y^NSOE DEVICE-:, INPUT DEVl.CE, AND EI.KCTRONIC APPARATUS
Technical Field
[OOOIJ The prosent technology reldLos to a sensor device, 3.n input device, and an electronic apparatus that are capable of electrosLaliical 1 y dcLecting an input operation. HacJcgronnd Art
[0002] As a sensor device for an eloclironic apparatus, for ej^aitiple, there la known a confiqnration includifiq a capaciLive elentenL and being capable of detecting an operation position and a pressing force of ^n opcrEiting element with respect to dn input operation surface (sec, for example, Patent Document 1J. [0003J Patent Document 1: Japanese Patent Application Laid-open No. 2011-170659 ^UTtimary of Invention
Problem to be solved by the Invention
[0004] In recent years, an input method with a higlt degree of freedom has been performed by a gesture operation usinq the movement of llnqers. Moreover, if a pressinq force on an operation siicface can be stably detected with high accurEicy, a greater diversity of input operations arP expected to be achieved, [0005J In view of the circumstances as described

above, it is an objecL of the present technology to provide a sensor device, an input device, and an electronic apparatus Lhat are capable of highly accurately detecting an operation position and a preaainr\<5, "the second ^ttuct\sEes "may be
i di sposed to be opposed to each othe"r.
With this, a region In which the first structures
and the second structures are disposed to be opposed to
[overlap] each other "is difficult to deiorni, and thus
is a re^"i on having low detection sensitivity. Thi;;
allows detection sensitiv"ity .in the sensoi device to be
controlled and the degree ol freedom of the device
configuration to be enhanced,
[0D1!J1 Moreover, the electrode substrate is not
limited to a confignrati on to electrostatically detect
a chanq^ in d"i stance from each of the f i "rst conductive
layer and the second conductive layer. Fojr example, a
ch;^nge in distance from each of the operating element

made of a conductor and the second conductive layer may be elecLrojJtaticaliy detected.
[OOlGl Fiirtht^r, the first support is not limiLod to a configuration including Lhe first apace portion. Gaps between the inultiple iir^Lt sttucture-s ina-y be filled W3 th an clastic iiiaLerial or Lhe TlKe.
Alternatively, the second support is not limilied to a conilguratton including the second space porti on. Gaps between thci multiple second sLructuces rnay be filled with an t?1astic material or the like.
f0017J V'urthor, each oX the multiple first electrode wires [nay include luultiple first unit electrode bodied, the multiple fi.rsL unit eleeLrode bodies each includirtg mulLiple firsL 3ub-elecl_rodes, each of the multiple second electrode wires may iiiclude mulLip] e second unit elccLrode bodies^ the multiple second unit olectrode bodi es each including myjltiple second sub-elecLrodes and being opposed to the rnult:ple lirst unit electrode bodies, and ttie electrode subaLrate may include a base materiiil, the multiple first electrode wires and the multiple second electrode wi.reu being disposed on Lhe base m^Lerial, and multiple detection portions in which Lhe multiple first sub-elpctrodes of each of the first unit electrode bodies and Lhe multiple second snb-electrodes ot each oi the second unit electrode bodies are opposed to c^ich other in an in-plane direction ot

the electrode subsLrzite.
With this, the first elocLrode wires and the second electrode wires are opposed to eac^i other in the in-pian'3 direction of the electrode substrate, to be capacitiv^ly coupled. This makes it possible to make Lhc fjltr'^J^to*^^ substrate thinner and achieve downsizing of the entire sensor device. Moreover, since the mulLlpl^ first and second sub-elecLrodes form the detection porti ons, the amounts of capacitfve coupling of the detccLion portions r.an be enhanced, and detection sensitivity as a sc;[isor device can be
enhance^"
[0018J According to an embodiment oi the present technoJt^gy^ there is provided an input device including an oporPiJ-°n member, a f"i rst conductive layer £condirc^^^e layer), an electrode substrate, a firsL supports ^^f the display unit can be
[002^] The operation member may include maltlple kJ^y regions.
I'his allowu the input- device to be applied as a keyboard device.
[002:3] H'urther, the electrode substrate may furthoj-" include multiple der.ection portions, each ol the multiple detection portions being formed in t^ach of intersection regions of the multiple first electrode wires and the multiple se'^ond electrode wires and having a capacitEincs variable in accordance witli a rciaLive distance from Lho conductive layer. fn0?4] Moreover, the input device may further include a control unit tii^t is electrically connected to the electrode substrate and is capable of generating information on an input operation with respect to eaclJ of the multiple key reqioH-'^ based on outputs of the multiple detection portions-
This allows the input device to perform^ by the

control unit, cP^^Lroi correRpondi ug to a key region on which an input operation is made.
[0025] The mtil^-i-plt3 first structures may be disposed along boundiiirie^ between the multiple key reqJons.
This can provide a confiquration in which Lhc key regions 3re opp^^^-^ to the first space portion. Therefore, the input operation in the key region can easily change a distance between the oporaLion meniber and the el ectroi^^ substrate, and detection sensitivity of the input opi^ration can be enhanced, [002(j] Furth^^i the Jiiultiple tlrst electrode wires may be flat-plal^^"^^i^Pt^^ electrodes and may be disposed on the operatioiT rnember side relative Lo Lho multipJe second electrode wires, and each of the multiple second electrode wires "i^Y i ncUide multiple elecLrode groups.
With this, the iirsL electrode wires are connected Lo the ground tP fiinction as an electroinagncLic shield. Therefore, wi thi^^'t a configuration of a metal film or the like formed °n the operation member, it is possible to suppress int'^'-'sion of elecLromagnetic waves from the outside of the iiloctrode substrate, for example, and Lo enhance the rel ^ ^^-^ ^ -^^Y ^^ de toe Lion sensitivi ty, [0027] FurLfit^-i^/ iti the input device according to one embodiment of tV^ present technology, the second structure is noL- limited to be disposed bcLween the first structured adjacenL Lo each other. !-'or example.

