Description Title of Invention SENSOR DEVICE, INPUT DEVICE, AND ELECTRONIC APPARATUS 5 Technical Field [0001] The present disclosure relates to a sensor device, an input device and an electronic apparatus, which are capable of electrostatically detecting an input 10 operation. Background Art [0002] As a sensor device for an electronic apparatus, a configuration including, for 15 example, a capacity element that is capable of detecting an operation position and a pressing force of an operant with respect to an input operation surface is known (for example, refer to Patent Literature 1). Citation List 20 Patent Literature [0003] Patent Literature 1: JP 2011-I70659A Summary of Invention 25 Technical Problem [0004] In recent years, various improvements of characteristics for improving operability of sensor devices are being anticipated. One such improvement is improvement of operation sensitivity 30 [0005] In view of the circumstances described above, the present disclosure SP352309WO00 2/132 provides a sensor device, an input device and an electronic apparatus capable of improving operation sensitivity Solution to Problem 5 [0006] In order to solve the above-described problem, a first technique is a sensor device including: a first conductor layer; an electrode substrate; and a plurality of first structural bodies configured to separate the first conductor layer from the electrode substrate. At least one of the first conductor layer and the electrode 10 substrate has flexibility The electrode substrate includes a plurality of first electrodes and a plurality of second electrodes intersecting the plurality of first electrodes. At least one of the first and second electrodes includes a plurality of sub-electrodes. [0007] 15 In the sensor device of the first technique, when pressing is performed from the upper side of the first conductor layer, a relative distance between the first conductor layer and the electrode substrate is changed, and thus an input operation such as pressing can be electrostatically detected based on the change in the distance. Since at least one of the first and second electrodes includes the plurality of sub- 20 electrodes, a difference in the electrostatic capacitance before and after the input operation such as pressing can be increased. Accordingly, it is possible to improve the operation sensitivity. [0008] The sensor device of the first technique preferably further includes a second 25 conductor layer provided to face the first conductor layer; and a plurality of second structural bodies configured to separate the electrode substrate from the second conductor layer. The electrode substrate preferably has flexibility. Accordingly, when pressing is performed from the upper side of the first conductor layer, a relative distance between each of the first and second conductor 30 layers and the electrode substrate is changed, and thus an input operation such as pressing can be electrostatically detected based on the change in the distance. 3/132 SP352309WO00 Therefore, it is possible to increase an amount of change in electrostatic capacitance with respect to the input operation and increase detection sensitivity Accordingly, it is possible to detect not only an intentional press operation but also a minute pressing force when a contact operation is performed, and the sensor device can also 5 be used as a touch sensor. [0009] The sensor device in the first technique can detect the input operation with high accuracy even when an operant such as a finger wearing a glove or a fine-tipped stylus is used to perform the input operation through the first conductor layer rather 10 than a configuration in which the operant and each electrode of the electrode substrate are directly capacitively coupled. [0010] The electrode substrate may include a plurality of detection units which are formed at the intersection regions between the plurality of first electrodes and the 15 plurality of second electrodes and of which capacitance can change according to the relative distance with each of the first and second conductor layers. Accordingly, it is possible to detect an input operation in a so-called mutual capacitance method of performing detection based on an amount of ehange in electrostatic capacitance between the first and second electrodes. Thus, it is also 20 easy to simultaneously detect two or more points in a multi-touch operation. [0011] A second technique is an input device including: an operation member that includes a conductor layer; an electrode substrate; and a plurality of first structural bodies configured to separate the operation member from the electrode substrate. 25 At least one of the first conductor layer and the electrode substrate has flexibility. The electrode substrate includes a plurality of first electrodes and a plurality of second electrodes intersecting the plurality of first electrodes. At least one of the first and second electrodes includes a plurality of sub-electrodes. [0012] 30 In the input device of the second technique, when pressing is performed from a point on the operation member, a relative distance between the operation SP352309WO00 4/132 member and the electrode substrate changes, and thus an input operation such as pressing can be electrostatically detected based on the change in the distance. Since at least one of the first and second electrodes includes the plurality of sub-electrodes, a difference in the electrostatic capacitance before and after the input operation such 5 as pressing can be increased. Accordingly, it is possible to improve the operation sensitivity. [0013] The input device of the second technique preferably further includes a conductor layer provided to face the operation member and a plurality of second 10 structural bodies configured to separate the electrode substrate from the conductor layer. The electrode substrate preferably has flexibility. Accordingly, when pressing is performed from a point on the operation member, a relative distance between each of the operation member and the conductor layer and the electrode substrate changes, and thus an input operation such as 15 pressing can be electrostatically detected based on the change in the distance. Therefore, it is possible to increase an amount of change in electrostatic capacitance with respect to the input operation and increase detection sensitivity. Accordingly, it is possible to detect not only an intentional press operation but also a minute pressing force when a contact operation is performed, and the input device can also 20 be used as an input device including a touch sensor. [0014] The operation member may include a metal film. The detection substrate may electrostatically detect a change in the distance between the metal film and the conductor layer. 25 Accordingly, the input operation is performed with high accuracy even when an operant such as a finger wearing a glove or a fine-tipped stylus is used to perform the input operation through the metal film without using a configuration in which the operant and each electrode of the electrode substrate are directly capacitively coupled. 30 [0015] The operation member may include a display unit. 5/132 SP352309WO00 As described above, the input device does not have the configuration in which the operant and each electrode of the electrode substrate are directly capacitively coupled. Therefore, even when the display unit including a conductive material between the electrode substrate and the operant is arranged, the input 5 operation can be detected with high accuracy. That is, the sensor device can be arranged on the rear surface of the display unit, and thus it is possible to suppress deterioration in the display quality of the display unit. [0016] The operation member may include a plurality of key regions. 10 Accordingly, the input device can be applied as a keyboard device. [0017] The electrode substrate may include a plurality of detection units which are formed at the intersecting regions between the plurality of first electrodes and the plurality of second electrodes and of which capacitance can change according to the 15 relative distance with the conductor layer. [0018] The input device may further include a control unit electrically connected to the electrode substrate and capable of generating a signal according to an input operation with respect to each of the plurality of key regions based on a change in 20 electrostatic capacitance of the plurality of detection units. Accordingly, in the input device, the control unit can perform control corresponding to the key region in which the input operation is performed. [0019] The plurality of second structural bodies may be arranged along a boundary 25 between the plurality of key regions. Accordingly, each key region can be configured to face the space portion. Thus, the distance between the operation member and the electrode substrate can be easily changed through the input operation in the key region, and thus it possible to increase the detection sensitivity of the input operation. 30 [0020] A third technique is an electronic apparatus including: an operation member 6/132 SP352309WO00 that includes a conductor layer; an electrode substrate; a plurality of first stmctural bodies configured to separate the operation member from the electrode substrate; and a control unit configured to generate a signal according to an input operation with respect to the operation member based on a change in electrostatic capacitance of the 5 electrode substrate. At least one of the first conductor layer and the electrode substrate has flexibility. The electrode substrate includes a plurality of first electrodes and a plurality of second electrodes intersecting the plurality of first electrodes. At least one of the first and second electrodes includes a plurality of sub-electrodes. 