Signal Processing Device

Abstract: The present technology relates to a signal processing device which allows reduction of manufacturing cost. This electronic apparatus has a semiconductor chip as a plurality of signal processing circuits. The semiconductor chip has an input/output circuit (I/O) which is configured with an input circuit which functions as an input interface of a signal of a predetermined frequency band and/or an output circuit which functions as an output interface of a signal of the predetermined frequency band in order to perform transmission of the signal of the predetermined frequency band between another semiconductor chip. The input/output circuit of the one semiconductor chip and the input/output circuit of the other semiconductor chip are capable of transmission of the signal of the predetermined frequency band via any of a plurality of such transmission media for which characteristics differ as metallic wire a dielectric waveguide free space etc. The present technology for example can be applied to an electronic apparatus configured by a plurality of semiconductor chips.

Patent Information

Application #

Filing Date

31 July 2014

Publication Number

36/2016

Publication Type

INA

Invention Field

ELECTRONICS

Status

Email

remfry-sagar@remfry.com

Parent Application

Applicants

SONY CORPORATION

1 7 1 Konan Minato ku Tokyo 1080075

Inventors

1. KAWASAKI Kenichi

c/o SONY CORPORATION 1 7 1 Konan Minato ku Tokyo 1080075

2. TANAKA Yusuke

c/o SONY CORPORATION 1 7 1 Konan Minato ku Tokyo 1080075

3. YAMAGISHI Hiroyuki

c/o SONY CORPORATION 1 7 1 Konan Minato ku Tokyo 1080075

4. HAJIMIRI Ali

c/o California Institute of Technology 3971 Robin Hill Rd. La Canada Flintridge California 91011

Specification

Documents

Application Documents

#	Name	Date
1	Form 3.pdf	2014-08-01
2	6456-DELNP-2014.pdf	2014-08-24
3	6456-DELNP-2014-Form 3-031114.pdf	2014-11-27
4	6456-DELNP-2014-Correspondence-031114.pdf	2014-11-27