< Back
Sign In to Follow Application
View All Documents & Correspondence
Login

Semiconductor Device, Semiconductor Device Manufacturing Method And Cover Frame

Abstract: A semiconductor device includes: a substrate; a semiconductor chip that is fixed to a first surface of the substrate; a chip covering lid body that is provided on the first surface of the substrate so as to cover the semiconductor chip and that forms a hollow first space portion that surrounds the semiconductor chip, and in which there is provided a substantially cylindrical aperture portion that extends to the outer side of the first space portion and has an aperture end at a distal end thereof and that is connected to the first space portion; and a first resin mold portion that forms the first space portion via the chip covering lid body and covers the substrate such that the aperture end is exposed, and that fixes the substrate integrally with the chip covering lid body.

Get Free WhatsApp Updates!
Notices, Deadlines & Correspondence

Patent Information

Application #
Filing Date
14 September 2007
Publication Number
13/2008
Publication Type
INA
Invention Field
ELECTRICAL
Status
Email
Parent Application

Applicants

YAMAHA CORPORATION
10-1, NAKAZAWA-CHO, NAKA-KU, HAMAMATSU-SHI SHIZUOKA

Inventors

1. SAITOH HIROSHI
C/O YAMAHA CORPORATION, 10-1, NAKAZAWA-CHO, NAKA-KU,, HAMAMATSU-SHI, SHIZUOKA 430-8650
2. SUZUKI TOSHIHISA
C/O YAMAHA CORPORATION, 10-1, NAKAZAWA-CHO, NAKA-KU,, HAMAMATSU-SHI, SHIZUOKA 430-8650
3. OMURA MASAYOSHI
C/O YAMAHA CORPORATION, 10-1, NAKAZAWA-CHO, NAKA-KU,, HAMAMATSU-SHI, SHIZUOKA 430-8650

Specification

A semiconductor device includes: a substrate; a semiconductor chip that is fixed
to a first surface of the substrate; a chip covering lid body that is provided on the first
surface of the substrate so as to cover the semiconductor chip and that forms a hollow
first space portion that surrounds the semiconductor chip, and in which there is provided
a substantially cylindrical aperture portion that extends to the outer side of the first space
portion and has an aperture end at a distal end thereof and that is connected to the first
space portion; and a first resin mold portion that forms the first space portion via the chip
covering lid body and covers the substrate such that the aperture end is exposed, and that
fixes the substrate integrally with the chip covering lid body.

