DESCRIPTION
SENSOR DEVICE, INPUT DEVICE, AND ELECTRONIC APPARATUS
Technical Field
5 [OOOl] The present technology relates to a sensor
device including a capacitive element, and to an input
device and an electronic apparatus.
Background Art
[0002] An input device including a capacitive
10 element is known as an input device for an electronic
apparatus. For example, Patent Document 1 discloses an
input device capable of detecting an operation by an
operating element based on a change in capacitance of
the capacitive element.
15 [00031 Patent Document 1: Japanese Patent
Application Laid-open No. 2011-170659
Summary of Invention
Problem to be solved by the Invention
[0004] The input device described in Patent Document
20 1 detects a pressing force associated with the
operation by the operating element. So, if an input
device can detect a smaller pressing force than that of
a publicly-known input device such as the input device
described in Patent Document 1, the input device can be
2 5 widely used in new applications.
[00051 In view of the circumstances as described
above, it i s an object of the present technology to
provide a sensor device, an input device, and an
electronic apparatus that are capable of detecting a
small pressing force.
5 Means for solving the Problem
[00061 According to an embodiment of the present
technology, there is provided a sensor device including
a f i r s t surface, a second surface, a support layer, and
a capacitive element.
10 The f i r s t surface and the second surface are
opposed to each other.
The support layer includes a f i r s t structure that
i s p a r t i a l l y arranged between the f i r s t surface and the
second surface and has a f i r s t height, and a space
15 portion formed between the f i r s t surface and the second
surface.
The capacitive element includes a f i r s t electrode
and a second electrode, the f i r s t electrode being
arranged on one of the f i r s t surface and the second
2 0 surface, the second electrode being arranged to be
opposed to the f i r s t electrode. The capacitive element
i s configured to generate a change in capacitance
between the f i r s t electrode and the second electrode in
accordance with a change in distance between the f i r s t
25 surface and the second surface that are opposed to each
other via the space portion.
With this configuration, the sensor device can
detect a small pressing force by the capacitive
element.
[00071 The support layer may further include a
5 second structure that is arranged in the space portion
and has a second height shorter than the first height.
With this configuration, the sensor device can
detect a smaller pressing force by the capacitive
element by the action of the second structure.
10 [00081 The second structure may be formed on at
least one of the first surface and the second surface.
With this configuration, the sensor device can
detect a smaller pressing force by the capacitive
element by the action of the second structure.
15 [00091 The sensor device may further include a third
surface that is arranged on an opposite side of the
first surface with respect to the second surface and is
opposed to the second surface, and a reference
electrode formed on the first surface. In this case,
20 the first electrode is formed on the second surface,
and the second electrode is formed on the third surface
that is opposed to the second surface on the opposite
side of the first surface.
With this configuration, the sensor device can
25 detect a small pressing force in a mutual capacitance
[OOlO] In the sensor device, the first electrode may
be formed on the first surface, and the second
electrode may be formed on the second surface.
With this configuration, the sensor device can
5 detect a small pressing force in a self-capacitance
system.
[0011] In the sensor device, the first electrode and
the second electrode may be formed on the first
surface.
With this configuration, the sensor device can
detect a small pressing force in a self-capacitance
system.
[0012] The sensor device may further include a
reference electrode formed on the first surface, and
15 the first electrode and the second electrode may be
formed on the second surface.
With this configuration, the sensor device can
detect a small pressing force in a mutual capacitance
system.
2 0 [0013] In the sensor device, the first structure may
be formed of a plurality of columnar bodies, and the
plurality of columnar bodies may be regularly arrayed.
With this configuration, in the sensor device, the
support layer can impart a uniform elastic force to the
25 first surface.
[0014] Each of the plurality of columnar bodies may
be formed to have one of a circular cross section and a
polygonal cross section that are parallel to the first
surface.
With this configuration, in the sensor device, the
5 support layer can impart a uniform elastic force to the
first surface.
[00151 According to another embodiment of the
present technology, there is provided a sensor device
including a base plate, a conductive layer, and a
10 support layer.
The base plate includes a plurality of first
electrodes, and a plurality of second electrodes
opposed to the plurality of first electrodes.
The conductive layer is opposed to the plurality
15 of first electrodes and has flexibility.
The support layer includes a plurality of
structures and a space portion. The plurality of
structures are arranged between the base plate and the
conductive layer and support the conductive layer.
20 The space portion is formed between the plurality
of structures and is capable of partially changing a
distance between the base plate and the conductive
layer.
[00161 The base plate may further include an
2 5 insulating layer provided between the plurality of
first electrodes and the support layer.
[00171 Each of the plurality of structures may be
arrayed in at least one portion of cross regions of the
plurality of first electrodes and the plurality of
second electrodes. In this case, each of the plurality
of structures may be formed of an elastic material.
[0018] Each of the plurality of structures may be
arrayed in a region other than cross regions of the
plurality of first electrodes and the plurality of
second electrodes. Alternatively, the base plate may
further include a base material that supports the
plurality of first electrodes, and each of the
plurality of structures may be arranged on the base
material.
[0019] The support layer may further include a
15 connection portion that is arranged between the
plurality of structures and the conductive layer and
connects the plurality of structures to the conductive
layer. Alternatively, each of the plurality of
structures may be formed of a connection material that
20 connects a gap between the base plate and the
conductive layer.
[00201 The support layer may further include a base
portion and a regulation portion. The base portion
supports the plurality of structures and is opposed to
25 the conductive layer with the space portion being
sandwiched therebetween. The regulation portion is
arranged on the base portion and inhibits contact of
the conductive layer to the base portion.
[0021] According to an embodiment of the present
technology, there is provided an input device including
5 one or more sensors and a controller.
The one or more sensors each include a first
surface, a second surface, a support layer, and a
capacitive element.
The first surface and the second surface are
10 opposed to each other.
The support layer includes a first structure that
is partially arranged between the first surface and the
second surface and has a first height, and a space
portion formed between the first surface and the second
15 surface.
The capacitive element includes a first electrode
and a second electrode, the first electrode being
arranged on one of the first surface and the second
surface, the second electrode being arranged to be
20 opposed to the first electrode. The capacitive element
is configured to generate a change in capacitance
between the first electrode and the second electrode in
accordance with a change in distance between the first
surface and the second surface that are opposed to each
25 other via the space portion.
The controller includes a detection unit that
detects the change in capacitance, and a signal
generation unit that generates an operation signal
based on a result of the detection of the detection
unit.
5 With this configuration, the input device can
detect a small pressing force by the capacitive
element.
[0022] The one or more sensors may include a
plurality of sensors. In this case, the detection unit
10 may determine, based on the change in capacitance of
the capacitive element, a first state in which an
operating element comes into contact with any of the
plurality of sensors and a change from the first state
to a second state in which the operating element
15 presses the sensor. With this, for example, a touch
operation and a push operation performed on the sensor
can be distinguished from each other based on whether
the amount of capacitance change exceeds a
predetermined threshold value or not.
2 0 [00231 Each of the plurality of sensors may further
include a third surface that is arranged on an opposite
side of the first surface with respect to the second
surface and is opposed to the second surface, and a
reference electrode formed on the first surface. In
25 this case, the first electrode is formed on the second
surface, and the second electrode is formed on the
third surface. With this configuration, each of the
sensors can detect a small pressing force in a mutual
capacitance system.
[0024] The first electrode may include an aggregate
of linear electrodes, and the second electrode may
include a planar electrode. With this, an area in which
the first electrode and the second electrode are
opposed to each other becomes small, and any of the
first and second electrodes can be capacitively coupled
to the reference electrode.
[0025] The first electrode may include a plurality
of first wiring electrodes arrayed in a first axis
direction. In this case, the second electrode may
include a plurality of second wiring electrodes arrayed
in a second axis direction crossing the first axis
direction, and each of the plurality of sensors may
include a plurality of crossing portions of the
plurality of first wiring electrodes and the plurality
of second wiring electrodes. With this, detection
sensitivities and output characteristics of high
linearity performance of the individual sensors are
ensured.
[0026] The plurality of crossing portions may be
formed at different densities for each of regions. With
this, desired output characteristics can be obtained.
[0027] Each of the plurality of sensors may include
a plurality of sensors each having a different
sensitivity of detecting a capacitance by the
capacitive element.
[0028] According to an embodiment of the present
technology, there is provided an electronic apparatus
including one or more sensors, a controller, and an
input operation unit.
The one or more sensors each include a first
surface, a second surface, a support layer, and a
capacitive element.
The first surface and the second surface are
opposed to each other.
The support layer includes a first structure that
is partially arranged between the first surface and the
second surface and has a first height, and a space
portion formed between the first surface and the second
surface.
The capacitive element includes a first electrode
and a second electrode, the first electrode being
arranged on one of the first surface and the second
surface, the second electrode being arranged to be
opposed to the first electrode. The capacitive element
is configured to generate a change in capacitance
between the first electrode and the second electrode in
accordance with a change in distance between the first
surface and the second surface that are opposed to each
other via the space portion.
The controller includes a detection unit that
detects the change in capacitance, and a signal
generation unit that. generates an operation signal
5 based on a result of the detection of the detection
unit.
The input operation unit is arranged on the first
surface side of the capacitive element.
With this configuration, the electronic apparatus
can detect a small pressing force applied to the input
operation unit by the capacitive element.
[0029] The input operation unit may be a flexible
display that displays an image based on the operation
signal. With this, input operability can be enhanced.
Effect of the Invention
[00301 As described above, according to the present
technology, it is possible to provide a sensor device,
an input device, and an electronic apparatus that are
capable of detecting a small pressing force.
Brief Description of Drawings
[0031]
[Fig. 11 Fig. 1 is a plan view of an input device
according to a first embodiment of the present
technology.
[Fig. 21 Fig. 2 is a cross-sectional view of the input
device taken along the line A-A' of Fig. 1.
[Fig. 31 Fig. 3 is a block diagram of an electronic
apparatus according to the first embodiment of the
present technology.
[Fig, 41 Fig. 4 is a plan view showing the
configuration of electrodes of the input device shown
in Fig. 1.
[Fig. 51 Fig. 5 is a diagram showing an example of
output signals of the input device shown in Fig. 1.
[Fig. 61 Fig. 6 is an explanatory diagram of a first
simulation.
[Fig. 71 Fig. 7 is an explanatory diagram of a second
simulation.
[Fig. 81 Fig. 8 is an explanatory diagram of the
second simulation.
[Fig. 91 Fig. 9 is a diagram showing a modified
example of a first structure shown in Fig. 1.
[Fig. 101 Fig. iO is a diagram showing a modified
example of the first structure shown in Fig. 1.
[Fig. 111 Fig. 11 is a diagram showing a modified
example of the first structure shown in Fig. 1.
[Fig. 121 Fig. 12 is an explanatory diagram of a third
simulation.
[Fig. 131 Fig. 13 is an explanatory diagram of a fourth
simulation.
[Fig. 141 Fig. 14 is a diagram showing an example of a
method of forming the first structure and a second
structure shown in Fig. 1.
[Fig. 151 Fig. 15 is a diagram showing modified
examples of a support layer shown in Fig. 1.
[Fig. 161 Fig. 16 is a cross-sectional view of an input
5 device according to a second embodiment of the present
technology.
[Fig. 171 Fig. 17 is a cross-sectional view of an input
device according to a third embodiment of the present
technology.
10 [Fig. 181 Fig. 18 is a cross-sectional view of an input
device according to a fourth embodiment of the present
technology.
[Fig. 191 Fig. 19 is a block diagram showing the
configuration of an input device according to a fifth
15 embodiment of the present technology.
[Fig. 201 Fig. 20 is a fragmentary cross-sectional view
of a main part of the input device.
[Fig. 211 Fig. 21 is a schematic diagram for describing
characteristic examples of a sensor matrix in which a
20 plurality of sensors are two-dimensionally arrayed.
[Fig. 221 Fig. 22 is a fragmentary plan view
schematically showing the configuration example of
electrodes of the sensor matrix.
[Fig. 231 Fig. 23 is a schematic diagram showing some
25 configuration examples of electrodes.
[Fig. 241 Fig. 24 is a fragmentary plan view
schematically showing another configuration example of
electrodes of the sensor matrix.
[Fig. 251 Fig. 25 is a partially enlarged view of the
configuration example of electrodes
5 [Fig. 261 Fig. 26 is a fragmentary plan view
schematically showing still another configuration
example of electrodes of the sensor matrix.
[Fig. 271 Fig. 27 is a cross-sectional view of an input
device according to a sixth embodiment of the present
10 technology.
[Fig. 281 Fig. 28 is a cross-sectional view of an input
device according to a modified example of Fig. 27.
[Fig. 291 Fig. 29 is a cross-sectional view of an input
device according to a modified example of Fig. 27.
15 [Fig. 301 Fig. 30 is a cross-sectional view of an input
device according to a modified example of Fig. 29.
[Fig. 311 Fig. 31 is a cross-sectional view of an input
device according to a modified example of Fig. 29.
[Fig. 321 Fig. 32 is a cross-sectional view of an input
device according to a modified example of Fig. 27.
[Fig. 331 Fig. 33 is an exploded perspective view of a
main part of the input device of Fig. 32.
[Fig. 341 Fig. 34 is a cross-sectional view of an input
device according to a modified example of Fig. 27.
[Fig. 351 Fig. 35 is a cross-sectional view of an input
device according to a seventh embodiment of the present
technology.
[Fig. 361 Fig. 36 is a plan view of a flexible keyboard
of the input device shown in Fig. 35.
[Fig. 371 Fig. 3.7 is a plan view of a support layer of
5 the input device shown in Fig. 35.
[Fig. 381 Fig. 38 is a plan view of a base plate of the
input device shown in Fig. 35.
[Fig. 391 Fig. 39 is a cross-sectional view of the
input device taken along a direction of the line B-B'
of Fig. 38.
[Fig. 401 Fig. 40 is a cross-sectional view of a main
part, for describing an action of the input device
shown in Fig. 35.
[Fig. 411 Fig. 41 is a cross-sectional view of a main
part, for describing an action of the input device
shown in Fig. 27.
Mode(s) for Carrying Out the Invention
[0032] Hereinafter, embodiments of the present
technology will be described with reference to the
drawings. The drawings show an X axis, a Y axis, and a
Z axis that are orthogonal to one another. Those axes
are common in the following embodiments.
[00331
(Overall Configuration)
Fig. 1 is a plan view of an input device 1
according to a first embodiment of the present
technology. Fig. 2 is a cross-sectional view of the
input device 1 taken along the l i n e A-A' of Fig. 1.
Fig. 3 is a block diagram of an e l e c t r o n i c apparatus z
using the input device 1.