10 [0021] A fourth technique is a sensor device including: a first conductor layer that has flexibility; an electrode substrate; and a plurality of first stmctural bodies configured to separate the first conductor layer from the electrode substrate. The electrode substrate includes a plurality of first electrodes and a plurality of second 15 electrodes intersecting the plurality of first electrodes. At least one of the first and second electrodes includes a plurality of sub-electrodes. [0022] A fifth technique is a sensor device including: a first layer; a second layer; an electrode substrate provided between the first and second layers; and a plurality of 20 stmctural bodies configured to separate at least one of the first and second layers from the electrode substrate. At least one of the first and second layers includes a conductive layer. At least one of the first layer and the electrode substrate has flexibility. The electrode substrate includes a plurality of first electrodes and a plurality of second electrodes intersecting the plurality of first electrodes. At least 25 one of the first and second electrodes includes a plurality of sub-electrodes. [0023] A sixth technique is an input device including: a first layer that includes an operation member; a second layer; an electrode substrate provided between the first and second layers; and a plurality of stmctural bodies configured to separate at least 30 one of the first and second layei's from the electrode substrate. At least one of the first layer and the electrode substrate has flexibility. The electrode substrate SP352309WO00 7/132 includes a plurality of first electrodes and a plurality of second electrodes intersecting the plurality of first electrodes. At least one of the first and second electrodes includes a plurality of sub-electrodes. [0024] 5 A seventh technique is an electronic apparatus including: a first layer that includes an operation member; a second layer; an electrode substrate provided between the first and second layers; a plurality of structural bodies configured to separate at least one of the first and second layers from the electrode substrate; and a control unit configured to generate a signal according to an input operation with 10 respect to the operation member based on a change in electrostatic capacitance of the electrode substrate. At least one of the first layer and the electrode substrate has flexibility. The electrode substrate includes a plurality of first electrodes and a plurality of second electrodes intersecting the plurality of first electrodes. At least one of the first and second electrodes includes a plurality of sub-electrodes. 15 [0025] An eighth technique is a sensor device including: a first layer; a second layer; an electrode substrate provided between the first and second layers; and a plurality of structural bodies configured to separate at least one of the first and second layers from the electrode substrate. At least one of the first and second 20 layers includes a conductive layer. At least one of the first layer and the electrode substrate has flexibility. The electrode substrate includes a plurality of first electrodes having a plurality of first unit electrode bodies and a plurality of second electrodes having a plurality of second unit electrode bodies. At least one of the first and second unit electrode bodies includes a plurality of sub-electrodes. 25 Advantageous Effects of Invention [0026] According to an embodiment of the present disclosure, as described above, it is possible to improve operation sensitivity. 30 Brief Description of Drawings SP3523O9WO00 8/132 [0027] [FIG. I] FIG. I is a schematic cross-sectional view illustrating one exemplary configuration of an input device according to a first embodiment of the present disclosure. 5 [FIG. 2] FIG. 2 is an exploded perspective view illustrating one exemplary configuration of the input device according to the first embodiment of the present disclosure. [FIG. 3] FIG. 3 is a schematic cross-sectional view illustrating one exemplary configuration of a main part of the input device according to the first embodiment of 10 the present disclosure. [FIG. 4] FIG. 4 is a block diagram illustrating one exemplary configuration of an electronic apparatus using the input device according to the first embodiment of the present disclosure. [FIG. 5] FIG. 5A is a schematic cross-sectional view illustrating an exemplary 15 configuration of a conductor layer of the input device according to the first embodiment of the present disclosure. FIG. 5B is a schematic cross-sectional view illustrating a modification of the conductor layer. FIG. 5C is a schematic crosssectional view illustrating a modification of the conductor layer. FIG. 5D is a schematic cross-sectional view illustrating a modification of the conductor layer. 20 FIG. 5E is a schematic cross-sectional view illustrating a modification of the conductor layer. [FIG. 6] FIG. 6A is a schematic cross-sectional view for describing a configuration of a detection unit of the input device according to the first embodiment of the present disclosure. FIG. 6B is a schematic cross-sectional view for describing a 25 configuration of a modification of the detection unit. [FIG. 7] FIG. 7A is a schematic cross-sectional view illustrating an exemplary method of forming a first support of the input device according to the first embodiment of the present disclosure. FIG. 7B is a schematic cross-sectional view illustrating an exemplary method of forming a first support. FIG. 7C is a schematic 30 cross-sectional view illustrating an exemplary method of forming a first support. [FIG. 8] FIG. 8 is a schematic cross-sectional view illustrating an exemplary method SP352309WO00 9/132 of forming a second support of the input device according to the first embodiment of the present disclosure. [FIG 9] FIG. 9Ais a schematic cross-sectional view illustrating a modification of the method of forming the first or second support. FIG. 9B is a schematic cross- 5 sectional view illustrating a modification of the method of forming the first or second support. [FIG. 10] FIG 10A is a schematic diagram illustrating an arrangement example of first and second electrode lines. FIG. 10B is a schematic diagram illustrating one exemplary configuration of first and second electrode lines. FIG. IOC is a 10 schematic diagram for describing a unit detection region. [FIG. 11] FIG 11A is a schematic plan view illustrating an arrangement example of first and second structural bodies, and a first electrode line (Y electrode) and a second electrode line (X electrode). FIG 1 IB is a schematic plan view illustrating another arrangement example of first and second structural bodies, and a first 15 electrode line (Y electrode) and a second electrode line (X electrode). [FIG. 12] FIG 12 is a schematic cross-sectional view illustrating a state of a force applied to first and second structural bodies when an operant presses a point at a first surface of an input device downward, i.e., in a Z-axis direction. [FIG 13] FIGS. 13A and 13B are diagrams for describing advantages that are 20 obtainable due to the fact that first and second electrodes are configured as subelectrodes. [FIG. 14] FIGS. 14A and 14B are diagrams for describing advantages that are obtainable due to the fact that first and second electrodes are configured as subelectrodes. 25 [FIG 15] FIG. 15 is a schematic main part cross-sectional view illustrating an aspect of an input device when a point on a first structural body of a first surface receives an operation from an operant and is a diagram illustrating exemplary amounts of changes in capacitance of respective detection units at that time. [FIG. 16] FIG. 16 is a schematic main part cross-sectional view illustrating an aspect 30 of an input device when a point on a first space portion of a first surface receives an operation from an operant and is a diagram illustrating exemplary amounts of SP352309WO00 10/132 changes in capacitance of respective detection units at that time. [FIG. 17] FIG. 17 is a schematic main part cross-sectiona! view illustrating an aspect of an input device when a first surface receives an operation from a stylus and is a diagram illustrating exemplary amounts of changes in capacitance of respective 5 detection units at that time. [FIG. 18] FIG. 18 is a schematic main part cross-sectional view illustrating an aspect of an input device when a first surface receives an operation from a finger and is a diagram illustrating exemplary amounts of changes in capacitance of respective detection units at that time. 10 [FIG. 19] FIG. I9A is a diagram illustrating an ideal capacitance change rate distribution. FIG. 19B is a diagram illustrating an actual capacitance change rate distribution. [FIG. 20] FIG. 20A is a schematic cross-sectional view illustrating an example in which the input device according to the first embodiment of the present disclosure is 15 implemented in an electronic apparatus. FIG. 20B is a schematic cross-sectional view illustrating a first modification of the example in which the input device according to the first embodiment of the present disclosure is implemented in an electronic apparatus. FIG. 20C is a schematic cross-sectional view illustrating a second modification of the example in which the input device according to the first 20 embodiment of the present disclosure is implemented in an electronic apparatus. [FIG. 21] FIG. 21A is a plan view illustrating a modification of the first electrode line. FIG. 21B is a plan view illustrating a modification of the second electrode line. [FIG. 22] FIGS. 22(A) to 22(P) are schematic diagrams illustrating exemplary shapes of a unit electrode body. 25 [FIG. 23] FIG. 23 is a schematic cross-sectional view illustrating a modification of the input device according to the first embodiment of the present disclosure. [FIG. 24] FIG. 24 is a schematic cross-sectional view illustrating one exemplary configuration of an input device according to a second embodiment of the present disclosure. 30 [FIG. 25] FIGS. 25A and 25B are schematic cross-sectional views for describing a reason for which two split peaks occur in a capacitance change rate distribution. SP352309WO00 11/132 [FIG. 26] FIGS. 26A and 26B are schematic cross-sectional views for describing a reason for which improvement in accuracy of coordinate calculation is possible when two or more first structural bodies are included in a unit detection region. [FIG. 27] FIG. 27A is a plan view illustrating a first example of a symmetrical 5 arrangement. FIG. 27B is a plan view illustrating a second example of the symmetrical arrangement. [FIG. 28] FIG. 28A is a plan view illustrating a third example of a symmetrical arrangement. FIG. 28B is a plan view illustrating a fourth example of the symmetrical arrangement. 10 [FIG. 29] FIG. 29A is a plan view illustrating a fifth example of a symmetrical arrangement. FIG. 29B is a plan view illustrating a sixth example of the symmetrical arrangement. [FIG. 30] FIG. 30 is a schematic cross-sectional view illustrating one exemplary configuration of an input device according to a fifth embodiment of the present 15 disclosure. [FIG. 31] FIG. 31Ais a schematic cross-sectional view illustrating one exemplary configuration of an operation member of the input device according to the fifth embodiment of the present disclosure. FIG. 31B is a schematic cross-sectional view illustrating a modification of the operation member. 20 [FIG. 32] FIG. 32 is a schematic cross-sectional view illustrating one exemplary configuration of an electronic apparatus in which an input device according to a sixth embodiment of the present disclosure is included. [FIG. 33] FIGS. 33A and 33B are schematic diagrams illustrating simulation conditions in test examples 1-1 to 1-7. 