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Simple Heat Exchange Assembly For Led Lighting System Using Heat Pipes With Minimal Components

Abstract: The present invention relates to a simple heat exchange assembly for LED lighting system using heat pipes with minimal components which comprises of a specially designed multi-purpose base plate which holds the LED PCBs, the cluster of lenses and the heat tube(s), limiting the number of components involved in making the LED lighting system, making it economical. Moreover this base plate acts as a primary heat sink and immediately transfers the heat produced from the LED chips to the finned heat tubes present on the rear of the base plate causing faster dissipation of heat thereby increasing the longevity of the LED chips as well as reducing the rate of lumen intensity fall from the LED chips. The present system also provides the flexibility to change the size and number of heat tubes for making LED lights of variable wattages.

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Notices, Deadlines & Correspondence

Patent Information

Application #
Filing Date
01 January 2018
Publication Number
01/2018
Publication Type
INA
Invention Field
ELECTRICAL
Status
Email
msshah1660@yahoo.in
Parent Application
Patent Number
Legal Status
Grant Date
2022-02-28
Renewal Date

Applicants

TUCANA LIGHTS PVT. LTD.
31, Heritage Homes Thaltej Village, Ahmedabad 380 059 Gujarat, India

Inventors

1. Mahesh Mohatta
31, Heritage Homes, Thaltej Village, Ahmedabad - 380059 Gujarat, India
2. Manu Mohatta
31, Heritage Homes, Thaltej Village, Ahmedabad - 380059 Gujarat, India

Specification

Claims:We claim,
1. Simple heat exchange assembly for LED lighting system using heat pipes with minimal components comprises a specially engineered multi-purpose base plate which works as the chassis of the LED lighting system having receptacles on the rear for holding the LED PCB board as well as for attaching heat tubes and receptacles on the front for holding the LED lens wherein the base plate acts as a primary heat sink for quick dissipation of heat.
2. The simple heat exchange assembly for LED lighting system using heat pipes with minimal components as claimed in claim 1 wherein the LED PCB board is attached directly to the base plate on which are fixed PCBs which emit heat and light.
3. The simple heat exchange assembly for LED lighting system using heat pipes with minimal components as claimed in claim 2 wherein the light emitted, passes through the cluster of lenses present in the front of the base plate which gives proper beam angle to the LED light leading to increased illumination.
4. The simple heat exchange assembly for LED lighting system using heat pipes with minimal components as claimed in claim 2 wherein the heat emitted from the LED PCBs is absorbed by the base plate which is the primary heat sink and immediately transferred to the extruded finned heat tubes present at the rear of the base plate for faster dissipation of heat.
5. The simple heat exchange assembly for LED lighting system using heat pipes with minimal components as claimed in claim 4 wherein the heat tubes are usually made of one or both among copper and aluminum and treated for evacuation and insertion of fluids and its vapors which is a mixture of water and some organic solvents like alcohol.
6. The simple heat exchange assembly for LED lighting system using heat pipes with minimal components as claimed in claim 5 wherein the heat emitted from the LED PCBs, when reaches the heat tubes, gets transferred through the vapors present in the heat tubes to its farthest end which are the multiple fins, leading to fastest possible dissipation of heat.
7. The simple heat exchange assembly for LED lighting system using heat pipes with minimal components as claimed in claim 1 wherein the system provides the flexibility to change the size and number of heat tubes for making the LED lighting system of variable wattages.
8. The simple heat exchange assembly for LED lighting system using heat pipes with minimal components as claimed in claim 1 wherein the lighting system can be made of desired shapes having circular, triangular, square, rectangular or any other shaped base plate and corresponding heat tubes.
9. The simple heat exchange assembly for LED lighting system using heat pipes with minimal components substantially herein described with reference to the foregoing description and diagrams.
, Description:TITLE OF THE INVENTION:
Simple heat exchange assembly for LED lighting system using heat pipes with minimal components

FIELD OF THE INVENTION:
The present invention relates to a simpler heat exchange assembly which is herein used for LED lighting system which involves the use of heat pipes attached to a specially engineered multi-purpose base plate with minimal essential components to dissipate the heat.