5 [0034] The input device 1 includes a f l e x i b l e
display 10 and a sensor device 11. In Fig. 1, the
f l e x i b l e display 10 is omitted and t h e i n t e r n a l
s t r u c t u r e of the sensor device 11 is schematically
shown. Each of the input device 1 and t h e f l e x i b l e
10 display 10 has a p l a t e - l i k e shape extending i n a
d i r e c t i o n perpendicular t o the Z a x i s .
[00351 The f l e x i b l e display 10 has a f u n c t i o n as an
input operation u n i t i n the input device 1 and a
function as a display u n i t i n t h e e l e c t r o n i c apparatus
15 z. In other words, t h e f l e x i b l e display 10 receives an
operation by a user on an upper ( f r o n t ) surface i n a Za
x i s d i r e c t i o n t o serve as an input operation u n i t of
the i n p u t device 1, and a l s o displays an image
corresponding t o an operation by the user upwardly i n
20 the Z-axis d i r e c t i o n t o serve a s a display u n i t of the
e l e c t r o n i c apparatus z . Examples of an operating
element t o perform an operation on the f l e x i b l e d i s p l a y
1 0 include a f i n g e r f shown i n Fig. 2(B) and a s t y l u s s
shown i n Fig. 2 ( C ) .
25 [0036] As the f l e x i b l e display 10, a commonlya
v a i l a b l e d i s p l a y can be used. Examples of such a
commonly-available display include a so-called
electronic paper, an organic EL (electroluminescence)
panel, an inorganic EL panel, and a liquid crystal
panel.
[0037] The sensor device 11 is arranged on a lower
(back) surface in the Z-axis direction of the flexible
display 10. Further, the sensor device 11 includes a
base plate llb including an X electrode 12 and a Y
electrode 13. The X electrode 12 and the Y electrode 13
constitute a capacitive element of a mutual capacitance
system. Furthermore, the sensor device 11 includes a
reference electrode 14, and due to the proximity of the
reference electrode 14 to the base plate llb, a
capacitance between the X electrode 12 and the Y
electrode 13 changes. Typically, the reference
electrode 14 is connected to a ground potential.
[0038] The input device 1 includes a controller c,
and the controller c includes a determination unit cl
(detection unit) and a signal generation unit c2. The
determination unit cl detects an operation by the user
based on a change in capacitance (between the X
electrode 12 and the Y electrode 13) of the sensor
device 11. The signal generation unit c2 generates an
operation signal based on a detection result by the
determination unit cl.
[0039] The electronic apparatus z shown in Fig. 3
includes a processing device p that performs processing
based on the operation signal generated by the signal
generation unit c2 of the input device 1. The operation
signal processed by the processing device p is output
to the flexible display 10 (input operation unit) as an
image signal, for example.
[00401 (Sensor Device)
The base plate llb is constituted by a laminate of
a plurality of base materials including a base material
on which the X electrode 12 is formed and a base
material on which the Y electrode 13 is formed. In this
embodiment, since the input device 1 itself is
deformable in a thickness direction, a deformable base
plate is used as the base plate llb. Examples of a
15 material that forms the base materials include
translucent or non-translucent resin materials made of
PET (polyethylene terephthalate), PEN (polyethylene
naphthalate), PI (polyimide), PC (polycarbonate), and
the like.
[0041] It should be noted that in the case where the
input device 1 itself is not deformable, the base plate
llb may not be deformable. In this case, as a material
forming the base materials, for example, hard materials
such as ceramic materials can'be used.
LOO421 Here, attention is focused on only the
electrodes 12, 13, and 14. The X electrode 12, the Y
electrode 13, and the reference electrode 1 4 are formed
on respective three surfaces that are orthogonal to the
Z axis and different from one another. Specifically,
the X electrode 12 is formed on an upper surface of the
5 base plate l l b in the Z-axis direction, the Y electrode
13 i s formed in the base plate l l b , and the reference
electrode 1 4 is formed on a lower surface of the
flexible display 10 in the Z-axis direction. So, those
electrode groups are aligned in the order of the
10 reference electrode 1 4 , the X electrode 1 2 , and the Y
electrode 13 from the top to the bottom in the Z-axis
direction.
LOO431 As described above, i n the sensor device 11,
the X electrode 12 and the Y electrode 13 constitute a
15 capacitive element, and a change in capacitance between
the X electrode 12 and the Y electrode 13 is detected.
On the other hand, the X electrode 12 and the reference
electrode 1 4 that are opposed t o each other also
constitute a capacitive element. When the reference
2 0 electrode 1 4 comes close to the base plate l l b , a
capacitance between the X electrode 12 and the
reference electrode 1 4 increases, and a capacitance
between the X electrode 12 and the Y electrode 13
decreases. In such a manner, i n the sensor device 11,
25 the proximity of the reference electrode 14 can be
detected based on a decrease in capacitance between the
X electrode 12 and the Y electrode 13.
[0044] It should be noted t h a t i n t h i s embodiment,
the reference electrode 1 4 is formed on the lower
surface of t h e f l e x i b l e display 10 i n the Z-axis
5 d i r e c t i o n . In the sensor device 11, however, the
reference electrode 14 only needs t o be arranged a t a
p o s i t i o n upwardly opposed t o the X electrode 12 i n the
Z-axis d i r e c t i o n . So, the reference electrode 1 4 may be
formed independently or may be formed i n a base p l a t e
10 e l a s t i c a l l y deformable, which is d i f f e r e n t from the
f l e x i b l e display 10.
[0045] The sensor device 11 includes a p l u r a l i t y of
first s t r u c t u r e s 15 arranged between the base p l a t e 1 l b
and the reference electrode 1 4 . Each of the first
15 s t r u c t u r e s 15 is a columnar body having a shape of a
c i r c u l a r cone whose top is cut off by a surface
p a r a l l e l t o a bottom surface, and having a center a x i s
extending i n the Z-axis d i r e c t i o n . The p l u r a l i t y of
f i r s t s t r u c t u r e s 15 a r e arranged r e g u l a r l y (at equal
20 i n t e r v a l s ) i n an X-axis d i r e c t i o n and a Y-axis
d i r e c t i o n . The f i r s t s t r u c t u r e s 15 a r e each formed of
an e l a s t i c a l l y deformable m a t e r i a l . Examples of such a
material include PET, a s i l i c o n r e s i n , and a sponge.
The upper surface of the f i r s t s t r u c t u r e 15 i n the Z-
2 5 a x i s d i r e c t i o n and the lower surface of the reference
electrode 1 4 i n the Z-axis d i r e c t i o n a r e bonded by a
bonding layer 18. The bonding layer 18 is formed of a
UV ( u l t r a v i o l e t ) curable r e s i n material, f o r example.
It should be noted t h a t the upper surface of the f i r s t
s t r u c t u e s 15 i n the Z-axis d i r e c t i o n and the lower
5 surface of the r e f e r e n c e e l e c t r o d e 1 4 i n the Z-axis
d i r e c t i o n may be i n d i r e c t contact with each other
without the bonding layer 1 8 .
[00461 Each of the first s t r u c t u r e s 15 has a
function as a support member t h a t supports the
10 reference electrode 1 4 i n a s t a t e where the reference
electrode 1 4 is away from the base p l a t e l l b . In other
words, the first s t r u c t u r e s 15 form a space portion 17
between the base p l a t e l l b and the reference electrode
1 4 . With t h i s , a support layer l l a containing the first
15 s t r u c t u r e s 15 and the space portion 17 is formed
between the base p l a t e l l b and the reference electrode
1 4 .
roo471 Second s t r u c t u r e s 16 are formed between the
f i r s t s t r u c t u r e s 15 on the upper surface of the base
20 p l a t e l l b i n the Z-axis d i r e c t i o n . As shown i n Fig. 1,
each of the second s t r u c t u r e s 16 has a square cross
section orthogonal t o the Z a x i s and is arranged a t
each position at which the X electrode 12 and the Y
electrode 13 cross each other. Further, as shown i n
25 Fig. 2, the height of the second s t r u c t u r e 16 is lower
than the height of the f i r s t s t r u c t u r e 15 (or the
support layer 1 l a ) . For that reason, the space portion
17 i s formed between the second structures 16 and the
reference electrode 1 4 .
[0048] Fig. 2 ( B ) shows a s t a t e where the flexible
5 display 10 receives an operation by the finger f of a
user. In t h i s s t a t e , the finger f exerts a force on the
flexible display 10 downwardly in the Z-axis direction.
A t that time, the flexible display 10 is deflected
downwardly in the Z-axis direction. The reference
10 electrode 1 4 bonded to the flexible display 10 i s
deflected downwardly in the Z-axis direction together
with the flexible display 10 and comes close to the
base plate l l b . With t h i s , a capacitance of the sensor
device 11 decreases.
15 [0049] As described above, the second structures 16
are formed between the reference electrode 1 4 and the
base plate l l b . Since the material forming the second
structures 1 6 has a specific d i e l e c t r i c constant higher
than that of a i r present in the space portion 17, a
20 capacitance between the X electrode 12 and the
reference electrode 1 4 is large as compared with the
structure without the second structures 1 6 . As the
capacitance between the X electrode 12 and the
reference electrode 1 4 becomes,larger, a change in
25 capacitance between the X electrode 12 and the
reference electrode 1 4 , which i s associated with a
displacement of the reference electrode 14 to the X
electrode 12 side, becomes larger.
[0050] On the other hand, as the change in
capacitance bet.ween the X electrode 12 and the
5 reference electrode 14 becomes larger, a change in
capacitance between the X electrode 12 and the Y
electrode 13 also becomes larger. So, in the sensor
device 11, due to the action of the second structures
16, a change in capacitance between the X electrode 12
10 and the Y electrode 13, which is associated with a
displacement of the reference electrode 14 to the X
electrode 12 side, becomes larger. For that reason, in
the sensor device 11, also in the case where the
displacement of the reference electrode 14 to the X
electrode 12 side is small, that displacement can be
detected. In other words, the sensor device 11 has a
high sensitivity for detecting a pressing force
associated with an operation on the flexible display 10
by the user.
[0051] As shown in Fig. 2 ( B ) , in association with
the downward deflection of the flexible display 10 by
being pressed by the finger f, the first structures 15
below the flexible display 10 are elastically deformed.
For that reason, when the finger f moves away from the
flexible display 10, the flexible display 10 and the
reference electrode 14 are pushed up by an elastic
r e s t o r i n g force of the f i r s t s t r u c t u r e s 15, and the
input device 1 is returned t o the s t a t e shown i n Fig.
2 (A) .
[00521 Fig. 2(C) shows a s t a t e where the f l e x i b l e
display 10 receives an operation by t h e s t y l u s s. As i n
the case shown i n Fig. 2 ( B ) where the operating element
is the f i n g e r f, the same holds t r u e f o r t h e case where
the operating element is t h e s t y l u s s. The material
forming the s t y l u s s may be a m a t e r i a l hard enough t o
be capable of pressing the f l e x i b l e display 10.
Examples of such a material include a metal material
and a r e s i n material such as p l a s t i c .
[0053] (Configuration of Electrodes of Sensor
Device)
Fig. 4 is a plan view of the sensor device 11 seen
from above i n the Z-axis d i r e c t i o n , showing only the
electrode 12 and the Y electrode 13 i n the sensor
device 11. The X electrode 12 and the Y electrode 13
are each c o n s t i t u t e d of a p l u r a l i t y of wiring
20 e l e c t r o d e s arrayed p a r a l l e l t o one another and form a
so-called cross-matrix. The sensor device 11 includes n
columns of the X electrodes 12 extending i n the Y-axis
d i r e c t i o n thereof over the e n t i r e range, and m rows of
the Y e l e c t r o d e s 13 extending i n the X-axis d i r e c t i o n
25 thereof over the e n t i r e range. The X electrodes 12 a r e
arrayed over the e n t i r e range of the input device 1 i n
the X-axis direction, and the Y-axis electrodes are
arrayed over the entire range of the input device 1 in
the Y-axis direction.
[0054] In the sensor device 11, the capacitive
5 elements shown in Fig. 2 are formed at respective
positions at which the X electrodes 12 and the Y
electrodes 13 cross each other. So, the sensor device
11 includes n*m pieces of capacitive elements 50. In
the sensor device 11, since larger values of n and m
10 provide a higher density of the capacitive elements on
the XY plane, an operation position can be detected
more accurately.
lo0551 (Controller)
The controller c is typically constituted of a CPU
15 (Central Processing Unit) or an MPU (Micro-Processing
Unit). In this embodiment, the controller c includes
the determination unit cl and the signal generation
unit c2 and executes various functions according to
programs stored in a storage unit not shown in the
20 figure. The determination unit cl determines the state.
of the flexible display 10 based on an electrical
signal (input signal) output from the sensor device 11.
he signal generation unit c2 generates an operation
signal based on the determination result.
2 5 [00561 Further, the controller c includes a drive
circuit for driving the inp& device 1. The drive
circuit outputs a drive signal to each of the
capacitive elements 50 at predetermined time intervals.
Furthermore, the determination unit cl processes an
output for the drive signal from each of the capacitive
5 elements 50 and determines an input operation on the
input device 1 by the user.
[0057] Fig. 5 is a diagram showing an example of
output signals that are output from the sensor device
11 when the flexible display 10 receives an operation
by the finger f of the user. A bar chart shown along
the X axis of Fig. 5 indicates the amount of
capacitance change from a reference capacitance in any
capacitive element formed by each X electrode 12.
Further, a bar chart shown along the Y axis of Fig. 5
indicates the amount of capacitance change from a
reference capacitance in any capacitive element formed
by each Y electrode 13.
[0058] The determination unit cl of the controller c
shown in Fig. 3 calculates coordinates in the X-axis
direction and the Y-axis direction of the operation
position by the finger f on the flexible display 10,
based on the amounts of capacitance change obtained
from the X electrodes 12 and the Y electrodes 13.
Specifically, in Fig. 5, the determination unit cl
calculates an X coordinate of the operation position by
the finger f based on a ratio of the amounts of
capacitance change in the sensor device 11 formed by
the X electrodes 12 (XI, X2, X3, X4), and calculates a
Y coordinate of the operation position by the finger f
based on a ratio of the amounts of capacitance change
5 in the sensor device 11 formed by the Y electrodes 13
(Yl, Y2, Y3, Y4). With this,, the determination unit cl
outputs the coordinates of the operation position in
the flexible display 10 to the signal generation unit
c2 (see Fig. 3) .
[0059] The determination unit cl can use, as an
evaluation value on whether the flexible display 10
receives an operation or not, the maximum value of the
amounts of capacitance change in the capacitive
elements formed by the respective X electrodes 12 or Y
electrodes 13.