the first structures and the second sLructures may be disposed to be opposed to each other in the thicknesa direction of the input device.
Moreover; the electrode stihstrate i s not limited to a configuration to electrostatically detect a change in distance irom each of the first condtjcti ve T ayer and the second conductive layer. For example, a change in disLance from each oi the operating element made of a condfictor and the second conducti ve layer may be electrostatically detected.
Further, the first support i s not 1Imited to a
configuration including the first space porLien. Gaps
bcLwiteti the mulLiplc first structures may be ■f i T 1 ed
i with an elastic material or the like, AlternaLivcly,
Lhe uecond supperL is iioL limited to a conf igurati on
including the second space portion. Gaps between Lhe
JiiuiLiple second sLiucLurcs may be filled with an
elastic material or the li ke.
[0028] According to an embodiment of Lhe present
technology, there is provided an input device including
an operation member, a back plate, an elecLrode
substrate, a first support, and a second support.
The operation metitber is deiormabie sheet-shaped
and includes a iirst surface, a second surface, and a
conductive layer, the first surface receiving an
operation by a user, the second surface being on Lhe

opposite side to the first surface, Lho condacLivo layer being formed on the second surface.
The back plate is disposed l_o be opposed Lo tho EiGcond surface.
The electrode substrate includes mu.lt:iplc lirsL electrode W"i re.s and mul txp.l e .second electrode wires and is disposed Le be deformable between the operation member and the back pi ate, the multiple second electrode wires being disposed to be opposed to the multiple first electrode wires and inLersecLing wiLh the multiple first electrode w"ire.s.
The lirsL EJupporL includes multiple first
structures, the m^i^tiple first structures connecting
i
the operation meiitbtir 3.nd the electrode substrate. The second support includes multiple second structures, Lhe multiple second structures connecting the back pi ate and the electrode substrate. [0029J Further, the multiple second electrode wires may be flat-piate-shaped electrodes and mjy be disposed on Lhe back plate side relative to the multiple first electrode wires, and each of the multiple first electrode wires may include multiple electrode qroups.
With this, the second elecLrode wires are connected to the ground to function as an
electromaqnetic shield. Therelore, 11 Lhe back plaLe is noL a conductor, it is possible to suppress intrusion

of eiecLroiiiagnetic waves from thtj outside of the electrode substrate, for example, and to enhanoo Lhe reMatiiiiLy of detection ne^nsiLlvlty. [0030J According to an einbodment of tho present technology, Lhere is provided an electronic apparatus iheludJug an oporaLion member, a conductive layer, an electrode substrate, a first support, a se?ccnd support, and a controller.
The operation ntemben is deformable sheet-shaped
ai>d includes a first surface and u second surface, the
first surface receiving an operafi on by a user, the
second surface benng on the opposite side to the firsL
surface. i
The conductive layer is disposed to be opposed to Lhe second riurf ace.
The electrode substrate includes rnultiple first electrode wires and multiple second electrode wires, the multiple second eiceLrode wires heinq disposed to be opposed to Lhe multiple first electrode w.i res and intersecting with the mulLiple first electrode wires, the electrode substrate being disposed to be deformable boLween the operation meiEiber and the conducLive layer and beinq capable of electrostatically detecting a change in distance irom Lh.e conductive layer.
the first support includes mulLiple first structures and a first space portion, the multiple

first St rue Lures coiinectinQ the operation member and the electrode substrate, the first space poirtion being formed between the multiple lirst structures.
The second support includes multiple second sLiiLictures and a second space portion, the multi pie set^ond sLi^irAAjres being each i:iispesed between the first structures adjacent to esch other and connecting the conductive layer and the electrode substrate, the second spaci^e portion being formed hetwecn the multiple sct;ond structures.
The controller "includes a control unit that is
electrically connected to the electrode .substrate and
is capable of yenerating information on aA input
i operation with respect to each of the iiiult-iple
oppration niembers based on an output of tho electrf?de
substrate.
Effect of the Invention
[0031] AS described above, according to the pre?5ent
technology, it is possible to highly accurately detect an operation position and a pressinq force. Brief Description of Drawi ngs
[0032] ['''ig^ 1] ^ schematic cross-secLional view of
an input device according to a f i rst embodiiiient of the present technology.
[ l''i g, 2] An exploded perspective vi ew of the input device.

fVig, 3} A scheEnat.ic cross-sectional view of a fEtain part of the input device,
r^'ig, 4] A block diagram of an electronic apparatus using the Input device.
[Klg. 51 A schemati c cross-sectional view showinq r.oi^figucatlor^ exiaii^ples oi ^ <^.0'nd\ietive layer of the input devi.ce.
[Fig. 6J A ijeheniatic view for desccibinq a method of connecting a metal liim of the input device and the conductive layer to a qrourtd potential.
[Fiq. 7] A schematic view lor describing a method ol connecting a metal film accord i iig to a modified ^xampl^^ and the coiid^icti'Jo layer Lti a grouiid potential .i
[fig, 8j A schematic cross-sectional view for describing a contigiiration of a deUoction. portion of the input device,
[Fig. 9] A schematic cross-seotional view showinq examples of a method ol forming a fnrst support of the input device.
SFiq. '\^] A RnheniaLic oross-seotiunai vi evj sho'iJing an example of a method of forming a fjccond support ol the input device.
[f-'ig. 11] A schematic cross-sectional view showing a jnodilied example of a method ol forming the first or second support.
[Fiq. 12J A schematic plan view showing

arrangement examples of. first aiid .second structures and Lir.st and second electrode vfire.^ ot the input device.
fFiq. 13] A scheyn^ftic: plan view shovji ng arrangeincnt examples o£ opening.^ oi the conductive layer, the lirst and second structsjres, the lirst anrf second electrode wires.
[Fig. 14] a schematic cros&-se[:tioEml view showing a state ol a force applied to the-, first ^ind second structures when a point on the f^irst suriirce ol the Inptil device i-? pressed downw^r^i ifi a S-axis dlrecLlon with aTi operating element.
[Fig. 15] A schematic cross-sec:tional view of a main part, showing an aspect ol t.he input device when a point of the first surface nbov^ L^e first structure receives iin operation by an opei-3t.|ng element and showing an example el outpuL i^ignais output from the deLect-Ton portions at that time.
[Fig. 16] A iJchematic cros-'^.-s^ct: onal view of a main part, showing an aspect of fhe input device when thf^ fit^t ^iVl^f^cf^ reci2ivep^ t^n oyK^i:ation by the operaLing element and showing ar,. example of output signals output from the deteeLic)n portions at thiit time, in which A shews a case VJlicre the operating element is ^ stylus, and Ei shewfi ^ cyse whtjre the operating element is a finger,
[Fig. 17J A schematic cross-sectional view showing

