageously, they may
cut into the profile 10 along its entire length. The card 2
may be detached from the adapter 15 by breaking the
25 residual, non-notched thickness in register with the
notch (es) 17.
In the invention, these two pre-cutting techniques may
be applied in alternation or together, in order to perform
the pre-cutting step 33 of a method having a spotfacing step
30 31 and a leveling step 32.
In an implementation, the method may also include an
additional step involving second pre-cutting to make a
second precut along a second outline. This second outline
is advantageously made in the large thickness and thus
35 circumscribes the leveled zone. By way of example, this
makes it possible to form an adapter that is detachable. A
small format card 2 is thus present in the plate 1, which
also includes an adapter to a larger format. Breaking the
outline 10 serves to release the card 2 which can then be
5 used on its own. Breaking the second outline serves to
release the adapter and thus enables the card 2 to be used
with a larger format corresponding to the second outline.
The second outline may be precut using any pre-cutter
means.
10 In such an embodiment having multiple nested outlines,
the order in which these outlines are made is advantageously
from the center outwards, starting with the smallest and
going towards the largest,
In a preferred implementation, the second outline is
15 precut by using the same method as for the step of precutting
the outline 10.
Thus, the second pre-cutting step may be performed by
the following sequence of steps. A first step involves go
punching the plate using a second go punch having a solid
20 shape that is substantially identical to the second outline
and acting in a second go direction against a die presenting
a hollow shape substantially identical to the second outline
and in alignment with the second go punch so as to be able
to receive the material pushed by the second go punch.
25 Thereafter, a second step is performed of return punching
the plate by means of a second return punch presenting a
solid shape substantially identical to that of the second
outline in alignment with the second go punch on a second
return direction that is opposite to the second go
30 direction, In the present situation, there is no longer any
difference of thickness and the spotfacing and leveling
steps do not need to be performed. Thus, the go stroke of
the second go punching step is substantially equal to the
return stroke of the second return punching step.
It is possible to perform the go and return second
punching steps in the same directions as the go and return
first punching steps 34 and 35. This is advantageous in
that there is no need to turn over the tooling or the card 1
5 between the punching step for making the outline 10 and the
second punching step for making the second outline. Under
such circumstances, the second go direction is identical to
the go direction D,, and the second return direction is
identical to the return direction D,,
Alternatively, it is possible to alternate. Under such
circumstances, the second go direction is identical to the
return direction D, and the second return direction is
identical to the go direction D,.
The method as described above enables two nested
15 outlines to be obtained, the first outline 10 defining a
card 2 of small format and small thickness, and the second
outline defining an adapter of larger format and of larger
thickness, at least at its periphery.
A particularly advantageous application is an
20 embodiment in which the card 2 is of 4FF format and presents
a small thickness corresponding to that format, and where
the adapter is of 3FF format and presents a large thickness
over at least a portion of its surface area and at very
least at its periphery.
It is also possible to nest other outlines that are
larger still around the second outline, It is thus possible
to make an all-in-one unit comprising a 4FF format card of
small thickness, surrounded by a 3FF adapter, in turn
surrounded by a 2FF adapter, all of which are arranged in a
30 plate of IFF format.

CLAIMS
1. Tooling (20) for fabricating a thin plastics plate (1) of
large format and of large thickness (6) including a card
(2) of small format and small thickness (5) that is
5 detachable from the plate (I), the tooling being
characterized in that it comprises:
spotfacing means (21) suitable for making (31) a
spotface (8) in a first face (3) of the plate (I), the
spotface (8) being of depth (7) equal to the difference
between the large thickness (6) and the small thickness
(5) ;
a leveling punch (22) suitable for performing
(32) leveling punching in the spotface zone in a leveling
direction (D,) facing a second face (4) of the plate (1)
opposite from the first face (3), through a leveling
stroke (en) equal to the depth (7) of the spotface (8),
in order to bring the bottom (9) of the spotface (8)
level with. the first face (3) of the plate (1); and
pre-cutting means suitable for pre-cutting an
outline (10) of the card (2) within the leveled zone, in
order to make the card (2) detachable.
