Claims:1. An apparatus (100) for one or more printed circuit boards, said apparatus comprising:
a vertical base (120) comprising a connector (106), the connector (106) adapted to receive and couple with the one or more printed circuit boards (102), each edge of the one or more printed circuit boards (102) having cut-out sections (124), wherein one end of the one or more printed circuit boards (PCBs) 102 is coupled to the connector and other end is free along its width;
one or more card guides (114-1, 114-2) having cut-out sections (130) in an opposite pattern to that of the cut-out sections (124) of the one or more printed circuit boards to align with the one or more printed circuit boards so as to facilitate the one or more printed circuit boards to couple with the connector (106);
a heat sink (110) coupled to the one or more printed circuit boards (102), the heat sink adapted to manage the heat dissipated from electronic components (104) coupled to the one or more printed circuit boards; and
a fascia panel unit (108) attached to the one or more printed circuit boards (102), the one or more printed circuit boards adapted to move between a first position and a second position, wherein the fascia panel unit (108) is un-fastened to the one or more card guides (114-1, 114-2) at the first position and fastened to the one or more card guides at the second position.
2. The apparatus as claimed in claim 1, wherein the movement of the one or more printed circuit boards (102) to the second position facilitates the one or more printed circuit boards to couple with the connector (106).
3. The apparatus as claimed in claim 1, wherein movement of the of the one or more printed circuit boards (102) to the first position creates uniform pulling force to act on the one or more printed circuit boards to facilitate the one or more printed circuit boards to de-couple with the connector (106).
4. The apparatus as claimed in claim 1, wherein said connector (106) accommodates the one or more printed circuit boards of any or a combination of single width and double width.
5. The apparatus as claimed in claim 1, wherein the one or more printed circuit boards (102) with the cut-out sections (124) at the edges adapted to travel horizontally at a short distance to couple with the connector (106).
6. The apparatus as claimed in claim 1, wherein the cut-out sections (124) at guiding edges of the one or more printed circuit boards is provided as non-plated and plated for heat dissipation.
7. The apparatus as claimed in claim 1, wherein the one or more card guides (114-1, 114-2) comprise stoppers (126) at rear end to arrest the rear movement of the one or more printed circuit boards and incorrect alignment of the one or more printed circuit boards to the one or more card guides, upon mounting the one or more printed circuit boards from top portion.
8. The apparatus as claimed in claim 1, wherein the one or more card guides (114-1, 114-2) have groove of length equal to the width of the one or more printed circuit boards.
9. The apparatus as claimed in claim 1, wherein the fascia panel unit (108) comprises at least two spring loaded captive screws (128) which is fastened to the one or more card guides (114-1, 114-2) when one or more printed circuit boards is coupled to the connector 106.
10. The apparatus as claimed in claim 1, wherein centre position of the heat sink (110) held using the slide guides (112-1, 112-2) and stationary guides (122-1, 122-2) prevents sagging of the one or more the printed circuit boards.
, Description:TECHNICAL FIELD
[0001] The present disclosure relates, in general, to printed circuit boards, and more specifically, relate to an apparatus with a slide locking mechanism and integrated heat sink.

BACKGROUND
[0002] Printed circuit boards (PCBs) are inserted into any housing and engaged with the mating connectors through the mechanical parts called card guides. There are multiple methods available to achieve it. Mezzanine cards are one of the kinds of PCBs that are pluggable into the Micro- telecommunications computing architecture (TCA) connector. These mezzanine cards come in different widths. This card is plugged into the Micro-TCA connector that is present in the backplane PCB of an electronic housing.
[0003] Peripheral Component Interconnect (PCI) Industrial Computer Manufacturers Group (PICMG) Advanced Mezzanine Card (AMC) specification defines the base requirements, which include complete mechanical dimensions, thermal definitions, mounting, guides, and a connector necessary to interface between the module and carrier board. With reference to this standard and based on the following prior art, it is seen that the mezzanine PCBs are mounted and guided in-line with the connector slot for its complete length of the PCB. For the mating edge of PCB to latch with the connector slot, the mating edge has to travel for the length equal to PCB length. Such application can be utilised where the PCBs are required to be ejected completely out of the enclosure. When there is a confined space where such PCBs are needed, ejection for the entire PCB length mandates more space.
