Title of Inventior~
SENSOR DEVICE, DISPLAY UNIT, AND INPUT UNIT
Tecltrrical Field
[OOOI] The technology relates to a sensor device, and to a display nnit and an input
unit each provided with the sensor device.
Bacltgronnd Art
[0002] In recent years, many bendable picture devices and supple and flexible devices
such as a flexible display and an electronic paper have been developed. Associated
therewith, for example, structures, substrates, and adhesives suitable for the flexible
devices have been newly developed (for example, see PTLI).
Citation list
Patent Literature
[0003] PTL 1: Japanese Unexatnined Patent Application Publication No.
2012-243935
Summary of Inventiort
[0004] However, a thin substrate is used for the flexible device, this rnay frequently
cause deflection of the substrate itself. When deflection occurs on the substrate, the
deflection may adversely affect other fin~ctionsin side the flexible device. In particulal;
when a sensor layer detecting contact to the substrate is provided, stress caused by the
deflectiot~o f the substrate is applied to the sensor layer, which may disadvantageously
result in deterioration of sensor characteristics.
[0005] It is therefore desirable to provide a sensor device that makes it possible to
supptess deterioration in sensor characteristics caused by deflection of a substrate, and a
[0006] A sensor device according to an embodiment of the teclmology includes: a
sensor layer provided at a position facing a surface, of a substrate having an operation
surface, opposite to the operation surface, and configured to detect a contacted position
or a pressed position on the operation surface; and a gap layer located in a gap behveen
the substrate and the sensor layer. The gap layer includes a bonding region bonding
the substrate to the sensor layet; and a relaxation region relaxing stress applied from the
substrate to the sensor layer.
[0007] In the sensor device according to the embodiment of the technology, the
bonding region bonding the substrate to the sensor layer and the relaxation region
relaxing stress applied from the substrate to the sensor layer are provided behveen the
substrate and the sensor device. Therefore, the stress applied from the substrate is
relaxed by the relaxation region.
[0008] A display unit according to an embodiment of the technology is provided with
a display panel including a display surface, and a sensor device provided on side of the
display panel opposite to the display surface. The sensor device includes: a sensor
layer provided at a position apart fro~na nd facing the display panel, and configured to
detect a contacted position or a pressed position on the display surface; and a gap layer
located in a gap behveen the display panel and the sensor layer. The gap layer
includes a bonding region bonding the display panel to the sensor layer, and a relaxation
region relaxing stress applied frotom the display panel to the sensor layer.
[0009] In the display unit according to the embodiment of the technology, the bonding
region bonding the display panel to the sensor layer and the relaxation region relaxing
stress applied from the display panel to the sensor layer ate provided behveen a back
surface of the display panel and the sensor layer. Therefore, the stress applied from
the display panel is relaxed by the relaxation region.
[0010] An input unit according to an embodiment of the disclosure is provided with a
substrate including an operation surface, and a sensor device provided on side of the
substrate opposite to the operation surface. The sensor device includes: a sensor layer
provided at a position apart fio111 and facing the substrate, and configured to detect a
contacted position or a pressed position on the operation surface; and a gap layer located
in a gap between the substrate and the sensor layer. The gap layer includes a bonding
region bondiug the substrate to the sensor layer, and a relaxation region relaxing stress
applied from the substrate to the sensor layer.
1001 I] hi the input unit according to the embodiment of the technology, the bonding
region bonding the substrate to the sensor layer and the relaxation region relaxing stress
applied from the substrate to the sensor layer are provided between a back surface of the
substrate and the sensor layer. Therefore, the stress applied from the substrate to the
sensor layer is relaxed by the relaxation region.
[0012] According to the sensor device, the display unit, and the input unit of the
respective enibodiments of the technology, stress applied from the substrate or the
display panel to the sensor layer is relaxed by the relaxation region. This makes it
possible to suppress deterioration in sensor characteristics caused by deflectio~io f the
substrate or the display panel. Note that effects achieved by the technology are not
limited to those described here. Effects achieved by the techtiology may be one or
more of effects described in the specification.
Brief Descriptiou of Drawings
[0013] [FIG. 11 FIG. 1 is a diagram illustrating an example of a sectional structure
of a display unit according to a first embodiment of the technology.
[FIG. 21 FIG. 2 is a diagram illustrating an example of a perspective configuration of
a display panel and a sensor device of FIG. 1.
[FIG. 31 FIG. 3 is a diagram illustrating an example of a planar configuration of a gap
layer of FIG. 2.
[FIG. 41 FIG. 4 is a diagram illustrating an example of the plane configuration of the
gap layer of FIG. 2.
[FIG. 51 FIG. 5 is a diagratn illustrating a state where curvature occurs at an end of the
display panel of FIG. I .
[FIG. 61 FIG. 6 is a diagram illust~ating a modification of the perspective
configuratiotl of the display panel and the sensor device of FIG. 1.
[FIG. 71 FIG. 7 is a diagram illustrating an example of a planar configuration of a gap
layer of FIG. 6.
[FIG. 81 FIG. 8 is a diagram illustrating an example of the planar configuration of the
gap layer of FIG. 6.
[FIG. 91 FIG. 9 is a diagram illustrating a state where curvature occu~sa t a center part
of the display panel of FIG. 1.
[FIG. 101 FIG. 10 is a diagran~ illustrating a modification of the planar configuration
of the gap layer of FIG. 3.
[FIG. 111 FIG. 11 is a diagram illustrating a modification of the planar configuration
of the gap layer of FIG. 4.
[FIG. 121 FIG. 12 is a diagratn illustrating a state where curvature occurs at an end of
the display panel of FIG. 1 in a display unit provided with the gap layer of FIG. 10 or
FIG. 11.
[FIG. 131 FIG. 13 is a diagram illust~atinga modification of the planar configuration
of the gap layer of FIG. 7.
[FIG. 141 FIG. 14 is a diagram illustrating a modification of the planar configuration
of the gap layer of FIG. 8.
[FIG. 151 FIG. 15 is a diagram illustlating a state where curvature occurs at a central
part of the display panel of FIG. 1 in a display unit provided with the gap layer of FIG.
13 or FIG. 14.
[FIG. 161 FIG. 16 is a diagram illustrating a state where curvature occurs at an end of
the display panel of FIG. 1 in a display unit provided with a modification of the gap
[FIG. 171 FIG. 17 is a diagram illustrating a state where ccurvature occurs at a central
part of the display panel of FIG. 1 in a display unit provided with a nlodificatiou of the
gap layer of FIG. 13 or FIG. 14.
[FIG. 181 FIG. 18 is a diagram illustrating-a state where curvature occurs at an end of
the display panel of FIG. 1 in a display unit provided with a ~nodification of the gap
layer of FIG. 16.
[FIG. 191 FIG. 19 is a diagram illustrating a state where curvature occurs at a central
part of the display pallel of FIG. 1 in a display unit provided with a ~nodification of the
gap layer of FIG. 17.
[FIG. 201 FIG. 20 is a diagram illustrating a state where curvature occurs at an end of
the display panel of FIG. 1 in a display unit provided with a modification of the gap
layer of FIG. 5.
[FIG. 211 FIG. 21 is a diagram illustrating a state where curvature occurs at a central
part of the display panel of'F1G:"l'in'~display unit provided with a ~nodification of the
gap layer of FIG. 9.
[FIG. 221 FIG. 22 is a diagram illustratiug a state where curvature occurs at an end of
the display panel of FIG. 1 in a display unit provided with a modification of the gap
layer of FIG. 20.