25 [FIG. 34] FIG. 34Ais a diagram illustrating simulationresults of test examples 1-1-1 to 1-1-7. FIG. 34B is a diagram illustrating simulation results of test examples 1-2- 1 to 1-2-7. [FIG. 35] FIG. 35Ais a diagram illustrating simulation results of Test Examples 1-3-1 to 1-3-6. FIG. 35B is a diagram illustrating simulation results of Test Examples 1-4- 30 1 to 1-4-6. [FIG. 36] FIGS. 36A and 36B are schematic diagrams illustrating simulation SP352309WO00 12/132 conditions in test examples 1-5-1 to 1-5-4. [FIG. 37] FIG 37A is a diagram illustrating simulation results of Test Examples 1-5-1 to 1-5-4. FIG 37B is a diagram illustrating simulation results of Test Examples 1-6- 1 to 1-6-4. 5 [FIG 38] FIG. 38A is a schematic diagram illustrating simulation conditions in test example 2-1. FIG. 38B is a schematic diagram illustrating the simulation conditions in test example 2-1. [FIG. 39] FIG. 39A is a schematic diagram illustrating simulation conditions in test example 2-1. FIG. 39B is a schematic diagram illustrating the simulation conditions 10 in test example 2-2. [FIG 40] FIG. 40A is a schematic diagram illustrating simulation conditions in test example 2-1. FIG. 40B is a schematic diagram illustrating the simulation conditions in test examples 2-1 to 2-5. [FIG 41] FIG. 41 is a diagram illustrating an expanded part of FIG 40B. 15 [FIG 42] FIG 42 is a diagram illustrating simulation results of Test Examples 2-1 to 2-5. [FIG 43] FIG 43 is a diagram illustrating simulation results of Test Examples 3-1 to 3-5. [FIG 44] FIGS. 44A and 44B are schematic cross-sectional views for describing a 20 reason for which improvement in accuracy of coordinate calculation is possible when two or more first structural bodies are included in a unit detection region. [FIG 45] FIG 45A is a schematic cross-sectional view illustrating a modification of the input device according to the first embodiment of the present disclosure. FIG 45B is a schematic main part cross-sectional view illustrating an aspect of the input 25 device when a first surface receives an operation from a finger. [FIG. 46] FIG 46A is a schematic plan view illustrating an arrangement example of first and second structural bodies, and a first electrode line (Y electrode) and a second electrode line (X electrode). FIG. 46B is a schematic plan view illustrating another arrangement example of first and second structural bodies, and a first 30 electrode line (Y electrode) and a second electrode line (X electrode). [FIG 47] FIG 47A is a plan view illustrating a first example of arrangement SP352309WO00 13/132 positions of a plurality of openings in a planar direction of the input device. FIG. 47B is a plan view illustrating a second example of the arrangement positions of the plurality of openings in the planar direction of the input device. [FIG. 48] FIG. 48 is a plan view illustrating an arrangement example of a plurality of 5 second structural bodies at the vertexes of the unit detection region and the vicinities of the vertexes. [FIG. 49] FIG. 49A is a schematic diagram illustrating a first example of a ground connection of the input device. FIG. 49B is a schematic diagram illustrating a second example of the ground connection of the input device. 10 [FIG. 50] FIG. 50 is a schematic cross-sectional view illustrating a modification of the input device according to the first embodiment of the present disclosure. [FIG. 51 ] FIG. 51A is a perspective view illustrating an exemplary shape of an input device having a cylindrical shape. FIG. 5 IB is a cross-sectional view taken along the line A-A of FIG. 51A. 15 [FIG. 52] FIG. 52A is a perspective view illustrating an exemplary shape of an input device having a curved shape. FIG. 52B is a cross-sectional view taken along the line A-A of FIG. 52A. [FIG. 53] FIG. 53A is a cross-sectional view illustrating an exemplary configuration of an input device according to a second embodiment of the present disclosure. FIG. 20 53B is a cross-sectional view illustrating an enlarged part of FIG. 53A. [FIG. 54] FIG. 54A is a plan view illustrating an exemplary configuration of a Y electrode. FIG. 54B is a plan view illustrating an exemplary configuration of an X electrode. [FIG. 55] FIG. 55A is a plan view illustrating an arrangement example of X 25 electrodes and Y electrodes. FIG. 55B is a cross-sectional view taken along the line A-A of FIG. 55A. [FIG. 56] FIG. 56A is a cross-sectional view illustrating a first example of a configuration of an input device according to a modification of the second embodiment of the present disclosure. FIG. 56B is a cross-sectional view 30 illustrating a second example of the configuration of the input device according to the modification of the second embodiment of the present disclosure. SP352309WO00 14/132 [FIG. 57] FIG. 57A is a plan view illustrating a first example of a configuration of the Y electrode. FIG. 57B is a plan view illustrating a first example of a configuration of the X electrode. [FIG. 58] FIG. 58A is a plan view illustrating a second example of a configuration of 5 the Y electrode. FIG. 58B is a plan view illustrating a second example of a configuration of the X electrode. [FIG. 59] FIG. 59A is a cross-sectional view illustrating a first example of a configuration of an input device according to a third embodiment of the present disclosure. FIG 59B is a cross-sectional view illustrating a second example of the 10 configuration of the input device according to the third embodiment of the present disclosure. [FIG 60] FIG. 60A is a cross-sectional view illustrating a first example of a configuration of an input device according to a modification 1 of the third embodiment of the present disclosure. FIG. 60B is a cross-sectional view 15 illustrating a second example of the configuration of the input device according to the modification 1 of the third embodiment of the present disclosure. [FIG. 61] FIG. 61A is a plan view illustrating a first example of a configuration of X and Y electrodes in an input device according to a modification of the third embodiment of the present disclosure. FIG. 61B is a plan view illustrating a second 20 example of the configuration of X and Y electrodes in the input device according to the modification of the third embodiment of the present disclosure. [FIG 62] FIG. 62A is a plan view illustrating an airangement example of first electrode lines (Y electrodes). FIG. 62B is a plan view illustrating an arrangement example of second electrode lines (X electrodes). 25 [FIG. 63] FIG 63A is a plan view illustrating an arrangement example of first structural bodies. FIG. 63B is a plan view illustrating an arrangement example of second structural bodies. [FIG. 64] FIG. 64 is a plan view illustrating an arrangement relation between first and second electrode lines and first and second structural bodies. 30 [FIG. 65] FIG. 65 is a plan view illustrating an airangement example of first and second structural bodies. SP352309WO00 15/132 Description of Embodiments [0028] In the present disclosure, a sensor device and an input device are appropriate 5 ly applied to an electronic apparatus, for example, a notebook personal computer, a t ouch panel display, a tablet computer, a cellular phone (for example, a smartphone), a digital camera, a digital video camera, an audio device (for example, a portable audi o player), and a game device. [0029] 10 In the present disclosure, a conductive layer having electrical conductivity is preferable. As the conductor layer, for example, an inorganic conductive layer including an inorganic conductive material, an organic conductive layer including an organic conductive material, and an organic-inorganic conductive layer including both the inorganic conductive material and the organic conductive material are 15 preferably used. [0030] Examples of the inorganic conductive material include a metal and a metal oxide. Here, metals are defined to include semimetals. Examples of the metal include a metal such as copper, silver, gold, platinum, palladium, nickel, tin, cobalt, 20 rhodium, iridium, iron, mthenium, osmium, manganese, molybdenum, tungsten, niobium, tantalum, titanium, bismuth, antimony, and lead or alloys thereof, but the present disclosure is not limited thereto. Examples of the metal oxide include indium tin oxide (ITO), zinc oxide, indium oxide, an antimony-doped tin oxide, a fluorine-doped tin oxide, aluminum-doped zinc oxide, gallium-doped zinc oxide, 25 silicon-doped zinc oxide, zinc-tin oxide, indium-tin oxide, and zinc-indiummagnesium oxide, but the present disclosure is not limited thereto. [0031] Examples of the organic conductive material include a carbon material and a conductive polymer. Examples of the carbon material include carbon black, carbo 30 n fibers, a fiillerene, graphene, carbon nanotubes, carbon microcoils, and nanohorns, but the present disclosure is not limited thereto. Examples of the conductive polym SP352309WO00 16/132 er include a substituted or unsubstituted polyaniline, a polypyrrole, a polythiophene, and a (co)polymer including one or two selected therefrom, but the present disclosure is not limited thereto. [0032] 5 Embodiments of the present disclosure will be described in the following order. 1. First embodiment (example of input device) 2. Second embodiment (example of input device) 3. Third embodiment (example of input device) 10 4. Fourth embodiment (example of input device) 5. Fifth embodiment (example of input device) 6. Sixth embodiment (example of electronic apparatus) [0033] <1 First embodiment 15 FIG. 1 is a schematic cross-sectional view illustrating one exemplary configuration of an input device 100 according to the first embodiment of the present disclosure. FIG. 2 is an exploded perspective view illustrating one exemplary configuration of the input device 100. FIG. 3 is a schematic cross-sectional view illustrating one exemplary configuration of a main part of the input device 100. FIG. 20 4 is a block diagram illustrating one exemplary configuration of an electronic apparatus 70 using the input device 100. Hereinafter, a configuration of the input device 100 of the present embodiment will be described. Also, in the drawing, an X axis and a Y axis indicate directions (planar directions of the input device 100) which are orthogonal to each other, and a Z axis indicates a direction (a thickness direction 25 or a vertical direction of the input device 100) orthogonal to the X axis and the Y axis. [0034] [Input device] The input device 100 includes a flexible display (display unit) 11 configured to receive an operation from a user, and a sensor device 1 configured to detect the 30 user operation. The input device 100 is configured as, for example, a flexible touch panel display, and embedded in the electronic apparatus 70 to be described below. SP352309WO00 17/132 The sensor device 1 and the flexible display 11 have a planar shape that extends in a direction perpendicular to the Z axis. [0035] The flexible display 11 includes a first surface 110 and a second surface 120 5 opposite to the first surface 110. The flexible display 11 has both a function as an input operation unit in the input device 100 and a function as a display unit. That is, the flexible display 11 enables the first surface 110 to function as an input operation surface and a display surface, and displays an image corresponding to the user operation from the first surface 110 upward, i.e., a Z-axis direction. For example, 10 an image corresponding to a keyboard or a graphical user interface (GUI) is displayed on the first surface 110. An operant that performs an operation with respect to the flexible display 11 includes, for example, a finger f illustrated in FIG. 18 or a stylus s illustrated in FIG. 17. [0036] 15 A specific configuration of the flexible display 11 is not particularly limited. As the flexible display 11, for example, a so-called electronic paper, an organic electroluminescent (EL) panel, an inorganic EL panel, or a liquid crystal panel can be used, hi addition, a thickness of the flexible display 11 is not particularly limited, and is, for example, 0.1 mm to 1 mm. 20 [0037] The sensor device 1 includes a metal film (first conductor layer (conductive layer)) 12, a conductor layer (second conductor layer (conductive layer)) 50, an electrode substrate 20, a first support 30, and a second support 40. The sensor device 1 is arranged on the second surface 120 of the flexible display 11. 