att example oi mountinq tho input, device to an olef^tronic: apparatus.
[Fig. IS] A scheinatic cros^-^pctional viow showing
a ctinfigurat.lon of a modified e>:aiv[ple i o± the input-device shown in h'iq. 1, in vfhi.ctt an adhesion layer is partiial Ly formed.
[Fiq. T5] A view schematically showing a state whore a flexible dispT.ay (display uniLJ shown in Fig. 18 is attached Lo the entire surface of a rnetal film shown in tha figur^i, the <^nt2re surface including the outer circomferonti al porfi.oEi.
[Fig. 20J A schematic etos^-^uecf.tonal view showing another coiifiguraLion oi a nfodifipd example 1 of the inp-a"t device ishovjri in Fig, 1, ^V-,ov^j.ng an e-zaTrtplc; in which an adhesion layer is formc.d in a predeLermined plane pattern.
[t'lg. 211 A schematic view showing examples oi the plane paLtern oi the adhesion l^yer shown in Kig. 20.
[Fig. 22[ A schematic pi Fin vic?w showing a oenfiguration example of the iii-st and second eloctriide wires acc:o>:d,itiq to d. isiodlfiiiii ^v.e,\uple 2 of the ir\put deuit^e shobfn in Fig. 1, in which /\ sliows the fir^jL eTectrode wires, and B shows th^ sG?cond electrode wire.^.
[Fig. 23] A sohematio vj ew allowing shape examples oi unit electrode bodies of the first and second

electrode? wires shown in Fig. 22 -
iFig. 2^] A schemaLic plan viuw showing strro^aqement e.xampluK of the first aud seoond structures and the first R.r].d second electrode wi rus according to a nfodified example 3 of the input device shown in l'±q. 1.
[Fig, 25J A schematic cross-.'secti on^l view oil a nisin part, showing £ari aspect of the input device whon the first surface of the input dovicG of Fig, 21 receives an operation by the operating element.
[Fig. 2&i A schemiit.ic cross-sectionEil vi^vj i^Uo'riiwg a configuration of a modified exa^nple 4 of the input device shown in Rig. ],
[Fig. 27] A schefJTistic cross-sectional v: ew of a main part, showing" a configuration ei^amplc ^ of a modified example 5 of the input device shown in Fig. 1.
I^'ig, 281 A .^Jchenatic cross-sectional view of a main part, riho'^^irig a cor^f ii^unLition exasviplt^ 3 of tl^e modified oxam^Jl e b ol the i.npiit device shown in Fig. 1.
[Fig. 29} A schematic cross-sectional vi^w of a main part ^ showing a configuration exampl e 'T of the modified example 5 of the input device shown in Fig. 1,
[Fig. 30} A schematic cross-sectional view of a main part, showing a configuration example 5 of the rriodif ii::d ei^siYiple 5 of t.Vie input device shov^n In Vig. 1.
[|:'ig. 31] h schevojiit-i c cross-sectional view of an input devii^e at^cordlng to a second ombtJdijrjfjnt of the

present techno^ ogy.
!FJ g, 32] A schematic cross-sactional view showing a configuration example of an operation member of the input device.
[Fig. 33] An enlarged cross-sectionai view showing a confiqiiration of a modified example of the input device shown in Fig. 31.
fFiq. 34] A plan view showing an nrrangemcnt example of iirst and second structures of Lho input device shown in Fig. 33, in which A shows the first structuT-es and B shows the second structures.
[Fiy. 3Ei] A plan view showinq a configuration example of multiple first and second electrode wires of the input device shown in j:'ig, 33, in which A showu the first electrode wires and B shows the .second electrode wires,
(Fiq. 3G] An enlarged plan view showing an arrangement example of first and second structures shown in Fiq. 34.
[h'lg, 3V i A schejiiatic cross-sectional view of an electronic apparatus in which an input device according to a third emb<3d:Tnent oi the pre:Jcnt technoloqy is iv^cortJorat.e':!,
[H'ig, 38] A view tihow.ing a fjonf i guration of an input device according to a fourth embodiment of the present tochnology, in which A is a schematic cross-

scctionaT. viow and B is an enl^iEtjed cro^s-^^ectiona]
view showing the main pari of A.
[Fig, 39] A schematic plan view showing a oonfigaratinn exEiJnpIe of lirst and second electrode ijiices of. the inpvit device sho'im ivt Fig. 3S, ici. *-ihich A shows the first electrode wires and B shows the second electrode wires.
[Fig. 401 A is a plan view showing an array of Lhe first and second eJectrode wires of the input device shown tn Fig. 3Q, and B is a eross-secLional view when viewed from the A-A direcLion of A.
fFig, 41] A schematic cross-sectionai view for describing a contigurat-iosi of rietecLion potiioris sho\*n in Fig. 3S.
[Fig. 43 J A schematic cross-sectional view of Jfi input device according to a configuration example of a fifth etiEbodinient of the present techno] ogy.
[Fig. 43] A schemaLic plan view shovjinq an arrangement example of first and second structures and first and secoEid electrode wires of the input device? shown Tn Fig. ^?..
[Fig. 44] A schematic cross^^ecti ofiai view oi ^n input device according to another configur,3tion exaniple of the fifth embodiment of the prosent techno.''ogy.
[Fig. 4^j] A schematic plan view showing an arranqe?ment example ol first and :^econd structures and

first and second electrode wires of tho input device shown in Fig. 44.
[t'ig. 461 A schematic plan view showing a configuration exaenple of the first and second electrode wires according to a modified example of the inpuL device shown in Fiy. 42, in which A shows the first electrode wires and H shows Lhe second electrode wires.
[Fig. 47] K scliematir. plsti 'jiew i^hovilng a confignratlon example of firaL and second electrode wires according to a modified e:^ample of the inpuL device ishown in Fig. 44, in whieh ft show5 Lhe first elecjtrode wires and B shows the second electrode wires.
[Fig. 4S] A view showing a confignration of an input, device according to a modified example of a sixth embodiment of the present technology, in which A is a perspective view and B is a cross-secLional view when viewed Lrom the B-B direction of A.
f Fi f(. 4 9] A perspective view showing a confiquraLion of a modiiied example of the input device '^ho^m in t'i g , 4^ .
Mode(s] for Carrying OuL Lhe Invention [0033J Hereinaiter, embodiments of the present technology will be described with reference to the drawing.'^. [0034]
Fig- 1 is a schematic cross-sectional view ol an