[0004] An example of such PCB insertion mechanism is recited in a Patent US 2010/0039783 A1, that relates to an apparatus for accommodating at least two different sized cards, the apparatus comprising a card housing comprising one or more card slots, each card slot being adaptable for inserting the at least two different sized cards; and a card guide system for adapting said one or more card slots for insertion of at least two different sized cards. There is also provided a modified mezzanine card having at least one increased non-standard physical dimension relative to a mezzanine card suitable for insertion in the apparatus using the card guide system.
[0005] Yet another example is recited in a Patent WO 2010/138824 A2, that describes micro-TCA shelf or like has a backplane mounted to a chassis that includes a cover, bottom and sidewalls, where the backplane is mounted using a backplane holder assembly that can accommodate PCBs of different thickness and does not impinge on the backplane datum plane. The backplane holder engages cavities defined by edged flaps and the chassis walls. A grounding clip welded to the chassis encroaches on a power module slot to contact and ground an inserted module automatically physically. Card guides are coupled to the chassis using visually verifiable means. Each card guide has a plastic support defining AMC module channels and a metal grounding structure using a metal insert encased in the plastic support to rigidize the card guide and ground inserted modules. Each AMC channel has an electrostatic dispersion (ESD) clip to automatically ground modules inserted in the channel. Each card guide also has latches for locking AMC modules into backplane engagement. A card guide latching post locks an AMC module’s striker to lock the module in backplane operational engagement. The card guide AMC channels use a stepped profile that matches an AMC module face plate. Hot swappable cooling units are coupled to the backplane using short header pin detection means and backplane locator pins that engage locator holes in the cooling unit. Each cooling unit has snap-in, vibration-dampened fans in a bracket.
[0006] However, the above-mentioned prior arts suggest the modification of mezzanine PCBs and full-length insertion and latching. These mechanisms require space equal to that of the PCB in order to insert the PCB if the assembly happens inside an enclosure. Similarly, if the insertion of PCB happens from outside the enclosure, the ejection of PCB has to be done for the full length of PCB where the area available outside the enclosure should be equal to the length of the PCB.
[0007] The mezzanine card PCB form factor as per PICMG AMC standard used in electronic enclosures, inserted and latched to the connector horizontally for its entire length of 180.6 mm irrespective of whether the width is single or double width. This shortcoming has an impact on utilizing this standard form factor where the PCB cannot be ejected for its entire length. Therefore, it is desired to develop a simple, cost-effective and improved PCB insertion mechanism for Mezzanine cards, where the PCB travel is reduced.

OBJECTS OF THE PRESENT DISCLOSURE
[0008] An object of the present disclosure relates, in general, to printed circuit boards, and more specifically, relates to an apparatus with a slide locking mechanism and integrated heat sink.
[0009] Another object of the present disclosure is to provide an improved PCB insertion mechanism for Mezzanine cards.
[0010] Another object of the present disclosure is to provide an apparatus that reduces the time and travel length required to insert and latch the PCB.
[0011] Another object of the present disclosure is to provide an apparatus that improves the standard form factor by modifying the PCB guiding edge with unique cut-outs.
[0012] Another object of the present disclosure is to provide an apparatus that prevents the sagging of the double-width mezzanine PCB.
[0013] Another object of the present disclosure is to provide an apparatus that enables the top placement of PCB and horizontal short latching of PCB for a travel distance of 8 mm
[0014] Yet another object of the present disclosure is to provide an apparatus that dissipates heat from the electronics components.

SUMMARY
[0015] The present disclosure relates, in general, to printed circuit boards, and more specifically, relates to an apparatus with a slide locking mechanism and integrated heat sink. The main objective of the present disclosure seeks to overcome various limitations of the prior art by providing improved PCB insertion mechanism for Mezzanine cards, where the PCB travel is reduced from 180.6 mm to 8 mm. The present disclosure seeks to provide a method of inserting the Mezzanine PCBs into the card guide and connector thereby reducing the time and travel length required to insert and latch the PCB. The present disclosure includes the heat sink over the PCB to dissipate heat from the electronics components. The heat sink is fastened to a sliding guide.