25 [0038] The metal film 12 has flexibility, and is configured in, for example, a deformable sheet shape. The conductor layer 50 is arranged to face the metal film 12. The electrode substrate 20 has flexibility, and includes a plurality of first electrode lines 210 and a plurality of second electrode lines 220 that are arranged to 30 face the plurality of first electrode lines 210 and intersect the plurality of first electrode lines 210. The electrode substrate 20 includes a plurality of second SP352309WO00 18/132 electrode lines 220 intersecting a plurality of first electrode lines 210. The electrode substrate 20 is deformable and arranged between the metal film 12 and the conductor layer 50, and is able to electrostatically detect a change in a distance from each of the metal film 12 and the conductor layer 50. The first support 30 includes, 5 for example, a plurality of first structural bodies 310 connecting the metal film 12 and the electrode substrate 20 and a first space portion 330 formed between the plurality of first structural bodies 310. The metal film 12 and the electrode substrate 20 are separated by the plurality of first structural bodies 310. The second support 40 includes, for example, a plurality of second structural bodies 410 that are 10 arranged between the plurality of adjacent first structural bodies 310 and connect the conductor layer 50 and the electrode substiate 20, and a second space portion 430 formed between the plurality of second structural bodies 410. The conductor layer 50 and the electrode substrate 20 are separated by the plurality of second structural bodies 410. The first space portion 330 and the second space portion 430 may be 15 filled with a medium such as a liquid or gel. hi addition, a gas other than air maybe filled therein. [0039] The sensor device 1 (the input device 100) according to the present embodiment electrostatically detects a change in distances between the metal film 12 20 and the electrode substiate 20 and between the conductor layer 50 and the electrode substrate 20 according to an input operation onto the first surface 110 of the flexible display 11, and thus detects the input operation. The input operation is not limited to an intentional press (push) operation on the first surface 110, but may include a contact (touch) operation. That is, as will be described below, since the input 25 device 100 can also detect a minute pressing force (for example, about several tens of g) applied by a general touch operation, it is configured such that the same touch operation as a general touch sensor is possible. [0040] The input device 100 includes a control unit 60. The control unit 60 30 includes an arithmetic operation unit 61 and a signal generating unit 62. The arithmetic operation unit 61 detects the user operation based on a change in SP352309WO00 19/132 electrostatic capacitance of a detection unit 20s. The signal generating unit 62 generates an operation signal based on the detection result of the arithmetic operation unit 61. [0041] 5 The electronic apparatus 70 illustrated in FIG. 4 includes a controller 710 configured to perform a process based on an operation signal that is generated from the signal generating unit 62 of the input device 100. The operation signal processed by the controller 710 is output to the flexible display 11 as, for example, an image signal. The flexible display 11 is connected to a drive circuit mounted in 10 the controller 710 through a flexible wiring substrate 113 (refer to FIG. 2). The drive circuit may also be mounted on the wiring substrate 113. [0042] In the present embodiment, the flexible display 11 is configured as a part of an operation member 10 of the input device 100. That is, the input device 100 15 includes the operation member 10, the electrode substrate 20, the first support 30, the second support 40, and the conductor layer 50. Hereinafter, these components will be described. [0043] (Operation member) 20 The operation member 10 has a structure in which the flexible display 11 having the first surface 110 and the second surface 120 and the metal film 12 are laminated. That is, the operation member 10 includes the first surface 110 receiving the user operation and the second surface 120 in which the metal film 12 is formed and that is opposite to the first surface 110, and is configured in a deformable sheet 25 shape. The metal film 12 is provided in the second surface 120 facing the conductor layer 50. [0044] The metal film 12 is configured in a sheet shape that is deformable according to deformation of the flexible display 11, and is configured as a metallic 30 foil such as copper (Cu), aluminum (Al), or stainless steel (SUS), or a mesh material. In addition, the metal film 12 may be configured as a vapor deposited film or a SP352309WO00 20/132 sputtering film of a conductor formed on a base material of a sheet shape, or a coating film such as a conductive paste. Also, the metal film 12 may function as the conductive layer and may also be an oxide conductor such as indium tin oxide (1TO) or an organic conductor such as carbon nanotubes. A thickness of the metal 5 film 12 is not particularly limited, and is, for example, several tens of nm to several tens of um. The metal film 12 is connected to, for example, a ground potential. Accordingly, the metal film 12 functions as an electromagnetic shielding layer when it is implemented in the electronic apparatus 70. That is, for example, introduction of electromagnetic waves from the flexible display 11 or introduction of 10 electromagnetic waves from other electronic components implemented in the electronic apparatus 70 and leakage of electromagnetic waves from the input device 100 are suppressed, which can contribute to stable operations of the electronic apparatus 70. In addition, in order to enhance the function as such an electromagnetic shielding layer, a plurality of metal films 12 may be provided. 15 [0045] As illustrated in FIG. 3, the metal film 12 is formed by, for example, attaching an adhesive layer 13 such as a pressure sensitive adhesive resin film in which a metallic foil is formed to the flexible display 11. Alternatively, the metal film 12 may be configured as a vapor deposited film or a sputtering film directly 20 formed on the flexible display 11, or a coating film such as a conductive paste printed on a surface of the flexible display 11. In addition, a non-conductive film may be formed on a surface opposite to the flexible display 11 of the metal film 12. As the non-conductive film, for example, a scratch-resistant hard coat layer or a corrosion resistant anti-oxidation film can be formed. 25 [0046] (Conductor layer) The conductor layer 50 configures the lowermost portion of the input device 100, and is arranged to face the metal film 12 in the Z-axis direction. The conductor layer 50 also functions as, for example, a support plate of the input device 30 100, and is configured to have, for example, higher flexural rigidity than the operation member 10 and the electrode substrate 20. The conductor layer 50 may SP352309WO00 21/132 be configured as a metal plate including, for example, an Al alloy, a magnesium (Mg) alloy or other metal materials, or a conductor plate such as a carbon-fiber-reinforced plastic. Alternatively, the conductor layer 50 may have a laminated structure in which a conductive film such as a plating film, a vapor deposited film, a sputtering 5 film or a metallic foil is formed on an insulator layer such as a plastic material. In addition, a thickness of the conductor layer 50 is not particularly limited, and is, for example, about 0.3 mm. [0047] FIGS. 5A to 5E are schematic cross-sectional views illustrating exemplary 10 configurations of the conductor layer 50. The conductor layer 50 is not limited to an example configured in a flat plate shape as illustrated in FIG. 5A, but may include a step portion 51 illustrated in FIGS 5B, 5C, and 5E. Alternatively, the conductor layer 50 may also be configured in a mesh shape. [0048] 15 For example, a conductor layer 50B illustrated in FIG. 5B includes a step portion 51B that is formed by bending a circumference portion upward, i.e., in a Zaxis direction. Conductor layers 50C and 50E illustrated in FIGS. 5C and 5E have step portions 5IC and 5IE, respectively, each are formed at a middle portion and recessed downward. According to the step portion 51, it is possible to increase 20 flexural rigidity of the conductor layer 50 in the Z-axis direction. [0049] In addition, one or a plurality of openings 50h are provided in the conductor layers 50D and 50E illustrated in FIGS. 5D and 5E. When the opening 50h is provided in the conductor layer 50 in this manner, it is possible to increase heat 25 dissipation while maintaining rigidity, suppress failure of the input device 100, and increase reliability. In addition, as described above, when the opening 50k is provided in the conductor layer 50, it is possible to decrease a volume of the conductor layer 50 and decrease a weight of the input device 100. Further, as described above, when the opening 50h is provided in the conductor layer 50, air 30 flow becomes easy when a volume of the second space portion 430 is changed due to deformation, and a response time of the electrode substrate 20 decreases. Here, the SP352309WO00 22/132 response time indicates a time from when a weight of the operation member 10 is changed until a capacity of the sensor device 1 is actually changed. [0050] As a shape of the opening 50h, a polygonal shape such as a triangle or a 5 rectangle, a circular shape, an elliptical shape, an oval shape, an irregular shape and a slit shape are exemplified. These shapes may be used alone or in combinations of two or more shapes. When the plurality of openings 50h are provided in the conductor layer 50, the plurality of openings 50h are arranged in a regular or irregular pattern, and the regular pattern is preferable from the viewpoint of 10 unifonnity of sensor sensitivity. This anangement may be either a ID anangement or a 2D anangement. In addition, when the plurality of openings 50h are provided in the conductor layer 50, the entire conductor layer 50 having the plurality of openings 50h may have a mesh shape or a stripe shape as a whole, and the plurality of openings 50h may form a geometric pattern as a whole. 