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"Semiconductor Chip Used For Evaluation, Evaluation System, And Repairing Method Thereof"

Abstract: A technique for evaluating a semiconductor chip is provided. The semiconductor chip is mounted on a mount substrate, the semi-conductor chip laminating on one surface of a silicone substrate, at least any of a metal wiring film 101 serving as a resistance temperature detector made up of multiple regions and a metal wiring film 102 serving as a heater made up of one or more regions, and an electrode 103 for connecting the metal wiring film 101 and the metal wiring film 102 with the mount substrate. Then, the metal wiring film 101 is electrically connected with an ammeter and a voltmeter, and the metal wiring film 102 is electrically connected with a power source, thereby providing an evaluation system which is capable of evaluating temperature measurement, heating, and temperature profile in each of the regions on the semiconductor chip.

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Notices, Deadlines & Correspondence

Patent Information

Application #
Filing Date
25 February 2011
Publication Number
36/2016
Publication Type
INA
Invention Field
NO SUBJECT
Status
Email
Parent Application

Applicants

HITACHI CHEMICAL CO., LTD.
1-1, NISHISHINJUKU 2-CHOME, SHINJUKU-KU, TOKYO 163-0449 JAPAN

Inventors

1. HASEBE TAKEHIKO
C/O HITACHI, LTD., INTELLECTUAL PROPERTY GROUP, 6-1, MARUNOUCHI 1-CHO,E CHIYODA-KU, TOKYO 100-8220 JAPAN
2. KATO MASAKO
C/O HITACHI, LTD., INTELLECTUAL PROPERTY GROUP, 6-1, MARUNOUCHI 1-CHO ME, CHIYODA-KU, TOKYO 100-8220 JAPAN
3. YAMAGUCHI YOSHIHIDE
C/O HITACHI, LTD., INTELLECTUAL PROPERTY GROUP, 6-1, MARUNOUCHI 1-CHO ME, CHIYODA-KU, TOKYO 100-8220 JAPAN
4. NISHIKI MASASHI
C/O HITACHI, LTD., INTELLECTUAL PROPERTY GROUP, 6-1, MARUNOUCHI 1-CHO ME, CHIYODA-KU, TOKYO 100-8220 JAPAN
5. MATSUSHIMA NAOKI
C/O HITACHI, LTD., INTELLECTUAL PROPERTY GROUP, 6-1, MARUNOUCHI 1-CHO ME, CHIYODA-KU, TOKYO 100-8220 JAPAN
6. INADA TEIICHI
C/O HITACHI CHEMICAL CO., LTD., 48, WADAI TSUKUBA-SHI, IBARAKI 300-4247 JAPAN.
7. YAMAMOTO REI
C/O HITACHI CHEMICAL CO., LTD., 48, WADAI TSUKUBA-SHI, IBARAKI 300-4247 JAPAN.
8. TEMMEI HIROYUKI
C/O HITACHI, LTD., INTELLECTUAL PROPERTY GROUP, 6-1, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO 100-8220 JAPAN
9. IKEDA UKYO
C/O HITACHI, LTD., INTELLECTUAL PROPERTY GROUP, 6-1, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO 100-8220 JAPAN

Specification

Documents

Application Documents

# Name Date
1 526-DEL-2011-AbandonedLetter.pdf 2018-02-01
1 526-DEL-2011-Form-3-(29-04-2011).pdf 2011-04-29
2 526-DEL-2011-Correspondence Others-(29-04-2011).pdf 2011-04-29
2 526-DEL-2011-FER.pdf 2017-07-24
3 526-del-2011-Form-3-(04-08-2011).pdf 2011-08-04
3 526-del-2011-Abstract.pdf 2011-10-03
4 526-del-2011-Correspondence-Others-(04-08-2011).pdf 2011-08-04
4 526-del-2011-Claims.pdf 2011-10-03
5 526-del-2011-GPA.pdf 2011-10-03
5 526-del-2011-Correspondence-others.pdf 2011-10-03
6 526-del-2011-Form-5.pdf 2011-10-03
6 526-del-2011-Description (Complete).pdf 2011-10-03
7 526-del-2011-Form-3.pdf 2011-10-03
7 526-del-2011-Drawings.pdf 2011-10-03
8 526-del-2011-Form-1.pdf 2011-10-03
8 526-del-2011-Form-2.pdf 2011-10-03
9 526-del-2011-Form-18.pdf 2011-10-03
10 526-del-2011-Form-2.pdf 2011-10-03
10 526-del-2011-Form-1.pdf 2011-10-03
11 526-del-2011-Form-3.pdf 2011-10-03
11 526-del-2011-Drawings.pdf 2011-10-03
12 526-del-2011-Form-5.pdf 2011-10-03
12 526-del-2011-Description (Complete).pdf 2011-10-03
13 526-del-2011-GPA.pdf 2011-10-03
13 526-del-2011-Correspondence-others.pdf 2011-10-03
14 526-del-2011-Correspondence-Others-(04-08-2011).pdf 2011-08-04
14 526-del-2011-Claims.pdf 2011-10-03
15 526-del-2011-Form-3-(04-08-2011).pdf 2011-08-04
15 526-del-2011-Abstract.pdf 2011-10-03
16 526-DEL-2011-FER.pdf 2017-07-24
16 526-DEL-2011-Correspondence Others-(29-04-2011).pdf 2011-04-29
17 526-DEL-2011-Form-3-(29-04-2011).pdf 2011-04-29
17 526-DEL-2011-AbandonedLetter.pdf 2018-02-01

Search Strategy

1 0526del2011_16-06-2017.pdf