[FIG. 231 FIG. 23 is a diagram illustrating a state where curvature occurs at a central
part of the display panel of FIG. 1 in a display unit provided wit11 a ~nodification of the
gap layer ofFIG. 21.
[FIG. 24A] FIG. 24A is a diagram illustrating a ~nodificationo f a planar layout of an
adhesive part and a bondiug layer in a bonding region.
[FIG. 24B] FIG. 24B is a diagram illustrating a modification of the planar layout of
the adhesive part and the bonding layer in the bonding region.
[FIG. 24C] FIG. 24C is a diagram illustrating a modification of the planar layout of
the adhesive part and the bonding layer in the bonding region.
[FIG. 25A] FIG. 25A is a diagram illustrating a modification of a planar layoot of an
adhesive part, a bonding layer, and a non-adhesive layer in a relaxation region.
[FIG. 25Bl FIG. 25B is a diagram illustrating a modification of the planar layout of
the adhesive part, the bonding layer, and the non-adhesive layer in the relaxation region.
[FIG. 25Cl FIG. 25C is a diagram illustrating a modification of the planar layout of
the adhesive part, the bonding layer, and the non-adhesive layer in the relaxation region.
[FIG. 261 FIG. 26 is a diagram illustrating an exa~npleo f a sectional structure of an
input unit according to a second embodiment of the technology.
[FIG. 271 FIG. 27 is a diagram illustrating a modification of the sectional stracture of
the display unit of FIG. 1.
[FIG. 281 FIG. 28 is a diagram illustrating a modification of the sectional structure of
the input unit of FIG. 26.
[FIG. 291 FIG. 29 is a diagram illustrating an example of a sectional structure of a
sensor device of any ofFlG.'l;FlG:'26, FIG. 27, and FIG. 28 together with an example
of an internal configuration of a driver.
[FIG. 301 FIG. 30 is a diagram illustrating an example of an action of the sensor
device of FIG. 29.
[FIG. 311 FIG. 31 is a diagram illustrating an example of the action of the sensor
device of FIG. 29.
Description of Embodiments
[0014] Some embodiments of the technology are described in detail below with
reference to drawings. Note that description is given in the following order.
1. First Etnbodiment (display onit)
An example in which a gap layer is provided between a sensor layer and a
display panel
An example in which a relaxation region is provided at an edge of the gap layer
An example in which a sheet adhesive layer or a sheet bonding
6
provided at a center part of the gap layer
2. Modifications
An example in which the relaxation region is provided at a center part of the
gap layer
An example in which a dot-like, lattice-like, or stripe-like adhesive part or
bonding part is provided
An example in which a non-adhesive part or a non-adhesive layer is provided
in the relaxation region
3. Second Etnboditnent (input unit)
An example in which a substrate is provided in place of the display panel in the
display unit of the above-described embodiment
4. Modification Cotnmon to Embodin~ents
An example in which the gap layer is also provided between the sensor layer
and a housing , .
5. Specific Examples of Sensor Layer
[0015] i l . First Embodiment>
[Configuration]
FIG. 1 illustrates an example of a sectional structure of a display unit I
according to a first embodiment of the technology. The display itnit 1 displays a
picture on a display surface 10A that is an operation surface. For example, the display
unit 1 may include a display panel 10, a sensor device 20, a driver 30, a housing 40, and
a pen 50. The display panel 10 corresponds to a specific but non-limiting example of
"substrate" in the technology.
[0016] The display panel 10 displays a picture on the display surface IOA, and may be
configured of, for example, a liquid crystal panel, an organic electro-luminescence (EL)
panel, or an electrophoretic panel. The display panel 10 has flexibility and may
20 detects a position on the display surface 10A contacted or pressed by, for example,
the pen 50. The sensor device 20 tnay output a detection result (a detection signal) to
the driver 30. Note that the sensor device 20 is described in detail later.
[0017] The driver 30 may apply a voltage to tlie display panel 10 to display a picture
on the display surface 10A. The driver 30 also may apply a voltage to the sensor
device 20 to drive the setlsor device 20 and to receive the detection signal fiotn the
sensor device 20. The driver 30 further may generate a voltage based on the received
detection signal, and then apply the generated voltage to the display panel 10 to change
the display of the display surface 10A. The driver 30 tnay generate an image signal
based on the received detection signal and output the image sigual to outside.
[0018] The housing 40 tnay protect the display panel 10, the sensor device 20, and the
driver 30. The housing 40 may further fix the display panel 10 and the sensor device
20 to the Iiousing 40. The housing 40 niay include, for example, a bottotn surface part
41, a side surface part 42, and an upper surface part 43. The bottom surface part 41
may face a back surface of the sensor device 20. The side surface part 42 may face a
side surface of the display panel 10 and a side surface of the sensor device 20. The
upper surface part 43 may face an edge of an upper surface of the display pat~el 10.
For example, an end of the display panel 10 and an end of the sensor device 20 may be
sandwiched between the bottotn surface part 41 and the upper surface part 43. The pen
50 tnay come into contact with the display surface 10A or press the display surface 10A.
The sensor device 20 detects a position on the display surface 10A contacted or pressed
by the pen 50. Note that the pen 50 may be omitted. 111 this case, for example, a
finger may be used in place of the pen 50.
[0019] Next, the sensor device 20 is described in detail. The sensor device 20 is
disposed at a position facing a surface opposite to the display surface 10A of the display
panel 10. In other words, the sensor device 20 is not provided on the display surface
10A. The sensor device 20 may include, for example, a sensor layer 21 and a gap
layer 22. The sensor layer 21 is disposed at a position facing the surface opposite to
the display surface IOA of the display panel 10. The gap layer 22 is located in a gap
between the display panel 10 and the sensor layer 21. The sensor layer 21 detects a
position on the display surface 10A contacted or pressed by, for example, the pen 50,
and may be configured of, for example, a detector of an electrostatic capacitance type, a
resistance film type, or a magnetic resistance type. The sensor layer 21 may have
flexibility, and for example, include one or a plurality of flexible resin layers or one or a
plurality of flexible electrically-conductive layers.
[0020] FIG. 2 illustrates an example of a perspective configuration of the display
panel 10 and the sensor device 20. As mentioned above, the gap layer 22 is located in
the gap between the display panel 10 and the sensor layer 21. The gap layer 22
includes a bonding region 22A and a relaxation region 22B. The bonding region 22A
has a fi~nction of bonding the display panel 10 and the sensor layer 21 to each other.
The relaxation region'22B has a function of relaxing stress applied from the display
panel I0 to the sensor layer 21.
[0021] FIG. 3 and FIG. 4 each illustrate an example of a planar configuration of the
gap layer 22. The bonding region 22A is disposed at a position facing a center part of
the sensor layer 21. For example, the bonding region 22A may have a rectangular
shape as illustrated in FIG. 3, or a shape in which four comers of a rectangle are cut out
as illustrated in FIG. 4. The shape of bonding region 22A is not limited to those
mentioned above, and for example, may have a circular shape or an ellipsoidal shape.
The bonding region 22A may he formed of a sheet adhesive layer 22-1 or a sheet
bonding layer 22-2. Note that the bonding region 22A may be formed of a plurality of
sheet adhesive layers 22-1 or a plurality of sheet bonding layers 22-2.
[0022] Non-limiting examples of the material of the adhesive layer 22-1 may include
an acrylic adhesive, ao ethylene-vinyl acetate copolymer, a nahlral rubber-based
adhesive, a synthetic lubber-based adhesive such as polyisobutylene, butyl lubber, a
styrene-butylene-styrene copolymer, and a styrene-isoprene-styrene block copolymer, a
polyurethane-based adhesive, a polyester-based adhesive, an epoxy-based adhesive, and
a silicon-based adhesive. For example, a material similar to the material described as
the material of the adhesive layer 22-1 may be used for the bonding layer 22-2.