15 [0051] When the opening 50h is provided in the conductor layer 50, the opening 50h is preferably provided at a position or a region that does not face the second structural body 410 and the second structural body 410 constituting a group. That is, the opening 50h and the second structural body 410 are preferably provided to be 20 shifted in a planar direction (within the XY plane) such that they do not overlap in the Z-axis direction (that is, a thickness direction of the input device 100). Therefore, the electrode substrate 20 and the conductor layer 50 are stably connected in the second structural body 410. [0052] 25 In addition, a preferable position of the opening 50h in the conductor layer 50 is a position that does not face intersecting regions (the detection units 20s) between a plurality of electrode groups 21w and a plurality of electrode groups 22w, which will be described below. That is, the opening 50h and the detection unit 20s are preferably provided to be shifted in the planar direction (within the XY plane) 30 such that they do not overlap in the Z-axis direction (that is, the thickness direction of the input device 100). When the opening 50h of the conductor layer 50 is SP352309WO00 23/132 arranged at a position facing the detection unit 20s, an initial capacitance or a capacitance change rate of the detection unit 20s is changed and sensor sensitivity in the input device 100 becomes nonuniform, compared with when the opening 50h of the conductor layer 50 is not arranged at a position facing the detection unit 20s. 5 [0053] It is preferable that an arrangement position of the opening 5Oh be the same position in all detection regions 20r. However, the unit detection regions 20r of the outermost circumference and in the vicinity of the outermost circumference of the input device 100 are excluded. Therefore, nonuniform sensor sensitivity in the 10 input device 100 as described above is prevented. Also, the unit detection region 20r will be described in detail below. In order to prevent sensor sensitivity from becoming nonuniform, it is preferable that the opening 50h be arranged symmetrically with respect to a center of the detection unit (intersecting region) 20s. More specifically, the opening 50h is preferably arranged in linear symmetry with 15 respect to a center line of each of the first and second electrode lines 210 and 220. [0054] FIGS. 47A and 47B are plan views illustrating arrangement position examples of the plurality of openings 50h in the planar direction (within the XY plane) of the input device 100. FIG. 47A illustrates an example in which the 20 opening 50h has an oval shape. FIG. 47B illustrates an example in which the opening 50h has a circular shape. The example illustrates that the plurality of openings 50h are arranged on an outer circumference (circumference) of the unit detection region 20r, and the opening 50h, the second structural body 410 and the detection unit 20s are provided to be shifted in the planar direction (within the XY 25 plane) without overlapping the second structural body 410 or the detection unit 20s in the Z-axis direction when viewed in the Z-axis direction (that is, the thickness direction of the input device 100). [0055] The conductor layer 50 is connected to, for example, a ground potential. 30 Accordingly, the conductor layer 50 functions as an electromagnetic shielding layer when it is implemented in the electronic apparatus 70. That is, for example, SP352309WO00 24/132 introduction of electromagnetic waves from other electronic components implemented in the electronic apparatus 70 and leakage of electromagnetic waves from the input device 100 are suppressed, which can contribute to stable operations of the electronic apparatus 70. 5 [0056] In order to enhance the function as the electromagnetic shielding layer, and particularly, in order to prevent electromagnetic waves from being introduced from the flexible display 11, a ground potential connecting method of the metal film 12 and the conductor layer 50 is preferably as follows. 10 [0057] As illustrated in FIG. 49A, it is preferable that the metal film 12 and the conductor layer 50 be connected to not only a ground of the control unit 60 but also a ground of the controller 710. The flexible display 11 is connected to the controller 710 and is directly connected to a noise source. Therefore, it is possible to increase 15 a shielding effect of the metal film 12. Moreover, when the metal film 12 and the conductor layer 50 are connected at many contact points, the effect increases. [0058] In addition, as illustrated in FIG. 49B, a ground connection of the conductor layer 50 is in the control unit 60 and a plurality of metal films 12 are arranged. 20 Among these metal films 12, the metal film 12 provided closest to the flexible display 11 may be connected to the controller 710. Further, a ground connection of the metal film 12 provided closest to the electrode substrate 20 among these metal films 12 may be connected to both the control unit 60 and the controller 710. Also, FIG. 57B illustrates an example in which two metal films 12 are provided. 25 [0059] (Adhesive layer) The adhesive layer 13 may also be provided between the flexible display 11 and the metal film 12. The adhesive layer 13 is configured as, for example, an adhesive or a pressure sensitive adhesive tape having an insulating property. As the 30 adhesive, for example, one or more selected from the group consisting of an acrylic adhesive, a silicone-based adhesive and a urethane-based adhesive may be used. In SP352309WO00 25/132 the present disclosure, pressure sensitive adhesion is defined as a type of adhesion. According to this definition, a pressure sensitive adhesive layer is considered to be a type of adhesive layer. [0060] 5 Entire surfaces of the flexible display 11 and the metal film 12 may be adhered by the adhesive layer 13. In this case, strong adhesion and uniform sensitivity are obtained in an entire planar surface of the flexible display 11 and the metal film 12. [0061] 10 In addition, only outer circumference portions of the flexible display 11 and the metal film 12 may be adhered by the adhesive layer 13, and particularly preferably, both are adhered only at a part above the first frame 320. A part of the first frame 320 has a stronger adhesive force than a part of the first structural body 310, and when an upward peeling force is applied to the flexible display 11, it is 15 possible to suppress destruction of the part of the first structural body 310, peeling of the metal film 12 and the first structural body 310, and peeling of the electrode substrate 20 and the first structural body 310. [0062] Li addition, only a display area (effective area) of the flexible display 11 20 may be adhered by the adhesive layer 13. When a wire, an FPC, a driver and the like are attached to the outer circumference portion of the flexible display 11, it is possible to prevent the flexible display 11 from being damaged. When a step of the outer circumference portion of the flexible display 11 is adhered, it is possible to prevent abnormality in sensitivity of a vicinity sensor from occurring. When the 25 step of the outer circumference portion of the flexible display 11 is large or a warp is large, bonding may only be performed further inside than the display area (effective area). [0063] In addition, as the adhesive layer 13, for example, an adhesive layer that has 30 a substantially unifonii thickness and is continuously provided between the flexible display 11 and the metal film 12, or an adhesive layer that has a predetermined SP352309WO00 26/132 pattern in a planar direction of the flexible display 11 and the metal film 12 may be used. A pattern of the adhesive layer 13 may be either a ID pattern in which a predetermined adhesive pattern is repeated in one direction or a 2D pattern in which a predetermined adhesive pattern is repeated in two directions. As a specific pattern 5 shape, a columnar shape, a stripe shape, a grid shape and the like are exemplified, but the present disclosure is not limited thereto. When the adhesive layer 13 has the pattern described above, it is possible to suppress air bubbles from being mixed into in the adhesive layer 13 and increase a yield rate when the flexible display 11 is laminated. When the adhesive layer 13 has the pattern described above, it is 10 preferable that a thickness of the adhesive layer 13 be smaller than a thickness of the metal film 12. Moreover, it is preferable that the adhesive layer 13 have higher definition than the first structural body 310. That is, it is preferable that a size of the pattern of the adhesive layer 13 be smaller than a size of the first structural body 310. In this case, it is preferable that the size of the pattern of the adhesive layer 13 15 be 1/10 or less the size of the first structural body 310. When the adhesive layer 13 has higher definition than the first structural body 310, it is possible to suppress occurrence of nonuniformity in sensitivity and occurrence of periodicity in sensitivity due to interference between the pattern of the adhesive layer 13 and the pattern of the first structural body 310. Also, without the adhesive layer 13, only 20 the flexible display 11 may be placed on the metal film 12. [0064] (Electrode substrate) The electrode substrate 20 is configured as a body in which a first wiring substrate 21 including the first electrode line 210 and a second wiring substrate 22 25 including the second electrode line 220 are laminated. [0065] The first wiring substrate 21 includes a first base material 211 (refer to FIG. 2), and a plurality of first electrode lines (Y electrodes) 210. The first base material 211 is configured as, for example, a sheet material having flexibility, and specifically, 30 configured as an electrically insulating plastic sheet (film) such as PET, PEN, PC, PMMA, or polyimide. A thickness of the first base material 211 is not particularly SP352309WO00 27/132 limited, and is, for example, several tens of um to several 100 urn. [0066] The plurality of first electrode lines 210 are integrally provided on one surface of the first base material 211. The plurality of first electrode lines 210 are 5 ananged in an X-axis direction at predetennined intervals, and substantially linearly formed in a Y-axis direction. Each of the first electrode lines 210 is drawn to an edge or the like of the first base material 211 and connected to a different terminal. In addition, each of the first electrode lines 210 is electrically connected to the control unit 60 through these terminals. 