WE CLAIM;
1. A system for quality monitoring and analysing the parameters of a tool or die or mould,
comprises:
a. one or more wireless compute nodes (1) attached with said tool or die or mould
wherein said wireless compute node (1) comprises,
i. one or more movement sensors (7) to detect movement of said tool or die
or mould; ii. a BLE controller (6) to provide wireless communication; iii. a switch to turn ON and/or OFF said wireless compute nodes (1); iv. a microprocessor (8) integrated with digital storage to store the quality
parameters of said tool or die or mould; and v. a battery (9) to operate the wireless compute nodes (1).
b. a display device with an application to display the information of key performance
indicators of said tool or die or mould; and
c. a cloud application (5) to store said quality parameters for analysis.
2. The system as claimed in claim 1, wherein said wireless compute node (1) is a battery operated.
3. The system as claimed in claim 1, wherein said wireless compute nodes (1) operates in Bluetooth or Radio Frequency (RF) communication.
4. The system as claimed in claim 1, wherein said display device is a smartphone or handheld device.
5. The system as claimed in claim 1 or 4, wherein said display device provides visualization information on quality of said tool or die or mould.
6. A method for quality monitoring and analysing the parameters of a tool or die or mould comprising the steps of:

a. placing wireless compute nodes (1) on said tool or die or mould;
b. detecting the movement of said tool or die or mould using movement sensor (7);
c. allowing user to enter the quality parameters on a smartphone application (3);
d. validating said quality parameters using said smartphone application (3) to
transfer said parameters to wireless compute node (1);
e. storing said quality parameters in said wireless compute nodes (1);
f visualizing said quality parameters through said display device; and
g. storing said quality parameters in cloud application (5) for further analysis.
7. The method as claimed in claim 6, wherein said transferred parameters is received by microprocessor (8) for analysing and storing said quality parameters.
8. The method as claimed in claim 6, further comprising collecting historical information of said tool or die or mould by said smartphone application (3) to provide key performance indicators and other analytical information.
9. The method as claimed in claim 8, wherein said key performance indicators are Mean Time To Repair (MTTR), Mean Time Between Failure (MTBF) and Defective Parts Per Million (DPPM).