Non-limiting examples of a method of curing the above-mentioned materials may
include ultraviolet curing, electron beatn curing, radiation curing, and dry curing. The
adhesive layer 22-1 and the bonding layer 22-2 each may have a thickness of, for
example, about 0.5 pm to about 500 pm both inclusive.
[0023] The relaxation region 22B may be disposed at a position facing an edge of the
sensor layer 21. The relaxation region 22B is disposed at au outer periphety of the
bonding region 22A. For example, as illustrated in FIG. 3 and FIG. 4, the relaxation
region 22B may have a frame shape in which a center part of a rectangular sheet is
replaced by the bonding region 22A. The relaxation region 22B may be configured of
clearancce.
[0024] FIG. 5 illustrates a state where curvature occu~sa t an end of the display panel
LO. FIG. 5 illustrates a state where cuwature occurs at the end of the display panel 10
in a direction apart fiotn the sensor layer 21 when the display pallel 10 is not tightelled
by the housing 40. In FIG. 5, a part where the curvature occurs is denoted by a curved
part 10B. It may be assumed that, when the display panel 10 is not tightened by the
housing 40, the curved part 10B exists at the cud of the display panel 10. At this time,
the relaxation region 22B (clearance in this case) may be disposed in a part or the entire
of the region facing the curved part 10B. In other words, the relaxation region 22B
uiay be provided according to the position where the curved part 10B is genetated.
The bonding region 22A (the adhesive layer 22-1 or the bonding layer 22-2 in this case)
may be disposed in a region facing a region of the display panel 10 that does not face
the relaxation region 22B, and for example, lnay be disposed in a legion facing a part
other than the curved part IOB of the display panel 10.
[0025] When the curved part 10B has a frame shape, the relaxation region 22B also
may have a kame shape. When the curvature of the curved part 10B is particularly
large at the four corners of the display panel 10, a width o f the relaxation region 228 at
each of the parts facing the respective four corners of the display panel 10 may be
preferably larger than a width of the relaxation region 22B at a part facing a part other
that1 the four corners of the display panel 10. The term "a width of the relaxation
region 22B" indicates a width of the frame when the relaxation region 22B has the
frame shape. At this time, for example, as illustrated in FIG. 4, the bonding region
22.4 has a shape in which four corners of a rectangle are cut out.
[0026] A percentage of the relaxation region 22B in the gap layer 22 may be
preferably in a range from 10% to 30% both inclusive by taking into consideration the
result of static measurement and dynamic measurement in the following table 1.
Accordingly, the percentage of the curved part 10B in the display panel 10 may be
preferably made equal to or lower than 30% so that the percentage of the relaxation
region 22B in the gap layer 22 satisfies the above-described condition. The static
measurement indicates measurement of in-plane variatiorr of the sensor sensitivity in a
state where the display surface 10A is not contacted or not pressed by, for example, the
pen 50. The dynamic measurement indicates measurement of in-plan variation of the
sensor sensitivity in a state where predetermined pressure is applied to the entire display
surface 10A. In table I , x (cross) indicates the in-plane variation of 15% or higher, A
(triangle) indicates the in-plane variation of 5% or higher and lower than 15%, and o
(white circle) indicates the in-plane variation of lower than 5%.
[Table 11
Percentage of Relaxation
Region 228 (%)
0
10
Measureme~it Condition
Static Measurement
x (abnormality of 40%)
A (abnonnalitp of 5%)
Dynamic Measurement
x
A
Next, tnodifications of the display unit 1 according to the above-described
emboditnent are described.
[0029] [Modification 11
FIG. 6 illustrates a modification of a perspective configuration of the display
panel 10 and the sensor device 20. FIG. 7 and FIG. 8 each illustrate an example of a
planar configuration of the gap layer 22 of FIG. 6. In the present modification, the
bonding region 22A is disposed at a position facing the end of the sensor layer 21. For
example, as illustrated in FIG. 7 and FIG. 8, the bonding region 22A may have a frame
shape in which a center part of the rectangnlar sheet is retnoved. The bonding region
22A may be fonned of the sheet adhesive layer 22-1 or the sheet bonding layer 22-2.
30
>50
[0027] [Effects]
Next, effects of the display nnit 1 according to the present etnboditnent are
described. In the present embodiment, the gap layer 22 including the bonding region
22A and the relaxation region 228 is provided between the display panel 10 and the
sensor layer 21. In the case where the display panel 10 is not tightened by the housing
40, when the curved part 10B may exist at the end of the display panel 10, the relaxation
region 22B is disposed in a part or the entire of the region facing the curved part 1OB.
In contrast, the bonding region 22A is disposed in a region facing a region of the display
panel 10 that does not face the relaxation region 22B. This tnakes it possible to relax
stress applied from the curved part 10B to the sensor layer 21 by the relaxation region
22B while fixing the display panel 10 and the sensor layer 21 to each other by the
bonding region 22A. It is therefore possible to suppress deterioration in sensor
characteristics caused by deflection of the display panel 10.
[0028] <2. Modifications>
o (0%)
o (0%)
o
x (abnonnality in sensitivity)
22-1 or a plurality of sheet bonding laye~s2 2-2.
[0030] The relaxation region 22B may be disposed at a position facing the center pal t
of the sensor layer 21. The relaxation region 22B may be disposed in a region
surrounded by the bonding region 22A. For example, the relaxation region 22B may
have a rectangular shape as illustrated in FIG. 7 or a shape in which four comers of a
rectangle are cut out as illustrated it1 FIG. 8. The shape of the bonding region 22A is
not limited to those mentioned above, and alternatively for example, may be a circular
shape or an ellipsoidal shape.
[003 11 FIG. 9 illustrates a state where curvature occurs at the center part of the display
panel 10, FIG. 9 illustrates a state where curvature occurs at the center part of the
display panel 10 in the direction apart ftom the sensor layer 21 when the display panel
10 is not tightened by the housing 40. In FIG. 9, a part where the curvature occurs is
denoted by a curved part IOC. It may be assumed that, whet1 the display panel 10 is
not tightened by the housing.40, the curved part 10C exists at the center part of the
display panel 10. At this time, the relaxation region 22B (clearance in this case) may
be disposed in a part or the entire of the region facing the curved part 10C. In other
words, the relaxation region 22 is disposed according to the position where the curved
pat* 10C is generated. The bonding region 22A (the adhesive layer 22-1 or the
bonding layer 22-2 in this case) may be disposed in a region facing a region of the
display panel 10 that does not face the relaxation region 22B, and for example, may be
disposed in a region facing a part other than the curved part 10C of the display panel 10.
[0032] Next, effects of the display unit 1 according to the present modification are
described. h~ the present modification, the gap layer 22 including the bonding region
22A and the relaxation region 22B is provided between the display panel 10 and the
sensor layer 21. In the case where the display panel 10 is not tightened by the housing
40, when the curvature 10C may exist at the center part of the display panel 10, the
relaxation region 228 is disposed in a part or the entire of the region facing the curved
part 10C. 111 contrast, the bonding region 22A is disposed in a region facing a region
of the display pallel 10 that does not face the relaxation region 22B. This makes it
possible to relax stress applied from the curved part IOB to the sensor layer 21 by the
relaxation region 228 while fixing the display par~el I0 aud the sensor layer 21 to each
other by the bonding region 22A. It is therefore possible to suppress deterioration in
sensor characteristics caused by deflection of the display panel 10.