BACKGROUND OF THE INVENTION:
LED (light emitting diode) is a two-lead semiconductor light source. It is a p-n junction diode that emits light when activated. When a suitable voltage is applied to the leads, electrons are able to recombine with electron holes within the device, releasing energy in the form of photons. Along with the production of light, these diodes produce heat when they are switched on by applying current. Upon application of direct current, LED’s emit light along with radiant energy. The LED chips used for producing LED light are mounted on a holding surface. The light emitted from the surface of the chip which faces the mounted surface, is converted into heat while the opposite surface of the chip emits the light. The heat generated on the surface of the chip facing the mounted surface increases with the increase in the power of the LED light. This heat causes damage to the chip, thereby reducing the age of the LED light. So proper heat dissipation systems are required to dissipate the heat produced from the LED chips.

US Patent 9816696 describes a fan cooled LED light and housing wherein the LED system includes a LED, a heat sink, a fan housing, a fan, and a cover. The heat sink is typically coupled to the LED, and the fan housing is typically coupled to the heat sink opposite the LED. The fan housing includes a fan housing aperture that extends through the fan housing and at least partially houses the fan. A cover may be coupled to the fan housing opposite the heat sink. The system may include at least one air intake opening and at least one air exhaust opening. When activated, the fan may external air into the fan housing through the air intake opening and direct the air toward the heat sink and ultimately through the air exhaust opening. In so doing, the temperature of the heat sink and the LED is reduced.
US Patent Application 2017321873 discusses thermal management for light-emitting diodes wherein heat management components for the LED chips employed in the lighting sources are provided. In embodiments of the invention, LED chips are cooled by one or more heatspreaders and heat sinks attached to a substrate that houses the LED chip and/or the topside of the LED chip.
US Patent Application 2017321875 discloses LED lighting fixture and heat sink therefor which includes a light emitting assembly that has a metal plate with opposite first and second surfaces, an LED mounted to the first surface of the metal plate and a foamed metal mounted to the second surface of the metal plate. The light emitting assembly is mounted in a housing that has a rear wall, a plurality of sidewalls projecting from the rear wall and an open front. The foamed metal faces the rear wall of the housing at a position spaced from the rear wall and the LED faces out from the open front of the housing. Openings are provided between the sidewalls of the housing and the light emitting assembly to accommodate a flow of cooling air between the light emitting assembly and the sidewalls and the rear wall of the housing.
US Patent Application 2017338391 provides a heat-sink patch LED luminescent tube comprising a first electrode pin used as a heat sink, and an LED chip, wherein the first electrode pin is composed of a first horizontal section electrode, a second horizontal section electrode and a protrusion heat sink, which are connected sequentially; the LED chip is mounted on the first horizontal section of the first electrode pin, a first electrode of the LED chip is connected with the first horizontal section, and a second electrode of the LED chip is connected with the third horizontal section through a conducting wire. When the actual patch is welded to this new utility model, the heat sink formed by the protrusion will penetrate a reserved copper hole in the circuit board to be connected with external metal elements, which radiates heat.
WO 2017195590 relates to a LED light source device which has excellent heat dissipating characteristics, and which enables high-density mounting of LED elements, an LED light source device 1 is provided with: an insulating substrate 4; a plurality of LED elements 5 that are mounted on the insulating substrate 4; and a sealing member 7 for sealing the LED elements 5 by containing a resin 70 having light transmitting characteristics, and a fluorescent material 71 that is contained such that the mass ratio thereof with respect to the resin 70 is 0.8-1.4.
RU 2635654 describes a LED lamp comprising a base with an integrated power supply, at least one thread-like emitter, electric current conductors, a light-permeable bulb with a cross-sectional end-to-end channel, and thread-like radiator in form of a flexible cord is positioned freely along a helical line around end-to-end channel, improving the heat transfer to the surrounding air.
CN 206176077 discusses flat optic fibre leaded light lighting device which contains lamp component and back panel component, and back panel component contains heat dissipation backboard, and lamp component contains heat dissipation rim and diffuser plate, and the heat dissipation rim contains the heating panel, and the heating panel setting gets into lamp component's diffuser plate and realizes the illumination at the week side of diffuser plate, the leading -in natural light of optic fibre, still including protection box and a plurality of fixer, optic fibre is fixed in the heating panel of heat dissipation rim with a plurality of fixers, makes optic fibre go out the face towards the diffuser plate that is fixed in the heating panel in the plain noodles, and at least fixed optic fibre of every fixer, protection box set up in the periphery of heat dissipation rim, forms a protection box space together with heat dissipation backboard behind heating panel and the protection box fixed connection, walks the line with the fixed optic fibre section of fixer in protection box space. Optic fibre can obtain good fixed and protection, and is not fragile. The lamp body still is provided with the LED light source, according to the weather condition, carries out intelligent light filling, guarantees output and stabilizes illuminance, also reaches energy saving and emission reduction simultaneously.
CN 206179541 relates to a big load of easily dispelling heat transmission of electricity copper bar, lead including the big load that has been used for conductive effect that electrical drainage copper is outer, be used for big load electrically conductive and heat conduction to lead electrical drainage aluminium intermediate layer and be used for dispelling the heat and electrical drainage aluminum alloy inlayer is led to big load that rigid support acted on, electrical drainage aluminum alloy inlayer is led to big load is the rounded rectangle tubular structure, big load is led the cladding of electrical drainage aluminium intermediate layer and is in the outside of electrical drainage aluminum alloy inlayer is led to big load, big load is led electrical drainage copper external sheath and is in the interbedded outside of electrical drainage aluminium is led to big load. The utility model provides a pair of big load of easily dispelling heat transmission of electricity copper bar can ensure enough that big load transmission of electricity copper bar has good heat dispersion and electric conductive property to big load transmission of electricity copper bar still has lower manufacturing cost.
Although a number of heat exchange assemblies are available in prior art for dissipating the heat generated by LED lighting systems, a heat exchange assembly using heat pipes, having a simple design and minimal components, which increase the longevity of the LED chips and reduce the number of components involved in dissipating heat generated by LED systems, is the need of the day.

