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"Receiver For Recovering And Retiming Electromagnetically Coupled Data"

Abstract: In one embodiment, the present invention includes a system having an electromagnetic coupler probe to electromagnetically sample signals from a device under test or a link under test and a receiver, e.g., configured as an integrated circuit that is to receive the sampled electromagnetic signals from the probe and output digital signals corresponding thereto. Other embodiments are described and claimed.

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Notices, Deadlines & Correspondence

Patent Information

Application #
Filing Date
02 August 2010
Publication Number
05/2012
Publication Type
INA
Invention Field
PHYSICS
Status
Email
sna@sna-ip.com
Parent Application
Patent Number
Legal Status
Grant Date
2018-01-25
Renewal Date

Applicants

INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, MS: RNB-4-150, SANTA CLARA, CA 95052, UNITED STATES AMERICA

Inventors

1. BECKER, MATTHEW
53 MYRICK LANE, HARVARD, MASSACHUSETTS 01451, UNITED STATES AMERICA
2. YANG, ZIBING
8 VILLAGE BROOK LANE, NATICK, MASSACHUSETTS 01760, UNITED STATES OF AMERICA
3. ZHANG, QIANG
3 BROOKSIDE LANE, NORTHBOROUGH, MASSACHUSETTS 01532, UNITED STATES AMERICA
4. HNICK, TODD
51 CLAREMONT AVE, ARLINGTON, MASSACHUSETTS 02476, UNITED STATES AMERICA
5. TATE, LARRY
15 GREENWOOD ROAD, HOPKINTON, MASSACHUSETTS 17480, UNITED STATES OF AMERICA

Specification

RECEIVER FOR RECOVERING AND RETTMTNG ELECTROMAGNETTCALLY COUPLED DATA Background For modern computer systems including semiconductor devices and buses, validation systems/tools incorporating logic/traffic trace probes are used to debug and validate new systems and boards for shipment, and also to quickly diagnose field return issues that may be design or process related or both in order to avoid costly product recalls. To support the bandwidth of ever-faster semiconductor devices such as microprocessors and so forth, the data rates on the buses that connect such devices to memory, graphics and peripherals must constantly scale to higher rates. Interactions between such devices are observed for purposes of logic validation, in order to debug the devices and ship product. Probing of various data buses such as input/output (I/O) buses has been done using various direct-attached methodologies. Example methodologies include resistive-based probe technology connected to a logic analyzer. However, as bus speeds scale to higher data rates, such probing may cause signal integrity issues for a link under test (LUT). Brief Description of the Drawings FIG. 1 is a block diagram of a data receiver electromagnetically coupled to a LUT according to an example embodiment of the present invention. FIG. 2 is block diagram of a receiver according to another example embodiment of the present invention. FIG. 3 is a flow diagram of training operations in accordance with one embodiment of the present invention. FIG. 4 is a block diagram of a system according to an example embodiment of the present invention. FIG. 5 is a block diagram of a system to be tested in accordance with an embodiment of the present invention. Detailed Description In order to mitigate signal integrity issues when probing a device under test (DUT) and a link under test (LUT), probe technology based on an electromagnetic (EM) coupler attached to a LUT may be used. The EM couplers sample the LUT signals using "controlled" crosstalk while causing only minimal disturbance to the LUT. In turn, a receiver system, which may be a separate integrated circuit (IC) or other dedicated semiconductor device, is used to recover, enhance, and convert the sampled signals to digital form for transmission from the receiver system. More specifically, embodiments of the present invention may provide a receiver for a direct-attached EM coupler probe (or coupler). An EM coupler probe (such as a direct-attached EM coupler probe) samples a LUT using back crosstalk coupled from signals on the LUT. The sampled signals are used to recover the digital signals that are present on the LUT. This is accomplished using an electronics receiver component (hereafter also called a receiver). The coupler probe outputs a derivative-like of the LUT signal. The LUT output signal is then recovered by integrating the signal first. An integration function is an inverse of a derivative function, so a baseband signal gets restored albeit in a scaled form. Embodiments of the present invention may provide probing for signaling validation or logical debug using an analyzing device coupled to the receiver. FIG. 1 is a block diagram of an electromagnetic receiver coupled to a LUT according to an example embodiment of the present invention. Other embodiments and configurations may also be used. The embodiment shown in FIG. 1 may relate to direct current (DC) balanced or non-DC balanced data transmitted on a LUT. As one example, DC balanced data may include a clock signal encoded into the data signals. FIG. 1 shows a transmitting device 50 and a receiving device 60 connected by a LUT 70. The terminology LUT refers to at least one signal connection between the transmitting device 50 and the receiving device 60. The transmitting device 50 and the receiving device 60 may be different ICs or other semiconductor components connected by a bus, an interconnect, signal lines, printed circuit board (pcb) traces, flex cables, micro-coax, and/or other electrical connection means. The transmitting device 50 may include processing circuitry or other such circuitry to generate data to be transmitted on the LUT 70 to the receiving device 60. The data may be differential DC encoded data. The transmitting device 50 may be provided on one chip and the receiving device 60 may be provided on another chip such that at least the LUT 70 is connected between the two chips to enable the data to be transmitted between the two chips. The data may be transmitted and/or validated during a validation process of a product (that includes at least one of the two chips), during a debugging of a product (that includes at least one of the two chips) and/or during actual use of the product (that includes at least one of the two chips). The EM receiver 100 shown in FIG. 1 may include an EM coupler probe 110 coupled to the LUT 70 and a receiver 120 connected to the EM coupler probe 110. Receiver 120 may be connected to EM coupler probe 110 using micro-coax, printed circuit board (pcb) traces, flex cables, and/or other electrical connection means. The EM coupler probe 110 may provide sampled electromagnetic signals. As one example, the EM coupler probe 110 may include two parallel signal traces provided for each differential pair of traces of the LUT 70. The EM coupler probe 110 may be coupled to the LUT 70, such as directly coupled. Additionally, the EM coupler probe 110 may be alternating current (AC) coupled to the LUT 70 by having both inductive and capacitive coupling. As one example, the coupler probe strength, a measure of the coupled signal to the LUT signal, may be set between approximately 0.l