(00331 [Modification 21
FIG. 10 illustrates a ~nodificatiou of a planar configuration of the gap layer 22
o f FIG. 3. FIG. 1 1 illustrates a modification of a planar configuration of the gap layer
22 of FIG. 4. In the present modification, the relaxation region 22 may be formed of
clearance. Further, the bonding region 22A may include a plurality of dot-like
adhesive parts 22-3 or a plurality of dot-like bonding parts 22-4. Each dot may have,
for example, a colu~nnar shape or a prism shape. The plurality of adhesive parts 22-3
rnay be arranged ih a matrix in plane. The plu~ality of bonding parts 22-4 may be
arrauged in a matrix in plane. A material similar to tlre material described as the
material of the adhesive layer 22-1 rnay be used for the adhesive part 22-3 and the
bonding part 22-4. The adhesive part 22-3 and the bonding part 22-4 each may have a
thickness of, for example, about 0.5 ptn to about 500 pm both inclusive.
[0034] FIG. 12 illustrates a state where curvature occu~s at the end of the display
panel 10. FIG. 12 illustrates a state where curvature occurs at the end of the display
panel 10 in the direction apart from the sensor layer 21 when the display panel 10 is not
tightened by the housing 40. It may be assumed that, when the display panel 10 is not
tightened by the housing 40, the curved part 10B exists at the end of the display panel
10. At this time, the relaxation region 22B (clearance in this case) rnay be disposed in
a part or the entire of the region facing the curved part 10B. In other words, the
relaxation region 22B rrlay be provided according to the positiou where the curved part
IOB is generated. The bonding region 22A (the plurality of adhesive parts 22-3 or the
plurality of bonding parts 22-4 in this case) may be disposed in a region facing a region
of the display panel 10 that does not face the relaxation region 22B, and for example,
may be disposed in a region facing a part other than the curved part 10B of the display
panel 10.
[0035] Next, effects of the display nnit 1 according to the present modification are
described. In the present modification, the gap layer 22 including the bonding region
22A and the relaxation region 22B is provided between the display panel 10 and the
sensor layer 21, as with the foregoing embodiment. This makes it possible to relax
stress applied from the curved part 10B to the sensor layer 2 1 by the relaxation region
22B while fixing the display panel 10 and the sensor layer 21 to each other with the
bonding region 22A. It is therefore possible to suppress deterioration in sensor
characteristics caused by deflection ofthe display panel 10.
[0036] Also, in the present modification, the bonding region 22A may include the
plurality of dotrlike adheiive parts 22-3 or the plurality of dot-like bonding parts 22-4.
This makes it possible to easily remove the gap layer 22 as compared with the case
where the bonding region 22A is formed of the sheet adhesive layer 22-1 or the sheet
bonding layer 22-2. As a result, it is possible to easily perfonn reworking in
manufacturing process.
[0037] [Modification 31
FIG. 13 illustrates a modification of a planar configuration of the gap layer 22
of FIG. 7. FIG. 14 illustrates a modification of a planar configuration of the gap layer
22 of FIG. 8. In the present modification, the relaxation region 22B may be formed of
clearance. Furthe]; the bonding region 22A may include the plurality of dot-like
adhesive parts 22-3 or the plurality of dot-like bonding parts 22-4. Each dot may have,
for example, a columnar shape or a pristn shape. FIG. 15 illustrates a state where
curvatare occurs at the center part of the display panel 10. FIG. 15 illustrates a state
where the curvature occu~sa t the center part of the display panel 10 in the direction
apart from the sensor layer 21 when the display panel 10 is not tightened by the housing
40. It rnay be assumed that, when the display panel 10 is not tightened by the housing
40, the curved part 10C exists at the center part of the display panel 10. At this time,
the relaxation region 22B (clearance in this case) may be disposed in a part or the entire
of the region facing the curved part IOC. In other words, the relaxation region 228
may be provided according to the position where the curved part 10C is generated.
The bonding region 22A (the plurality of adhesive parts 22-3 or the plurality of bonding
parts 22-4 in this case) may be disposed in a region facing a region of the display panel
10 that does not face the relaxation region 22B, for example, may be disposed in a
region facing a part other than the curved part 10C of the display panel 10.
[0038] Next, effects of the display unit 1 according to the present modification are
described. In the present modification, the gap layer 22 including the bonding region
22A and the relaxation region 22B is provided between the display panel 10 and the
sensor layer 21, as with'the foregoing embodiment. This makes it possible to relax
stress applied from the curved part IOB to the sensor layer 21 by the relaxation region
228 while fixing the display panel 10 and the sensor layer 21 to each other by the
bonding region 22A. It is therefore possible to suppress deterioration in sensor
characteristics caused by deflection ofthe display panel 10.
[0039] Also, in the present modification, as with the modification 2, the bonding
region 22A includes the plurality of dot-like adhesive palls 22-3 or the plurality of
dot-like bonding parts 22-4. This makes it possible to easily remove the gap layer 22
as compared with the case where the bonding region 22A is formed of the sheet
adhesive layer 22-1 or the sheet bonding layer 22-2. As a result, it is possible to easily
perforin reworking in manufacturing process.
[0040] [Modification 41
FIG. 16 illustrates a state where the curved part IOB exists at the end of the
display panel 10 in the display unit 1 provided with a modification of the gap layer 22
of FIG. 10 or FIG. 11. FIG. 16 illustrates a state where curvature occurs at the end of
the display panel 10 in the direction apart from the sensor layer 21 when the display
panel 10 is not tightened by the housing 40. FIG. 17 illustrates a state where curvature
occurs at the center part ofthe display panel 10 in the display unit 1 provided with a
modification of the gap layer 22 of FIG. 13 or FIG. 14. FIG. 17 illustrates a state
where curvature occurs at the center part of the display panel 10 in the direction apart
from the sensor layer 21 when the display panel 10 is not tightened by the housing 40.
[0041] In the present modification, the bonding region 22A may include the plurality
of dot-like adhesive parts 22-3 or the plurality of dot-like bonding parts 22-4. Further,
the relaxation region 22B may include a plurality of dot-like adhesive parts 22-5 or a
plurality of dot-like bonding parts 22-6. When the bonding region 22A includes the
plurality of dot-like adhesive palts 22-3, the relaxation region 22B may include the
plurality of dot-like adhesive parts 22-5. When the bonding region 22A includes the
plurality of dot-like bonding parts-22-4, the relaxation region 22B may include the
plurality of dot-like bonding parts 22-6.
[0042] The plurality of adhesive parts 22-5 may be arranged in a matrix in plane.
The plurality of bonding parts 22-6 may be arranged in a matrix in plane. A niaterial
similar to the material described as the material of the adhesive layer 22-1 may be used
for the adhesive part 22-5 and the bonding part 22-6. The adhesive part 22-5 and the
bonding part 22-6 each may have a thickness of, for example, about 0.5 pln to about
500 pm both inclusive.
[0043] The bonding strength of the relaxation region 22B may be lower than the
bonding strength of the bonding region 22A. The bonding strength of the relaxation
region 22B rnay be, for example, an extent that the adhesive part 22-5 or the bonding
part 22-6 falls away fiom the curved part 10B of the display panel 10 when the display
panel 10 is not tightened by the housing 40. The bonding strength of the bonding
region 22A may be, for example, 1N/25 mm to 40Nf25 mm. The bonding strength of
17
the relaxation region 22B tnay be, for example, snlaller than IN125 mm. Two specific
but non-limiting examples of measures that allow the bonding strength of the relaxation
region 22B to be lower than the bo~tdiug strength of the bonding region 22A are
described below.