OBJECT OF THE INVENTION:
The main object of the invention is to provide for a simple heat exchange assembly for LED lighting system using heat pipes with minimal components which has a specially designed multi-purpose base plate which works as a chassis for the LED lighting system and has receptacle for LED PCB, receptacle for LED lens, receptacle for heat tubes and acts as a reflector and a primary heat sink.
Another object of the invention is to provide for a simple heat exchange assembly for LED lighting system using heat pipes with minimal components which provides flexibility to change the size and number of heat tubes in accordance with the wattage if the LED light.
Still another object of the invention is to provide for a simple heat exchange assembly for LED lighting system using heat pipes with minimal components for faster dissipation of heat.
Yet another object of the invention is to provide for a simple heat exchange assembly for LED lighting system using heat pipes with minimal components which increases the longevity of the LED chips.
A further object of the invention is to provide for a simple heat exchange assembly for LED lighting system using heat pipes with minimal components making it comparatively economical.

SUMMARY OF THE INVENTION:
The present invention is a simple heat exchange assembly for LED lighting system using heat pipes with minimal components which comprises of a multi-functional base plate which on the front side acts as a reflector, and has LED PCB receptacle and a receptacle for LED lens while on the rear side has receptacle(s) for heat tube(s). LED PCB’s are fitted on the front side of the base plate and they are covered with a LED lens. The whole base plate acts as a reflector, thereby increasing the intensity of the light produced by the LED. Depending on the wattage of the LED, a number of heat tubes are fitted on the rear face of the base plate. The heat produced on lighting the LED, is immediately passed on to the heat tubes which gets transferred through the vapors in the heat tube to the farthest point in the heat tube thereby keeping the LED chips cool .

BRIEF DESCRIPTION OF THE DRAWINGS
Fig. 1 gives the diagram of the whole LED light system having a single thick heat tube It includes a 2D view, a 3D view and a cross section view.
Fig. 2 gives the diagram of the whole LED light system having multiple heat tubes with labeled parts and their optimum dimensions.
Fig. 3 gives the exploded diagram of the split parts of the LED light in which the rear of the base plate has a single receptacle for a single heat pipe.
Fig. 4 gives the exploded diagram of the split parts of the LED light in which the rear of the base plate has a number of receptacles for multiple heat pipes.
Fig. 5 gives the diagram of an extruded finned heat tube which includes the cross section view.
Fig. 6 gives the diagram of different views of the base plate of LED light having multiple heat tube receptacles.
Fig. 7 gives the diagram of different views of the base plate of LED light having multiple heat tube receptacles along with its cross-section view.
Fig. 8 gives the diagram of different views of the base plate of LED light having single heat tube receptacle.
Fig. 9 gives the diagram of different views of the base plate of LED light having single heat tube receptacle along with its cross-section view.