Sr350706WO00 24
input device 100 according io a first etnbodiment of the present technology. Fig. 2 is nn exploded perspective view of the input device 100. F'ig, 3 is a .scheinalic cross^scctional view of a main pEirt of the input device 5 100. i-'ig. 4 is a block diagram of an electronic
apparatus 70 using tho inpnt device 100. Hereinafter, a confiigiiration ol the : nput device 3 00 ol this enibodimt;nt will be described. It should be noted that in Iho figures, an X axis and a Y axis represent
10 direct:ions orthoqonal to each other (in-pl ane direction of the input device 100), and a Z axis represents a direction orthogonal to the X axis and the Y axis (thickness direction or vertical direction ul the "input device? 100) ,
lb [0035] [Input Device]
The -input device 100 includes a flexibJe display (display unit) 11 that receives an operation by a user and a sensor device 1 that detects the operation of the user. The input device 100 is formed as a flcxfb]e
20 touch panel display, for example, and is inoorporatod
into an electronic apparatus 70 that will be described later. The sensor device 1 and the flexible display 11 each have a flat-plate shape that cKtends in a direction perpendicular to the Z axis.
25 I00.T6J The flexible display 1.1 ini:3udes a first
surlace 110 and a second surface J 20 on the opposite

SP350706WO00 25
side to the iirst surface 110. The flexible display 11 has a lunct.ion as an input operation unit and a function as a display unit in the input device 100. In other words, the iiexible display IJ causes the iirst 5 surface 110 Lo function as an input operation surface and a display surface and displays an image corresponding to an operation by the user from the first surface ] 1 0 upward i.n a Z-ax: s direction, On the fir^t surface liO, an image correspondinq to a
10 keyboard, a GUI (Graphical User Interface), and the
like are rifsplayed. Examples of an operating element that performs im operation with respect to the flexible i display 11 include a finger i shown in Fig. 16B and a stylus s shown in t-'lg, 16R.
lb [0037J A specific configuration of the flexible
display n is not particularly limited. For example, as the flexible dlspliiy 11, a so-called electronic paper, an organic !-ZL (electrolmiilnuscence) panel, an inorganic EL panel, a liguid crystal panel, or the like can bo
?0 adopted. Additionally, the thickness of the Iiexible display 11 is also not particularly limited, and is approximately 0.1 mm to 1 lEim, for example. [0038] The sensor device 1 includes a metal film (first conductive layer or second conductive layer) 12,
25 a conductive layer (second conduct:ve layof or first conductive layerj ffO, an electrode substrate 20, a

3P35a706KO00 26
lirst support 30, and a second supporL 40. The sensot
device 1 is disposed on the second surface 120 side of
Lhe flexible display 11.
[0039] The metal film 12 is formed to have a
5 deformable sheet shEfpe. The conductive layer 50 is
disposed to bo opposed to the meLai film 12, The
eiecLrode substrate 20 includes multiple first
electrode wires 210 and Eiiultiplt; second electrode wir^s
220. The rnultipl e second electrode wlces 220 are
10 disposed to be opposed to the multiple first electrode
wires 210 and intersect with Lhe multiple first
clcc!_rode wires 210. The electrode subsLrate 20 is
disposed tfo be deformable between the metal film 12 and
I the conductive layer 50 and is capable oi
15 electrostatically detecting a change in distance from each el the metal film 12 and the conducLive layer 50, The first support 30 includes mulLiple first structures 310 and a lirst space portion :i30. The mulLiple first structures 310 connect the metal fllrn 12 and the
90 electrode substrate 20. The first space perLion 330 is
iormed between the mulLiple first sLructures 310. The second supporL 1Q includes mulLiple second sLructures 410 and a second space portion -^30. The multiple second structures 410 are disposed between the mulLiple first
2b structures 310 adjacent to each other and connecL the
conducLive layer 50 and Lhe electrode substrate 20. The

aP350706WO00 27
second space portion 430 js formed between the multiple
second sLrucC-Vires 410.
[0040] The sensor device 1 (input device lOOj
according to this enbndiment electrostatlcally detects
:J changes in distance between the metal film 1? and the
electrode substrate 20 and between the conductive layer
50 and the electrode substrate 20 due to an input
operation on the firsr. surface 110 oi the flexible
display 11, to detect the input operation. The input
10 operation is not limited to a conscious press (push)
operation on the first surface 110 and may be a contact
(touch) operation thereon. [n other words, as will be
described later, the ibput device 100 is capable^ of
I detecting even a minute pressing force (for example,
15 approj^imaLely several 10 g) that is applied by ^
gencjral touch operation, and is thus configured E;O as to enable a touch operation siini^ar to that of a normal touch sensor, [OOi^l] Tlie input device 100 includes a control unit
20 60, The control unit 60 IncJ udes an aritliinet.i c unit 61 and a signal generation unit 62- 'I'he arithmetic unit 61 detects an operation by a user based on a capacitance change of a detection portion 20s. The signal qeneraLion unit 62 generates an operation signal based
25 on a result of the detection by the arithmetic unit 61. [0042] 'I'he electronic apparatus 70 shown in Fig. 4

SP1^50706WOnO 28
"includes a controller 71.0. The controller 710 performs
processing based on the operation signal generated by
the signal generation unit 62 of tht; input device tOO.
The operation signal processed by the controller 710 is
S output, asi an image signal, for example, to Lhe
llcxibTe display 11. The flexible display 11 is
connected to a drive circuit via a flexible wiring
substrate 113 (see Fig. 2), the drive circuit being
mounted in the controller 710. The drive ci rcuit may be
10 mounted on the wiring substrate 113.
[0043] The flexible display 11 is formed as a part
of an operation member 10 ol the input device 100 in
Lhis embodiment. In oLher words, the input device 100
I includes the operiition member 10, the electrode
15 substrate 20, the first support 30, the second support -^0, and Lhe conduc;Live layer bO. Heroinafter, those element.^ will be described. [0044] (Operation Member)
Th*5 operation rrtember 10 has a Jaminate structure
20 of the flexible display 11 and the metal film 12, the
flexible display 11 including the fir.^t surface 110 and the second ynrface 120. I n oLher words, the operati on member 10 includes the first surface 130 and the second surface 120 and is lormed to have a deiorniatile ^heet
2!i shape. The first surface 110 receives an operation by a
user. The second surface 120 is the opposite side to