LO0441 (Specific Example I)
For example, population density of the plurality of adhesive parts 22-5 or the
plurality of bonding parts 22-6 in the relaxation region 228 may be smaller than
population density of the plurality of adhesive parts 22-3 or the plurality of bonding
parts 22-4 in the bonding region 22A. To control the population density lnentioned
above, for exaniple, the size of each dot may be adjusted or the number of dots per unit
area may be adjusted. Note that, in the specific example I, the bonding strength of
each adllesive part 22-5 or each bonding part 22-6 may be equivalent to or lower than
the bonding strength of each adhesive part 22-3 or each bonding part 22-4.
[0045] (Specific Example2) --
For example, the bonding strength of each adhesive part 22-5 or each bonding
part 22-6 may be lower than the bonding strength of each adhesive part 22-3 or each
bonding part 22-4. To control the bonding strength mentioned above, for exa~nplet,h e
size of each dot may be adjusted, the adhesive part 22-5 and the adhesive part 22-3 may
be formed of materials different in viscosity from each other, or the bonding part 22-6
and the bonding part 22-4 may be fanned of materials different in adhesion force from
each other. Note that, in the specific exan~ple2, the population density of the plurality
of adhesive parts 22-5 or the plurality of bonding parts 22-6 in the relaxation region 22B
may be equivalent to or s~nallerth an the population density of the plurality of adhesive
parts 22-3 or the plurality of bonding parts 22-4 in the bonding legion 22A.
[0046] Next, effects of the display unit 1 according to the present modification are
described. In the present modification, the gap layer 22 including the bonding region
low bonding strength is provided between the display panel I0 and the sensor layer 21.
This makes it possible to relax stress applied fiom the curved part 1OB or 10C to the
sensor layer 21 by the relaxation region 22B while fixing the display panel 10 and the
sensor layer 21 to each other by the bonding region 22A. It is therefore possible to
suppress deterioration in sensor characteristics caused by deflection of the display panel
10.
[0047] Also, in the present modification, the relaxatiot~ region 22B includes the
plurality of dot-like adhesive parts 22-5 or the plurality of dot-like bonding patts 22-6.
This makes it possible to unifonn the height of the gap between the display panel 10
and tile sensor layer 21 in plane even when the display surface 10A is pressed down by,
for example, the pen 50, as compared with the case where the relaxation region 22B is
formed of clearance.
[0048] Incidentally, in the present modification, for example, as illustrated in FIG. 18
and FIG. 19, the felaxation region 228 may include a plurality of dot-like non-adhesive
parts 22-7. Also in this case, since the bonding strength of the relaxation region 228 is
made lower than the bonding strength of the bonding region 22A, it is possible to
suppress deterioration in sensor characteristics caused by deflection of the display panel
10.
[0049] [Modificatiotl5]
FIG. 20 illustrates a state where the cutved part IOB exists at the end of the
display panel 10 in the display unit 1 provided with a modification of the gap layer 22
of FIG. 5. FIG. 20 illustrates a state where curvature occurs at the end of the display
panel 10 in the direction apat-t from the sensor layer 21 when the display panel 10 is not
tightened by the housing 40. FIG. 21 illustrates a state where curvature occuts at the
center part of the display panel 10 in the display unit 1 ptovided with a modification of
the gap layer 22 of FIG. 9. FIG. 21 illostrates a state where curvature occurs at the
center part of the display panel I0 in the direction apart fiom the sensor layer 21 when
the display panel I0 is not tightened by the housing 40.
[0050] In the present tnodification, both of the bonding region 22A and the relaxation
region 22B may be formed of the sheet adhesive layer 22-1 or the sheet bonding layer
22-2. The bonding strength of the relaxation region 22B may be lower than the
bonding strength of the bonding region 22A. The bonding strength of the relaxation
region 22B may be, for example, an extent that the adhesive layer 22-1 or the bonding
layer 22-2 falls away from the curved part 10B or IOC of the display panel 10 when the
display panel 10 is not tightened by the housing 40. The bonding strength of the
bonding region 22A may be, for example, IN125 mm to 40Nl25 mtn. The bonding
strength of the relaxation region 22B may be, for example, smaller than IN125 mtn.
[0051] To control the bonding strength mentioned above, for example, the adhesive
layer 22-1 of the relaxation region 22B may be formed of a material different in
viscosity from a material of the adhesive layer 22-1 of the bonding region 22A.
Further, to control the Mntling strength mentioned above, for example, the bonding
layer 22-2 of the relaxation region 22B may be formed of a material different in
adhesive force frotn a rnaterial of the bonding layer 22-2 of the bonding region 22A.
[0052] Next, effects of the display unit I according to the present modification are
described. In the present modification, the gap layer 22 including the bonding region
22A \vitll relatively high bonding strength and the relaxation region 22B with relatively
low bonding strength is provided behveen the display panel 10 and the sensor layer 21.
This makes it possible to relax stress applied frotn the curved part 10B or 10C to the
sensor layer 21 by the relaxation region 22B while fixing the display panel 10 and the
sensor layer 21 to each other by the bonding legion 22A. It is therefore possible to
suppress deterioration in sensor characteristics caused by deflection of the display panel
10.
[0053] Incidentally, in the present modification, for example, as illustrated in FIG. 22
and FIG. 23, the relaxation region 22B may be formed of a sheet non-adhesive layer
22-8. Also in this case, since the bonding strength of the relaxation region 22B is
tilade lower than the bonding strength of the bonding region 22A, it is possible to
suppress deterioration in sensor characteristics caused by deflection of the display panel
10.
[0054] [Modification 51
FIGs. 24A, 24B, and 24C each illustrate a nnodification of a planar layout of
the adhesive pails 22-3 and the bonding parts 22-4 in the bonding region 22A. FIGs.
25A, 25B, and 25C each illustrate a modification of a planar layout of the adhesive parts
22-5, the bonding parts 22-6, and the non-adhesive palts 22-7 in the relaxation region
22B.
[0055] In the bonding region 22A, for example, as illustrated in FIG. 24A, the
adhesive parts 22-3 and the bonding parts 22-4 each may be formed in a lattice shape.
Futther, in the relaxation region 22B, for example, as illustrated in FIG. 25A, the
adhesive parts223,'fhe bonding palls 22-6, and the non-adhesive parts 22-7 each may
be formed in a lattice shape.
[0056] In the bonding region 22A, for example, as illustrated in FIG. 24B, the
adhesive part 22-3 and the bonding part 22-4 each may be formed in a rod shape.
Futther, in the relaxation region 22B, for example, as illustrated in FIG. 25B, the
adhesive part 22-5, the bonding part 22-6, and the non-adhesive pait 22-7 each lnay be
formed in a rod shape. At this time, the plurality of adhesive patts 22-3 and the
plurality of bonding parts 22-4 may form a straight stripe pattern. Likewise, the
plurality of adhesive palls 22-5, the plurality of bonding patts 22-6, and the plurality of
non-adhesive palls 22-7 tnay also form a straight stripe pattern.
[0057] In the bonding region 22A, for example, as illustrated in FIG. 24C, the
adhesive part 22-3 and the bonding part 22-4 each tnay be fotmed in a wave shape.
Further, in the relaxation region 22-7, for exaniple as illustrated in FIG. 25C, the
adhesive part 22-5, the bonding part 22-6, and the non-adhesive part 22-7 may be
fonned in a wave shape. At this time, the plurality of adhesive parts 22-3 and the
plurality of bonding parts 22-4 may form a waved stripe pattern. Likewise, the
plurality of adhesive parts 22-5, the plurality of bonding parts 22-6, and the plurality of
non-adhesive parts 22-7 may also form a waved stripe pattern.