10 [0067] Also, each of the plurality of first electrode lines 210 is configured as the plurality of electrode groups 21w (refer to FIG. 10B) arranged in the X-axis direction. In addition, the plurality of electrode lines constituting each of the electrode groups 21w may be connected to a common terminal, or separately connected to two or 15 more different terminals. [0068] On the other hand, the second wiring substrate 22 includes a second base material 221 (refer to FIG. 2), and a plurality of second electrode lines (X electrodes) 220. Similar to the first base material 211, the second base material 221 is 20 configured as, for example, a sheet material having flexibility, and specifically, configured as an electrically insulating plastic sheet (film) such as PET, PEN, PC, PMMA, or polyimide. A thickness of the second base material 221 is not particularly limited, and is, for example, several tens of um to several 100 um. The second wiring substrate 22 is arranged to face the first wiring substrate 21. 25 [0069] The plurality of second electrode lines 220 are configured similarly to the plurality of first electrode lines 210. That is, the plurality of second electrode lines 220 are arranged in the Y-axis direction at predetermined intervals, and substantially linearly formed in the X-axis direction. In addition, each of the plurality of second 30 electrode lines 220 is configured as the plurality of electrode groups 22w (refer to FIG 10B) arranged in the Y-axis direction. SP352309WO00 28/132 [0070] Each of the second electrode lines 220 is drawn to an edge or the like of the second base material 221 and connected to a different terminal. The plurality of electrode lines constituting each of the electrode groups 22w may be connected to a 5 common terminal or separately connected to two or more different terminals, hi addition, each of the second electrode lines 210 is electrically connected to the control unit 60 through these terminals. [0071] The first and second electrode lines 210 and 220 may be formed by a 10 printing method such as screen printing, gravure offset printing, or ink jet printing using a conductive paste, or may be formed by a patterning method using a photolithography teclmique of a metallic foil or a metal layer. In addition, when both of the first and second base materials 211 and 221 are configured as a sheet having flexibility, the entire electrode substrate 20 can have flexibility. 15 [0072] As illustrated in FIG. 3, the electrode substrate 20 includes an adhesive layer 23 that bonds the first wiring substrate 21 and the second wiring substrate 22 to each other. The adhesive layer 23 has an electrically insulating property, and is configured as, for example, a cured material of an adhesive, or a pressure sensitive 20 adhesive material such as a pressure sensitive adhesive tape. [0073] The electrode substrate 20 includes the plurality of detection units 20s that are formed in regions in which the first electrode line 210 and the second electrode line 220 intersect and have a capacity that is changed according to a relative distance 25 to each of the metal film (first conductor layer) 12 and the conductor layer (second conductor layer) 50. The plurality of first structural bodies 310 may forrn a group associated with each of the detection units 20s. In addition, the plurality of second structural bodies 410 may form a group associated with each of the detection units 20s. The plurality of first and second structural bodies 310 and 410 constituting 30 each group may also be arranged symmetrically with respect to a center of the detection unit (intersecting region) 20s. More specifically, the first and second SP352309WO00 29/132 electrode lines 210 and 220 may also be arranged in linear symmetry with respect to respective center lines. [0074] FIG. 6A is a schematic cross-sectional view for describing a configuration of 5 the detection unit 20s. The detection unit 20s includes the first electrode line 210, the second electrode line 220 facing the first electrode line 210, and a capacity element that has a dielectric layer provided between the first and second electrode lines 210 and 220 and uses a mutual capacitance method. Also, it is described in FIGS. 6A and 6B that each of the first and second electrode lines 210 and 220 is 10 configured as a single electrode line. [0075] FIG. 6A illustrates an example in which the first electrode lines 210 (210xi, 210XJ+I, and 210XJ+2) and the second electrode line 220 (220y) are arranged to face each other in the Z-axis direction. In the example illustrated in FIG. 6A, the first 15 wiring substrate 21 and the second wiring substrate 22 are bonded to each other by the adhesive layer 23, and the first base material 211 of the first wiring substrate 21 and the adhesive layer 23 constitute the dielectric layer, hi this case, the detection units 20s;, 20SJ+I, and 20SJ+2 are configured to be formed in intersecting regions in which each of the first electrode lines 210x;, 210XJ+1, and 210x;+2 and the second 20 electrode line 220y are capacitively coupled, and these electrostatic capacitances Q, Cj+i, and Cj+2 are changed according to capacitive coupling of each of the metal film 12 and the conductor layer 50 and the first electrode lines 210XJ, 210XJ+I, and 210xi+2, and the second electrode line 220y. Also, an initial capacitance of the detection unit 20s is set by, for example, a facing area between the first and second electrode lines 25 210 and 220, a facing distance between the first and second electrode lines 210 and 220, and a dielectric constant of the adhesive layer 23. [0076] hi addition, FIG. 6B illustrates a modification of the configuration of the detection unit 20s and illustrates an example in which first electrode lines 210D 30 (210Dxi, 210Dxi+!, and 210Dxi+2) and the second electrode line 220D (220Dy;, 220Dyj+i, and 220Dyi+2) are arranged inside the same plane on the first base material SP352309WO00 30/132 211D and capacitively coupled inside the XY plane. In this case, for example, the first base material 21 ID forms a dielectric layer of detection units 20Ds (20DSJ, 20Dsn-i, and 20Dsi+2). Even such an arrangement is configured such that electrostatic capacitances Ca;, Caj+i, and Cai+2 of the detection units 20Dsi, 20Dsi+i, 5 and 20Dsi+-2 are clianged according to capacitive coupling of each of the metal film 12 and the conductor layer 50 and the fust and second electrode lines 210Dx and 220Dy In addition, in the above configuration, the second base material and the adhesive layer are unnecessary, which can contribute to decreasing a thickness of the input device 100. 10 [0077] In the present embodiment, each of the plurality of detection units 20s may be arranged to face the first structural body 310 or the group including the first structural bodies 310 in the Z-axis direction, and alternatively, may be arranged to face the second structural body 410 or the group including the second structural 15 bodies 410 in the Z-axis direction. In addition, in the present embodiment, while the first wiring substrate 21 is laminated to be above the second wiring substrate 22, the present disclosure is not limited thereto, but the second wiring substrate 22 may be laminated to be above the first wiring substrate 21. [0078] 20 (Control unit) The control unit 60 is electrically connected to the electrode substrate 20. More specifically, the control unit 60 is connected to each of the plurality of first and second electrode lines 210 and 220 through a terminal. The control unit 60 includes a signal processing circuit capable of generating information (a signal) about an input 25 operation with respect to the first siuface 110 based on outputs of the plurality of detection units 20s. The control unit 60 obtains an amount of changes in capacitance of each of the detection units 20s while each of the plurality of detection units 20s is scanned at predetermined periods, and generates information (a signal) about the input operation based on the amount of change in capacitance. 30 [0079] Typically, the control unit 60 is configured as a computer including a SP352309WO00 31/132 CPU/MPU, a memory and the like. The control unit 60 may be configured as a single chip component or may be configured as a plurality of circuit components. The control unit 60 may also be mounted in the input device 100, or mounted in the electronic apparatus 70 in which the input device 100 is embedded. In the former 5 case, for example, the control unit 60 is implemented on a flexible wiring substrate connected to the electrode substrate 20. In the latter case, the control unit 60 may be integrally formed with the controller 710 configured to control the electronic apparatus 70. [0080] 10 As described above, the control unit 60 includes the arithmetic operation unit 61 and the signal generating unit 62, and executes various functions according to a program stored in a storage unit (not illustrated). The arithmetic operation unit 61 computes an operation position in an XY coordinate system on the first surface 110 based on an electrical signal (input signal) output from each of the first and second 15 electrode lines 210 and 220 of the electrode substrate 20. The signal generating unit 62 generates an operation signal based on the results. Accordingly, an image based on the input operation on the first surface 110 can be displayed on the flexible display 11. [0081] 20 The arithmetic operation unit 61 illustrated in FIGS. 3 and 4 computes XY coordinates of an operation position on the first surface 110 by an operant based on outputs from each of the detection units 20s to which unique XY coordinates are assigned. Specifically, the arithmetic operation unit 61 computes an amount of changes in electrostatic capacitance in each of the detection units 20s formed in each 25 intersecting region between the Y electrode 210 and the X electrode 220 based on the amount of change in electrostatic capacitance obtained from each of the Y electrode 210 and the X electrode 220. According to a ratio of amounts of changes in electrostatic capacitance of the detection units 20s, it is possible to compute XY coordinates of the operation position by the operant. 