Documents

Application Documents

# Name Date
1 5517-DELNP-2010-FORM-27 [28-09-2024(online)].pdf 2024-09-28
1 5517-delnp-2010-Form-3-(02-02-2011).pdf 2011-02-02
2 5517-delnp-2010-Correspondence-others-(02-02-2011).pdf 2011-02-02
2 5517-DELNP-2010-RELEVANT DOCUMENTS [15-09-2023(online)].pdf 2023-09-15
3 5517-DELNP-2010-RELEVANT DOCUMENTS [24-09-2022(online)].pdf 2022-09-24
3 5517-delnp-2010-Assignment-(02-02-2011).pdf 2011-02-02
4 5517-DELNP-2010-RELEVANT DOCUMENTS [25-09-2021(online)].pdf 2021-09-25
4 5517-DELNP-2010-Correspondence-Others-(07-02-2011).pdf 2011-02-07
5 5517-DELNP-2010-RELEVANT DOCUMENTS [30-03-2020(online)].pdf 2020-03-30
5 5517-DELNP-2010-Assignment-(07-02-2011).pdf 2011-02-07
6 abstract.jpg 2011-08-21
6 5517-DELNP-2010-IntimationOfGrant25-01-2018.pdf 2018-01-25
7 5517-DELNP-2010-PatentCertificate25-01-2018.pdf 2018-01-25
7 5517-delnp-2010-form-5.pdf 2011-08-21
8 5517-delnp-2010-form-3.pdf 2011-08-21
8 5517-DELNP-2010-Correspondence-260917.pdf 2017-10-03
9 5517-delnp-2010-form-2.pdf 2011-08-21
9 5517-DELNP-2010-Power of Attorney-260917.pdf 2017-10-03
10 5517-DELNP-2010-ABSTRACT [28-09-2017(online)].pdf 2017-09-28
10 5517-delnp-2010-form-1.pdf 2011-08-21
11 5517-DELNP-2010-CLAIMS [28-09-2017(online)].pdf 2017-09-28
11 5517-delnp-2010-drawings.pdf 2011-08-21
12 5517-DELNP-2010-COMPLETE SPECIFICATION [28-09-2017(online)].pdf 2017-09-28
12 5517-delnp-2010-description (complete).pdf 2011-08-21
13 5517-DELNP-2010-CORRESPONDENCE [28-09-2017(online)].pdf 2017-09-28
13 5517-delnp-2010-correspondence-others.pdf 2011-08-21
14 5517-delnp-2010-claims.pdf 2011-08-21
14 5517-DELNP-2010-DRAWING [28-09-2017(online)].pdf 2017-09-28
15 5517-delnp-2010-abstract.pdf 2011-08-21
15 5517-DELNP-2010-FER_SER_REPLY [28-09-2017(online)].pdf 2017-09-28
16 5517-delnp-2010-Form-18-(28-12-2011).pdf 2011-12-28
16 5517-DELNP-2010-Information under section 8(2) (MANDATORY) [28-09-2017(online)].pdf 2017-09-28
17 5517-DELNP-2010-OTHERS [28-09-2017(online)].pdf 2017-09-28
17 5517-delnp-2010-Correspondence-Others-(28-12-2011).pdf 2011-12-28
18 5517-DELNP-2010-FER.pdf 2017-03-30
18 5517-DELNP-2010-Response to office action (Mandatory) [28-09-2017(online)].pdf 2017-09-28
19 5517-DELNP-2010-FORM 3 [27-09-2017(online)].pdf 2017-09-27
19 Form 3 [04-05-2017(online)].pdf 2017-05-04
20 5517-DELNP-2010-FORM-26 [22-09-2017(online)].pdf 2017-09-22
20 5517-DELNP-2010-PETITION UNDER RULE 137 [27-09-2017(online)].pdf 2017-09-27
21 5517-DELNP-2010-RELEVANT DOCUMENTS [27-09-2017(online)].pdf 2017-09-27