[0058] Next, effects of the display unit 1 according to the present modification are
described. In the present modification, the bonding region 22.4 includes the plurality
of dot-like, lattice-like, or stripe-like adhesive parts 22-3 or bonding parts 22-4, and the
telaxation region 22B includes the plurality of dot-like, lattice-like, or stripe-like
bonding parts 22-5 or bonding parts 22-6. This makes it possible to easily remove the
display panel 10 fiotn the gap layer 22 as compared with the case where the bonding
legion 22A is formed of the sheet adhesive layer 22-1 or the sheet bonding layer 22-2.
As a result, it is possible to easily perfonn reworking in manufacturing process.
Further, as compared with the case where the relaxation region 22B is formed of
clearance, it is possible to uriiform the height of the gap behveen the display panel 10
and the sensor layer 21 in plane even when the display surface 10A is pressed down by,
for example, the pen 50.
[0059] <3. Second Embodiment>
FIG. 26 illustrates an example of a sectional structure of an input unit 2
according to a second embodiment of the technology. The display unit 2 corresponds
to the display unit I according to the above-described embodiment provided with a
substrate 60 in place of the display panel 10.
[0060] The substrate 60 is a substrate including an operation surface 60A. The
substrate 60 may be, for example, a flexible non-transparent resin plate or a flexible
non-transparent metal plate. When the substrate 60 is not tightened by the housing 40,
a curved part sinlilar to the curved part 10B or 10C of the above-described e~nbodiment
may exist at an end or a center part of the substrate 60. The sensor device 20 detects a
position on the operation surface 60A contacted or pressed by, for example, the pen 50,
22
and outputs a detection result (a detection signal) to the driver 30.
[OO6I] The driver 30 may apply a voltage to the sensor device 20 to drive the sensor
device 20, and receive the detection signal from the sensor device 20. The sensor
device 20 may further generate an image signal based on the received detection signal,
and output the image signal to outside. The housing 40 tnay protect the substrate 60,
the sensor device 20, and the driver 30. The housing 40 may fu~therfi x the substrate
60 and the sensor device 20 to the housing 40. The housing 40 map include, for
example, the bottom surface part 41, the side surface part 42, and the upper surface part
43. The bottom surface pal* 41 may face the back surface of the sensor device 20.
The side surface part 42 tnay face a side surface of the substrate 60 and the side surface
of the sensor device 20. The upper surface part 43 may face an edge of an upper
surface of the substrate 60. For example, the ends of the substrate 60 and the sensor
device 20 may be sandwiched by the bottom surface part 41 aud the upper surface part
43. Tlie pen 50 tnay come into contact with the operation surface 60A or press the
operation surface 6OA. The sensor device 20 detects a position on the operation
surface 6OA contacted or pressed by the pen 50. Note that the pen 50 may be omitted.
In this case, for example, a finger may be used in place of the pen 50.
[0062] [Effects]
Next, effects of the input unit 2 according to the present embodiment are
described. In the present embodiment, the gap layer 22 including the bonding region
22A and the relaxation region 22B is provided between the substrate 60 and the sensor
layer 21. In the case where the substrate 60 is not tightened by the housing 40, when a
curved part (for example, curvature corresponding to the curved part 10B or 10C) exists
at the end or the center part of the substrate 60, the relaxation region 22B is disposed in
a part or the entire of the region facing the curved part. In contrast, the bonding region
22A is disposed in a region facing a region of the substrate 60 that does not face the
part of the substrate 60 to tlie sensor layer 21 by the relaxation region 22B while fixing
the substrate 60 and the sensor layer 21 to each other by the bonding region 22A. It is
therefore possible to suppress deterioration in sensor characteristics caused by
deflection of the substlate 60.
[0063] <4. Modification Cotntnoti to Embodiments>
FIG. 27 illustrates a niodification of a sectional structure of the display itnit 1
according to the above-described first embodiment and the modifications thereof. FIG.
28 illustrates a modification of a sectional structure of the input unit 2 according to the
above-described second embodiment. Note that illustration of the driver 30 is otnitted
in FIG. 27 and FIG. 28.
[0064] In the present tiiodificatioti, the gap layer 22 tnay be provided behveen the
sensor layer 21 and the bottom surface pat-t 41 of the housing 40. When a curved patt
(for exatnple, curvature corresponding to the curved part 10B or 10C) exists at the end
or the center pat* of the'bottom surface part 41, the relaxation rcgion 22B tnay be
provided in a part or the entire of the region facing the cutved part. The bonding
rcgion 22A tnay be disposed in a rcgion facing a region of the bottotn surface pat2 41
that does not face the relaxation region 22B. This makes it possible to relax stress
applied from the curved pat* of the bottom surface pat-t 41 to the sensor layer 21 by the
relaxation region 22B while fixing the bottom surface pat* 41 atid the sensor layer 21 to
each other by the bonding region 22A. It is therefore possible to suppress deterioration
in sensor characteristics caused by deflection of tlie bottotn surface patt 41.
100651 <5. Specific Exaniple of Sensor Layer 21>
FIG. 29 illustrates an example of a sectional structure of the sensor layer 21
together with an example of an internal configuration of the driver 30. The sensor
layer 21 detects a positioti on the display panel 10 or the substrate 60 contacted or
pressed by, for example, tlie pen 50. The sensor layer 21 tnay be of an electrostatic
capacitance type, and may have a configuration in which, for exatnple, at1 electrode
24
substrate 210 is sandwiched by an electrically-conductive layer 211 and an
electrically-condnctive layer 217 in a vertical direction. The electrode substrate 210,
the electrically-conductive layer 21 1, and the electrically-conductive layer 217 each
may have flexibility. The electrode substrate 210 may include, for example, an
insulating layer 212, a lower electrode 213, an insulating layer 214, an upper electrode
215, and an insulating layer 216 in this order fiom the electrically-conductive layer 21 1
side. The sensor layer 21 may include, for example, a gap between the
electrically-conductive layer 21 I and the electrode substrate 210, and a plurality of
spacers 21 8 that maintain the gap. The sensor layer 21 may also include, for example,
a gap between the electrically-conductive layer 217 and the electrode substrate 210, and
a plurality of spacers 219 that maintain the gap. The plurality of spacers 218 and the
plurality of spacers 219 may be so provided as not to be overlapped with each other as
viewed fiom a thickness direction of the sensor layer 21.
(00661 The electrically-chdnctive layer 21 1 and the electrically-conductive layer 217
each may have a function of a shield layer that prevents variation in an electrostatic
capacitance formed between the senor layer 21 and the outside from affecting the inside
of the sensor layer 21. The electrically-conductive layer 211 and the
electrically-conductive layer 217 may be at a fixed potential, for example, at a ground
potential. The electrically-conductive layer 21 1 and the electrically-conductive layer
217 may be each formed of a metal plate of, for example, SUS or iron. The metal
plate may have flexibility. The electrically-conductive layer 211 and the
electrically-conductive layer 217 may be formed of, for example, a film on which a
metal thin film such as aluminum, carbon, CNT, ITO, 120, a natlo-metal wire, a silver
fine wire, etc. is formed.