[00601 Further, the determination unit cl can use,
as an evaluation value on whether the flexible display
10 receives an operation or not, a combined value of
the amounts of capacitance change in the capacitive
elements formed by the respective X electrodes 12 (the
combined value is a combined value of values of the bar
chart shown along the X axis of Fig. 5 and is
hereinafter referred to as X combined value). Further,
instead of the X combined value, a combined value of
the amounts of capacitance change in the capacitive
elements formed by the respective Y electrodes 13 (the
combined value is a combined value of values of the bar
chart shown along the Y axis of Fig. 5 and is
hereinafter referred to as Y combined value) may be
used. Furthermore, instead of the X combined value or
5 the Y combined value, a value obtained by further
adding the X combined value and the Y combined value
may be used.
[00611 Specifically, a threshold value is set for
the determination unit cl. In the case where the
10 evaluation value is the threshold value or larger, the
determination unit cl determines that the flexible
display 10 receives an operation. The determination
unit cl outputs a result of the determination to the
signal generation unit c2 (see Fig. 3). The signal
15 generation unit c2 generates an operation signal in
accordance with the output signal from the
determination unit cl.
[0062] The determination unit cl can set any value
as a threshold value. For example, the determination
unit cl can set a low threshold value for users such as
women and children having weak finger power or a high
threshold value for users having strong finger power.
[0063] In such a manner, in the input device 1
according to this embodiment, it is possible to
accurately determine a position at which the flexible
display 10 receives an operation.
[0064] (Structure of support layer)
In this embodiment, as described above, the
reference electrode 14 and the flexible display 10 are
supported by the base plate llb via the support layer
lla. The support layer lla has a configuration in which
the reference electrode 14 and the flexible display 10
are supported on the base plate llb by only the
plurality of first structures 15 shown in Figs. 1 and
2.
[00651 In this embodiment, with the configuration of
the support layer lla, sufficient displacements of the
reference electrode 14 and the flexible display 10
downwardly in the Z-axis direction can be obtained,
also in the case where the user performs an operation
by a smaller pressing force.
COO661 Hereinafter, simulations that were performed
in order to study the configuration of the support
layer lla will be described.
100671 (1) First Simulation
Fig. 6(A) is a schematic configuration diagram of
a first simulation. This simulation was performed on
the assumption that the support layer is filled with a
single material, unlike the support layer lla according
to this embodiment.
[0068] In this simulation, as shown in Fig. 6(A), a
model constituted of a sheet 110 having a Young's
modulus E that is the same as a Young's modulus E of
the flexible display 10 according to this embodiment, a
support layer llla filled with a single material having
a varying Young's modulus E, and a base material b
formed of a sufficiently hard material is used. The
thickness T of the sheet 110 was set to 300 [pml, 500
[w], and 800 [pm], and a lower surface of the support
layer llla in the Z-axis direction was restricted by
the base material b.
[00691 In the model shown in Fig. 6(A), assuming
that the sheet 110 receives an operation by a small
pressing force, a calculation was performed under a
condition that the sheet 110 is pressed by a constant
force (0.25 [N]) with use of a cylindrical pressing
element P having a diameter of 3 [mml.
[00701 Fig. 6(B) shows results of the calculation
for a displacement d of the lower surface of the sheet
110 in the Z-axis direction. In Fig. 6(B), the
horizontal axis indicates a Young's modulus E of a
material with which the support layer llla is filled,
and the vertical axis indicates a displacement d of the
lower surface of the sheet 110 in the Z-axis direction.
[00711 The results of this simulation show a trend
of a larger displacement d as the Young's modulus E of
the material with which the support layer llla is
filled becomes lower, and of a larger displacement as
the thickness T of the sheet 110 becomes thinner.
[00721 The thickness T of the sheet 110 is actually
determined based on the design of an electronic
apparatus. In particular, in the case where the
5 flexible display 10 is adopted as the sheet 110 as in
this embodiment, it is difficult to reduce the
thickness T technically in some cases. So, in order to
sufficiently increase the displacement d of the lower
surface of the sheet 110 in the Z-axis direction, there
10 is a demand for use of a material having a sufficiently
small Young's modulus E as a material with which the
support layer llla is filled.
[00731 In this embodiment, when the lower surface of
the sheet 110 in the Z-axis direction at the operation
15 by the user shown in Fig. 2 (B) and Fig. 2 ( C ) has a
displacement of 1 [p] or larger, a capacitance change
in the sensor device 11 can be sufficiently detected.
Further, the flexible display 10 according to this
embodiment has a thickness of 800 [pm].
2 0 roo741 So, in this embodiment, under a condition
that T=800 [p], it is desirable that the lower surface
of the sheet 110 in the Z-axis direction have a
displacement d of 1 [p] or larger. To that end, it is
necessary that the Young's modulus E of a material with
2 5 which the support layer llla is filled be 0.1 [MPa] or
smaller.
[0075] However, the Young's modulus E of a
generally-used silicon resin is about several tens to
several hundreds of [MPa]. The Young's modulus E of a
sponge, having a low Young's modulus E, remains about 1
to 10 [MPa]. Further, with a special sponge that is
formed so as to reduce a Young's modulus E more, it is
difficult to reduce a Young's modulus E to be 0.1 [MPa]
or smaller.
[0076] In such a manner, since a Young's modulus E
that can be expected for a single material has a
limitation, it was found that in this embodiment, a
sufficient displacement d associated with the operation
of a user is not obtained in the configuration in which
the support layer lla is filled with a single material.
[00771 (2) Second Simulation
Figs. 7 (A) and 8 (A) are schematic configuration
diagrams of a second simulation. In this simulation,
unlike the configuration as in the first simulation, in
which the support layer llla is filled with a single
material, a configuration in which cylindrical first
structures 115 are arranged at intervals in the X-axis
direction and the Y-axis direction in the support layer
llla was studied. In this configuration, in the support
layer llla, the first structures 115 and space portions
117 are alternately aligned in the X-axis direction and
the Y-axis direction.
[0078] First, as shown in Fig. 7 (A), with the
diameter of the first structure 115 being set to 100
[PI, calculations were performed for the following
four models in which a Young's modulus E of a material
forming the first structure 115 and an interval L of
the first structures 115 are changed.
Model a: E=2 [GPa], L=l [mm]
Model b: E=2 [GPa], L=2 [mm]
Model c: E=100 [MPa], L=l [mm]
Model d: E=100 [MPa], L=2 [mm]
[0079] In each model, as in the first simulation, a
calculation was performed under a condition that the
sheet 110 is pressed by a constant force (0.25 [N])
with use of a cylindrical pressing element P having a
15 diameter of 3 [mm] .
[0080] Fig. 7(B) shows results of the calculation
for a displacement d of the lower surface of the sheet
110 in the Z-axis direction. In Fig. 7(B), the
horizontal axis indicates a model name, and the
20 vertical axis indicates a displacement d of the lower
surface of the sheet 110 in the Z-axis direction.
[0081] The results of this simulation show a trend
of a larger displacement d of the lower surface of the
sheet 110 in the Z-axis direction as the Young's
25 modulus E of the first structures 115 becomes lower and
as the intervals between the first structures 115
become larger.
[00821 In this simulation, a large displacement d is
obtained for the magnitude of the Young's modulus E of
the material forming the first structures 115. This
5 results from the fact that the sheet 110 is supported
by the whole of the support layer llla in the first
simulation, while the sheet 110 is supported by only
portions, having the first structures 115, of the
support layer llla in this simulation.
10 [0083] In other words, in this simulation, a support
area of the sheet 110 in the support layer llla is
reduced and thus the hardness of the support layer llla
in the Z-axis direction (hereinafter, referred to as
"apparent Young's modulus E"') is reduced. Thus, a
15 large displacement d is obtained.
[0084] So, in order to reduce an apparent Young's
modulus E' of the support layer llla, a method of
reducing the support area of the sheet 110 in the
support layer llla is effective. As such a method,
20 there are conceived a method of reducing the diameter 9
of the first structures 115 and a method of increasing
the interval L between the first structures 115.
However, when the interval L between the first
structures 115 is too large, there is a possibility
that the support layer llla cannot support the sheet
110 appropriately. Thus, the method of reducing the
diameter q of the first structures 115 was studied.
[0085] As shown in Fig. 8(A), with the diameter q of
the first structures 115 being reduced from 100 [pm] to
50 [PI, calculations were performed for the' following
5 four models in which the Young's modulus E of the first
structures 115 and the interval L of the first
structures 115 are changed.
Model a: E=2 [GPal, L=l [mml
Model b: E=2 [GPal, L=2 [mm]
Model c: E=100 [MPal, L=l [mm]
Model d: E=100 [MPa], L=2 [mm]
[0086] In each model, as in the first simulation, a
calculation was performed assuming a case where the
sheet 110 is pressed by a constant force (0.25 [N])
15 with use of a cylindrical pressing element P having a
diameter of 3 [mml .
[00871 Fig. 8 ( B ) shows results of the calculation
for a displacement d of the lower surface of thesheet
110 in the Z-axis direction. In Fig. 8(B), the
2 0 horizontal axis indicates a model name, and the
vertical axis indicates a displacement d of the lower
surface of the sheet 110 in the Z-axis direction. The
value of the displacement d of the lower surface of the
sheet 110 in the Z-axis direction in each model became
25 larger than in the first simulation across the board.
In particular, in the model d (E=100 [MPal , ~ = 2[m ml ) ,
the displacement d exceeded 1 [pm], and the apparent
Young's modulus E ' of the support layer llla was 0.1
[MPal or smaller.
[00881 The first.and second simulations leaded to
5 the configuration in which the reference electrode 14
and the flexible display 10 are supported by only the
first structures 15 in the support layer lla according
to this embodiment.
[00891 (First Structure)
The first structure 15 can have any shape other
than the shape shown in Fig. 2 and the cylindrical
shape shown in the simulation described above. For
example, the first structure 15 may have a shape having
a step in the Z-axis direction shown in Fig. 9 ( A ) , a
15 shape having a domal upper portion shown in Fig. 9(B),
or a shape having a groove 15a on the upper end shown
in Fig. 9(C). In this case, as compared with the
structure having a cylindrical shape, the amount of
compressive deformation in the Z-axis direction can be
20 increased, and the domal shape having a larger
curvature can provide a larger amount of deformation.
Further, the shape of the first structure 15 may not
have a circular cross section orthogonal to the Z axis
as in the case of the cylinder (circular cone). The
25 shape of the first structure 15 may have a polygonal
cross section orthogonal to the Z axis or may have a
cross section of a quadrangular prism (square pyramid)
or a triangular prism (triangular pyramid), for
example.
[0090] Further, the arrangement of thc first
5 structures 15 on the XY plane may not have a uniform
configuration across the entire surface as shown in
Fig. 10(A). For example, the arrangement of the first
structures 15 may have a configuration as shown in
10(B) in which only an outer edge portion has a high
10 density, or may have a configuration as shown in Fig.
10(C) in which nothing is arranged in a certain region.
Further, the first structures 15 may be different from
one another in size as shown in Fig. 10(D).
[00911 Furthermore, the first structures 15 may not
15 be columnar and may be, for example, wall-like.
Examples of wall-like first structures 15 include a
grid-like first structure 15 shown in Fig. 11(A), a
combination of rectangles having different diameters
shown in Fig. 11(B), and a radial first structure 15
20 shown in Fig. 11 (C) .
[00921 (Second Structure)
As described above, the second structures 16
increase a change in capacitance between the X
electrode 12 and the Y electrode 13, which is
25 associated with a displacement of the reference
electrode 14 to the X electrode 12 side, by increasing
the capacitance between the X electrode 12 and the
reference electrode 14.
[00931 Hereinafter, simulations that were performed
in order to study the configuration of the second
5 structures 16 will be described.
[0094] (3) Third Simulation
Fig. 12(A) is a schematic configuration diagram of
a third simulation. In this simulation, the thickness
of a second structure 116 in the Z-axis direction was
10 studied. For the simulation, a model shown in Fig.
12(A), which is the same as in this embodiment, was
used. The model is constituted of a sheet 110, a
support layer llla, and a base plate lllb. As in the
input device 1 according to this embodiment, the base
15 plate lllb includes an X electrode 112 and a Y
electrode 113, and a reference electrode 114 is formed
on a lower surface of the sheet 110 in the Z-axis
direction.
[0095] First structures 115 are arranged in the
20 support layer llla such that a space portion 117 having
an interval H in the Z-axis direction is formed between
the base plate lllb and the reference electrode 114. It
was assumed that the second structure 116 is arranged
at a position at which the X electrode 112 and the Y
2 5 electrode 113 cross each other, and in the shape of the
second structure 116, a cross section orthogonal to the
Z axis is a square and the height in the Z-axis
direction is HI.
[00961 In the model shown in Fig. 12(A), a
calculation was performed under a condition that the
sheet 110 is pressed with use of a cylindrical pressing
element P having a diameter of 5 [mm] and the lower
surface of the sheet 110 in the Z-axis direction is
displaced downwardly in the Z-axis direction by 3 [pm].
The value of H was set to 30 [pm] and 50 [pm]. The
magnitude of the initial capacitance between the X
electrode 112 and the Y electrode 113 was set to 3
[PFI.
[00971 Fig. 12(B) is a graph showing a change in
change value AC of a capacitance before and after the
press of the sheet 110 with use of the pressing element
P, based on the magnitude of HI. With H=30 [pm] and
H=50 [pm], it was found that as the value of the
thickness H1 of the second structure 116 becomes
larger, the change value AC of the capacitance becomes
larger.
[0098] By this simulation, it was found that as the
second structure 16 according to this embodiment
becomes thicker, a change in capacitance becomes larger
and thus the sensitivity of the sensor device 11
becomes higher.
(4) Fourth Simulation
[0099] Fig. 13(A) is a schematic configuration
diagram of a fourth simulation. In this simulation, a
simulation model shown in Fig. 13(A) was used to study
the widths in the X-axis direction and the Y-axis
5 direction of the second structure 116. The thickness H
of the support layer llla was set to 50 [pm], and the
thickness H1 of the second structure 116 was set to 30
[ P I . An outer width of the second structure 116 from
the X electrode 112 was set to L1.
[ 01001 Fig. 13(B) is a graph showing a change in
change value AC of a capacitance before and after the
press of the sheet 110 with use of the pressing element
P, based on the magnitude of H1. It was found that when
an outer length L1 of the second structure 116 from the
15 X electrode 112 is 300 or larger, a sufficient change
value AC of a capacitance is obtained.
[OlOl] It should be noted that the second structure
16 only needs to be formed in the support layer lla,
and the shape thereof is not limited. In this
embodiment, the second structure 16 has a shape whose
cross section orthogonal to the Z axis is a square, but
may have a shape whose cross section orthogonal to the
Z axis is circular or of any polygon, for example.