SP3iJ0706WOOO 29
the first surface 110 and is provided with tho metal film 12.
[004!)] The nieCal film 12 is formed to have a sheet
shape that is deformable following tihe deformation of
b tho fleKible display IK The iiiGtal filrn 12 is fomied of
a rtiesh iiiatt^rial or metal foil that la made of, for example, CU (copper), Al (alutninum) ^^ or steel use sta-inleas (HUS) . The thickness of tho metal film 12 is not particularly limited and is several 10 nm to
10 Hoveral 10 }im, for example. Tho metal film 12 is
connected to a ground potential, for example. Tho met^il film only noeds to function as a conductive layer, and is not limited to metal. H'or example, the metalf tiim may be an oKide conductor such as ITO (indium tin
15 oxide) or an organic conductor such as carbon nanotube-
This allows the metai film 12 to exert a function as an olectromagnetic shield layer when mounted in the electronic apparatus VO, In other words, it is possible to suppress intrusion ol electromagnetic waves from
20 other electronic t^ompon^nts mounttid in the electronic
apparatus 70 and leakage of electromagEieti c waves trom the input device J 00, for example, and contribute to operation stability as the electronic apparatus 70. It should be noted that the metai film 1? may include
2!J multiple layers each connected to the ground potential
tsee Fig. 7). This cstf strengthen the function as the

SP350706KO00 30
elt;c:trornagneLic shield layer.
[0046] t'or example, as shown in F:g. 3, a viscous
adEiosion layer 13 on which meLal foil is formed is
attached to the ilexible display 11, thus forming the
^ inotal filjit 12. The material of the adhesion layer 1.3 is
not parLicularly limited a^ long aa it has viscosity,
buL may be a resin film to which a resin material "is
applied, AlternaLively, Lhe metal film 12 may be iormed
of a deposited filfis, a sputtering film, or the like
10 Lhat IS directly formed on Lhe flexible display 11, or
may bo a coating fJlra oi a conductive pauLe or the like Lh^jt is prinLed on the surface of the flexible display
11. FnrLher, a non-conductive film may be forrrted on the i
I
surface of Lho film metal film 12. Examples ot the non-15 conductive film include a hardcoaL layer rcisistanL to
scratches and an antioxidant lilm resistant to
corrosion.
[0047J fConddctive Layer)
The conductive layer 50 forms Lhe lowermost
20 portion of the input device 100 and is disposed to be
opposed to Lhe metal film 12 in the Z-axis direction.
'I'he conductive layer 50 also functions as, for example,
a support plate of Lhe inpuL device 100 and is forjiied
so as to have a higher bonding riqidity than that of
25 Lhe operaLion member 10 and the electrode suhstraLo 20,
for exampie- The conductive layer 50 may hC formed ol a

3P350706WO00 31
metal plate including, for example* an Rl alloy, an Hg (Tnagne^iiirnj alloy, or other inota.l materi als or may be formed of a conducLive plate made of a carbon-fiber-reinfojiced plastic or Lhe like. Alternatively, the 5 conductive layer 50 may have a laminate structure in which a conductive film such aa a plating film, a deposited tilm, a sputtering film, and metal foil is formed on an insulating layer made of a plastic material or Lhe like. Fiirther, the thickneEJs of the
10 conductive layer SO is noL particularly limited and is approximately 0.3 mm, for example.
[OO'lBj Fig. 5A Lo E is a scbemaLic cross-sectiona! view showing confignraLlon examples ol the conductive layer 50, The conductive layer 50 is not limited to ^n
15 example formed into a llat-plaLe .shape a.s shown in Fig. 5R and may include step portions 51 shown in Kig. 5B, C, and E. Alternatively, the cendoctive layer 50 may be formed into a mesh provided with openings 50h. [00^9] For example, a conductive layer SOB shown in
20 Klg, bB includes step portiotis 51B. The step portions
51B are each formed hy bending a circuiitletentiai portion upward in the Z-axis direction. Conductive layers 50C shown in hig, bC, K include step portii ons EilC and iill';, respectively. The step portions 51.C and
25 51E are formed at the center portion and recessed
downward. 3uch step portions 51 can enhance bending

SP350706WO00 32
rigidity of the conductive layer 50 in the Z-ii%is direcfi on,
[0050J further, conductive JIayera bOE shown in Fig. 5D, E are provided with one or multiple openings SOh. 5 Providing the openings SOh to the conductive layer 50 ill such a jfianiiGr can enhEince radiation performance while maintaining rigidity. Therefore, it is possible Lo suppress defects of Lhe inpuL device 100 and to enhance roliabi1ity. Further, the openings SOh can
10 decrease the volume of the conductive layer 50 and
reduce the weight ol the input devi ce 100. Kurthermore, the openings SOh can facilitate air Lo flow when the volume of the second space portion ^30 is changed by deformaLion, and thus a response time of the electrode
15 substrate 20 is shortened. Here, the response time refers Lo time from time whc;n a Toad applied Lo the oporatinn meiEtber 10 is changed Lo time when the volume of the sensor device lis actual1y changed^ [0051] Kxample.^ of the shape oA the^ opening 50h in
20 plan view may i ncludo mul ti-^angul ar shapes such as a trianglo and a square, circular shape.^, elliptifial shapes, oval shapes, indeteimlnate shapes, and ijlit-likc shapes, Tiiose shapes may be used independently or in combination of two or more of them.
2b [0052J further, in tho case where the conductive
layer 50 is provided with tho multiplG openings SOh, an

SP350706WO00 33
arrangement pattern of the multiple openings SOh :i s not particjularl.y limited, but may be a regular pattern, for example. This o^n make detection sensitivity more uniform. E-^urther, the regular pattern describe above 5 may be a one-dimensional arr^y or a r.\^o-dimensional
array, and may be mesh-1 ike, lor example, a^ shown in Fig. 3\i. AlLGrnati vely, the multiple openings JjOh may be formed into a stripe shape or may be formed to have a geometric paLterr as a whole.
10 f0053] The openings 50h are provided at positions or in regions thaL are not opposed to any of the multiple second struoturt?s 410, for example. In other words, tho openings JJOh and Lhe second utruotiires 410 are provided to he displaced in an in-plane (in-XY ptanej direction
1^ so as not to overlap in the Z-anis direction tin Lhe thickness direction of Lhe input device TOO). This allowEJ the electrode substraLc 20 and Lhe conductive layer TiO to be stably connected to each otlier via the second structures 4:1 0 .
^0 [00b4] The conductive layer 50 is connected to the
ground potential, for example. The conductive layer bO thus exerts the function as an elecLrcmagnetic shield ]ayer when mounted in the electron!c apparatus 70. In other words, for example, it is possible to suppress
2b i ntrusion of electromagnetic waves f roin other
electronic components and the like that arc mounted In