DETAILED DESCRIPTION:
The nature of the invention and the manner in which it is performed is clearly described in the specification. The invention has various components and they are clearly described in the following pages of the complete specification.
Heat dissipation is a type of heat transfer. During heat dissipation heat from a hotter object is transferred to colder objects and the surrounding environment. A number of heat management techniques have been developed for managing heat released from LED systems. In some systems, heat is conducted to a heat sink from the LED junction and then dissipated to the ambient by natural convection or radiation while in other cases the LED systems are cooled by using extended surfaces like plate fins and pin fins which significantly increase the heat transfer area over unfinned heat sinks.
The present invention is a simple heat exchange assembly for LED lighting system using heat pipes with minimal components which comprises a specially engineered multi-purpose base plate. This base plate has receptacles for holding the LED PCB board on its front side along with receptacle for holding the LED lens. This cluster of lenses gives proper beam angle to the LED light. This way the base plate itself works as a reflector of light. It also works as a primary heat sink which is directly connected with the LED PCB for immediate dissipation of heat. On the rear side of the base plate are present hollow plugs which are then transformed to heat tubes by simply mounting extruded finned hollow tubes. These tubes are further treated for evacuation and then insertion of evaporative fluids and its vapors. The size and number of heat tubes added to a LED lighting system can be changed depending on the wattage of the system. This multi-purpose base plate works as the central most critical component which works as a chassis for the entire LED lighting system, on which all the components are mounted or supported for their efficient and easy functionality.
Heat tubes used in LED lighting system are usually made of copper and or aluminum, which after treatment for evacuation and insertion of fluids and its vapors, are connected to the source of heat which are the LED light PCB. One end of these heat tubes is in touch with the heat source where the LED PCB is mounted. On switching on the LED light, heat is emitted from the PCB and transferred through the vapors present in the heat tubes, to its farthest end. The vapor phase is a mixture of water and some organic solvents like alcohol. This mixture is a better conductor of heat than metals including copper. The heat from the heat tubes is transferred to the finned heat exchanger thereby reducing the heat present near the LED light PCB in the fastest possible time, thereby keeping the chips cool. This fast transfer of heat from the LED light PCB, contributes to the longevity of the LED chips as well as reduces the rate of lumen intensity fall from the LED chips.
Displayed in Fig. 1 is the diagram of the complete LED light system of the present invention wherein are displayed a two dimensional view, a three dimensional view as well as a cross section view of an LED light system having a single thick heat tube. Fig. 2 gives the diagram of a complete LED light system which has multiple heat tubes for dissipation of heat. As shown in the figure, the LED light is hung from a suspension hook which is supported on a driver suspension box. Ideally, this suspension box has a height of 69 mm and a diameter of 208 mm. However the dimensions may vary according to the requirement. This box holds the converter which converts the alternate current to direct current which is the basic requirement of LED chips. The farthest end of the heat tubes (pipes) are attached to the driver suspension box while its front end goes into the base plate. The ideal heat of these heat tubes is 230 mm. The base plate acts as a heat plate cum reflector which ideally is 100 mm in height and 355 mm in diameter at its open end. Although the ideal dimensions and shape of all the parts have been mentioned in the diagram, these dimensions and shape may be changed according to the requirement.
Fig. 3 gives the exploded 3D diagram of the parts of a LED light system wherein all the parts of the light system have been separately shown in their correct order. The topmost is the suspension hook followed by the driver suspension box. This is followed by a thick heat tube with a number of extruded fins. Below the heat tube is the specially designed base plate which also acts as a reflector, having a single receptacle for a single heat tube. This base plate also has receptacles for holding the LED PCB board on its front side along with receptacle for holding the LED lens. Similar to Fig. 3, Fig. 4 gives the exploded 3D diagram of the parts of a LED light system wherein all the parts of the light system have been shown separately in their correct order in which instead of a single heat tube, as shown in Fig. 3, multiple heat tubes and their receptacles have been displayed. The rest of the diagram is same as shown in Fig. 3.
Fig. 5 gives the diagram of an extruded finned heat pipe (tube) used in the LED light system of the present invention which includes a section view of the finned heat pipe. The diagram shows the finned heat pipe design, the hollow of which is filled with an evaporative fluid and closed with a hermatic plug. The evaporative fluid is a mixture of water and some organic solvents like alcohol which makes it a better conductor of heat as compared to metals like aluminum and copper. Moreover the fins in the heat tubes provide more area for the heat to spread out thus dissipating the heat at a faster rate leading to increased longevity of the LED chips.
Fig. 6 gives the diagram of the different views of the base plate of the LED light having multiple heat tube receptacles wherein the rear view shows the heat tube receptacles as well as receptacles for holding the LED PCB board. The front, rear, side and 3D views of the front and rear of the base plate cum reflector has been shown in the diagram. Also shown is the half sliced view of the base plate, for its complete understanding. Fig. 7 also gives the diagram of the different views of the base plate of the LED light system having multiple heat tube receptacles which includes cross-section view, side view, 3D view as well as a partially cut view of the reflector cum LED PCB receptacle, for its complete understanding.
Fig. 8 gives the diagram of the different views of the base plate of the LED light having single heat tube receptacle wherein the rear view shows the heat tube receptacle as well as receptacles for holding the LED PCB board. The front, rear, side and 3D views of the front and rear of the base plate cum reflector has been shown in the diagram. Also shown is the half sliced view of the base plate, for its complete understanding. Fig. 9 also gives the diagram of the different views of the base plate of the LED light system having single heat tube receptacle which includes cross-section view, side view, 3D view as well as a partially cut view of the reflector cum LED PCB receptacle, for its complete understanding.
Although all the above mentioned diagrams show a circular base plate of the LED light system along with cylindrical heat tubes, the complete LED light system can be made of different shapes having square, triangular, oval etc base plates and their corresponding heat tubes.