Further, a part or all of the outer shape of the second
structure 16 may be formed of a curved surface.
[0102] (Method of Forming First Structure and Second
Structure)
Fig. 14 is a diagram showing a method of forming
the first structures 15 and the second structures 16 of
the input device 1 according to this embodiment. First,
as shown in Fig. 14(A), a UV resin R is arranged on the
translucent base plate llb. As the resin R, a solid
sheet material or a liquid UV curable material may be
used. As shown in Fig. 14 (B) , with use of a roll die M
having a predetermined concavo-convex shape pattern,
the concavo-convex shape pattern of the die M is
transferred onto the UV resin R, and a UV application
is performed from the base material llb side to harden
the UV resin R. In such a manner, as shown in Fig.
14(C), the first structures 15 and the second
structures 16 are formed on the base plate llb. It
should be noted that the first structures 15 and the
second structures 16 may be formed by, in addition to
the forming using the UV resin described above, for
example, general thermoforming (for example, press
forming or injection molding) or discharge of a resin
material with use of a dispenser or the like.
[0103] (Modified Example of Configuration of Support
Layer)
Fig. 15 shows modified examples of the support
layer lla according to this embodiment. The support
layer lla may have the second structures 16 each having
domal, curved upper surface i n the Z-axis d i r e c t i o n a s
shown i n Fig. 15(A), or the second s t r u c t u r e s 16 may be
formed of a material d i f f e r e n t from the f i r s t
s t r u c t u r e s 15 a s shown i n Fig. 15(B).
[0104] Further, i n the support layer l l a , as shown
i n Fig. 15(C), the bonding layer 18 may be caused t o
protrude downwardly t o provide second s t r u c t u r e s 18b on
the upper s i d e i n the Z-axis d i r e c t i o n , s e p a r a t e l y from
the second s t r u c t u r e s 1 6 on the lower s i d e i n the Za
x i s d i r e c t i o n . In t h i s case, the second s t r u c t u r e s 18b
increase a capacitance between the X electrode 12 and
the reference electrode 14 as i n the case of the second
s t r u c t u r e s 1 6 . The support layer l l a only needs t o be
provided with any one of t h e s t r u c t u r e s 16 and the
s t r u c t u r e s 18b. It should be noted t h a t both of the
s t r u c t u r e s 1 6 and the s t r u c t u r e s 18b may be omitted a s
necessary.
[0105] Further, i n the support layer l l a , the f i r s t
s t r u c t u r e 15 and the second s t r u c t u r e 16 may be
continuously formed a s shown i n Fig. 15(D), a s t e p may
be formed on the upper surface of the second s t r u c t u r e
1 6 i n the Z-axis d i r e c t i o n as shown i n Fig. 15(E), and
the height of each second s t r u c t u r e 16 may d i f f e r as
shown i n Fig. 1 5 ( F ) .
[01061
Fig. 16 is a fragmentary cross-sectional view of
an input device 2 according to a second embodiment of
the present technology. The configuration other than a
sensor device 21 of the input device 2 according to
this embodiment is the same as that of the first
5 embodiment, and description thereof will be omitted as
appropriate. Fig. 16 corresponds to Fig. 2 according to
the first embodiment.
[01071 (Overall Configuration)
The input device 2 according to this embodiment
10 includes a sensor device 21, which is different from
that of the first embodiment, and a flexible display
10, which is the same as that of the first embodiment.
The sensor device 21 includes an X electrode 22 and a Y
electrode 23 that are opposed to each other. The X
15 electrode 22 and the Y electrode 23 constitute a
capacitive element of a self-capacitance system.
Further, due to the proximity of the X electrode 22 to
the Y electrode 23, in the sensor device 21, a
capacitance between the X electrode 22 and the Y
2 0 electrode 23 increases.
[01081 (Sensor Device)
The Y electrode 23 is formed on an upper surface
of a base plate 21b in the Z-axis direction. On the
other hand, the X electrode 22 is formed on a lower
2 5 surface of the flexible display 10 in the Z-axis
direction. In the sensor device 21, the proximity of
the X electrode 22 t o the Y electrode 23 can be
detected based on a decrease i n capacitance between the
X electrode 22 and the Y electrode 23.
[0109] The sensor device 21 includes a p l u r a l i t y of
first s t r u c t u r e s 25 arranged between the base p l a t e 21b
and t h e f l e x i b l e display 10. The f i r s t s t r u c t u r e s 25
have the same configuration a s the f i r s t s t r u c t u r e s 15
according t o the f i r s t embodiment. The upper surface of
the first s t r u c t u r e 25 i n the Z-axis d i r e c t i o n and the
lower surface of the f l e x i b l e display 10 i n the Z-axis
d i r e c t i o n are bonded by a bonding layer 28. With t h i s ,
a support layer 21a containing the first s t r u c t u r e s 25
and a space portion 27 is formed between the base p l a t e
21b and the f l e x i b l e display 10.
[OllO] Second s t r u c t u r e s 26 are formed between the
first s t r u c t u r e s 25 on the upper surface of the base
p l a t e 21b i n the Z-axis d i r e c t i o n . The second
s t r u c t u r e s 26 have the same configuration as the second
s t r u c t u r e s 16 according t o the f i r s t embodiment.
[ O l l l ] Fig. 16(B) shows a s t a t e where the f l e x i b l e
display 10 receives an operation by the f i n g e r f of a
user. I n t h i s s t a t e , the f i n g e r f e x e r t s a force on the
f l e x i b l e display 10 downwardly i n the Z-axis d i r e c t i o n .
A t t h a t time, the f l e x i b l e display 10 is d e f l e c t e d
downwardly i n the Z-axis d i r e c t i o n . The X electrode 22
bonded t o the f l e x i b l e display 10 is deflected
downwardly in the Z-axis direction together with the
flexible display 10 and comes close to the base plate
21b. With this, a capacitance of the sensor device 21
increases.
[0112] As described above, the second structures 26
are formed between the flexible display 10 and the base
plate 21b. Since the material forming the second
structures 26 has a specific dielectric constant higher
than that of air present in the space portion 27, a
capacitance between the X electrode 22 and the Y
electrode 23 is large as compared with the structure
without the second structures 26. For that reason, in
the sensor device 21, also in the case where a
displacement of the X electrode 22 to the Y electrode
23 side is small, that displacement can be detected. In
other words, the sensor device 21 has a high
sensitivity for detecting a pressing ,force associated
with an operation on the flexible display 10 by the
user.
[0113] Fig. 16(C) shows a state where the flexible
display 10 receives an operation by a stylus s. As in
the case shown in Fig. 16(B) where the operating
element is the finger f, the same holds true for the
case where the operating element is the stylus s.
[0114]
Fig. 17 is a fragmentary cross-sectional view of
an input device 3 according to a third embodiment of
the present technology. The configuration other than a
sensor device 31 of the input device 3 according to
this embodiment is the same as that of the first
embodiment, and description thereof will be omitted as
appropriate. Fig. 17 corresponds to Fig. 2 according to
the first embodiment.
[01151 (Overall Configuration)
The input device 3 according to this embodiment
includes a sensor device 31, which is different from
that of the first embodiment, and a flexible display
10, which is the same as that of the first embodiment.
The sensor device 31 includes a base plate 31b
including a first electrode 32 and a second electrode
33. The first electrode 32 and the second electrode 33
constitute a capacitive element of a mutual capacitance
system. Further, the sensor device 31 includes a
reference electrode 34, and due to the proximity of the
reference electrode 34 to the base plate 31b, a
capacitance between the first electrode 32 and the
second electrode 33 decreases. Typically, the reference
electrode 34 is connected to a ground potential.
[0116] (Sensor Device)
The first electrode 32 and the second electrode 33
arranged side by side along the X axis are formed on an
upper surface of the base plate 31b in the Z-axis
d i r e c t i o n . The reference electrode 34 is formed on a
lower surface of t h e f l e x i b l e display 10 i n the Z-axis
d i r e c t i o n . In the sensor device 31, the proximity of
the reference electrode 34 t o the base p l a t e 31b can be
detected based on a decrease i n capacitance between the
f i r s t electrode 32 and the second electrode 33.
[0117] The sensor device 31 includes a p l u r a l i t y of
f i r s t s t r u c t u r e s 35 arranged between the base p l a t e 31b
and the reference electrode 34. The f i r s t s t r u c t u r e s 35
have the same configuration a s the f i r s t s t r u c t u r e s 15
according t o the first embodiment. The upper surface of
the f i r s t s t r u c t u r e 35 i n the Z-axis d i r e c t i o n and the
lower surface of the reference electrode 34 i n the Za
x i s d i r e c t i o n a r e bonded by a bonding layer 38. With
t h i s , a support l a y e r 31a containing the first
s t r u c t u r e s 35 and a space portion 37 is formed between
the base p l a t e 31b and the f l e x i b l e display 10.
[0118] Second s t r u c t u r e s 36 are formed between the
f i r s t s t r u c t u r e s 35 on the upper surface of the base
p l a t e 31b i n the Z-axis d i r e c t i o n . The second
s t r u c t u r e s 36 have the same configuration as the second
s t r u c t u r e s 16 according t o the f i r s t embodiment.
[01191 Fig. 17(B) shows a s t a t e where t h e f l e x i b l e
display 10 receives an operation by t h e f i n g e r f of a
user. In t h i s s t a t e , the f i n g e r f e x e r t s a force on the
f l e x i b l e display 10 downwardly i n the Z-axis d i r e c t i o n .
At that time, the flexible display 10 is deflected
downwardly in the Z-axis direction. The reference
electrode 34 bonded to the flexible display 10 is
deflected downwardly in thc Z-axis dircction together
5 with the flexible display 10 and comes close to the
base plate 31b. With this, a capacitance of the sensor
device 31 decreases.
[01201 As described above, the second structures 36
are formed between the reference electrode 34 and the
base plate 31b. Since the material forming the second
structures 36 has a specific dielectric constant higher
than that of air present in the space portion 37, a
capacitance between the first electrode 32 and the
second electrode 33 is large as compared with the
structure without the second structures 36. For that
reason, in the sensor device 31, also in the case where
a displacement of the first electrode 32 to the second
electrode 33 side is small, that displacement can be
detected. In other words, the sensor device 31 has a
high sensitivity for detecting a pressing force
associated with an operation on the flexible display 10
by the user.
[0121] Fig. 17(C) shows a state where the flexible
display 10 receives an operation by a stylus s. As in
the case shown in Fig. 17(B) where the operating
element is the finger f, the same holds true for the
case where the operating element is the stylus s.
[OX221
Fig. 18 is a fragmentary cross-sectional view of
an input device 4 according to a fourth embodiment of
5 the present technology. The configuration other than a
sensor device 41 of the input device 4 according to
this embodiment is the same as that of the first
embodiment, and description thereof will be omitted as
appropriate. Fig. 18 corresponds to Fig. 2 according to
10 the first embodiment.
LO1231 (Overall Configuration)
The input device 4 according to this embodiment
includes a sensor device 41, which is different from
that of the first embodiment, and a flexible display
15 10, which is the same as that of the first embodiment.
The sensor device 41 includes a base plate 41b and a
bonding layer provided with a first electrode 42 and a
second electrode 43. The first electrode 42 and the
second electrode 43 constitute a capacitive element of
20 a mutual capacitance system.
[01241 (Sensor Device)
In the sensor device 41, the first electrode 42
and the second electrode 43 arranged side by side along
the X axis are formed on a lower surface of the
25 flexible display 10 in the Z-axis direction.
LO1251 The sensor device 41 includes a plurality of
f i r s t s t r u c t u r e s 45 arranged between the base p l a t e 41b
and t h e f l e x i b l e display 10. The f i r s t s t r u c t u r e s 45
have the same configuration as the f i r s t s t r u c t u r e s 15
according t o thc f i r s t cmbodimcnt. Thc uppcr surface of
the f i r s t s t r u c t u r e 45 i n the Z-axis d i r e c t i o n and the
lower surface of t h e f l e x i b l e display 10 i n the Z-axis
d i r e c t i o n are bonded by a bonding layer 48. With t h i s ,
a support layer 41a containing the first s t r u c t u r e s 45
and a space portion 47 is formed between the base p l a t e
41b and t h e f l e x i b l e display 10.
[0126] Second s t r u c t u r e s 46 are formed between the
f i r s t s t r u c t u r e s 45 on the upper surface of the base
p l a t e 41b i n the Z-axis d i r e c t i o n . The second
s t r u c t u r e s 46 have the same configuration as the second
s t r u c t u r e s 16 according t o the f i r s t embodiment.
[0127] Fig. 18(B) shows a s t a t e where t h e f l e x i b l e
d i s p l a y 10 receives an operation by the f i n g e r f of a
u s e r . I n t h i s s t a t e , the f i n g e r f e x e r t s a f o r c e on the
f l e x i b l e display 10 downwardly i n the Z-axis d i r e c t i o n .
A t t h a t time, the f l e x i b l e display 10 is deflected
downwardly i n the Z-axis d i r e c t i o n . The f i r s t electrode
42 and the second electrode 43 t h a t are bonded t o the
f l e x i b l e display 10 a r e deflected downwardly i n the Za
x i s d i r e c t i o n together with t h e f l e x i b l e display 10
and come close t o the second s t r u c t u r e s 46.
[0128] As described above, the second s t r u c t u r e s 46
are formed between the flexible display 10 and the base
plate 41b. Since the material forming the second
structures 46 has a specific dielectric constant higher
than that of air present in the space portion 47, when
the first electrode 42 and the second electrode 43 come
close to the second structure 46, a capacitance between
the first electrode 42 and the second electrode 43
increases.
[01291 If a configuration without the second
structures 46 is adopted, due to the proximity of the
first electrode 42 and the second electrode 43 to the
base plate 41b, a capacitance between the first
electrode 42 and the second electrode 43 increases.
However, since the input device 4 according to this
embodiment includes the second structures 46 in
addition to the base plate 41b, the amount of increase
in capacitance between the first electrode 42 and the
second electrode 43 significantly increases as compared
with the configuration without the second structures
46.
[0130] For that reason, in the sensor device 41,
also in the case where a displacement of the first
electrode 42 to the second electrode 43 side is small,
that displacement can be detected. In other words, the
sensor device 41 has a high sensitivity for detecting a
pressing force associated with an operation on the
flexible display 10 by the user.
[01311 Fig. 18(C) shows a state where the flexible
display 10 receives an operation by a stylus s. As in
the case shown in Fig. 18(B) where the operating
element is the finger f, the same holds true. for the
case where the operating element is the stylus s.
[0132]
Fig. 19 is a block diagram showing a configuration
of an input device 5 according to a fifth embodiment of
the present technology.