SP3bn706KO00 34
the electronic apparatus? 70 and 1 eakago of electromagnetic waves from the input device 100, and contribute to operation stability as the electronic apparatus 70. Further, using the following connection 5 method can enhance the electromagnetic shi eld tunction. ipore.
[OOfj.'iJ (Method of Connecting Metal Film and Conductive Jrayer to Ground PotentiEil]
Fig. 6 is a schematic view loi: describing a itiethod 10 of connecting tUe metal film 12 and the conductive
layer 5t) to a ground potential. As shown in Kig. h, the
metal film 12 ar\d the conductive layer bO are connected
i to, for example, a ground of the control unit 60 of tJie
i
input device 100 and a ground of the controller 710 of
15 the elcictronlc iipparatus 70.
[OOJjfi] Here, the ilex-ible display 11 is described as an exajriple of a device thtit has an influence on the detection sensitivity of the sensor device i. It the metal lilm 12 and the conductive layer ^0 arc connected
20 to only the ground of the control unit 6Q, tUe flexible display 11 has a possibility of affecting the ground potential of the control iinit 60 and inhibiting an electrcmagneti c shield effect from being suifici ently exerted, "in this regard, the mctat film 12 and the
25 conductive layer 50 are connected to the ground of the controller 710 to which the flexible display 11 is

SP3!J0706VJO00 35
cortrtccted, and thus iL is possible to keep the ground potential more sLable and enhance the electromagnetic shield eff ecL. Further, as shown "in the figure, connecting the metal film 12 and the conductive liiyer 3 50 at more contact points can also eniiance tho elPCtcomagnetic shield effect.
[0057J ftlLornatlvely, as shown "in Fig. 1, the metal film 12 may be forineti of multiple layers. In the ei^^mpio shown in the figure, the metal film 12 incliides
If) a first metal film i2a on tho flexible display 11 side and a second metal film 12b on the electrode substrate 20 side. This allows the firsL metal iilm ■i2a to be /connected to the yjroxind of the controller 710 and the second metal film 12b Lo be connected to only the
15 control unit 60, lor example. Alternatively, the second metal film 12b may be connected to both the control unit 60 atid the controller 710, This can :iiso enhance the electrnmagnotir. shield ef f ecL . [OObS] iEieotrodo Substrate)
20 The eJectrode substrate 20 is formed ^s a laminate
of a f i rst wiring substrate 21 and a second wir"! ng substrate 22. The first wiring substrate 21 includes the first electrode wires 210. The second wiring substrate 22 includes the second electrode wires 220.
25 [00Ei9] The first wiring substrate 21 includes a
first base material 211 (see Fig. 2) and the multiple

SP3!30706KOOO
first electrode wires (K electrodes] 210. The first base niateriEjl 211 is formed of a sbeet material having flexibility, for example. Specifically, the first base material 211 is formed of a plastic -sheet (film) hEiving
5 elecLrical insulirtion property, whic:h is made of Pi'lT,
PEN, PC, PMMA, polyimido, oi: the like. The thickness of
the first base maLerial 211 is not particularly limited
and is several 10 yita to several 100 prn, for example.
[0060] The multiple first electrode wires 210 are
10 in Leg rail y provided to otte surface of the first base
material 211. "J'he multiple first electrode wires 210
are arrayed at predeterfEtined intervals along ati X-axls
direction atid formed substantially linearly along a ¥-
I axis direction. The first electrode wires 210 are drawn
15 out to 3n edge portion and the like of the first base
(naterial 211 and connected Lo respective different Cermijials, Additionally, the first electrode wires 210 ^re electrically connected to the control unit 60 via those terminals.
20 [0061J It should be noted Lhat the multiple iirst
electrode wires 210 may be each f oritied of a sinql e electrode wite or may be formed of multiple elecLrode groups 21w arrayed along the X-axis direction (see Fig. 12). fidditional1y, multiple electrode wires thai form
25 each of the electrode groups ;^lw may he connected to a
common terminal or may be connected Lo two or more

SP350706WO00
37
diiferent teritiinii] s.
[0062] On the othei: hand, the second wiring
substrate 22 includes a second base material 221 (see
Pig. 2) and the multiple second electrode wires (Y
5 electrodes) 220. The second base material ^21 is formed
of a sheet material having IlexibiliLy, for (Example,
similarly to Lhe first base material 211. fipeciiically,
the second baae material 221 is formed of a plastic
sheet (film) having elecLrical insulation property,
10 which is made of PET, PEfJ, PC, PMMA, pelyimide, or the
liJce. The thickness of the second ba.^e material 221 is
not particularly limited and is several 10 pm to
several 100 fim, for examtilo. The second wiring
I substrate 22 is disposed to be opposed Lo the first
i.5 wiring substrate 21.
[0063[ The multiple second electrode wires 220 are
formed similarly to the mulLiple first electrode wires
210. In other words, the multiple second electrode
wires 220 are integrally provided to one .surface of the
20 second base material 221, arrayed at predetermined intervals along the Y-axi s directi on, and formed .substantia] 1 y linearly alonq the X-axis direction, Additionally, the multiple second electrode wires 220 may be each formed of a single electrode wire or may be
25 formed of multiple electrode groups 22w arrayed along the Y-ax-i .'3 direction (see t'ig. 12).

SP-150706WO0O 38
[0064] The second electrode wires 220 arc drawn out
to an edge [jortion and Lhe like of the second bauc
material 2?1 and connect.ed to respective difiorent
terminals. Multiple electrode wires Lhat form each of
5 the electr'ode groups 22w may bo connected to J comnion
terminal or may be connecLcd to two or more different
terminals. Additionally, the second electrodc wires 210
are electrically connected Lo the control unit 60 via
those terminals.
10 [0065] The first electrode wires 71Q and the second
electrode wires 220 may be formed by a method of
priiiLing the conductive paste and the lifce, such as
screen prinLltig, gravure ulfset printing, and ink-jet
I
printing, or may be formed by a paLterning method using
15 photolithography technology of metal foil or a metal layer. Addifi onallyi the first aaid second base materials 211 and 22] are each formed oi a sheet liaving flexibility, and thus Lhe electrode substrate 20 can have flexibility as a whole.
20 [006G] fts shown in Fig. 3, the electrode substrate 20 includes an adltcsion layer 23 that bonds Lhe first wiring subEiLrate 21 and Lhe second wiring substrate 22 Lo each other, Tlic adhesion layer 23 has elecrrical insulation property and is formed ol, for example, a
25 hardened material of an adhesive, or a pressure-sensitive material such as a pressure-sensitive tape,