[0016] The present disclosure aims at improving the standard form factor by modifying the PCB guiding edge with unique cut out with or without plating, guiding and sliding parts to minimize the PCB movement from 180.6 mm to 8 mm. The heat sink along with the sliding guide ensures that sagging of the double width mezzanine PCB does not happen as the PCB centre is properly supported and held firmly with the aid of sliding and stationary guides.
[0017] In an aspect, the present disclosure relates to an apparatus for one or more printed circuit boards, the apparatus includes a vertical base comprising connectors, the connector adapted to receive and couple with the one or more printed circuit boards, wherein each edge of the one or more printed circuit boards having cut-out sections. One or more card guides having cut-out sections in an opposite pattern to that of the cut-out sections of the one or more printed circuit boards to align with the one or more printed circuit boards so as to facilitate the one or more printed circuit boards to couple with the connectors. A heat sink coupled to the one or more printed circuit boards, the heat sink adapted to manage the heat dissipated from electronic components coupled to the one or more printed circuit boards and a fascia panel unit attached to the one or more printed circuit boards, the one or more printed circuit boards adapted to move between a first position and a second position, wherein the fascia panel unit is un-fastened to the one or more card guides at the first position and fastened to the one or more card guides at the second position.
[0018] According to an embodiment, the movement of the one or more printed circuit boards to the second position facilitates the one or more printed circuit boards to couple with the connector. The movement of the of the one or more printed circuit boards to the first position creates uniform pulling force to act on the one or more printed circuit boards to facilitate the one or more printed circuit boards to de-couple with the connector.
[0019] According to an embodiment, the connector accommodates the one or more printed circuit boards of any or a combination of single width and double width. The one or more printed circuit boards with the cut-out sections at the edges adapted to travel horizontally at a short distance to couple with the connector. Unique PCB guiding edge with cut-out provided as non-plated and plated for heat dissipation The one or more card guides comprise stoppers at rear end to arrest the rear movement and incorrect alignment of the one or more printed circuit boards to the one or more card guides, upon mounting the one or more printed circuit boards from top portion. The one or more card guides have groove of length equal to the width of the one or more printed circuit boards.
[0020] According to an embodiment, fascia panel unit comprises at least two spring loaded captive screws which is fastened to the one or more card guides when one or more printed circuit boards is coupled to the connector. The centre position of the heat sink held using the slide guides and stationary guides prevents sagging of the one or more the printed circuit boards.
[0021] Various objects, features, aspects, and advantages of the inventive subject matter will become more apparent from the following detailed description of preferred embodiments, along with the accompanying drawing figures in which like numerals represent like components.

BRIEF DESCRIPTION OF THE DRAWINGS
[0022] The following drawings form part of the present specification and are included to further illustrate aspects of the present disclosure. The disclosure may be better understood by reference to the drawings in combination with the detailed description of the specific embodiments presented herein.
[0023] FIG. 1A illustrates an exemplary view of a PCB assembly, in accordance with an embodiment of the present disclosure.
[0024] FIG. 1B is a simplified isometric view illustrating the PCB mated to the micro-TCA connector, in accordance with an embodiment of the present disclosure.
[0025] FIG. 1C is a schematic view of a not-to-scale PCB with a non-plated edge cut-out on both sides, in accordance with an embodiment of the present disclosure.
[0026] FIG. 1D is a schematic view of a not-to-scale PCB with a plated edge cut-out on both sides, in accordance with an embodiment of the present disclosure.
[0027] FIG. 1E illustrates a schematic view of a simplified right sided card guide, in accordance with an embodiment of the present disclosure.
[0028] FIG. 1F illustrates a schematic view of a simplified left sided card guide, in accordance with an embodiment of the present disclosure.
[0029] FIG. 1G illustrates a simplified isometric view of slide guide illustrating the across flat for tool holding and stationary guide threaded for fastening, in accordance with an embodiment of the present disclosure.
[0030] FIG. 2A is a simplified view illustrating the mounting and latching of PCB, in accordance with an embodiment of the present disclosure.
[0031] FIG. 2B is a simplified three-dimensional (3D) view illustrating the position of the PCB assembly, in accordance with an embodiment of the present disclosure.
[0032] FIG. 2C illustrates the position of PCB relative to the micro-TCA connector, in accordance with an embodiment of the present disclosure.
