Sign In to Follow Application
View All Documents & Correspondence
View All Documents & Correspondence
"Solid State Imaging Device And Electronic Apparatus"
Abstract: A solid-state imaging device includes an image sensor chip and a signal processing chip, which are electrically connected. A low thermal conductivity region is positioned between the image sensor chip and the signal processing chip. The low thermal conductivity region is configured to insulate the image sensor chip from heat, which may be generated by the signal processing chip.
Get Free WhatsApp Updates!
Notices, Deadlines & Correspondence
Notices, Deadlines & Correspondence
Patent Information
Application #
Filing Date
16 June 2011
Publication Number
17/2012
Publication Type
INA
Invention Field
ELECTRICAL
Status
Email
Parent Application
Applicants
SONY CORPORATION
1-7-1 KONAN, MINATO-KU, TOKYO, JAPAN
Inventors
1. KEIJI SASANO
C/O SONY CORPORATION, 1-7-1 KONAN, MINATO-KU, TOKYO, JAPAN
2. HIROAKI TANAKA
C/O SONY CORPORATION, 1-7-1 KONAN, MINATO-KU, TOKYO, JAPAN
3. HIROKI HAGIWARA
C/O SONY CORPORATION, 1-7-1 KONAN, MINATO-KU, TOKYO, JAPAN
4. YUKI TSUJI
C/O SONY CORPORATION, 1-7-1 KONAN, MINATO-KU, TOKYO, JAPAN
5. WATANABE TSUYOSHI
C/O SONY CORPORATION, 1-7-1 KONAN, MINATO-KU, TOKYO, JAPAN
6. KOJI TSUCHIYA
C/O SONY CORPORATION, 1-7-1 KONAN, MINATO-KU, TOKYO, JAPAN
7. KENZO TANAKA
C/O SONY SEMICONDUCTOR KYUSHU CORPORATION, 2-3-2 MOMOCHIHAMA, SAWARA-KU, FUKUOKA-SHI, FUKUOKA, JAPAN
8. TAKAYA WADA
C/O SONY SEMICONDUCTOR KYUSHU CORPORATION, 2-3-2 MOMOCHIHAMA, SAWARA-KU, FUKUOKA-SHI, FUKUOKA, JAPAN
9. HIROKAZU YOSHIDA
C/O SONY SEMICONDUCTOR KYUSHU CORPORATION, 2-3-2 MOMOCHIHAMA, SAWARA-KU, FUKUOKA-SHI, FUKUOKA, JAPAN
10. NOBORU KAWABATA
C/O SONY SEMICONDUCTOR KYUSHU CORPORATION, 2-3-2 MOMOCHIHAMA, SAWARA-KU, FUKUOKA-SHI, FUKUOKA, JAPAN
11. HIRONORI YOKOYAMA
C/O SONY SEMICONDUCTOR KYUSHU CORPORATION, 2-3-2 MOMOCHIHAMA, SAWARA-KU, FUKUOKA-SHI, FUKUOKA, JAPAN