The simple heat exchange assembly for LED lighting system using heat pipes with minimal components is highly advantageous. It eliminates the need of a separate LED PCB board which is common in the currently available LED lights, as the LED PCB receptacles are present on the specially engineered multi-purpose base plate such that the PCB’s are attached directly on it. So the extra expense of a PCB plate is cut down. The heat tubes in the LED light system of the present invention start directly from the base plate due to the presence of their receptacles due to which one step in heat transfer is eliminated and heat transfer from the LED PCB becomes faster. The heat emitted from the PCB’s is immediately and directly transferred to the heat tubes having extruded fins which completely dissipate the heat of the system. As the heat transfer is immediate, the longevity of these LED PCBs increases thereby making it advantageous. It also reduces the rate of lumen intensity fall from the LED chips. Thus the specially engineered base plate is an economical multipurpose component which has;
• Receptacles for holding the LED PCB board;
• Lens cluster which gives the LED light a proper beam angle;
• Additional reflector for stray light beams;
• Primary heat sink which directly connects with the PCB or LED chips for quick heat dissipation;
• Provision of attaching heat tubes at the rear of the base plate for immediate and enhanced heat dissipation; and
• Flexibility to change the size and numbers of heat tubes for making the LED lighting system of variable wattages.

Although the preferred embodiment as well as the construction and use have been specifically described, it should be understood that variations in the preferred embodiment could be achieved by a person skilled in the art without departing from the spirit of the invention. The invention has been described with reference to specific embodiment which is merely illustrative and not intended to limit the scope of the invention as defined in the claims.

Documents

Orders

Section Controller Decision Date
section 15 ashlesh maurya 2022-02-28
section 15 ashlesh maurya 2022-02-28