[0067] With such a confiauration, Lhe first electrode wires 21tJ are disposed to be opposed to the second electrode wires 220 in the thickness direction of the electrode substrate 20, that is, the J^-axis direct!on, Addi tionally, the electrode substrate 20 includes the multiple detection portions 20s that are formed "i n r regions where the first, e lee L rode wires !?tO and the second electrode wires 220 intersect, [006SI Vtq^ HA. is a achetaatie cross-sectional view ioc describinq a configuration of thi? detection porLion 20s. The detection porLion ?.0s is formed of a cap3citive element in a mutual capacitance sysLem, the capacitive element includinq the iir?^t. electrode ^jire 210, t.he second eleeinotie wire 220 opposed to the first electrode wire 210 in the Z-^xls direction, and a dielectric layer provided between the first and second electrode wires 210 and 220. f.t should be nor.ed Lhat in ffig. iSA and B, the first and second electrode wires 210 and 220 are each assnnied to be formed of a single elecLrode wire.
[0069] Fig. 8A ;;hows an example in which Lhe fir^t electrode wires 210 [210x1, 210x2, 210x3) are disposed to be oppoEied to tlie second electrode wire 220 t220y) in the Z-axi s direction. In the example shown in t'ig, 8A, the first wiring substrate 21 and the second wiring subEittate 22 ace boY\d<^d to eacLi other by the iirfhesioti

]ayer 23, and the iirst base material 211 of the first
wirinq substrate ?/i and the adhesion layer 23 form Lhe
dielectric layer described above- In this case,
detection portions 20sl, 2Vis?., a^itl 2ns3 arc formed at
intersection regions where the first electrode wires
210x1, 710x2, and 210K3 and the second electrode wire
220y are capacitively-conpled, E*?!ipectivelY.
Capacitances Cl, C2., and C3 of the detection, portions
20sl, 20s2, and 20s3, respectively, are changed in
accordance with capacitive coupling between each of the
metal film 12 and the conductive layer 50 and the first
electrode wires 210x1, 210x2, and :^10x3 and the second
electrode wire 220y. 11 should bt; noted thaL an Initial J
capacitance of the detection portion 20s is set by, for
exinnple, a facing area between tl^t? first ^nd second
electrode wires 210 and :?20, a facing distance between
Lhe first and second electrode wishes 210 and 220, and a
dielectric constant oi the adhesion layer 23-
[0070] further, Fig, 8B shows a modified example of
the configuration ot the. detection portioiis 2(Js, in
which first, electrode wires 2101? (210Dxl, 2lODx2, and
2lODx3) and second electrode wires 220D (22ULiy],
220Dy2, and 220Dy3) are disposed in Lhe same plane on a
first base material 211D and are capacitiveiy-coupled
in Lhe X¥ plane. In this case, the first electrode
wires 210D and the second electrode wires 2:>0D are

disposed tn be opposed t-o each other in the in-plane direction oi the electrode substrate 20 (lor example, In the X-axis direction), and for example, the lir.st base material 21111 forms a dielectric layer of the detection portions 20Ds (2OD3I, 20Ds2, and 20Dy3t. In such an arrangement, capacitances Cll, C1.2, and CIS of the detection portions ?ODsl, 2nns2, and 20i:fsS, respectively, are formed to be variabJe according to the capacitive coupling between each of the metal iilrti 12 and the conductive layer 50 and the first iiiid second electrode wires ?TODx and ?20Dy. Additionally, in the configuration described above, the second base material and the adhesion layer become unnecessary, which can contribute to a reduction in thickness of the input device 100.
[0071J In this embodiment, the multiple detection portions 20s are disposed to be opposed to the jre-Kpectivc ficst sttuctures 310, ^-h4 ch ^iiil be described later, in the Z-axi s direc:tion. ^Alternatively, the multiple detection portions 20s may be disposed to i^e opposed to the respective second structures 410, which will be described later, in the 2-axis direction. Further, in this embodiment, the first wiriny sutistrato 21 is laminated to be cm upper surlacG of tlie second wirrnq substrate '/'/, but the first wiring substrate 21 is not limited theret^J. 'J'he

second wirinvi tbe flexible display 11, ar an uperatiosi. signal on an operation corresponding to a GUI
{Graphical User Interface).
[00/9] Here, the input device 100 includes the first and second supports 30 and 40 as a configuration to cau^o a change in distance between each oi the metiil fl]m 12 and the conductive layer 50 and the electrode substrate 20 (dcLcction portion 20H) by an operation on \ the f-JTst s\}rfac;e 110. HeTeinaiter, the first and second supports 30 aiiti ^0 will b^ doscrn bed.
[0080] (Basic Configuration of t'lrst and Second Supports)
The first support 30 is disposed between the operation member 10 and the electrode subStraLe 20. The first support 30 includes the mnitiple first structures 310, a first frame 320, and the firsL space portion 330. In this eiirbodiment, the first support .^0 is bonded to the electrode substrate 20 via an adhesion layer 35
{see Fig. 3), Tn& adhesion layer dTt may be an adhesive or T(\dY be formed of u pressure-sensitive material such as a pressure-sensitive adhesive and a pressure-sensitive tape.

[OOGl] As shown in Fig. 3, tho first support 30
according Lo this embodiment includes a laminate
stTTUCtnre including a base materiiil 31, a atrtJCturc
layer 32 provided on the surface {upper surfacct of the
base material 31, and multiple bonding portions 341
formed at prodeteirmincd positions on the structure
layer 32. The base material 31 is formed of a plastic
sheet having electrical insulalion property, which is
fliiide of PET, PKM, PC, or the like, Ttie thicktiess of Lhe
base material 31 is not particularly limited and is
iseveral ]im to several 100 \im, for exLirnple.
[00S2] The striicttire layer 32 is formed of a resin
maLtirial havtrtg electrical inoculation property, which is made of a UV resin or the like. The structure lay*?r 32 inclijdes multiple lirst convex portions 321, a second convex portion 322, anti a concave portion 32!^ on the base materia] 31. The first convex portions 321 oBch have a shape such as a columnar shape, a rectangular columnar shape, ^nd a frustUEEE shape protruding In the Z-axis ditcction, lor example, and are arrayed at ptedetermined "intervals on the base material 31. The second convex portion 322 i:J formed to have a predetermined width so as to surround the clrcojiiferenco of the base materia! 31.
[0083] Additionally, the structure layer 32 is made
of a sviate^iai that h^s relatively high ri^iditY and is

