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"Semiconductor Device With Cleaved Surface"
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"Semiconductor Device With Cleaved Surface"
Sony Corporation.
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"Semiconductor Device With Cleaved Surface"
Abstract: NA
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Patent Information
Application #
Filing Date
23 December 1996
Publication Number
36/2016
Publication Type
INA
Invention Field
ELECTRICAL
Status
Withdrawn
Email
Parent Application
Applicants
Country: Japan
SONY CORPORATION.
7-35, KITASHINAGAWA 6-CHOME, SHINAGAWA-KU, TOKYO, JAPAN
Inventors
Country: Japan
1. ETSUO MORITA
C/O SONY CORPORATION, 7-35, KITASHINAGAWA 6-CHOME, SHINAGAWA-KU, TOKYO, JAPAN
Country: Japan
2. HIROJI KAWAI
C/O SONY CORPORATION, 7-35, KITASHINAGAWA 6-CHOME, SHINAGAWA-KU, TOKYO, JAPAN
Specification
NA
Documents
Application Documents
#
Name
Date
1
2913-del-1996.pdf
2011-08-21