2. Tooling (20) according to claim 1, wherein the pre-cutting
means comprise:
a go punch (24) presenting a solid shape (29)
substantially identical to the outline (10) of the card
(2), and suitable for punching the plate (1) along a go
direction (D,) ;
a die (26) presenting a hollow shape (29)
substantially identical to the outline (10) of the card
(2), and in alignment with the go punch (24) in order to
be capable of receiving the material (13) pushed by the
go punch (24); and
a return punch (25) presenting a solid shape
(29) substantially identical to the outline (10) of the
card (2), in alignment with the go punch (24) and
suitable for punching the plate (1) in a return direction
(D,) opposite to the go direction (D,) +
3. Tooling (20) according to claim 2, wherein the leveling
direction (D,) is identical to the go direction (Da)
5 wherein the go punch (24) and the leveling punch (22) are
the same punch, and wherein a go stroke (e,) of the go
punch (24) is substantially equal to a return stroke (e,)
of the return punch (25) plus the leveling stroke (e,) .
4. Tooling (20) according to claim 2, wherein the leveling
10 direction (D,) is identical to the return direction (D,)
wherein the return punch (25) and the leveling punch (22)
are the same punch, and wherein a return stroke (e,) of
the return punch (25) is substantially equal to a go
stroke (e,) of the go punch (24) plus the leveling stroke
15 (en)
5. Tooling (20) according to any one of claims 1 to 4,
wherein the return punch (25) includes return means (27)
that are loaded when the return punch (25) is subjected to
thrust along the go direction (D) , and urging the return
20 punch (25) along the return direction (D,) when the thrust
ceases.
6. Tooling (20) according to claim 5, wherein the return
means (27) at rest are such that the return punch (25)
projects from the die (26) in the leveling direction (D,)
25 by a height equal to the leveling stroke (en)*
7. A method (30) of fabricating a thin plastics plate (1) of
large format and of large thickness (6) and including a
card (2) of small format and of small thickness (5) that
is detachable from the plate (I), the method being
30 characterized in that it comprises the following steps:
making (31) a spotface (8) in a first face (3)
of the plate (1) to a depth (7) equal to the difference
between the large thickness (6) and the small thickness
(5) ;
leveling punching (32) in the spotface zone
along a leveling direction (D,) facing a second face (4)
of the plate (1) opposite from the first face (3),
through a leveling stroke (en) equal to the depth (7) of
the spotface (8), in order to bring the bottom (9) of the
spotface (4) level with the first face (3) of the plate
(1); and
pre-cutting (33) an outline (10) of the card (2)
within the leveled zone, in order to make the card (2)
detachable.
8. A method according to claim 7, wherein the pre-cutting
step (33) comprises the following steps:
go punching (34) the plate (1) by means of a go
punch (24) presenting a solid shape (29) substantially
15 identical to the outline (10) of the card (2), the
punching taking place along a go direction (D,) against a
die (26) presenting a hollow shape (29) substantially
identical to the outline (10) of the card (2) and in
alignment with the go punch (24), in order to receive the
20 material (13) pushed by the go punch (24); and
return punching (35) the plate (1) by means of a
return punch (25) presenting a solid shape (29)
substantially identical to the outline (10) of the card
(2) and in alignment with the go punch (24), the return
25 punching taking place along a return direction (D,)
opposite to the go direction (D,).
9. A method according to claim 8, wherein the leveling
direction (D,) is identical to the go direction (D,) and
wherein the go punching step (34) and the leveling
30 punching step (32) are a single punching step with a go
stroke (e,) substantially equal to a return stroke (e,) of
the return punching step (35) plus the leveling stroke
(en) -
10. A method according to claim 8, wherein the leveling
direction (D,) is identical to the return direction (Dr)
and wherein the return punching step (35) and the
leveling punching step (32) comprise a single punching
step through a return stroke (e,) substantially equal to
a go stroke (e,) of the go punching step (34) plus the
leveling stroke (en) .
11. A method according to any one of claims 7 to 10, further
comprising:
a second pre-cutting step of pre-cutting a
second outline circumscribing the leveled zone in order
to form a detachable adapter.
12. A method according to claim 11, wherein the second precutting
step comprises the following steps:
15 go punching the plate (1) by means of a second
go punch presenting a solid shape substantially identical
to the second outline and performed along a second go
direction against a second die presenting a hollow shape
substantially identical to the second outline and in
alignment with the second go punch in order to be capable
of receiving the material pushed by the second go punch;
and
- return punching the plate (1) by means of a
second return punch presenting a solid shape
substantially identical to the second outline and in
alignment with the second go punch, punching taking place
along a second return direction opposite to the second go
direction.
13. A method according to claim 12, wherein the second go
30 direction is identical to the go direction (D,).
14. A method according to claim 12, wherein the second go
direction is identical to the return direction (D,).
15, A method according to any one of claims 11 to 14, wherein
the card (2) is of 4FF format and wherein the adapter is
of 3FF format.
16. A product obtained by the method and/or tooling according
5 to any preceding claim.