capable of doforming the electrode substrate 20 by ^n
inpuL operation on the first surface 110, but may be
made of an clastic material that is deformable together
with the operation member 10 dt the time of the input
operation. In other words, an elasLic modulus of the
structure layer 32 is not particularly limited and can
be selected as appropriaLa within, a Ciiciqe capable of
obtaining a target operational feeling or detection
sonsitivity.
[00S4J The concave portion 323 is formed of a flat
surface that is formed between the first and second
convei^ portions 321 and 322. In other words, a spat"i al
reyiort above the concaved portion 323 forms the first
I space portion 330. Additionally, above the concave
porticJn 32!^, In this embodiment, an adhesion prevention
layer 342 madu of a \)V rcain or the like having iovj
viscosity is formed (not shown in ETig. 3). The shape of
the adhesion prevention layer 342 is net particul^irly
limited and may be an island shape or may be formed iti
a flat film on the concave portion 323.
[0085J Further, the bonding portions 341 each iiiade
oi a visccJua resin material or the like are formed on
the respective f i rst and second convE^x portions 32 i and
322. In other words, each oi the first structures 310
TS forined as a laminate of the lirst convex portion 321
and the bonding portion 341 formed thereon. Each first

frame 320 i^ foxTiied EIS a lamiiiGte of tYio second convex portion 322 and the bonding portion 341 formed thereon. This mal'.cu, the thickness (1-Leiyhtl of thu first structures 310 and the iirst frame 320 substantially the samo, and the thickness [heiqhtj falls within a range of, for example, several pm to several 100 pm in t.h-is embodinient. It shotild be noted that the height of the adhesion prevention layer 342 is not particularly limited as long as the height is lower than the first structures 310 and the first frame 320. for example, the height ol the adhesion prevention Tayer 342 Is formed to be lower than the first ^nd second convex portions 321 and 329.

we claims:-
[1] A sensor device, comprising:
a deformable sheet-shaped first conductive layer;
a second conductive layer that is disposed to be opposed to the first condtictive layer;
ian electrode substrate that includes multiple first electrode wires and multiple second electrode wires nfid is di sposed to be def ormable between the first conductive layer ^nd the second tronductive layor, the multiple second electrode wires being disposed to be oppof3ed to the niultiple first electrode wires and intersecting with the multiple first electrode w:res;
a first support that includes multiple first structures, the multiple first structures connectinq the first conductive layer and the electrode substrate; and
^ sceond support that Includes maltjple second structures, the muHtipie second structures connecting the second conductive layer and the electrode substrate. [2f A tensor device, comprising:
a f^eformable sheet-shaped fi rst conductive layer;
a second conductive layer that is disposed to be opposed to the first conductive ]ayer;
^" electrode substrate that includes multiple first electrode wires and multiple second electrode

wires, the multiple second electrode wires being
disposed to be opposed to the m\iltiple first electrode
wires and intersecting with the multiple first
electrode wires, the eicct?:odc; ^nbstrate being disposed
to be defocTnable between the fit^t conductive layer and
the second, conductive layer and being capable oi
electrostatically detecting a change in distance from
each of the fir^t conductive lay^i and the second
conductive layer;
a first support that includes multiple first
structures and 5 first apace portion, the multiple
first stncctiire^ cannectinq the J:irst condncLive l^yer
hnd the electrode siibstrate, the first space portion
I
being formed between the multiple first structures; and
a second support that includes multiple second structures and a second space po-ttion, the multiple second stj:[jcturos being each disposed between the f j r.st structures adjacent to each other and connecting the second eondnctive layer and the electrode substrate, the second space portion being formed between the multiple second struc:tures. [31 The sensor device according to claiTVi 1, wherein
the electrode substrate further includes multiple detccCion portions, ^acfi of the multiple detection portions being formed in e^ch of intersection regions of the multiple first electrode wires and the multiple

second electrode wires and having a capacitance variable in accordance with a relative distance from each at the first conductive layer and the second conductive layer. [4J The sensor device according to cJaim 3, wherein
the jj^ultiplc detecLao/3 portions are foi:med to be opposed to the multiple first structures, [bj The sensor devrice according to claim 3, wherein
the multiple detection portions are formed to be opposed to the multiple second structures. [61 The sensor device according to claim 1, wherein
the first support includes a first frame, the
first frame Connecting the first conductive layer and
I the electrode substrate and being disposed alontj a
circuinferenti al edge oi the electrode substrate, and the second support include.'* a second frame, the
second frame connectintj the second conductive layer and
the electrode svcbsLrate jnd being disposed to be
opposed to the first iraroe.
[7] The sensor device according to claim 1, wherei n thi^ seaoiid conduct? ve l^yer Includes a st^p
portion.
iS] The sensor device according to claim 1, wheri^in the electrode; substrate is configured to be
capable of electrostatically detecting a change in
distance from each of the first conductive layer and

the second conductive Izayer. [9j The sensor device accordirt^ ^Q claim 1, wheteln
the first support iurther includes a first space portion., the first space portiori String formed between the multiple first structures. [lOj The sensor device accordird ^O claim J, wherein
the second support further ini:liides a second space portion, the second apace portion benng iormed between the multiple second structures. [11] The sensor device accordind to claim 1, wherein
OLich of the muiliple first electrode wires includes multiple first un: t ele^ctrodo bodies, the multiple first unit eleciirode b<^'=Jies each including multiple fJ rst sub-electrodes,
each oi the maitiple seconti electrode wires includes multiple se<3ond unit electrode bodies, the multiple second unit electrode botiies each including multiple second sub-electrodes 3^^ being opposed to the multiple tirst unit electrode botlies, and
the electrode substrate inc^l udes
a b^se material, the mLfltfple first electrode wires ^nd the multiple second electrode wires being disposed on the base material, a^^'^
multiple detection portions in which the multiple iirst sub-electrodes of tiach oi the first unit electrode bodies and the multiple second sub-electrodes

of each of the second ursit olecf-i^operGtion member and the olectrodc substxate^ the fir^t space portion being fomred betweevi the multiple fir^t structures;
a second support that inciuqes multiple second structures anti a second space potti on, the Tnuitiple aecDiid 3triir±UTes being each '^^^hc^ed between the first struct,u^es adjacent to each oth^j- ^-^^ connecting the conductive layer and the electrocte substrate, the second space portion bt^ing formeq JjFit-we^en the mulLiplti second .5ti-i)otLf?-es; mid
a contro^er including a coiitrol unit that is electrically connected to the els^trode substrate and is capable oi generating informatiori on an input operation with respect to each "ol^ the Eiiultjpie operation meiiibers baj;ed on an output: of the elecLrode substrate.