Abstract: ABSTRACT SEAL FOR THERMAL INTERFACE MATERIAL OF POWER ELECTRONICS MODULES A heat exchanger assembly includes a heat exchanger and a power electronics 5 module mounted to the heat exchanger. The power electronics module is thermally coupled to the heat exchanger at a heat sink interface. A thermal interface material is arranged between the heat sink interface and a surface of the heat exchanger and a gasket arranged between the heat sink interface and the surface of the heat exchanger.
Description:As attached , Claims:As attached
| # | Name | Date |
|---|---|---|
| 1 | 202214059727-US 63270888-DASCODE-5722 [19-10-2022].pdf | 2022-10-19 |
| 2 | 202214059727-STATEMENT OF UNDERTAKING (FORM 3) [19-10-2022(online)].pdf | 2022-10-19 |
| 3 | 202214059727-REQUEST FOR EXAMINATION (FORM-18) [19-10-2022(online)].pdf | 2022-10-19 |
| 4 | 202214059727-POWER OF AUTHORITY [19-10-2022(online)].pdf | 2022-10-19 |
| 5 | 202214059727-FORM 18 [19-10-2022(online)].pdf | 2022-10-19 |
| 6 | 202214059727-FORM 1 [19-10-2022(online)].pdf | 2022-10-19 |
| 7 | 202214059727-DRAWINGS [19-10-2022(online)].pdf | 2022-10-19 |
| 8 | 202214059727-DECLARATION OF INVENTORSHIP (FORM 5) [19-10-2022(online)].pdf | 2022-10-19 |
| 9 | 202214059727-COMPLETE SPECIFICATION [19-10-2022(online)].pdf | 2022-10-19 |
| 10 | 202214059727-Proof of Right [20-10-2022(online)].pdf | 2022-10-20 |
| 11 | 202214059727-Correspondence-Letter [20-10-2022(online)].pdf | 2022-10-20 |
| 12 | 202214059727-FORM-26 [04-11-2022(online)].pdf | 2022-11-04 |
| 13 | 202214059727-Others-181122.pdf | 2022-12-07 |
| 14 | 202214059727-GPA-181122.pdf | 2022-12-07 |
| 15 | 202214059727-Correspondence-181122.pdf | 2022-12-07 |
| 16 | 202214059727-Correspondence-181122-1.pdf | 2022-12-07 |
| 17 | 202214059727-FORM 3 [23-03-2023(online)].pdf | 2023-03-23 |