[0133] (Overall Configuration)
The input device 5 includes a sensor unit 500, a
controller c5, a storage unit 55, and a communication
unit 56.
[0134] (Sensor Unit)
The sensor unit 500 includes a matrix sensor 51
and an input operation unit 54. The sensor matrix 51
includes a plurality of sensors 50s and outputs
detection signals corresponding to a touch operation
and a push operation performed on the input operation
unit 54. The input operation unit 54 constitutes an
input operation screen that is the same as a keyboard
or the like that receives a push operation, and
constitutes an input operation screen that is the same
as a track pad or the like that receives a touch
operation.
[0135] Fig. 20 is a fragmentary cross-sectional view
of the sensor unit 500. The sensor unit 500 includes a
surface $1 (first surface) that corresponds to a back
surface of the input operation unit 54 and on which a
reference electrode 14 is arranged, a front surface 52
(second surface) of a base plate llb on which X
electrodes 12 are arranged, and a surface S3 (third
surface) of the base plate llb in which Y electrodes 13
are arranged. The sensor matrix 51 has a laminate
structure of a support layer lla and the base plate llb
according to the first embodiment, and individual
capacitance components formed at respective cross
regions of the plurality of X electrodes 12 and the
plurality of Y electrodes 13 constitute the plurality
of sensors 50s.
101361 The plurality of sensors 50s are arrayed on
the XY plane in a key array that is the same as a
keyboard for a generally-used personal computer, for
example. Each of the sensors 50s has a predetermined
size and shape based on the arrangement thereof and a
function assigned thereto. The number of capacitive
elements constituting each of the sensors 50s may be
one or more than one.
[0137] Ea'ch of the sensors 50s constitutes a sensor
device of a mutual capacitance system. The capacitive
element constituting each sensor 50s corresponds to the
capacitive element 50 according to the first embodiment
and outputs a detection signal on a touch operation or
a push operation by a user based on a capacitance
between the X electrode 12 and the Y electrode 13 that
5 changes in accordance with a user operation for the
input operation unit 54.
[01381 The input operation unit 54 is constituted of
the flexible display 10 according to the first
embodiment. In this case, in the input operation unit
54, characters or patterns of a key array that is the
same as a keyboard for a generally-used personal
computer are displayed. In addition thereto, the input
operation unit 54 may be constituted of a cover made of
metal or a synthetic resin, on which characters or
patterns of a key array that is the same as a keyboard
for a generally-used personal computer are drawn.
[01391 (Controller)
The controller c5 corresponds to the controller c
according to the first embodiment and includes a
determination unit c51 (detection unit) and a signal
generation unit c52. The determination unit c51
determines, based on a change in capacitance of each
sensor 50s, a first state in which a finger f
(operating element) comes into contact with any one of
the plurality of sensors 50s and a change from the
first state to a second state in which the finger f
presses the sensor 50s. The signal generation unit c52
generates an operation signal that is different between
a touch state and a push state based on the
determination of the determination unit c51.
5 [0140] The capacitances of the capacitive elements
constituting the sensors 50s almost linearly change
with respect to a change in distance between the
reference electrode 14 and the base plate llb, as in
the first embodiment. So, the difference in magnitude
10 of a pressing force onto the input operation unit 54
can be easily detected. For example, whether the amount
of capacitance change exceeds a predetermined threshold
value or not allows a touch operation and a push
operation to the input operation unit 54 to be
distinguished from each other.
[0141] For example, in the state where the user puts
the finger f or the like softly on an operation surface
(Fig. 20) of the input operation unit 54, a weak force
is applied to an operation surface 54a. On the other
hand, in the case where the user performs an operation
of pushing a key in, a larger load is applied to the
operation surface 54a than a load of the state where
the finger f or the like is softly put. In the sensor
unit 500, the capacitances of the sensors 50s increase
and decrease in accordance with the amount of the
force. It is possible to estimate the load based on the
magnitude of a value corresponding to this change in
capacitance, and to distinguish between a touch state
where the user puts the finger f softly and a push
state where the user pushes the operation surface f in.
[0142] Here, the controller c5 is constituted so as
to output key information for only the push state in
key input, and thus an operational feeling of a
generally-used keyboard can be achieved. In this case,
the sensor unit 500 can detect a position of the finger
f based on the amount of capacitance change in each
sensor 50s in the touch state, and thus an input with
touch coordinates being detected can be achieved.
[01431 On the other hand, the input device 5 of this
embodiment can detect the coordinates in XY directions
on the operation surface 54a and can also detect the
magnitude of the load on the operation surface 54a
accurately. With this effect, the following new input
can be achieved.
[0144] (Input Example 1)
In the case where the input operation unit 54 is
constituted of a flexible display, a magnification
percentage of an image displayed on the input operation
unit 54 may be changed in accordance with a force to
push the operation surface 54a in. For example, a map
is displayed as an image, and the display of the image
is controlled such that the display of a push-in
position is changed at a magnification percentage that
is proportional to a push-in amount.
[0145] (Input Example 2)
In the case where the input device 5 is applied to
an electronic apparatus such as a portable game device,
the sensor unit may be used as an operation key of an
accelerator pedal or a brake pedal of a vehicle. With
this, an acceleration feeling or a deceleration feeling
corresponding to the push-in amount can be provided to
the user.
LO1461 (Input Example 3)
In the case where a plurality of photographs or
documents are browsed on the input operation unit 54
constituted of a flexible display, the speed of page
feeding may be changed in accordance with a push-in
force to the operation surface 54a. For example, pages
can be changed one by one when the operation surface
54a is push in weakly, and changed in unis of a
plurality of pages when the operation surface 54a is
push in strongly.
lo1471 (Input Example 4)
In the case where a drawing operation is performed
on the input operation unit 54 constituted of a
flexible display, the thickness or color of a line to
be drawn may be changed in accordance with a push-in
level. With this, an input close to an actual drawing
feeling can be achieved.
[0148] The storage unit 55 is constituted of a RAM
(Random Access Memory), a ROM (Read Only Memory), other
semiconductor memories, and the like and stores
5 calculated coordinates of an operation position of a
finger or the like of a user and a program and the like
used in various calculations by the determination unit
c51. For example, the ROM is constituted of a nonvolatile
memory and stores appropriate threshold value
10 data used in a determination of a touch operation and a
push operation for the input operation unit 54, a
program for causing the determination unit c51 to
execute calculation processing such as a calculation of
an operation position, and the like.
15 [01491 The threshold value data of the amount of
capacitance change of each sensor 50s that is stored in
the storage unlt 55 can be changed as appropriate. The
threshold value data may be common to the sensors 50s
or may differ between the sensors 50s. In other words,
in accordance with the location or key type of the
sensor 50s, the sensitivity of a predetermined one or
plurality of sensors 50s can be made different from the
sensitivities of the other sensors 50s.
[01501 For example, the detection sensitivities of
the individual sensors 50s constituting the sensor
matrix 500 can be measured by detecting the outputs of
the respective sensors 50s when a metallic plate of a
predetermined weight is placed on the operation surface
54a of the input operation unit 54. At that time, for
example, threshold value data for determining a touch
operation only needs to be individually set for each of
the sensors 50s and stored in the storage unit 55. With
this, variations of characteristics between the sensors
50s can be reduced, or desired sensitivity
characteristics can be set for a specific sensor 50s.
[0151] The communication unit 56 is constituted such
that various types of operation signals generated by
the signal generation unit c52 can be transmitted to
the processing device p (see Fig. 3). A communication
means in the communication unit c53 may be a wired one
via a USB (Universal Serial Bus) or the like or a
wireless one such as "Wi Fi" (registered trademark) or
"Bluetooth" (registered trademark) .
[0152] The signal generation unit c52 generates an
operation signal in accordance with an output signal
from the determination unit c51. Specifically, the
signal generation unit c52 generates different
operation signals for the touch state and the push
state, and in the case where the push state is
detected, generates a particular operation signal to
each sensor 50 corresponding to each key of the
keyboard.
[01531 (Configuration of Electrodes)
In the sensor u n i t 500 shown i n Fig. 20, by a
press operation t o the operation surface 54a, the
reference electrode 1 4 supported by the support l a y e r
l l a is deflected t o the base p l a t e l l b s i d e and a
capacitance of the sensor 50s located immediately below
the press p o s i t i o n is reduced. With t h i s , a touch
operation or a push operation a t the press p o s i t i o n is
detected.
[0154] In a sensor matrix i n which a p l u r a l i t y of
sensors are two-dimensionally arrayed, a high accuracy
is required f o r a p l u r a l i t y of adjacent sensor
c h a r a c t e r i s t i c s and i n d i v i d u a l sensor c h a r a c t e r i s t i c s .
For example, Fig. 21(A) shows an example i n which
s e n s i t i v i t y regions between adjacent sensors do not
overlap. In t h i s case, there is a p o s s i b i l i t y t h a t the
detection s e n s i t i v i t i e s between adjacent sensors a r e
reduced. Fig. 21(B) shows an example i n which a
capacitance is not changed with good l i n e a r i t y . In t h i s
case, it is d i f f i c u l t t o d i s t i n g u i s h between a touch
operation and a push operation. Further, Fig. 21(C)
shows an example i n which the amount of capacitance
change of each sensor is small. In t h i s case, it is
d i f f i c u l t t o determine an input p o s i t i o n . So, i n the
sensor matrix, as shown i n Fig. 21(D), the overlap of
s e n s i t i v i t y regions between adjacent s e n s o r s , the
change with good linearity in capacitance of each
sensor, and the large amount of capacitance change are
required.
[01551 In order to stably ensure the sensor
5 characteristics as shown in Fig. 21(D), in this
embodiment, for example, the X electrodes 12 and the Y
electrodes 13 of the sensors 50s are constituted as
shown in Fig. 22. Fig. 22 is a fragmentary plan view of
the sensor matrix 51 and shows only the X electrodes 12
10 and the Y electrodes 13.
[0156] In this embodiment, the X electrodes 12 are
arranged between the Y electrodes 13 and the reference
electrode 14. The reference electrode 14 is typically
connected to a ground potential. The X electrodes 12
15 close to the reference electrode 14 contain aggregates
of linear electrodes 12a, and the Y electrodes 13 far
from the reference electrode 14 contain planar
electrodes 13a. The linear electrodes 12a correspond to
the electrode example shown in Fig. 11(C). The sensors
20 50s are formed at cross regions of the linear
electrodes 12a and the planar electrodes 13a.
[0157] The aggregate of the linear electrodes 12a is
constituted of an aggregate of a plurality of
rectilinear electrode patterns radially extending from
25 the center portion. The linear electrodes 12a are
formed in a line width of 200 pm or smaller, for
example. The X electrodes 12 and the Y electrodes 13
are formed by a screen printing method, for example.
[0158] In the sensor matrix 51 including such a
configuration of electrodes, the area in which the X
electrode 12 and the Y electrode 13 are opposed to each
other becomes small, and any of the X electrode 12 and .
the Y electrode 13 can be capacitively coupled to the
reference electrode 14. With this, even when the amount
of displacement of the reference electrode 14 is
10 minute, the amount of capacitance change can be made
high, and thus linearity performance of a capacitance
change and a detection sensitivity are enhanced.
Further, since the individual linear electrodes 12a
have sensitivity regions, sensitivities at valleys
15 between adjacent sensors 50s can be easily ensured.
[01591 Fig. 23 is a schematic diagram showing a
configuration example of the linear electrodes 12a.
Fig. 23(A) corresponds to the linear electrodes of Fig.
22. In this example, the electrode density is different
2 0 between the center portion of the capacitive element 51
and a circumferential portion thereof, and the amount
of capacitance change due to the proximity of a finger
in the center portion is larger. Fig. 23(B) shows an
example in which one of the radial linear electrodes
shown in the example of (A) is formed to be thicker
than the other linear electrodes. With this, the amount
of capacitance change on the thick linear electrode can
be increased more than on the other linear electrodes.
Further, Fig. 23(C) and (D) each show an example in
which an annular linear electrode is arranged at
substantially the center and linear electrodes are
radially formed from the center. With this, the
concentration of the linear electrodes at the center
portion can be suppressed and the generation of a
reduced-sensitivity region can be prevented.
[0160] Fig. 2 3 ( E ) to (H) each show an example in
which a plurality of linear electrodes each formed into
an annular or rectangular annular shape are combined to
form an aggregate. With this, the electrode density can
be adjusted and the generation of a reduced-sensitivity
region can be suppressed. Further, Fig. 2 3 ( I ) to (L)
each show an example in which a plurality of linear
electrodes each arrayed in the Y-axis direction are
combined to form an aggregate. The adjustment of the
shape, length, pitch, or the like of the linear
electrodes allows a desired electrode density to be
obtained.
[0161] In addition, Fig. Fig. 23(M) to (P) each show
an example in which linear electrodes are arranged
asymmetrically in the X-axis direction or the Y-axis
direction. The electrodes are formed such that the
electrode density is asymmetric, and thus the detection
sensitivities of the sensors 50s can be adjusted for
each region. So, the detection sensitivities in the
sensors 50s can be finely adjusted.
[0162] On the other hand, another configuration
5 example of electrodes is shown in Fig. 24. Fig. 25 is
an enlarged view of a part thereof. In this example,
the X electrode 12 and the Y electrode are each
constituted of a plurality of linear wiring electrodes
and arrayed so as to be substantially orthogonal to
10 each other. Each of the sensor 50s contains a plurality
of crossing portions of the plurality of X electrodes
12 and Y electrodes 13. In other words, each of the
sensors 50s is constituted of a plurality of capacitive
elements 50c. With this, the detection sensitivities
15 and output characteristics of high linearity
performance of the individual sensors 50s are ensured.
It should be noted that each of the sensors 50s only
needs to contain at least one electrode crossing
portion.
[0163] The plurality of electrode crossing portions,
that is, the capacitive elements, which constitute each
of the sensors 50s, are formed in a different density
for each region. In the example of Fig. 24, the
electrodes 12 and 13 are arrayed such that line
distances between the electrodes 12 and between the
electrodes 13 are sequentially increased as being
separated from the center of the sensor 50s. For that
reason, the density of the capacitive elements 50c is
higher on the center side of the sensor 50s and lower
on a circumferential side of the sensor 50s. As a
5 result, output characteristics having a higher amount
of capacitance change can be obtained at a position
closer to the center of the sensor 50s.
I01641 It should be noted that without being limited
to the example described above, for example, the sensor
10 50s may be configured such that the density is lower at
a position closer to the center side. An interelectrode
distance is optionally adjusted, and thus desired
output characteristics can be obtained.