Application Documents

# Name Date
1 201821000061-IntimationOfGrant28-02-2022.pdf 2022-02-28
1 201821000061-STATEMENT OF UNDERTAKING (FORM 3) [01-01-2018(online)].pdf 2018-01-01
2 201821000061-REQUEST FOR EARLY PUBLICATION(FORM-9) [01-01-2018(online)].pdf 2018-01-01
2 201821000061-PatentCertificate28-02-2022.pdf 2022-02-28
3 201821000061-POWER OF AUTHORITY [01-01-2018(online)].pdf 2018-01-01
3 201821000061-ORIGINAL UR 6(1A) FORM 1, FORM 3 & FORM 26-290921.pdf 2021-10-30
4 201821000061-US(14)-HearingNotice-(HearingDate-02-09-2021).pdf 2021-10-18
4 201821000061-FORM-9 [01-01-2018(online)].pdf 2018-01-01
5 201821000061-FORM FOR STARTUP [01-01-2018(online)].pdf 2018-01-01
5 201821000061-AMMENDED DOCUMENTS [16-09-2021(online)].pdf 2021-09-16
6 201821000061-FORM FOR SMALL ENTITY(FORM-28) [01-01-2018(online)].pdf 2018-01-01
6 201821000061-Annexure [16-09-2021(online)].pdf 2021-09-16
7 201821000061-FORM 13 [16-09-2021(online)].pdf 2021-09-16
7 201821000061-FORM 1 [01-01-2018(online)].pdf 2018-01-01
8 201821000061-FORM 3 [16-09-2021(online)].pdf 2021-09-16
8 201821000061-FIGURE OF ABSTRACT [01-01-2018(online)].pdf 2018-01-01
9 201821000061-MARKED COPIES OF AMENDEMENTS [16-09-2021(online)].pdf 2021-09-16
9 201821000061-EVIDENCE FOR REGISTRATION UNDER SSI(FORM-28) [01-01-2018(online)].pdf 2018-01-01
10 201821000061-EVIDENCE FOR REGISTRATION UNDER SSI [01-01-2018(online)].pdf 2018-01-01
10 201821000061-POA [16-09-2021(online)].pdf 2021-09-16
11 201821000061-DRAWINGS [01-01-2018(online)].pdf 2018-01-01
11 201821000061-RELEVANT DOCUMENTS [16-09-2021(online)].pdf 2021-09-16
12 201821000061-DECLARATION OF INVENTORSHIP (FORM 5) [01-01-2018(online)].pdf 2018-01-01
12 201821000061-Written submissions and relevant documents [16-09-2021(online)].pdf 2021-09-16
13 201821000061-COMPLETE SPECIFICATION [01-01-2018(online)].pdf 2018-01-01
13 201821000061-Correspondence to notify the Controller [28-08-2021(online)].pdf 2021-08-28
14 201821000061-FORM-26 [24-07-2018(online)].pdf 2018-07-24
14 201821000061-PETITION UNDER RULE 137 [17-01-2020(online)].pdf 2020-01-17
15 201821000061-Response to office action (Mandatory) [06-09-2019(online)].pdf 2019-09-06
15 ABSTRACT1.jpg 2018-08-11
16 201821000061-ORIGINAL UNDER RULE 6 (1A)-080118.pdf 2018-08-11
16 201821000061-SER.pdf 2019-05-30
17 201821000061-ABSTRACT [27-05-2019(online)].pdf 2019-05-27
17 201821000061-FORM 18A [19-12-2018(online)].pdf 2018-12-19
18 201821000061-AMMENDED DOCUMENTS [27-05-2019(online)].pdf 2019-05-27
18 201821000061-FER.pdf 2019-01-16
19 201821000061-RELEVANT DOCUMENTS [27-05-2019(online)].pdf 2019-05-27
19 201821000061-CLAIMS [27-05-2019(online)].pdf 2019-05-27
20 201821000061-DRAWING [27-05-2019(online)].pdf 2019-05-27
20 201821000061-OTHERS [27-05-2019(online)].pdf 2019-05-27
21 201821000061-ENDORSEMENT BY INVENTORS [27-05-2019(online)].pdf 2019-05-27
21 201821000061-MARKED COPIES OF AMENDEMENTS [27-05-2019(online)].pdf 2019-05-27
22 201821000061-FER_SER_REPLY [27-05-2019(online)].pdf 2019-05-27
22 201821000061-FORM 3 [27-05-2019(online)].pdf 2019-05-27
23 201821000061-FORM 13 [27-05-2019(online)].pdf 2019-05-27