[0033] FIG. 2D is a simplified three-dimensional (3D) view illustrating the latched position of the PCB assembly, in accordance with an embodiment of the present disclosure.
[0034] FIG. 2E illustrates the latched position of PCB relative to the micro-TCA connector, in accordance with an embodiment of the present disclosure.

DETAILED DESCRIPTION
[0035] The following is a detailed description of embodiments of the disclosure depicted in the accompanying drawings. The embodiments are in such detail as to clearly communicate the disclosure. If the specification states a component or feature “may”, “can”, “could”, or “might” be included or have a characteristic, that particular component or feature is not required to be included or have the characteristic.
[0036] As used in the description herein and throughout the claims that follow, the meaning of “a,” “an,” and “the” includes plural reference unless the context clearly dictates otherwise. Also, as used in the description herein, the meaning of “in” includes “in” and “on” unless the context clearly dictates otherwise.
[0037] The present disclosure relates, in general, to printed circuit boards, and more specifically, relates to an apparatus with a slide locking mechanism and integrated heat sink. The apparatus of the present disclosure enables to overcome the limitation of the prior art by improving the standard form factor by modifying the PCB guiding edge with unique cut out with or without plating, guiding and sliding parts to minimize the PCB movement from 180.6 mm to 8 mm. The present disclosure includes a heat sink for heat dissipation, a facia panel enables the user to hold the PCB assembly and to arrest the horizontal movement of the PCB assembly and a mechanism to prevent the sagging of double-width PCB. The present disclosure enables the top placement of PCB and horizontal short latching of PCB for a travel distance of 8 mm.
[0038] The present disclosure can be described in enabling detail in the following examples, which may represent more than one embodiment of the present disclosure. The description of terms and features related to the present disclosure shall be clear from the embodiments that are illustrated and described; however, the invention is not limited to these embodiments only. Numerous modifications, changes, variations, substitutions, and equivalents of the embodiments are possible within the scope of the present disclosure. Additionally, the invention can include other embodiments that are within the scope of the claims but are not described in detail with respect to the following description.
[0039] FIG. 1A illustrates an exemplary view of a PCB assembly, in accordance with an embodiment of the present disclosure.
[0040] Referring to FIG. 1A, PCB assembly 100 (also referred to as an apparatus 100, herein) of the present disclosure provides a method of inserting Mezzanine PCBs into a card guide and connector thereby reducing the time and travel length required to insert and latch the PCB. The PCB assembly 100 can include one or more printed circuit boards 102, electronics components 104, connector 106, fascia panel unit 108, heat sink 110, slide guides (112-1, 112-2), card guides (114-1, 114-2), base plate 116, screws 118, vertical base 120 (also referred to as backplane assembly 120, herein) and stationary guides (122-1, 122-2).
[0041] The vertical base 120 can include connector 106, each of the connectors 106 adapted to receive and couple with one or more printed circuit boards (PCBs) 102. In an exemplary embodiment, the one or more printed circuit boards (PCBs) 102 can be mezzanine PCBs. One end of the one or more printed circuit boards (PCBs) 102 (also referred to as PCBs, 102) is latched to the connector 106 and the other end is free along its width. The PCBs 102 having cut-out sections 124 at edges to couple with the card guide 114 travels horizontally at a short distance of e.g., 8 mm to couple with the connector 106. The PCB, considering the basic dimensions as per the standard mentioned earlier is modified to get the required 8 mm travel. In an exemplary embodiment, connector 106 can be a micro -TCA connector, the PCB movement is constrained horizontally.
[0042] The one or more card guides (114-1, 114-2) having cut-out sections 130 in an opposite pattern to that of cut-out sections 124 of the one or more printed circuit boards 102, the card guides (114-1, 114-2) are aligned with the PCBs 102 so as to facilitate the PCBs to couple with the connectors 106. The card guides (114-1, 114-2) screwed to a base plate 116 using screws 118. The card guides (114-1, 114-2) can include stoppers 126 at the rear end to arrest the rear movement of the PCBs 102 and incorrect alignment of the PCBs 102 to the card guides (114-1, 114-2), upon mounting of the PCBs 102 from the top portion. The card guides (114-1, 114-2) have groove of length equal to the width of the PCBs 102.