[0165] Fig. 26 shows still another configuration
15 example of electrodes. Also in this example, the X
electrode 12 and the Y electrode are each constituted
of a plurality of linear wiring electrodes and arrayed
so as to be substantially orthogonal to each other. In
this example, the plurality of X electrodes and the
plurality of Y electrodes 13 contain regions in which
the X electrodes and the Y electrodes are arrayed in
partially irregular pitches.
[0166] In the sensor unit 500 of this embodiment,
the circumferential portion of the input operation unit
54 is supported by a casing (not shown) of the input
device 5 with use of a pressure-sensitive tape or the
like. So, the circumferential portion of the input
operation unit 54 is hard to be deformed in accordance
with an input operation as compared with the center
portion. As a result, an input position of the input
5 operation unit 54 on the circumferential side may be
detected by a sensor on an inner circumferential side
than that input position.
[01671 To eliminate such concerns, in the sensor
unit 500 of this example, the X electrodes 12 and the Y
10 electrodes 13 are arrayed such that the interelectrode
distances in regions 121 and 131 on the circumferential
side of the sensor matrix 51 are shorter than the
interelectrode distances in regions 120 and 130 on the
center side thereof. With this, even when an input is
performed in a circumferential region of the input
operation unit 54, since a capacitive element that
detects the circumferential region is iocated on the
center side, an input position can be detected
accurately.
[0168] It should be noted that without being limited
to the case where portions with irregular wiring
intervals are provided on the circumferential side of
the sensor matrix as described above, an optional
setting can be performed in accordance with
specifications of a sensor or required characteristics.
[0169]
Fig. 27 is a fragmentary cross-sectional view of
an input device 6 according to a sixth embodiment of
the present technology. The configuration other than a
sensor device 610 of the input device 6 according to
5 this embodiment is the same as that of the first
embodiment, and description thereof will be omitted as
appropriate.
[0170] The sensor device 610 according to this
embodiment includes a base plate 610b including a
10 plurality of capacitive elements 60s, a conductive
layer 64, and a support layer 610a.
[0171] The base plate 610b includes an X electrode
62, a first base material 601 that supports the X
electrode 62, a Y electrode 63, and a second base
material 602 that supports the Y electrode 63. The X
electrode 62 is constituted of a plurality of wiring
electrodes arrayed in the X-axis direction and formed
on a front surface (upper surface of the figure) of the
first base material 601. In this embodiment, the X
electrode 62 is constituted of wiring electrode groups
each including an optional number of electrodes, in
which individual cross regions with at least the Y
electrode 63 are arrayed at predetermined pitches in
the X-axis direction. Similarly, the Y electrode 63 is
also constituted of a plurality of wiring electrodes
arrayed in the Y-axis direction and formed on a front
surface (upper surface of the figure) of the second
base material 602. In this embodiment, the Y electrode
63 is constituted of wiring electrode groups each
including an optional. number of electrodes, in which
5 individual cross regions with at least the X electrode
62 are arrayed at predetermined pitches in the Y-axis
direction.
[0172] The first base material 601 is laminated on
the second base'material 602 via a bonding layer 68a.
10 The X electrode 62 and the Y electrode 63 are each
constituted of, for example, a metal material such as
Ag (silver) or Cu(copper), a conductive paste
containing those metal materials, or a conductive oxide
such as IT0 (indium tin oxide). The first and second
15 base materials 601 and 602 are each constituted of, for
example, a resin sheet of electrical insulation
property, such as PET, PEN, PI, and PC.
101731 A plurality of capacitive elements 60s are
constituted as capacitive elements of a mutual
20 capacitance system, which are formed at cross regions
of the X electrodes 62 and the Y electrodes 63, and
each have a predetermined capacitance corresponding to
an area and a distance in which the electrodes 62 and
63 are opposed to each other and dielectric constants
25 of the first base material 601 and the bonding layer
68a. In this embodiment, the plurality of capacitive
elements 60s are arrayed in a matrix in a surface
parallel to the XY plane.
[0174] The base plate 610b further includes an
insulating layer 66 and a shielding layer 69.
[0175] The insulating layer 66 is constituted of an
insulating resin film made of PET or PEN, for example.
The insulating layer 66 is provided between the X
electrodes 62 and the support layer 610a and coats the
X electrodes 62 via a bonding layer 68b. With this,
electrical contact between the conductive layer 64 and
the first base material 601 (X electrode 62) can be
prevented. The bonding layer 68b is formed in a
thickness for coating the X electrodes 62 arranged on
the front surface of the first base material 601 and
connects the first base material 601 and the insulating
layer 66 to each other. It should be noted that without
being limited to the case of being constituted of a
resin film, the insulating layer 66 may be an
insulating film applied onto the first base material
601.
[0176] The shielding layer 69 is formed of a
metallic layer made of copper foil or the like formed
on a back surface (lower surface of the figure) of the
second base material 602. The shielding layer 69 is for
2 5 shielding electromagnetic noise that is input from the
back surface side of the sensor device 6 to the
capacitive elements 60s and is formed in a solid form,
a mesh form, or a grid form, for example. The shielding
layer 69 is connected to a ground potential, and thus
the shielding effect described above can be enhanced.
It should be noted that the installation of the
shielding layer 69 may be omitted as necessary.
[0177] The conductive layer 64 is supported by a
third base material 603. The third base material 603 is
constituted of a resin sheet that is the same as the
first and second base materials 601 and 602, and is
bonded to the back surface of a flexible display 10 via
a bonding layer 68c.
[0178] The conductive layer 64 corresponds to the
reference electrode described in the first embodiment
and is boded to the back surface of the flexible
display 10 via the bonding layer 68c, the back surface
of the flexible display 10 being opposed to the base
plate llb. The conductive layer 64 is formed in a solid
form, a mesh form, or a grid form, for example, and is
connected to a ground potential.
[0179] The conductive layer 64 is arranged to be
opposed to the capacitive elements 60s (base plate llb)
via the support layer 610a. The conductive layer 64 has
flexibility and is constituted to be partially
deformable toward the capacitive elements 60s (base
plate llb) together with the flexible display 10 by
receiving a pressing force, which is input to an
operation surface 10a as a front surface of the
flexible display 10.
[01801 The support layer 610a is arranged between
the capacitive elements 60s (base plate llb) and the
conductive layer 64. The support layer 610a includes a
plurality of structures 650, which support the
conductive layer 64, and a space portion 67 formed
between the plurality of structures 650.
[01811 The space portion 67 is constituted to be
capable of partially changing a distance between the
capacitive elements 60s (base plate llb) and the
conductive layer 64. With this, since a capacitance
(cross capacitance) of a capacitive element 60s of the
plurality of capacitive elements 60s, which comes close
to a deformed area of the conductive layer 64, is
changed, an input position or a pressing amount to the
operation surface 10a can be electrostatically detected
based on the change in the capacitance.
[01821 The space portion 67 is typically formed of
an air layer, but may be filled with other gas (for
example, inert gas) other than air. Further, the space
portion 67 communicates around the plurality of
structures 650, but depending on the shape of the
structures 650 (for example, in the case where the
structures 650 are formed in a grid form), the space
portion 67 may be partitioned into a plurality of space
portions.
[0183] In this embodiment, the plurality of
structures 650 are formed of an elastic material
capable of being elastically deformed in the Z-axis
direction. As such a material, for example, in addition
to a rubber material such as a silicon rubber or a
urethane rubber, an appropriate shock-absorbing
material such as a sponge is applicable. The plurality
of structures 650 are each formed in a hemisphere or
domal shape that is convex on the conductive layer 64
side. However, the plurality of structures 650 are not
limited thereto and may be formed in other geometric
shapes such as a cuboid shape and a cylindrical shape.
Further, the plurality of structures 650 are not
limited to the case of being formed to be punctiform,
and may be formed linearly and parallel to the X-axis
direction or the Y-axis direction, for example.
[01841 The support layer 610a further includes
20 connection portions 651. The connection portions 651
are arranged between the plurality of structures 650
and the conductive layer 64 and connects the plurality
of structures 650 to the conductive layer 64. With
this, it is possible to bring the structures 650 into
25 close contact with the conductive layer 64 and prevent
a displacement or a separation between the plurality of
structures 650 and the conductive layer 64. Further,
since the connection portions 651 are formed at only
positions immediately above the structures 650, it is
possible to prevent the conductive layer 64 and the
5 insulating layer 66 from sticking to each other in the
process of connecting the support layer 610a and the
conductive layer 64. As a connection material
constituting the connection portions 651, a pressuresensitive
adhesive, an adhesive, and the like are used.
10 [0185] The plurality of structures 650 are formed on
a front surface of the insulating layer 66 by using,
for example, appropriate printing technology such as a
screen printing method, a pad printing method, and a
transfer method. At that time, a frame body 650a is
15 formed of a material constituting the structures 650 at
a circumferential portion of the front surface of the
insulating layer 66. Further, at the time of forming
the connection portions 651, a connection material
constituting the connection portions 651 is also
20 applied to the front surface of the frame body 650a.
With this, the frame body 650a is integrally connected
to the conductive layer 64.
[0186] The frame body 650a may be formed along a
circumference of the insulating layer 66 continuously
25 or intermittently. In the case where the frame body
650a is continuously formed along the circumference of
the insulating layer 66, the space portion 67 can be
put in isolation from the surrounding area of the
sensor device 610, and thus the infiltration of water
or the like into the space portion 67 can be blocked.
On the other hand, in the case where the frame body
650a is intermittently formed along the circumference
of the insulating layer 66, the space portion 67 can
communicate with the surrounding area of the sensor
device 610, and thus the generation of a pressure
difference between the inner side and the outer side of
the frame body 650a can be avoided.
[0187] Further, in this embodiment, the plurality of
structures 650 are arranged immediately above the
capacitive elements 60s. In other words, each of the
plurality of structures 650 is arrayed in at least one
portion of the cross regions of the X electrodes 62 and
the Y electrodes 63. With this, an isotropic pressure
detection with a small sensitivity difference can be
performed almost over the entire operation surface 10a.
[0188] In other words, in the sensor device 610
according to the this embodiment, since the structures
650 are formed of an elastic material, even in the case
where a press operation is input at a position
immediately above any of the structures 650, due to an
elastic deformation of the structure 650, a relative
distance between a region of the conductive layer 64,
which corresponds to the press position, and a
capacitive element 60s opposite to the region is
reduced. So, even in the case where the amount of
deformation of the elastically-deformed structure 650
is small, a change in capacitance of the capacitive
element 60s corresponding to that input position can be
detected.
[01891 On the other hand, in the case where a press
operation is input to a gap between the plurality of
adjacent structures 650, since no structures 650 exist
immediately belor51 that input position, the region of
the conductive layer 64, which corresponds to the press
position, has a larger amount of deformation as
compared with the case where a position immediately
above the structure 650 is pressed. So, the deformed
region of the conductive layer 64 is easily
capacitively coupled to the surrounding capacitive
elements 60s, and as a result, a change in capacitance
of the capacitive elements 60s can be detected.
[0190] As described above, also in this embodiment,
actions and effects that are the same as those in the
first embodiment can be obtained. Further, according to
the sensor device 610 of this embodiment, since the
operation surface 10a with a small difference in input
sensitivity can be achieved, it is possible to provide
an excellent input operational feeling in the case
where the flexible display 10 is applied as the input
operation unit. Further, the XY coordinates of the
input position can be detected highly accurately by a
calculation of the center.
5 [0191] It should be noted that in this embodiment,
the insulating layer 66 also has a function as the
second structures in the sensor device 11 of the first
embodiment. In other words, the sensor device 610
according to this embodiment corresponds to the
10 structure integrating the first structures 15 and the
second structures 16 in the sensor device 11 shown in
Fig. 1.
[0192]
Fig. 28 is a fragmentary cross-sectional view
15 showing a modified example of the sensor device
according to the sixth embodiment. It should be noted
that in Fig. 28, portions corresponding to those of
Fig. 27 are denoted by the same reference symbols and
description thereof will be omitted.
2 0 [0193] In an input device 6A (sensor device 611)
according to this modified example, the configuration
of a base plate 611b is different from the
configuration of the base plate 610b of the sensor
device 610 shown in Fig. 27. In the base plate 611b,
25 the plurality of structures 650 are directly provided
on the first base material 601 that support the X
electrodes 62. In other words, the sensor device 61A of
this embodiment has a configuration in which the
insulating layer 66 in the sensor device 6 of Fig. 27
is omitted,
[0194] Also in this modified example, actions and
effects that are the same as those in the sixth
embodiment described above can be obtained. According
to this modified example, a distance in which the
conductive layer 64 and the capacitive element 60s are
opposed to each other can be shortened, and thus the
sensitivity of a press operation can be enhanced.
Further, according to this modified example, since the
configuration of the base plate 611b can be thinned,
the thinning of the sensor device can be achieved.
101951
Fig. 29 is a fragmentary cross-sectional view
showing another modified example of the sensor device
according to the sixth embodiment. It should be noted
that in Fig. 29, portions corresponding to those of
Fig. 27 are denoted by the same reference symbols and
description thereof will be omitted.
101961 In an input device 6B (sensor device 612)
according to this modified example, the configuration
of a support layer 611a is different from the
configuration of the support layer 610a of the sensor
device 610 shown in Fig. 27. In other words, in the
support layer 611a according to this modified example,
a plurality of structures 652 are formed of a
connection material including a pressure-sensitive
adhesive, an adhesive, and the like and have a function
of forming a space portion 67 in the support layer 611a
and a function of connecting an insulating layer 66
(base plate 610b) and a conductive layer 64 to each
other. The plurality of structures 652 are each formed
in a hemisphere or domal shape that is convex on the
conductive layer 64 side.
[01971 It should be noted that in the sensor device
6B according to this modified example, a frame body 653
formed at the surrounding area of the insulating layer
66 is also formed of a single layer of the connection
material that forms the structures 652.
[01981 Also in this modified example, actions and
effects that are the same as those in the sixth
embodiment described above can be obtained. According
to this modified example, since the structures 652 can
be formed of a single layer, the manufacture of the
support layer 611a can be facilitated. With this,
productivity can be enhanced and material costs can be
reduced.
[0199] On the other hand, as shown in Fig. 30, the
plurality of structures 652 may be each formed in a
hemisphere or domal shape that is convex on the base
plate 610b side. With this, when a press operation is
performed at a position of a gap between the plurality
of structures 652, a deformed region of the conductive
layer 64 is prevented from sticking to curved
5 peripheral surfaces of the structures 652. Thus, at the
time of releasing the press operation, the deformed
region of the conductive layer 64 can be appropriately
and rapidly returned to the original position.
[0200] Alternatively, as shown in Fig. 31, the
10 plurality of structures 652 may be formed in a
cylindrical shape or a prism shape. In this case, the
plurality of structures 652 can be formed of a
pressure-sensitive sheet (double-sided sheet) punched
out in a predetermined shape and size. Also with such a
15 configuration, actions and effects that are the same as
those in Fig. 30 can be obtained.