24 201821000061-FER_SER_REPLY [27-05-2019(online)].pdf 2019-05-27
24 201821000061-FORM 3 [27-05-2019(online)].pdf 2019-05-27
25 201821000061-MARKED COPIES OF AMENDEMENTS [27-05-2019(online)].pdf 2019-05-27
25 201821000061-ENDORSEMENT BY INVENTORS [27-05-2019(online)].pdf 2019-05-27
26 201821000061-OTHERS [27-05-2019(online)].pdf 2019-05-27
26 201821000061-DRAWING [27-05-2019(online)].pdf 2019-05-27
27 201821000061-CLAIMS [27-05-2019(online)].pdf 2019-05-27
27 201821000061-RELEVANT DOCUMENTS [27-05-2019(online)].pdf 2019-05-27
28 201821000061-AMMENDED DOCUMENTS [27-05-2019(online)].pdf 2019-05-27
28 201821000061-FER.pdf 2019-01-16
29 201821000061-ABSTRACT [27-05-2019(online)].pdf 2019-05-27
29 201821000061-FORM 18A [19-12-2018(online)].pdf 2018-12-19
30 201821000061-ORIGINAL UNDER RULE 6 (1A)-080118.pdf 2018-08-11
30 201821000061-SER.pdf 2019-05-30
31 201821000061-Response to office action (Mandatory) [06-09-2019(online)].pdf 2019-09-06
31 ABSTRACT1.jpg 2018-08-11
32 201821000061-FORM-26 [24-07-2018(online)].pdf 2018-07-24
32 201821000061-PETITION UNDER RULE 137 [17-01-2020(online)].pdf 2020-01-17
33 201821000061-COMPLETE SPECIFICATION [01-01-2018(online)].pdf 2018-01-01
33 201821000061-Correspondence to notify the Controller [28-08-2021(online)].pdf 2021-08-28
34 201821000061-DECLARATION OF INVENTORSHIP (FORM 5) [01-01-2018(online)].pdf 2018-01-01
34 201821000061-Written submissions and relevant documents [16-09-2021(online)].pdf 2021-09-16
35 201821000061-DRAWINGS [01-01-2018(online)].pdf 2018-01-01
35 201821000061-RELEVANT DOCUMENTS [16-09-2021(online)].pdf 2021-09-16
36 201821000061-EVIDENCE FOR REGISTRATION UNDER SSI [01-01-2018(online)].pdf 2018-01-01
36 201821000061-POA [16-09-2021(online)].pdf 2021-09-16
37 201821000061-MARKED COPIES OF AMENDEMENTS [16-09-2021(online)].pdf 2021-09-16
37 201821000061-EVIDENCE FOR REGISTRATION UNDER SSI(FORM-28) [01-01-2018(online)].pdf 2018-01-01
38 201821000061-FORM 3 [16-09-2021(online)].pdf 2021-09-16
38 201821000061-FIGURE OF ABSTRACT [01-01-2018(online)].pdf 2018-01-01
39 201821000061-FORM 13 [16-09-2021(online)].pdf 2021-09-16
39 201821000061-FORM 1 [01-01-2018(online)].pdf 2018-01-01
40 201821000061-FORM FOR SMALL ENTITY(FORM-28) [01-01-2018(online)].pdf 2018-01-01
40 201821000061-Annexure [16-09-2021(online)].pdf 2021-09-16
41 201821000061-FORM FOR STARTUP [01-01-2018(online)].pdf 2018-01-01
41 201821000061-AMMENDED DOCUMENTS [16-09-2021(online)].pdf 2021-09-16
42 201821000061-US(14)-HearingNotice-(HearingDate-02-09-2021).pdf 2021-10-18
42 201821000061-FORM-9 [01-01-2018(online)].pdf 2018-01-01
43 201821000061-ORIGINAL UR 6(1A) FORM 1, FORM 3 & FORM 26-290921.pdf 2021-10-30
43 201821000061-POWER OF AUTHORITY [01-01-2018(online)].pdf 2018-01-01
44 201821000061-PatentCertificate28-02-2022.pdf 2022-02-28
44 201821000061-REQUEST FOR EARLY PUBLICATION(FORM-9) [01-01-2018(online)].pdf 2018-01-01
45 201821000061-IntimationOfGrant28-02-2022.pdf 2022-02-28
45 201821000061-STATEMENT OF UNDERTAKING (FORM 3) [01-01-2018(online)].pdf 2018-01-01

Search Strategy

1 searchstragey_11-01-2019.pdf

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