[0067] The lower electrode 213 may be provided at a position facing the
electrically-conductive layer 21 1. The lower electrode 213 may include a plurality of
partial electrodes each extending in a predetermined direction (the X direction in the
drawing). In other words, the lower electrode 213 and the electrically-conductive layer
21 1 may detect variation in electrostatic capacitance at a coordiuate positiou in a
direction (the Y direction in the drawing) orthogonal to the extending direction of the
lower electrode 213. The upper electrode 21 5 lnay be provided at a position facing the
electrically-conductive layer 217. The upper electrode 215 may include a plurality of
partial electrodes each extending in a direction (the Y direction in the drawing)
o~thogonalto the lower electrode 21 3. In other words, the upper electrode 215 and the
electrically-conductive layer 217 tnay detect variation in electrostatic capacitance at a
coordinate positiou in a direction (the X direction in the drawing) orthogonal to the
extending direction of the upper electrode 215. The lower electrode 213 and the upper
electrode 215 may be formed of, for example, a film on which a metal thin film such as
aluminum, carbon, CNT, ITO, 120, a nano-metal wire, a silver fine wire, etc. is formed.
[0068] The insulating layer 212 may insulate the electrically-conductive layer 21 1 and
the lower electrode 213 Eom each other. The iusulatiug layer 214 may insulate the
lower electrode 213 aud the upper electrode 215 from each other. The iusulating layer
216 tnay insulate the upper electrode 215 and the electrically-conductive layer 217 from
each other. The insulating layer 212, the insulating layer 214, and the insulating layer
216 each may be formed of, for example, a hard coating agent that is cured by UV light
or heat after screen printing. Alternatively, the insulating layer 216 tnay be formed
through patterning of a spin-coated photosensitive resin by photolithography.
[0069] The driver 30 may generate drawing data based on an output of the sensor
layer 21 and output the d~awingd ata to outside. For example, as illustrated in FIG. 29,
the driver 30 may ir~cludea detector circuit 31, a calculation section 32, a memory 33,
and an output section 34.
[0070] For example, the detector circuit 31 may read variation in electrostatic
capacitance of the sensor layer 21 fro111 variation of an amount of a current flowing
through the electrode substrate 210. The detector circuit 31 tnay include, for example,
a switching device, a signal source, and a current-voltage conversion circuit. The
switching tnay device switch over the plurality of lower electrodes 213 and the plurality
of upper electrodes 215 included in the electrode substrate 210. The signal source nlay
supply an AC signal to the electrode substrate 210. The switching device may be, for
example, a multiplexer. A plurality of terminals p~.ovided at one end of the
nlultiplexer may be respectively coupled to ends of the respective lower electrodes 213
and ends of the respective upper electrodes 215, and one terminal provided on the other
end of the multiplexer may be coupled to the signal source and the current-voltage
conversion circuit.
[0071] For example, the detector circuit 31 may select the plurality of lower
electrodes 213 one after another and select the plurality of upper electrodes 215 one
after another. Thus, the detector circuit 31 may apply the AC signal to the plurality of
lower electrodes 213 one after another and apply the AC signal to the plul-dlity of upper
electrodes 215 one.after ari6theK' At this time, for example, as illustrated in FIG. 30
and FIG. 31, when the display surface 10A or the operation surface 60 is contacted or
pressed by the pen 50, the electrostatic capacitance of the electrode substrate 210 may
vary, and the variation map cause variation in the amount of the cuwent flowing through
the electrode 210. For example, the detector circuit 31 may cotlvelt the variation of
the cuwent amount into variation of a voltage, and provide the variation of the voltage to
the calculation section 32. Even when the display surface 10A or the operation surface
6OA is contacted by the pen 50, the electrode substrate 210 may be slightly deformed,
which may result in variation in the electrostatic capacitance of the electrode substrate
210. Note that FIG. 30 illastrates an example of the sectional structnre of the sensor
210 and one of the display panel 10 and the substrate 60 at the time when the display
surface 10A or the operation surface 60A is contacted by the pen 50, in a simplified
manner. FIG. 31 illustrates an example of the sectional st~uch~orfe t he sensor layer 21
and one of the display panel I0 and the substrate 60 at the time when the display surface
10A or the operation surface 6OA is pressed by the pen 50, in a simplified manner.
[0072] The calculation section 32 may evaluate the voltage variation provided from
the detector circuit 31 to detect a position on the display surface 10A or the operation
surface 60A contactedor pressed by the pen 50. Furthet; the calculation section 32
may evaluate the voltage variation provided from the detector circuit 31 to derive
magnitude of pressing force of the pen 50 on the display surface 10A or the operation
surface 60A. The calculation sectiou 32 tnay overlap derived position data (postscript
data generated based on the output of the sensor layer 21) with the drawing data stored
in the tnetnory 33 to generate the drawing data. The calc~~latiosenc tion 32 may store,
in the memoly 33, the drawing data that is generated by overlapping the derived
position data (the postscript data generated based on the output of the sensor layer 21)
with the drawing data stored in the memory 33, and output the drawing data to the
output section 34. The memoly 33 may hold the drawing data provided from the
calculation section'32. ' Theoutput 'Section 34 may output, to the outside, the drawing
data provided from the calculation section 32.
[0073] In the sensor layer 21, the drawing data corresponding to the image drawn on
the display surface 10A or the operatio11 surface 60A may be generated. More
specifically, contact and pressing of the pen 50 to the display surface 10A or the
operation surface 60A at the time when the image is drawn on the display surface 10A
or the operation surface 60A with use of the pen 50 may be detected by the sensor layer
21. The drawing data may be generated with use of a result of the detection. In other
words, presence of the display panel 10 or the substrate 60 nlay not interfere the
generation of the drawing data. This is because the sensor layer 21 detects the contact
and the pressing of the pen 50 to the display surface IOA or the operation surface 60A
with use of variation in the electrostatic capacitance generated between the electrode
substrate 210 and the electrically-conductive layer 211 and behveen the electrode
substrate 21 0 is electrically shielded by the electrically-conductive layers 21 1 and 21 7.
[0074] The display panel 10 or the substrate 60 is bonded to the sensor layer 21 with
the gap layer 22 in between. This makes it possible to rclax stress applied from thc
curved part 10B to the sensor layer 21 by the relaxation region 22 while fixing the
sensor layer 21 and one of the display panel I0 and the substrate 60 to each other by the
bonding region 22A. As a result, for example, in the sensor layer 21, falling away of
the spacers 218 from the insulating layer 212 or falling away of the spacers 219 from
the insulating layer 216 is prevented. It is therefore possible to suppress deterioration
in sensor characteristics caused by deflection of the display pat~el1 0 or the substrate 60.
[0075] Hereinbefore, althougl~ the technology has been described with referring to
some embodiments and the modifications thereof, the technology is not limited thereto,
and various modifications may be made. Note that the effects described in the present
specification are illustrative. Effects of the embodiments of the technology are not
limited to those descrilied'in'Yhe'iii;esent specification. The technology may achieve
effect other than the effects described in the present specification.
[0076] Further, for example, an embodiment of the technology may be co~~figureads
follows.
(I) A sensor device including:
a sensor layer provided at a position facing a surface, of a substrate having an
operation surface, opposite to the operation surface, and cot~figuredt o detect a contacted
position or a pressed position on the operation surface; and
a gap layer located in a gap behveen the substrate and the sensor layer, the gap
layer including a bonding region and a relaxation region, the bonding region bonding
the substrate to the sensor layer, and the relaxation region relaxing stress applied from
the substrate to the sensor layer.
(2) The sensor device according to (I), wherein
the bonding region and the relaxatiot~ region are each foulled of dot-like,
lattice-like, or stripe-like adhesive parts or dot-like, lattice-like, or stripe-like bonding
parts, and
the relaxation region has bonding strength lower than bonding strength of the
bonding region.