[0201]
Fig. 32 is a fragmentary cross-sectional view
showing another modified example of the sensor device
2 0 according to the sixth embodiment. Fig. 33 is a
schematic exploded perspective view of an input device
6C. It should be noted that in Figs. 32 and 33,
portions corresponding to those of Fig. 27 are denoted
by the same reference symbols and description thereof
25 will be omitted.
[0202] In an input device 6C (sensor device 613)
according to this modified example, the configuration
of a support layer 612a is different from the
configuration of the support layer 610a of the sensor
device 610 shown in Fig. 27. In other words, the
support layer 612a according to this modified example
includes a plurality of structures 654, a frame body
655, and a base portion 656, and those plurality of
structures 654, frame body 655, and base portion 656
are integrally formed of a single resin material (for
example, ultraviolet curable resin) and formed by a
transfer method, for example.
[0203] Each of the plurality of structures 654 has a
columnar shape that is the same as the first structure
15 in the first embodiment. The frame body 655 is
formed along the surrounding area of the insulating
layer 66 continuously or intermittently. The base
portion 656 is formed on a front surface of an
insulating layer 66 and functions as an underlayer of
the plurality of structures 654 and the frame body 655.
Further, the plurality of structures 654 and the frame
body 655 are connected to the conductive layer 64 via
connection portions 651.
[02041 The support layer 612a in this modified
example further include regulation portions 657
arranged between the plurality of structures 654. The
regulation portions 657 are arranged on the base
portion 65'6 that is opposed to a conductive layer 64
with a space portion 67 being sandwiched therebetween,
and are configured to inhibit contact of the conductive
layer 64 to the base portion 656. With this, also i.n
the case where the base portion 656 (structures 654 and
frame body 655) is formed of a material with tackiness
(adherence property) of a predetermined value or more
after curing, such as an ultraviolet curable resin,
sticking of the conductive layer 64, which is deformed
at the time of a press operation, to the base portion
656 can be inhibited and an appropriate input release
operation can be ensured.
[0205] In this case, the regulation portion 657 is
formed of a material having lower tackiness than the
15 material that forms the base portion 656. The shape,
the size, and the number of regulation portions 657 are
not particularly limited. In this modified example, one
or the plurality of regulation portions 657 are
provided in each gap between the plurality of
structures 654 that are adjacent in the X-axis
direction. The shape of the regulation portion 657 is
not particularly limited as long as the regulation
portion 657 is shorter in height than the structures
654 and the frame body 655. For example, the regulation
25 portion 657 is formed in a hemisphere or domal shape
that is convex on the conductive layer 64 side, other
curved shapes, or a cuboid shape.
[0206]
Fig. 35 is a fragmentary cross-sectional view of
an input device according to a seventh embodiment of
the present technology. It should be noted that in Fig.
35, portions corresponding to those of the sixth
embodiment are denoted by the same reference symbols
and description thereof will be omitted.
[0210] A sensor device 710 of this embodiment is
different from that of the sixth embodiment described
above in the configuration of a base plate 710b. In
other words, in the base plate 710b of this embodiment,
a plurality of X electrodes 62 are arrayed so as to be
located between a plurality of structures 650. In other
words, the plurality of structures 650 are arrayed in
regions other than cross regions of the plurality of X
electrodes 62 and a plurality of Y electrodes 63. It
should be noted that without being limited to the
example of Fig. 35, the method of arraying the X
electrodes 62 is also applicable to the configuration
examples shown in Figs. 28 to 34 in the same manner.
[0211] Further, the input device 7 of this
embodiment is different from that of the sixth
embodiment described above in the configuration
including a flexible keyboard 20, instead of the
flexible display 10. The flexible keyboard 20 is
connected to the front surface of a third base material
603 via a bonding layer 68c, the third base material
603 supporting a conductive layer 64.
[0212] Fig. 36 is a plan view showing the whole of
the flexible keyboard 20. The flexible keyboard 20 is
formed of, for example, a plastic sheet of electrical
insulation property, but may be formed of a metallic
sheet. In this case, in the case where the flexible
keyboard is formed of a metallic sheet, the conductive
layer 64 can be omitted. A plurality of key regions 20a
are arrayed on the front surface of the flexible
keyboard 20. The flexible keyboard 20 is not limited to
the example of being formed in a flat-sheet shape. For
example, the key regions 20a may be formed of a
predetermined concave-convex surface.
LO2133 The plurality of key regions 20a are not
limited to a case where all of the key regions 20a are
formed in the same size and shape and may have a size
different from other keys in accordance with the type
of key. In each of the key regions 20a, an appropriate
key display may be provided. The key display may
display the type of key, the position (outline) of each
key, or both of them.
[0214] Fig. 37 is a schematic plan view of the
support layer 610a that constitutes the sensor device
710. The support layer 610a includes the plurality of
structures 650 and space portions 67 formed between the
plurality of structures 650. In this embodiment, the
plurality of structures 650 are formed of a material
5 having a relatively high rigidity, such as an epoxybased
resin, but may be formed of an elastic material
having a relatively low rigidity, such as a urethanebased
resin. Alternatively, the plurality of structures
650 may be a continuous body that includes a base
10 portion and a frame body as shown in Fig. 32 and is
formed of an ultraviolet curable resin. On the other
hand, the space portions 67 are each formed in the
shape and the size corresponding to the key region 20a
of the flexible keyboard 20. On the other hand, the
15 plurality of structures 650 are provided between the
key regions 20a of the flexible keyboard 20 (regions
shown with hatched iines in Fig. 37).
[0215] Fig. 38 is a schematic plan view of the base
plate 710b that constitutes the sensor device 710. Fig.
20 39 is a cross-sectional view of the input device 7
taken along a direction of the line B-B' of Fig. 38. As
described above, since the plurality of structures 650
are arrayed in respective regions other than the cross
regions of the plurality of X electrodes 62 and the
25 plurality of Y electrodes 63, the capacitive elements
60s are arranged at the positions opposed to the key
regions 20a (space portions 67) in the Z-axis
direction. In particular, in this embodiment, the X
electrodes 62 are wired by a single line between the
key regions 20a and wired by branching into a plurality
of lines in the key regions 20a. With this, since the
number of capacitive elements 60s opposed to the
respective key regions 20a is increased, the detection
sensitivity of a key input operation can be enhanced.
[0216] In the input device 7 in this embodiment
constituted as described above, since one or a
plurality of capacitive elements 60s are arranged to be
opposed to each of the key regions 20a of the flexible
keyboard 20, an input position can be detected with
high sensitivity.
[0217] For example, Fig. 40 is a schematic view
showing a relationship between an input operation to
the lnput device 7 according to this embodiment and an
output of the capacitive element 60s. According to the
input device 7 of this embodiment, a significant
capacitance change is generated between the capacitive
element 60s located below the key region 20a and
another capacitive element 60s adjacent to the
capacitive element 60s, and thus it is possible to
detect an input key position with high accuracy and
suitably use the input device 7 as an input device such
as a keyboard. In this case, the plurality of
structures 650 are each formed of a material having a
relatively high rigidity, and thus a capacitance change
of another adjacent capacitive element 60s can be more
reduced,
[0218] On the other hand, Fig. 41, shown as a
comparison, is a schematic view showing a relationship
between an input operation to the input device 6
according to the sixth embodiment and an output of the
capacitive element 60s. As shown in Fig. 41, in the
case where the capacitive elements 60s are arranged to
be opposed to the structures 650, the plurality of
capacitive elements 60s near an input position generate
capacitance changes. In this example, it is
particularly suitable for the case where as in the
first embodiment, a press position (XY coordinates) of
the flexible display 20 is specified by a calculation
of the center.
[0219] Hereinabove, the embodiments of the present
technology have been described, but the present
technology is not limited to the embodiments described
above and can be variously modified without departing
from the gist of the present technology as a matter of
course.
[02201 For example, the sensor device can constitute
a detection device such as a pressure sensor by a
sensor device alone, without being provided with a
flexible display. Instead of the flexible display, a
sheet formed of a resin or the like can be bonded to
the sensor device. Since the sensor device of the
present technology has a high sensitivity, it is
possible to comply with a wide variety of sheets.
[02211 Further, the present technology can be
applied to information input apparatuses such as a
touch pad, a mouse, and a keyboard, and information
display apparatuses such as a television and a digital
signage. Furthermore, the present technology is also
applicable to information processing apparatuses such
as a mobile phone, a smartphone, a laptop PC, and a
tablet PC.
[0222] Moreover, in the above embodiments, the
sensor device including the plurality of capacitive
elements arrayed in the XY plane has been described as
an example, but the present technology is not limited
thereto and can also be applied to a sensor device
including a single capacitive element. In this case,
the sensor device can be configured as a press switch
for a game controller or the like.
[0223] Additionally, for example, in the first
embodiment, the reference electrode 14 is arranged
between the flexible display 10 and the support layer
25 lla, but the reference electrode 14 may be incorporated
in the flexible display 10. In this case, the reference
electrode may be arranged on the flexible display 10
separately or may be configured by a conductive layer
(for example, scanning electrode or the like of TFT
(Thin-Film Transistor)) incorporated in the flexible
5 display 1 0 .
[0224] It should be noted that the present
technology can have the following configurations.
(1) A sensor device, including:
a f i r s t surface and a second surface that are
10 opposed to each other;
a support layer including
a f i r s t structure that i s p a r t i a l l y arranged
between the f i r s t surface and the second surface and
has a f i r s t height, and
15 a space portion formed between the f i r s t
surface and the second surface; and
a capacitive element including a f i r s t electrode
and a second electrode, the f i r s t electrode being
arranged on one of the f i r s t surface and the second
surface, the second electrode being arranged t o be
opposed to the f i r s t electrode, the capacitive element
being configured to generate a change in capacitance
between the f i r s t electrode and the second electrode in
accordance with a change in distance between the f i r s t
surface and the second surface t h a t a r e opposed to each
other via the space portion.
(2) The sensor device according t o ( I ) , i n which
the support l a y e r f u r t h e r includes a second
s t r u c t u r e t h a t is arranged i n the space portion and has
a second height s h o r t e r than the first height.
5 (3) The sensor device according t o ( 2 ) , i n which
the second s t r u c t u r e is formed on a t l e a s t one of
the f i r s t surface and the second surface.
( 4 ) The sensor device according t o any one of (1) t o
( 3 ) , f u r t h e r including:
a t h i r d surface t h a t is arranged on an opposite
side of the f i r s t surface with respect t o the second
surface and is opposed t o the second surface; and
a reference electrode formed on the f i r s t surface,
i n which
15 the f i r s t electrode is formed on the second
surface, and the second electrode is formed on the
t h i r d surface.
(5) The sensor device according t o any one of (1) t o
( 3 ) , i n which
20 the f i r s t electrode is formed on the f i r s t
surface, and the second electrode is formed on the
second surface.
(6) The sensor device according t o any one of (1) t o
( 3 ) , i n which
2 5 the first electrode and the second electrode are
formed on the f i r s t surface.
(7) The sensor device according t o any one of (1) t o
( 3 ) , f u r t h e r including a reference electrode formed on
the f i r s t surface, i n which
the first electrode and the second electrode are
5 formed on the second surface.
(8) The sensor device according t o any one of (1) t o
( 7 ) , i n which
the first s t r u c t u r e is formed of a p l u r a l i t y of
columnar bodies, and
the p l u r a l i t y of columnar bodies are r e g u l a r l y
arrayed.
(9) The sensor device according t o ( 8 ) , i n which
each of t h e p l u r a l i t y of columnar bodies is formed
t o have one of a c i r c u l a r cross section and a polygonal
15 cross section t h a t a r e p a r a l l e l t o the f i r s t surface.
(10) A sensor device, including:
a base p l a t e including
a p l u r a l i t y of f i r s t electrodes, and
a p l u r a l i t y of second electrodes opposed t o
the p l u r a l i t y of f i r s t electrodes;
a conductive l a y e r t h a t is opposed t o the
p l u r a l i t y of first electrodes and has f l e x i b i l i t y ; and
a support layer including
a p l u r a l i t y of s t r u c t u r e s t h a t are arranged
between the base p l a t e and the conductive l a y e r and
support the conductive layer, and
a space portion that is formed between the
plurality of structures and is capable of partially
changing a distance between the base plate and the
conductive layer.
5 (1) The sensor device according to (lo), in which
the base plate further includes an insulating
layer provided between the plurality of first
electrodes and the support layer.
(12) The sensor device according to (10) or (11), in
10 which
each of the plurality of structures is arrayed in
at least one portion of cross regions of the plurality
of first electrodes and the plurality of second
electrodes.
(13) The sensor device according to (12), in which
each of the plurality of structures is formed of
an elastic material.
(14) The sensor device according to (10) or (ll), in
which
each of the plurality of structures is arrayed in
a region other than cross regions of the plurality of
first electrodes and the plurality of second
electrodes.
(15) The sensor device according to any one of (10) to
(14), in which
the base plate further includes a base material
that supports the plurality of first electrodes, and
each of the plurality of structures is arranged on
the base material.
(16) The sensor device according to any one of (10) to
(15), in which
the support layer further includes a connection
portion that is arranged between the plurality of
structures and the conductive layer and connects the
plurality of structures to the conductive layer.
(17) The sensor device according to any one of (10) to
(16), in which
each of the plurality of structures is formed of a
connection material that connects a gap between the
base plate and the conductive layer.
(18) The sensor device according to any one of (10) to
(17), in which
the support layer further includes
a base portion that supports the plurality of
structures and is opposed to the conductive layer with
the space portion being sandwiched therebetween, and
a regulation portion that is arranged on the
base portion and inhibits contact of the conductive
layer to the base portion.
(19) An input device, comprising:
a first surface and a second surface that are
opposed to each other;
a support layer including
a f i r s t s t r u c t u r e t h a t is p a r t i a l l y arranged
between the f i r s t surface and the second surface and
has a f i r s t height, and
a space portion formed between the f i r s t
surface and the second surface;
a capacitive element including a f i r s t electrode
and a second electrode, the f i r s t electrode being
arranged on one of the f i r s t surface and the second
surface, the second electrode being arranged t o be
opposed t o the f i r s t electrode, the capacitive element
being configured t o generate a change i n capacitance
between the f i r s t electrode and the second electrode i n
accordance with a change i n distance between the f i r s t
surface and the second surface t h a t are opposed t o each
other via the space portion; and
a c o n t r o l l e r including
a detection u n i t t h a t d e t e c t s the change i n
capacitance, and
a s i g n a l generation u n i t t h a t generates an
operation s i g n a l based on a r e s u l t of the detection of
the detection u n i t .