[0043] The PCB assembly 100 can include the fascia panel unit 108 attached to the PCB 102, the PCBs 102 adapted to move between a first position and a second position, where the fascia panel unit 108 is un-fastened to the card guides (114-1, 114-2) at the first position and fastened to the card guides at the second position. The fascia panel unit 108 include at least two spring-loaded captive screws 128 which is fastened to the card guides (114-1, 114-2) once the PCB 102 is latched to the connector 106. The fascia panel unit 108 is attached to the PCB 102 by means of an eyelet or a fastener and clinched with the spring-loaded captive screws 128 at both ends.
[0044] The PCB assembly 100 can include the heat sink 110 that is fastened to the PCB 102 through a unique slide guide (112-1, 112-2) that screws into the heat sink at two places, where the PCB is sandwiched in between. The heat sinks 110 is integrated into the PCB assembly 100 to manage the heat (forced convection) that the electronic components 104 dissipate.
[0045] The heat sink 110 inclusion provides heat dissipation for the electronic components 104, which can be included in a forced convection cooling enclosure, depending on the electronic components 104. The plated edges aid in the heat dissipation through PCB 102 by conduction. The centre of the PCBs 102 is held using the slide guides (112-1, 112-2) and stationary guides (122-1, 122-2) to prevent sagging of the PCBs 102.
[0046] The vertical base 120 holds the backplane assembly, where the micro-TCA connector 106 is soldered to the backplane PCB that stands perpendicular to the base plate 116. The backplane PCB is held onto a holder and fastened. The backplane assembly is mounted to the base plate 116 by the screws 118. The base plate 116 can include stationary guides (122-1, 122-2) that are placed diagonally in such a way that the slide guides (112-1, 112-2) get locked into it when the PCB is pushed 8 mm horizontally against the micro-TCA connector 106. The stationary guides (122-1, 122-2) are fastened with the help of screws 118 to the base 116.
[0047] FIG. 1B is a simplified isometric view illustrating the PCB mated to the micro-TCA connector, in accordance with an embodiment of the present disclosure. The mezzanine PCB 102 can be of any form factor e.g., single and double width mezzanine card as per PICMG AMC standard, where only one end of the PCB 102 is latched to the connector 106 and the other end along its width is free for double width AMC PCB. The dimension of the PCB 102 can be 180.6 mm in length and 148.5 mm in width or any suitable dimension. The PCB 102 can include electronics components 104. The cut-out sections 124 at the edges of the PCBs 102 are provided as plated and non-plated.
[0048] FIG. 1C is a schematic view of a not-to-scale PCB with a non-plated edge cut out on both sides, in accordance with an embodiment of the present disclosure.
[0049] FIG. 1D is a schematic view of a not-to-scale PCB with a plated edge cut out on both sides, in accordance with an embodiment of the present disclosure. The PCB 102 is shown in FIG. 1C and FIG. 1D have unique cut-out sections 124 at the guiding edges that enable the PCB 102 to travel only a distance of 8 mm to get mated with the micro-TCA connector 106. The PCB form factor as shown in FIG.1C and FIG.1D may be non-plated or plated in case of heat dissipation through the printed circuit board 102. The PCB form factor can be more than one i.e., a single width PCB that has a length of 180.6 mm and width 73.5 mm to implement the same cut-out and achieve the 8 mm travel.
[0050] FIG. 1E illustrates a schematic view of a simplified right sided card guide, in accordance with an embodiment of the present disclosure. The card guides (114-1, 114-2) in the right portion are spaced apart based on the width of the PCB 102. The stoppers 126 are provided at the rear end of card guides (114-1, 114-2) to arrest the rear movement and wrong mounting of PCB to the card guide from the top.
[0051] FIG. 1F illustrates a schematic view of a simplified left sided card guide, in accordance with an embodiment of the present disclosure. The stopper 126 prevents the back movement of PCB. The card guides (114-1, 114-2) in left portion are spaced apart based on the width of the PCB 102. These guides (114-1, 114-2) have cavities/cut-out sections 130 same as the PCB edge cut out 124 and groove for the entire length of the PCB whose width and thickness are based on the PCB thickness and the cut-out width.