(3) The sensor device according to (2), wherein population density of the
adhesive parts or the bonding parts in the relaxation region is smaller than population
density of the adhesive parts or the bonding parts in the bonding region.
(4) The sensor device according to (2), wherein bonding strength of each of the
adhesive parts or each of the bonding parts in the relaxation region is lo\ver than
bonding strength of each of the adhesive parts or each of the bonding partsin the
bonding region.
(5) The sensor device according to (I), wherein
the bonding region is formed of dot-like, lattice-like, or stripe-like adhesive
palls or dot-like;latiice~like; or stripe-like bonding parts,
the relaxation region is formed of dot-like, lattice-like, or stripe-like
lion-adhesive parts, and
the relaxation region has bonding strength lower than bonding strength of the
bonding region.
(6) The sensor device according to (I), wherein
the bonding region is formed of dot-like, lattice-like, or stripe-like adhesive
palls or dot-like, lattice-like, or stripe-like bonding parts, and
the relaxation region is formed of clearance.
(7) The sensor device according to (I), wherein
the bonding region is formed of one of a sheet adhesive layer and a sheet
bonding layer, and
the relaxation region is formed of clearance.
the bonding region and the relaxation region are each formed of one of a sheet
adhesive layer and a sheet bonding layer, and
the relaxation region bas bonding strength lower than bonding strength of the
bonding region.
(9) The sensor device according to (I), wherein
the bonding region is formed of one of a sheet adhesive layer and a sheet
bonding layel;
the relaxation region is fonned of a sheet non-adhesive part, and
the relaxation region has bonding strength lower than bonding strength of the
bonding region.
(10) The sensor device according to any one of (1) to (9), wherein
the bonding region is provided at a position facing a center part of the sensor
layel; and
the relaxafion region is provided at a position facing an edge of the sensor
layer.
(1 1) The sensor device according to any one of (1) to (9), wherein
the bonding region is provided at a position facing an edge of the sensor layel;
and
the relaxation region is provided at a position facing a center part of the sensor
layer.
(12) The sensor device according to any one of (1) to (1 I), wherein the sensor
layer has flexibility.
(13) A display unit provided with a display panel and a sensor device, the
display panel including a display surface, and the sensor device being provided on side
of the display panel opposite to the display surface, the sensor device including:
a sensor layer provided at a position apart frorn and facing the display panel,
and configured to detect a contacted position or a pressed position on the display
31
surface; and
a gap layer located in a gap between the display panel and the sensor layer, the
gap layer including a bonding region and a relaxation region, the bonding region
bonding the display panel to the sensor layer, and the relaxation region relaxing stress
applied fiotn the display panel to the sensor layer.
(14) An input unit provided with a substrate atid a sensor device, the substrate
including an operation surface, and the setisor device being provided on side of the
substrate opposite to the operation surface, the sensor device including:
a sensor layer provided at a position apart fro111 and facing the substrate, and
configured to detect a contacted position or a pressed position on the operation surface;
and
a gap layer located in a gap between the substrate and the sensor layer, the gap
layer including a bonding region and a relaxation region, the bonding region bonding
the substrate to the sensoFlayer;and the relaxation region relaxing stress applied fiotn
the substrate to the setisor layer.
[0077] This application is based upon and claims the benefit of priority of the
Japanese Patent Application No. 2013-182509 filed in the Japan Patent Office on
Septetl~ber3 ,2013, the entire contents of which are incorporated herein by reference.
[0078] It should be ui~derstood by those skilled in the att that various modifications,
cotnbinations, sub-combinatiotts, and alterations tnay occur depending on design
requirements and other factors insofar as they are within the scope of the appended
claitns or the equivalents thereof.

CLAIMS
1. A sensor device comprising:
a sensor layer provided at a position facing a surface, of a substrate having an
operation surface, opposite to the operation surface, and configured to detect a contacted
position or a pressed position on the operation surface; and
a gap layer located in a gap between the substrate and the sensor layer, the gap
layer including a bonding region and a relaxation region, the bonding region bonding
the substrate to the sensor layer, and the relaxation region relaxing stress applied from
the substlate to the sensor layer.
2. The sensor device according to clairn 1, wherein
the bonding region and the relaxation region are each formed of dot-like,
lattice-like, or stripe-like adhesive parts or dot-like, lattice-like, or stripe-like bonding
parts, and
the relaxation region has bonding strength lower than bonding strength of the
bonding region.
3. The sensor device according to claim 2, wherein population density of the
adhesive parts or the bonding parts in the relaxation region is smaller than population
density of the adhesive parts or the bonding parts in the bonding region.
4. The sensor device according to claim 2, wherein bonding strength of each of
the adhesive parts or each of the bonding parts in the relaxation region is lower than
bonding strength of each of the adhesive parts or each of the boltding paits in the
bonding region.
5. The sensor device according to clain~1 , wherein
the bonding region is formed of dot-like, lattice-like, or stripe-like adhesive
parts or dot-like, lattice-like, or stripe-like bonding parts,
the relaxation region is fonned of dot-like, lattice-like, or stripe-like
non-adhesive parts, and
the relaxation ,region has bonding strength lower than bonding strength of the
bonding region.
6. The sensor device according to claim 1, wherein
the bonding region is formed of dot-like, lattice-like, or stripe-like adhesive
parts or dot-like, lattice-like, or stripe-like bonding parts, and
the relaxation region is formed of clearance.
7. The sensor device according to claim 1, wherein
the bonding region is formed of one of a sheet adhesive layer and a sheet
bonding layer, and
the relaxation region is fonned of clearance.
8. The sensor device according to claim I, wherein
the bonding region and the relaxation region are each formed of one of a sheet
adhesive layer and a sheet bonding layer, and
the relaxation region has bonding strength lower than bonding strength of the
bonding region.
9. The sensor device according to claim 1, wherein
the bonding region is fornied of one of a sheet adhesive layer and a sheet
the relaxation region is fonned of a sheet non-adhesive part, and
the relaxation region has bonding strength lower than bonding strength of the
bonding region.
10. The sensor device according to claim 1, wherein
the bonding region is provided at a position facing a center part of the sensor
layer, and
the relaxation region is provided at a position facing an edge of the sensor
layer.
11. The sensor device according to claim 1, wherein
the bonding region is provided at a position facing an edge of the sensor layel;
and
the relaxation region'Ysprovided at a position facing a center part of the sensor
layer.
12. The sensor device according to claim 1, wherein the sensor layer has
flexibility.
13. A display unit provided with a display panel and a sensor device, the
display panel including a display surface, and the sensor device being provided on side
of the display panel opposite to the display surface, the sensor device comprising:
a sensor layer provided at a position apart from and facing tbe display panel,
and configured to detect a contacted position or a pressed position on the display
surface; and
a gap layer located in a gap behveen the display panel and the sensor layel; the
gap layer including a bonding region and a relaxation region, the bonding region
bonding the display panel to the sensor layer, and the relaxation region relaxing stress
applied fro111 the display panel to the sensor layer.
14. An.input unit provided with a substrate and a sensor device, the substrate
including .i&op eration surface, and the sensor device being provided on side of the
substrate opposite to the operation surface, the sensor device comprising:
a sensor layer provided at a position apart from and facing the substrate, and
configured to detect a contacted position or a pressed position on the operation surface;
and a gap layer located in a gap between the substrate and the sensor layer, the gap
layer including a bonding region and a relaxation region, the bonding region bonding
the substrate to the sensor layer, and the relaxation region relaxing stress applied from
the substrate to the sensor layer.