(20) An input device, including:
a p l u r a l i t y of sensors each including
a first surface and a second surface t h a t are
opposed t o each other,
a support layer including
a first structure that is partially
arranged between the first surface and the second
surface and has a first height, and
a space portion formed between the first
surface and the second surface, and
a capacitive element including a first
electrode and a second electrode, the first electrode
being arranged on one of the first surface and the
second surface, the second electrode being arranged to
be opposed to the first electrode, the capacitive
element being configured to generate a change in
capacitance between the first electrode and the second
electrode in accordance with a change in distance
between the first surface and the second surface that
are opposed to each other via the space portion; and
a controller including
a detection unit that detects the change in
capacitance, and
a signal generation unit that generates an
operation signal based on a result of the detection of
the detection unit.
(21) The input device according to (20), in which
the detection unit determines, based on the change
in capacitance of the capacitive element, a first state
in which an operating element comes into contact with
any of the plurality of sensors and a change from the
first state to a second state in which the operating
element presses the sensor.
(22) The input device according to (20) or (21), in
5 which
each of the plurality of sensors further includes
a third surface that is arranged on an
opposite side of the first surface with respect to the
second surface and is opposed to the second surface,
and
a reference electrode formed on the first
surface, and
the first electrode is formed on the second
surface, and the second electrode is formed on the
third surface.
(23) The input device according to (22), in which
the first electrode includes an aggregate of
linear electrodes, and
the second electrode includes a planar electrode.
(24) The input device according to (23), in which
each of the linear electrodes has a line width of
200 pm or smaller.
(25) The input device according to any one of (20) to
(24), in which
the first electrode includes a plurality of first
wiring electrodes arrayed in a first axis direction,
the second electrode includes a plurality of
second wiring electrodes arrayed in a second axis
direction crossing the first axis direction, and
each of the plurality of sensors includes a
5 plurality of crossing portions of the plurality of
first wiring electrodes and the plurality of second
wiring electrodes.
(26) The input device according to (25), in which
the plurality of crossing portions are formed at
10 different densities for each of regions.
(27) The input device according to any one of (20) to
( 2 6 ) , in which
each of the plurality of sensors includes a
plurality of sensors each having a different
15 sensitivity of detecting a capacitance by the
capacitive element.
(28) An electronic apparatus, comprising:
a first surface and a second surface that are
opposed to each other;
a support layer including
a first structure that is partially arranged
between the first surface and the second surface and
has a first height, and
a space portion formed between the first
25 surface and the second surface;
a capacitive element including a first electrode
and a second electrode, the f i r s t electrode being
arranged on one of the f i r s t surface and the second
surface, the second electrode being arranged t o be
opposed t o the f i r s t e l e c t r o d e , t h e c a p a c i t i v e element
5 being configured t o generate a change i n capacitance
between the f i r s t electrode and the second electrode i n
accordance with a change i n distance between the first
surface and the second surface t h a t are opposed t o each
other v i a t h e space portion;
a c o n t r o l l e r including
a detection u n i t t h a t d e t e c t s the change i n
capacitance, and
a s i g n a l generation u n i t t h a t generates an
operation s i g n a l based on a r e s u l t of the detection of
15 the d e t e c t i o n u n i t ; and
a f l e x i b l e display t h a t is arranged on the f i r s t
surface of the capacitive element and displays an image
based on the operation s i g n a l .
(29) An e l e c t r o n i c apparatus, comprising:
a p l u r a l i t y of sensors each including
a f i r s t surface and a second surface t h a t are
opposed t o each other,
a support l a y e r including
a f i r s t s t r u c t u r e t h a t i s p a r t i a l l y
2 5 arranged between the f i r s t surface and the second
surface and has a f i r s t height, and
a space portion formed between the f i r s t
surface and the second surface, and
a capacitive element including a f i r s t
electrode and a second electrode, the f i r s t electrode
5 being arranged on one of the f i r s t surface and the
second surface, the second electrode being arranged t o
be opposed t o the f i r s t electrode, the capacitive
element being configured t o generate a change i n
capacitance between the f i r s t electrode and the second
10 electrode i n accordance with a change i n distance
between the f i r s t surface and the second surface t h a t
a r e opposed t o each other v i a t h e space portion;
a c o n t r o l l e r including
a detection u n i t t h a t d e t e c t s t h e change i n
15 capacitance, and
a s i g n a l generation u n i t t h a t generates an
operation s i g n a l based on a r e s u l t of the detection of
the d e t e c t i o n u n i t ; and
an input operation u n i t arranged on the f i r s t
20 surface of the capacitive element.
(30) The e l e c t r o n i c apparatus according t o (29), i n
which
the ' f i r s t electrode includes a p l u r a l i t y of f i r s t
wiring electrodes arrayed i n a f i r s t axis d i r e c t i o n ,
the second electrode includes a p l u r a l i t y of
second wiring electrodes arrayed i n a second a x i s
d i r e c t i o n crossing the f i r s t a x i s d i r e c t i o n , and
each of the p l u r a l i t y of sensors includes a t l e a s t
one c r o s s i n g p o r t i o n of the p l u r a l i t y of f i r s t wiring
e l e c t r o d e s and the p l u r a l i t y of second wiring
5 e l e c t r o d e s .
(31) The e l e c t r o n i c apparatus according t o (301, i n
which
each of the p l u r a l i t y of f i r s t wiring electrodes
and the p l u r a l i t y of second wiring e l e c t r o d e s i n c l u d e s
a region with an array of p a r t i a l l y i r r e g u l a r p i t c h e s .
(32) The e l e c t r o n i c apparatus according t o any one of
(29) t o ( 3 1 ) , i n which
the input operation u n i t is a f l e x i b l e display
t h a t displays an image based on the operation s i g n a l .
Description of Symbols
102251
1, 2, 3, 4, 5, 6, 7 input device
1 0 f l e x i b l e display
20 f l e x i b l e keyboard
11 sensor device
l l a support l a y e r
l l b base p l a t e
12 X electrode
13 Y electrode
1 4 reference electrode
15 first s t r u c t u r e
16 second s t r u c t u r e
17 space portion
18 bonding l a y e r
50s, 60s sensor
Claims
[I] A sensor device, comprising:
a f i r s t surface and a second surface t h a t are
opposed t o each other;
5 a support layer including
a f i r s t s t r u c t u r e t h a t is p a r t i a l l y arranged
between the first surface and the second surface and
has a first height, and
a space portion formed between the f i r s t
10 surface and the second surface; and
a capacitive element including a f i r s t electrode
and a second electrode, the first electrode being
arranged on one of the f i r s t surface and the second
surface, the second electrode being arranged t o be
15 opposed t o the f i r s t electrode, the c a p a c i t i v e element
being configured t o generate a change i n capacitance
between the f i r s t electrode and the second electrode i n
accordance with a change i n distance between the f i r s t
surface and the second surface t h a t a r e opposed t o each
20 other v i a t h e space portion.
[2] The sensor device according t o claim 1, wherein
the support l a y e r f u r t h e r includes a second
s t r u c t u r e t h a t is arranged i n the space portion and has
a second height s h o r t e r than the f i r s t height.
2 5 [ 3 ] The sensor device according t o claim 2, wherein
the second s t r u c t u r e is formed on a t l e a s t one of
the f i r s t surface and the second surface.
[ 4 1 The sensor device according to claim 1, further
comprising:
a third surface that is arranged on an opposite
5 side of the f i r s t surface with respect to the second
surface and is opposed t o the second surface; and
a reference electrode formed on the f i r s t surface,
wherein
the f i r s t electrode is formed on the second
10 surface, and the second electrode is formed on the
third surface.
[51 The sensor device according to claim 1, wherein
the f i r s t electrode is formed on the f i r s t
surface, and the second electrode is formed on the
15 second surface.
[ 6 ] The sensor device according to claim 1, wherein
the f i r s t electrode and the second electrode are
formed on the f i r s t surface.
[71 The sensor device according to claim 1, further
20 comprising a reference electrode formed on the f i r s t
surface, wherein
the f i r s t electrode and the second electrode are
formed on the second surface.
[8] The sensor device according to claim 1, wherein
25 the f i r s t structure is formed of a p l u r a l i t y of
columnar bodies, and
the plurality of columnar bodies are regularly
arrayed.
[9] The sensor device according to claim 8, wherein
each of the plurality of columnar bodies is formed
5 to have one of a circular cross section and a polygonal
cross section that are parallel to the first surface.
[lo] A sensor device, comprising:
a base plate including
a plurality of first electrodes, and
a plurality of second electrodes opposed to
the plurality of first electrodes;
a conductive layer that is opposed to the
plurality of first electrodes and has flexibility; and
a support layer including
a plurality of structures that are arranged
between the base plate and the conductive layer and
support the conductive layer, and
a space portion that is formed between the
plurality of structures and is capable of partially
2 0 changing a distance between the base plate and the
conductive layer.
[ll] The sensor device according to claim 10, wherein
the base plate further includes an insulating
layer provided between the plurality of first
25 electrodes and the support layer.
[12] The sensor device according to claim 10, wherein
each of the p l u r a l i t y of s t r u c t u r e s is arrayed i n
a t l e a s t one portion of cross regions of the p l u r a l i t y
of first electrodes and the p l u r a l i t y of second
e l e c t r o d e s .
5 [13] The sensor device according t o claim 12, wherein
each of the p l u r a l i t y of s t r u c t u r e s is formed of
an e l a s t i c m a t e r i a l .
[14] The sensor device according t o claim 10, wherein
each of the p l u r a l i t y of s t r u c t u r e s is arrayed i n
10 a region other than cross regions of the p l u r a l i t y of
f i r s t e l e c t r o d e s and the p l u r a l i t y of second
e l e c t r o d e s .
[I51 The sensor device according t o claim 10, wherein
the base p l a t e f u r t h e r includes a base material
15 t h a t supports the p l u r a l i t y of f i r s t electrodes, and
each of the p l u r a l i t y of s t r u c t u r e s is arranged on
the base m a t e r i a l .
1161 The sensor device according t o claim 10, wherein
the support layer f u r t h e r includes a connection
20 portion t h a t is arranged between t h e p l u r a l i t y of
s t r u c t u r e s and the conductive l a y e r and connects the
p l u r a l i t y of s t r u c t u r e s t o the conductive l a y e r .
[17] The sensor device according t o claim 10, wherein
each of the p l u r a l i t y of s t r u c t u r e s is formed of a
2 5 connection material t h a t connects a gap between the
base p l a t e and the conductive l a y e r .
[18] The sensor device according to claim 10, wherein
the support layer further includes
a base portion that supports the plurality of
structures and is opposed to the conductive layer with
5 the space portion being sandwiched therebetween, and
a regulation portion that is arranged on the
base portion and inhibits contact of the conductive
layer to the base portion.
[I91 An input device, comprising:
one or more sensors each including
a first surface and a second surface that are
opposed to each other,
a support layer including
a first structure that is partially
arranged between the first surface and the second
surface and has a first height, and
a space portion formed between the first
surface and the second surface, and
a capacitive element including a first
electrode and a second electrode, the first electrode
being arranged on one of the first surface and the
second surface, the second electrode being arranged to
be opposed to the first electrode, the capacitive
element being configured to generate a change in
capacitance between the first electrode and the second
electrode in accordance with a change in distance
between the first surface and the second surface that
are opposed to each other via the space portion; and
a controller including
a detection unit that detects the change in
5 capacitance, and
a signal generation unit that generates an
operation signal based on a result of the detection of
the detection unit.
[201 The input device according to claim 19, wherein
the one or more sensors include a plurality of
sensors, and
the detection unit determines, based on the change
in capacitance of the capacitive element, a first state
in which an operating element comes into contact with
15 any of the plurality of sensors and a change from the
first state to a second state in which the operating
element presses the sensor.
[211 The input device according to claim 20, wherein
each of the plurality of sensors further includes
a third surface that is arranged on an
opposite side of the first surface with respect to the
second surface and is opposed to the second surface,
and
a reference electrode formed on the first
surface, and
the first electrode is formed on the second
surface, and the second electrode is formed on the
third surface.
[22] The input device according to claim 21, wherein
the first electrode includes an aggregate of
5 linear electrodes, and
the second electrode includes a planar electrode.
[23] The input device according to claim 19, wherein
the one or more sensors include a plurality of
sensors,
10 the first electrode includes a plurality of first
wiring electrodes arrayed in a first axis direction,
the second electrode includes a plurality of
second wiring electrodes arrayed in a second axis
direction crossing the first axis direction, and
15 each of the plurality of sensors includes a
plurality of crossing portions of the plurality of
first wiring electrodes and the plurality of second
wiring electrodes.
[24] The input device according to claim 23, wherein
2 0 the plurality of crossing portions are formed at
different densities for each of regions.
[25] The input device according to claim 19, wherein
the one or more sensors include a plurality of
sensors,
each of the plurality of sensors includes a
plurality of sensors each having a different
s e n s i t i v i t y of detecting a capacitance by the
capacitive element.
[ 2 6 ] An electronic apparatus, comprising:
one or more sensors each including
5 a f i r s t surface and a second surface that are
opposed to each other,
a support layer including
a f i r s t structure that i s p a r t i a l l y
arranged between the f i r s t surface and the second
10 surface and has a f i r s t height, and
a space portion formed between the f i r s t
surface and the second surface, and
a capacitive element including a f i r s t
electrode and a second electrode, the f i r s t electrode
15 being arranged on one of the f i r s t surface and the
second surface, the second electrode being arranged to
be opposed to the f i r s t electrode, the capacitive
element being configured to generate a change in
capacitance between the f i r s t electrode and the second
20 electrode in accordance with a change in distance
between the f i r s t surface and the second surface that
are opposed to each other via the space portion;
a controller including
a detection unit that detects the change in
2 5 capacitance, and
a signal generation unit that generates an
I
operation signal based on a result of the detection of
i
the detection unit; and
4
an input operation unit arranged on the first
surface side of the capacitive element.
5 [27] The electronic apparatus according to claim 26,
wherein I
the one or more sensors include a plurality of
sensors,
the first electrode includes a plurality of first
10 wiring electrodes arrayed in a first axis direction,
' the second electrode includes a plurality of
second wiring electrodes arrayed in a second axis
I
direction crossing the first axis direcdion, and
each of the plurality of sensors idcludes at least
I
15 one crossing portion of the plurality of first wiring
electrodes and the plurality of second wiring
electrodes.
[28] The electronic apparatus according to claim 27,
wherein
20 each of the plurality of first wiring electrodes
and the plurality of second wiring electrodes includes
a region with an array of partially irre'gular pitches.
[29] The electronic apparatus according to claim 26,
wherein i
I
25 the input operation unit is a flexible display
that displays an image based on the operation signal.