30 [0082] In addition, the arithmetic operation unit 61 can determine whether the first SP352309WO00 32/132 surface 110 receives an operation. Specifically, for example, when an amount of changes in electrostatic capacitances of all of the detection units 20s or an amount of change in electrostatic capacitance of each of the detection units 20s is equal to or greater than a predetermined threshold value, it is possible to determine that the first 5 surface 110 is receiving an operation. In addition, when two or more threshold values are provided, it is possible to distinguish, for example, a touch operation and an (intentional) push operation. Moreover, it is possible to compute a pressing force based on the amount of change in electrostatic capacitance of the detection unit 20s. 10 [0083] The arithmetic operation unit 61 can output these computation results to the signal generating unit 62. [0084] The signal generating unit 62 generates a predetermined operation signal 15 based on the computation result of the arithmetic operation unit 61. The operation signal may be, for example, an image control signal for generating a display image to be output to the flexible display 11, an operation signal corresponding to a key of a keyboard image to be displayed at an operation position on the flexible display 11, or an operation signal related to an operation corresponding to a graphical user interface 20 (GUI). [0085] Here, the input device 100 includes the first and second supports 30 and 40 as a configuration that causes a change in distances of each of the metal film 12 and the conductor layer 50 from the electrode substrate 20 (the detection unit 20s) 25 according to an operation on the first surface HO. Hereinafter, the first and second supports 30 and 40 will be described. [0086] (Basic configuration of first and second supports) The first support 30 is arranged between the operation member 10 and the 30 electrode substrate 20. The first support 30 includes the plurality of first structural bodies 310, the first frame 320, and the first space portion 330. In the present SP352309WO00 33/132 embodiment, the first support 30 is bonded on the electrode substrate 20 through an adhesive layer 35 (refer to FIG. 3). The adhesive layer 35 may be an adhesive, and may be configured as a pressure sensitive adhesive material such as a pressure sensitive adhesive tape. 5 [0087] As illustrated in FIG. 3, the first support 30 according to the present embodiment has a structure in which a base material 31, a structure layer 32 provided on a surface (upper surface) of the base material 31, and a plurality of bonding units 341 formed at predetermined positions on the structure layer 32 are laminated. The 10 base material 31 is configured as an electrically insulating plastic sheet such as PET, PEN, or PC. A thickness of the base material 31 is not particularly limited, and is, for example, several um to several 100 urn. [0088] The structure layer 32 is made of a resin material having an electrically 15 insulating property such as a UV resin, and a plurality of first convex portions 321, second convex portions 322, and concave portions 323 are formed on the base material 31. The first convex portions 321 have a shape that protrudes in the Z-axis direction, for example, a columnar shape, a prismatic shape, or a truncated cone shape, and are arranged on the base material 31 at predetermined intervals. The 20 second convex portions 322 are fonned to sunound the periphery of the base material 31 at predetermined widths. [0089] In addition, the structure layer 32 is made of a material that has relatively high rigidity at which the electrode substrate 20 is deformable according to an input 25 operation on the first surface 110, or may be made of an elastic material that is defonnable together with the operation member 10 when the input operation is performed. That is, a modulus of elasticity of the structure layer 32 is not particularly limited, but is appropriately selected in a range in which a desired operation feeling or detection sensitivity is obtained. 30 [0090] The concave portion 323 is configured as a flat surface fonned between the SP352309WO00 34/132 first and second convex portions 321 and 322. That is, a space region on the concave portion 323 forms the first space portion 330. In addition, an adhesion prevention layer 342 made of a UV resin having low pressure sensitive adhesion or the like may be formed on the concave portion 323 (not illustrated in FIG. 3). A 5 shape of the adhesion prevention layer 342 is not particularly limited, but it may be formed in an island shape and formed as a flat film on the concave portion 323. [0091] Further, the bonding unit 341 made of a resin material having pressure sensitive adhesion or the like is formed on each of the first and second convex 10 portions 321 and 322. That is, each of the first stmctuial bodies 310 is configured as a laminated body of the first convex portion 321 and the bonding unit 341 formed thereon. Each of the first frames 320 is configured as a laminated body of the second convex portion 322 and the bonding unit 341 formed thereon. Accordingly, the first structural body 310 and the first frame 320 have substantially the same 15 thickness (heiglit), for example, several um to several 100 urn in the present embodiment. Also, the height of the adhesion prevention layer 342 is not particularly limited as long as it is smaller than the heiglit of the first stmctuial body 310 and the first frame 320, and is, for example, smaller than the first and second convex portions 321 and 322. 20 [0092] The plurality of first stmctuial bodies 310 are arranged, for example, to correspond to the arrangement of the detection unit 20s or the unit detection region 20r. In the present embodiment, the plurality of first structural bodies 310 are arranged to face, for example, the plurality of detection units 20s or the unit detection 25 region 20r in the Z-axis direction. [0093] On the other hand, the first frame 320 is formed to surround the periphery of the first support 30 along a circumference of the electrode substrate 20. A length of the first frame 320 in a lateral direction, that is, a width, is not particularly limited as 30 long as strength of the first support 30 and the entire input device 100 can be sufficiently ensured. SP352309WO00 35/132 [0094] Meanwhile, the second support 40 is arranged between the electrode substrate 20 and the conductor layer 50. The second support 40 includes the plurality of second structural bodies 410, a second fiame 420, and the second space 5 portion 430. [0095] As illustrated in FIG. 3, the second support 40 according to the present embodiment includes the second structural body 410 and the second fiame 420, which are directly formed on the conductor layer 50. The second stmctural body 10 410 and the second fiame 420 are made of, for example, an insulating resin mateiial having pressure sensitive adhesion, and also function as a bonding unit configured to bond the conductor layer 50 and the electrode substrate 20. A thickness of the second stmctural body 410 and the second fiame 420 is not particularly limited, and is, for example, several urn to several 100 urn. Also, it is preferable that the 15 thickness of the second stmctural body 410 be smaller than the thickness of the first stmctural body 310. Therefore, the electrode substrate 20 is deformed to be closer to the bottom of the conductor layer 50 and a great amount of change in capacitance is obtained, as illustrated in FIG. 15 below. [0096] 20 The second stmctural body 410 is arranged between the adjacent first structural bodies 310. That is to say, the second structural body 410 is arranged to correspond to the arrangement of each of the detection units 20s, and is arranged, between the adjacent detection units 20s in the present embodiment. On the other hand, the second frame 420 is formed to surround the periphery of the second 25 support 40 along a circumference of the conductor layer 50. A width of the second fiame 420 is not particularly limited as long as it can sufficiently ensure strength of the second support 40 and the entire input device 100, and is, for example, substantially the same as the width of the first fiame 320. [0097] 30 hi addition, similar to the structure layer 32 forming the first structural body 310, a modulus of elasticity of the second structural body 410 is not particularly SP352309WO00 36/132 limited. That is, the modulus of elasticity is appropriately selected in a range in which a desired operation feeling or detection sensitivity is obtained, and the second structural body 410 may be made of an elastic mateiial that is deformable together with the electrode substrate 20 when the input operation is performed. 5 [0098] In addition, the second space portion 430 is formed between the second structural bodies 410 and forms a space region of peripheries of the second structural body 410 and the second frame 420. The second space portion 430 accommodates each of the detection units 20s and the first structural body 310 when viewed in the 10 Z-axis direction hi the present embodiment. [0099] The first and second supports 30 and 40 having the configuration described above are formed as follows. [0100] 15 (Method of forming first and second supports) FIGS. 7A, 7B, and 7C are schematic cross-sectional views illustrating exemplary methods of forming the first support 30. First, a UV resin is arranged on the base material 31a, and a predetermined pattern is formed in the resin. Accordingly, as illustrated in FIG. 7A, the stmcture layer 32a including a plurality of 20 first and second convex poitions 321a and 322a and concave portions 323a is fomied. As the UV resin, a solid sheet material or a liquid UV curable material may be used. In addition, a method of forming a pattern is not particularly limited. For example, a method in which an uneven shape pattern of a mold is transferred to the UV resin by a roll-shaped mold hi which a pattern of a predetermined uneven shape is formed, 25 UV light is radiated from the base material 31a side, and the UV resin is cured may be applied. In addition, other than the formation using the UV resin, the pattern maybe fomied by, for example, general thermofomiing (for example, press molding or injection molding), or discharging a resin material using a dispenser or the like. [0101] 30 Next, as illustrated in FIG. 7B, a low adhesion UV resin or the like is applied on the concave portion 323a in a predetermined pattern by, for example, a SP352309WO00 37/132 screen printing method, and an adhesion prevention layer 342a is formed. Accordingly, for example, when a resin material forming the structure layer 32a has high adhesiveness, it is possible to prevent the metal film 12 and the concave portion 323 arranged on the first support 30 from being adhered. Also, when a resin 5 material forming the structure layer 32a has low adhesiveness, no adhesion prevention layer 342a may be formed. [0102] Next, as illustrated in FIG. 7C, the bonding unit 341a made of a high adhesion UV resin is formed on the convex portion 321a by, for example, a screen 10 printing method. The first support 30 and the metal film 12 are bonded by the bonding unit 341a. By the above forming method, it is possible to form the first structural body 310 and the first frame 320 having a desired shape. [0103] On the other hand, FIG. 8 is a schematic cross-sectional view illustrating an 15 exemplary method of forming the second support 40. hi FIG. 8, a high adhesion UV resin is directly applied on the conductor layer 50b in a predetermined pattern by, for example, a screen printing method, and the second structural body 410b and the second frame 420b are formed. Accordingly, it is possible to significantly decrease the number of processes and increase productivity. 