[0052] FIG. 1G illustrates a simplified isometric view of slide guide illustrating the across flat for tool holding and stationary guide threaded for fastening, in accordance with an embodiment of the present disclosure. The scaling of these modified form factor of PCB to populate more electronics along with the scaling of centred heat sink, sliding and stationary guide, card guides and fascia panel.
[0053] FIG. 2A is a simplified view illustrating the mounting and latching of PCB, in accordance with an embodiment of the present disclosure. The PCB assembly 100 with heat sink 110, PCB 102, fascia panel unit 108, electronic components 104 and slide guides (112-1, 112-2) are placed on top of card guides (114-1, 114-2) shown in FIG. 1E and FIG. 1F and then inserted 8 mm into the Micro TCA connector 106. The insertion direction and position of PCB assembly 100 is illustrated in FIG. 2E.
[0054] FIG. 2B is a simplified three-dimensional (3D) view illustrating the position of the PCB assembly, in accordance with an embodiment of the present disclosure. FIG. 2B depicts the position of the PCB assembly 100, slide guides (112-1, 112-2) and spring-loaded captive screws 128 before engaging with the micro-TCA connector 106.
[0055] FIG. 2C illustrates the position of PCB relative to the micro-TCA connector, in accordance with an embodiment of the present disclosure. FIG. 2C depicts the position of PCB relative to the micro-TCA connector 106. FIG. 2C depicts the card guides (114-1, 114-2) and spring-loaded captive screw position before engaging with the micro-TCA connector 106, the PCB 102 and the micro-TCA connector 106 before engagement, the PCB 102 and the guide position before engagement, PCB 102 and the spring-loaded captive screw 128 before engagement. The card guides (114-1, 114-2) and spring-loaded captive screw 128 positions before engaging with the micro-TCA connector 106 have an 8mm gap between the card guides (114-1, 114-2) and fascia panel unit 108.
[0056] FIG. 2D is a simplified three-dimensional (3D) view illustrating the latched position of the PCB assembly, in accordance with an embodiment of the present disclosure. The PCB assembly 100 after latching can be seen from FIG. 2D and FIG. 2E respectively. FIG. 2D depicts the position of the PCB assembly 100, slide guides (112-1, 112-2) and spring-loaded captive screws 128 after engaging with the micro-TCA connector 106.
[0057] FIG. 2E illustrates the latched position of PCB relative to the micro-TCA connector, in accordance with an embodiment of the present disclosure. FIG. 2E depicts the card guides (114-1, 114-2) and spring-loaded captive screw 128 position after engaging with the micro-TCA connector 106, the PCB 102 and the micro-TCA connector 106 after the engagement, the PCB 102 and the guide position after the engagement, and PCB 102 and the spring-loaded captive screw 128 after engagement.
[0058] The embodiments of the present disclosure described above provide several advantages. The present disclosure provides an improved PCB insertion mechanism for Mezzanine cards. The apparatus 100 reduces the time and travel length required to insert and latch the PCB improves the standard form factor by modifying the PCB guiding edge with unique cut outs and prevents sagging of the double-width mezzanine PCB. The present disclosure enables the top placement of PCB and horizontal short latching of PCB for a travel distance of 8 mm and dissipates heat from the electronics components.
[0059] It will be apparent to those skilled in the art that the apparatus 100 of the disclosure may be provided using some or all of the mentioned features and components without departing from the scope of the present disclosure. While various embodiments of the present disclosure have been illustrated and described herein, it will be clear that the disclosure is not limited to these embodiments only. Numerous modifications, changes, variations, substitutions, and equivalents will be apparent to those skilled in the art, without departing from the spirit and scope of the disclosure, as described in the claims.

ADVANTAGES OF THE PRESENT DISCLOSURE
[0060] The present disclosure provides an improved PCB insertion mechanism for Mezzanine cards.
[0061] The present disclosure provides an apparatus that reduces the time and travel length required to insert and latch the PCB.
[0062] The present disclosure provides an apparatus that improves the standard form factor by modifying the PCB guiding edge with unique cut-outs.
[0063] The present disclosure provides an apparatus that prevents the sagging of the double-width mezzanine PCB.
[0064] The present disclosure provides an apparatus that enables the top placement of PCB and horizontal short latching of PCB for a travel distance of 8 mm
[0065] The present disclosure provides an apparatus that dissipates heat from the electronics components.