Documents

Application Documents

# Name Date
1 3463-KOLNP-2007 ABADONED LETTER.pdf 2017-06-22
1 3463-KOLNP-2007-(14-09-2007)-CORRESPONDENCE 1.1.pdf 2007-09-14
2 3463-KOLNP-2007 FIRST EXAMINATION REPORT.pdf 2017-06-22
2 3463-KOLNP-2007-(22-01-2008)-FORM 18.pdf 2008-01-22
3 abstract-03463-kolnp-2007.jpg 2011-10-07
3 3463-KOLNP-2007 FORM 18.pdf 2017-06-22
4 3463-KOLNP-2007_EXAMREPORT.pdf 2016-06-30
4 3463-KOLNP-2007-PA.pdf 2011-10-07
5 3463-KOLNP-2007-FORM 3-1.1.pdf 2011-10-07
5 3463-KOLNP-2007-(14-06-2016)-ABANDONED LETTER.pdf 2016-06-14
6 3463-KOLNP-2007-CORRESPONDENCE-1.2.pdf 2011-10-07
6 3463-KOLNP-2007-(25-10-2012)-CORRESPONDENCE.pdf 2012-10-25
7 3463-KOLNP-2007-CORRESPONDENCE-1.1.pdf 2011-10-07
7 3463-KOLNP-2007-(03-08-2012)-CORRESPONDENCE.pdf 2012-08-03
8 3463-KOLNP-2007-ASSIGNMENT.pdf 2011-10-07
8 3463-KOLNP-2007-(26-07-2012)-CORRESPONDENCE 1.pdf 2012-07-26
9 03463-kolnp-2007-pct priority document notification.pdf 2011-10-07
9 3463-KOLNP-2007-(26-07-2012)-EXAMINATION REPORT REPLY RECIEVED.pdf 2012-07-26
10 03463-kolnp-2007-international search report.pdf 2011-10-07
10 3463-KOLNP-2007_1-(26-07-2012)-CORRESPONDENCE.pdf 2012-07-26
11 03463-kolnp-2007-international publication.pdf 2011-10-07
11 3463-KOLNP-2007_1-(26-07-2012)-ENGLISH TRANSLATION.pdf 2012-07-26
12 03463-kolnp-2007-form 5.pdf 2011-10-07
12 3463-KOLNP-2007-(17-07-2012)-FIRST EXAMINATION REPORT.pdf 2012-07-17
13 03463-kolnp-2007-abstract.pdf 2011-10-07
13 03463-kolnp-2007-form 3.pdf 2011-10-07
14 03463-kolnp-2007-claims.pdf 2011-10-07
14 03463-kolnp-2007-form 1.pdf 2011-10-07
15 03463-kolnp-2007-correspondence others.pdf 2011-10-07
15 03463-kolnp-2007-drawings.pdf 2011-10-07
16 03463-kolnp-2007-description complete.pdf 2011-10-07
17 03463-kolnp-2007-drawings.pdf 2011-10-07
17 03463-kolnp-2007-correspondence others.pdf 2011-10-07
18 03463-kolnp-2007-form 1.pdf 2011-10-07
18 03463-kolnp-2007-claims.pdf 2011-10-07
19 03463-kolnp-2007-abstract.pdf 2011-10-07
19 03463-kolnp-2007-form 3.pdf 2011-10-07
20 03463-kolnp-2007-form 5.pdf 2011-10-07
20 3463-KOLNP-2007-(17-07-2012)-FIRST EXAMINATION REPORT.pdf 2012-07-17
21 03463-kolnp-2007-international publication.pdf 2011-10-07
21 3463-KOLNP-2007_1-(26-07-2012)-ENGLISH TRANSLATION.pdf 2012-07-26
22 03463-kolnp-2007-international search report.pdf 2011-10-07
22 3463-KOLNP-2007_1-(26-07-2012)-CORRESPONDENCE.pdf 2012-07-26
23 03463-kolnp-2007-pct priority document notification.pdf 2011-10-07
23 3463-KOLNP-2007-(26-07-2012)-EXAMINATION REPORT REPLY RECIEVED.pdf 2012-07-26
24 3463-KOLNP-2007-ASSIGNMENT.pdf 2011-10-07
24 3463-KOLNP-2007-(26-07-2012)-CORRESPONDENCE 1.pdf 2012-07-26
25 3463-KOLNP-2007-CORRESPONDENCE-1.1.pdf 2011-10-07
25 3463-KOLNP-2007-(03-08-2012)-CORRESPONDENCE.pdf 2012-08-03
26 3463-KOLNP-2007-CORRESPONDENCE-1.2.pdf 2011-10-07
26 3463-KOLNP-2007-(25-10-2012)-CORRESPONDENCE.pdf 2012-10-25
27 3463-KOLNP-2007-FORM 3-1.1.pdf 2011-10-07
27 3463-KOLNP-2007-(14-06-2016)-ABANDONED LETTER.pdf 2016-06-14
28 3463-KOLNP-2007_EXAMREPORT.pdf 2016-06-30
28 3463-KOLNP-2007-PA.pdf 2011-10-07
29 abstract-03463-kolnp-2007.jpg 2011-10-07
29 3463-KOLNP-2007 FORM 18.pdf 2017-06-22
30 3463-KOLNP-2007-(22-01-2008)-FORM 18.pdf 2008-01-22
30 3463-KOLNP-2007 FIRST EXAMINATION REPORT.pdf 2017-06-22
31 3463-KOLNP-2007 ABADONED LETTER.pdf 2017-06-22
31 3463-KOLNP-2007-(14-09-2007)-CORRESPONDENCE 1.1.pdf 2007-09-14