20 [0104] The above forming method is an example. For example, the first support 30 may be formed by the method illustrated in FIG. 8, and the second support 40 may be formed by the method illustrated in FIG. 7. In addition, the first and second supports 30 and 40 may be formed by the following method illustrated in FIG 9. 25 [0105] FIGS. 9A and 9B are schematic cross-sectional views illustrating modifications of the method of forming the first and second supports 30 and 40. Also, description of FIG. 9 will refer to reference numerals of the first support 30. In FIG. 9A, the UV resin or the like is applied onto the base material 31C or the like 30 in a predetermined pattern by, for example, a screen printing method, and a first convex portion 311c and a second convex portion 312c are formed. Further, the SP352309WO00 38/132 bonding unit 341c made of a high adhesion UV resin or the like is formed on the first convex portion 311c and the second convex portion 312c by, for example, a screen printing method. Accordingly, it is possible to form the first structural body 310 (the second structural body 410) including the first convex portion 311c and the 5 bonding unit 341c and the first frame 320 (or the second frame 420) including the second convex portion 312c and the bonding unit 341c. [0106] (First and second electrode lines) FIG. 10A is a schematic diagram illustrating an arrangement example of the 10 first and second electrode lines 210 and 220. The first electrode line 210 is a Y electrode that extends in the Y-axis direction and is provided in a stripe shape. The second electrode line 220 is an X electrode that extends in the X-axis direction and is provided in a stripe shape. The first electrode line 210 and the second electrode line 220 are arranged orthogonally to each other. 15 [0107] FIG. 10B is a schematic diagram illustrating one exemplary configuration of the first and second electrode lines 210 and 220. The first electrode line 210 is configured as the electrode group 21w that includes a group of a plurality of first sub-electrodes (electrode elements) 21z. The first sub-electrode 21z is a linear 20 conductive member mat extends in, for example, the Y-axis direction. The second electrode line 220 is configured as the electrode group 22w that includes a group of a plurality of second sub-electrodes (electrode elements) 22z. The second subelectrode 22z is a linear conductive member (sub-electrode) that extends in, for example, the X-axis direction. The configuration of the first and second electrode 25 lines 210 and 220 is not limited tliereto, but one of the first electrode line 210 and the second electrode line 220 may be configured as a sub-electrode. When such a configuration is adopted, the plurality of first electrode lines 210 may be provided between the plurality of second electrode lines 220 and the metal films 12. Of the first and second electrode lines 210 and 220, the first electrode lines 210 may be 30 configured to include a plurality of sub-electrodes 21z. [0108] SP352309WO00 39/132 FIG. IOC is a schematic diagram describing the unit detection region 20r. The plurality of unit detection regions 20r are provided to correspond to respective intersecting sections between the first and second electrode lines 210 and 220. hi the unit detection region 20r, the detection units 20s provided in the intersecting 5 sections of the first and second electrode lines 210 and 220 are included. The plurality of unit detection regions 20r are two-diinensionally packed and arranged in, for example, the X-axis direction (first direction) and the Y-axis direction (second direction). The unit detection region 20r has, for example, a square shape or a rectangular shape that has a pair of sides extending in the X-axis direction and a pair 10 of sides extending in the Y-axis direction. When the unit detection region 20r has the square shape or the rectangular shape, the packing arrangement of the plurality of unit detection regions 20r is a packing arrangement in a grid shape (matrix form). [0109] The plurality of second structural bodies 410 are arranged, for example, 15 between the adjacent unit detection regions 20r. That is, the plurality of second structural bodies 410 are arranged on, for example, the outer circumference (circumference) of the unit detection region 20r. hi addition, the plurality of second structural bodies 410 are arranged, for example, symmetrically with respect to a center of the unit detection region 20r. 20 [0110] When the unit detection region 20r has a square shape or a rectangular shape, the arrangement position of the second structural body 410 can be, for example, a midpoint of each side forming the unit detection region 20r, each vertex (comer) of the unit detection region 20r, a vicinity of each vertex (corner) of the unit detection 25 region 20r. Two or more of the arrangement positions may be combined. FIG. 10C illustrates an example in which the second structural body 410 is arranged at each vertex (comer) of the unit detection region 20r. [0111] From the viewpoint of the improvement in the detection sensitivity of an 30 input operation, the arrangement position of the second structural body 410 is preferably both positions of the midpoint of each side forming the unit detection 40/132 SP352309WO00 region 20r and each vertex (corner) of the unit detection region 20r, more preferably the position of the midpoint of each side forming the unit detection region 20r, and most preferably the position of each vertex (corner) of the unit detection region 20r. From the viewpoint of improvement in an adhesive force of the second structural 5 body 410 with the electrode substrate 20 and the surface of the conductor layer 50, the arrangement position of the second structural body 410 is preferably a combination of each vertex (coiner) and the vicinity of each vertex (corner) of the unit detection region 20r. The arrangement position of the second structural body 410 is not limited to the above-described arrangement examples, but the second 10 structural body 410 may instead be arranged on the outer circumference (circumference) of the unit detection region 20r. [0112] FIG. 48 is a plan view illustrating an arrangement example of a plurality of second structural bodies at the vertexes (corners) of the unit detection region 20r and 15 the vicinities of the vertexes (comers). The plurality of second structural bodies 410 are arranged in a cross form in winch a position a is an intersecting point. Here, the position a is a position at winch the vertexes of four adjacent unit detection regions 20r come in contact with each other. As an arrangement distance (an arrangement distance in the X-axis direction or the Y-axis direction) of the plurality 20 of second structural bodies 410 arranged in the cross form, for example, an equal distance is selected. [0113] (Arrangement example of first and second structural bodies) FIGS. 11A and 1 IB are schematic plan views illustrating arrangement 25 examples of the first and second structural bodies 310 and 410, the first electrode line (Y electrode) 210 and the second electrode line (X electrode) 220. FIGS. 11A and 11B illustrate examples in which the X electrodes 220 and the Y electrodes 210 have the electrode groups 21w and 22w, respectively, hi addition, as described above, since the respective detection units 20s are formed hi intersecting sections between 30 the Y electrodes 210 and the X electrodes 220, for example, six detection units 20s are arranged in FIGS. 11A and 11B. Also, in FIGS. 11A and 1 IB, black circles SP352309WO00 41/132 indicate the first structural bodies 310 and white circles indicate the second structural bodies 410. [0114] A region in which the detection unit 20s is formed is a region in which the 5 first electrode line (Y electrode) 210 and the first electrode line (X electrode) 220 overlap with each other viewed in the Z-axis direction (the thickness direction of the input device 100). Specifically, a region in which the detection unit 20s is formed in the X-axis direction is in a range from the outside end surface of the first subelectrode 21z forming one end of the first electrode line (Y electrode) 210 in the 10 width direction to the outside end surface of the first sub-electrode 21z fonning the other end. On the other hand, a region in which the detection unit 20s is formed in the Y-axis direction is in a range from the outside end surface of the second subelectrode 22z forming one end of the second electrode line (X electrode) 220 in the width direction to the outside end surface of the second sub-electrode 22z forming 15 the other end. Here, the outside end surface of the first sub-electrode 21 z refers to a far end surface from the center of the detection unit 20s between both end surfaces of the first sub-electrode 21z in the x-axis direction. On the other hand, the outside end surface of the second sub-electrode 22z refers to a far end surface from the center of the detection unit 20s between both end surfaces of the second sub- 20 electrode 22z in the y-axis direction. [0115] The unit detection region (unit sensor region) 20r is provided to correspond to the intersecting section between the Y electrode 210 and the X electrode 220. The detection unit 20s is provided in the unit detection region 20r. The plurality of 25 second structural bodies 410 are arranged on the outer circumference of the unit detection region 20r. The unit detection region 20r refers to a region obtained by equally dividing a principal surface of the input device 100 to correspond to the intersecting section between the Y electrode 210 and the X electrode 220. Typically, the unit detection region 20r is defined by the following (A) or (B). 30 [0116] (A) A region defined by the plurality of second structural bodies 410 that are SP352309WO00 42/132 provided to correspond to the intersecting sections between the Y electrodes 210 and the X electrodes 220. Here, a position of each side (for example, a midpoint of each side) and/or each vertex (comer) of the unit detection region 20r is defined by the second 5 structural body 410. (B) A region satisfying the following two formulae when each intersecting point between a center line of the Y electrode 210 and a center line of the X electrode 220 is set as an origin point O -Lx/2