22 5517-DELNP-2010-FORM-26 [22-09-2017(online)].pdf 2017-09-22
22 5517-DELNP-2010-PETITION UNDER RULE 137 [27-09-2017(online)].pdf 2017-09-27
23 5517-DELNP-2010-FORM 3 [27-09-2017(online)].pdf 2017-09-27
23 Form 3 [04-05-2017(online)].pdf 2017-05-04
24 5517-DELNP-2010-Response to office action (Mandatory) [28-09-2017(online)].pdf 2017-09-28
24 5517-DELNP-2010-FER.pdf 2017-03-30
25 5517-DELNP-2010-OTHERS [28-09-2017(online)].pdf 2017-09-28
25 5517-delnp-2010-Correspondence-Others-(28-12-2011).pdf 2011-12-28
26 5517-delnp-2010-Form-18-(28-12-2011).pdf 2011-12-28
26 5517-DELNP-2010-Information under section 8(2) (MANDATORY) [28-09-2017(online)].pdf 2017-09-28
27 5517-delnp-2010-abstract.pdf 2011-08-21
27 5517-DELNP-2010-FER_SER_REPLY [28-09-2017(online)].pdf 2017-09-28
28 5517-delnp-2010-claims.pdf 2011-08-21
28 5517-DELNP-2010-DRAWING [28-09-2017(online)].pdf 2017-09-28
29 5517-DELNP-2010-CORRESPONDENCE [28-09-2017(online)].pdf 2017-09-28
29 5517-delnp-2010-correspondence-others.pdf 2011-08-21
30 5517-DELNP-2010-COMPLETE SPECIFICATION [28-09-2017(online)].pdf 2017-09-28
30 5517-delnp-2010-description (complete).pdf 2011-08-21
31 5517-DELNP-2010-CLAIMS [28-09-2017(online)].pdf 2017-09-28
31 5517-delnp-2010-drawings.pdf 2011-08-21
32 5517-DELNP-2010-ABSTRACT [28-09-2017(online)].pdf 2017-09-28
32 5517-delnp-2010-form-1.pdf 2011-08-21
33 5517-delnp-2010-form-2.pdf 2011-08-21
33 5517-DELNP-2010-Power of Attorney-260917.pdf 2017-10-03
34 5517-DELNP-2010-Correspondence-260917.pdf 2017-10-03
34 5517-delnp-2010-form-3.pdf 2011-08-21
35 5517-delnp-2010-form-5.pdf 2011-08-21
35 5517-DELNP-2010-PatentCertificate25-01-2018.pdf 2018-01-25
36 abstract.jpg 2011-08-21
36 5517-DELNP-2010-IntimationOfGrant25-01-2018.pdf 2018-01-25
37 5517-DELNP-2010-RELEVANT DOCUMENTS [30-03-2020(online)].pdf 2020-03-30
37 5517-DELNP-2010-Assignment-(07-02-2011).pdf 2011-02-07
38 5517-DELNP-2010-RELEVANT DOCUMENTS [25-09-2021(online)].pdf 2021-09-25
38 5517-DELNP-2010-Correspondence-Others-(07-02-2011).pdf 2011-02-07
39 5517-DELNP-2010-RELEVANT DOCUMENTS [24-09-2022(online)].pdf 2022-09-24
39 5517-delnp-2010-Assignment-(02-02-2011).pdf 2011-02-02
40 5517-DELNP-2010-RELEVANT DOCUMENTS [15-09-2023(online)].pdf 2023-09-15
40 5517-delnp-2010-Correspondence-others-(02-02-2011).pdf 2011-02-02
41 5517-delnp-2010-Form-3-(02-02-2011).pdf 2011-02-02
41 5517-DELNP-2010-FORM-27 [28-09-2024(online)].pdf 2024-09-28

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