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Structure For Connecting Wiring Conductor

Abstract: The present invention is configured of: a housing (2) for an electronic apparatus; a board like wiring conductor (3) formed in the housing (2) by means of insert molding using resin portions (2a 2b); a wiring terminal surface (3a) formed by bending an leading end portion of the wiring conductor (3); a hook like protrusion (3b) formed on the wiring terminal surface (3a); a wiring terminal surface (4a) of an external wiring terminal (4) fixed by having an end portion of the wiring terminal surface in contact with the hook like protrusion (3b); a crimping unit (4f) which connects flexible wiring (5) to the external wiring terminal (4); and a bolt (6) and a nut (7) which fasten the wiring terminal surface (3a) and the wiring terminal surface (4a) to each other. At the time of electrically connecting the wiring terminals to each other aligning operations are facilitated and an operation time is shortened.

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Notices, Deadlines & Correspondence

Patent Information

Application #
Filing Date
28 April 2014
Publication Number
27/2015
Publication Type
INA
Invention Field
ELECTRICAL
Status
Email
patent@depenning.com
Parent Application
Patent Number
Legal Status
Grant Date
2019-08-27
Renewal Date

Applicants

Mitsubishi Electric Corporation
7 3 Marunouchi 2 chome Chiyoda ku Tokyo 1008310

Inventors

1. AKIYAMA Shuzo
c/o Mitsubishi Electric Corporation 7 3 Marunouchi 2 chome Chiyoda ku Tokyo 1008310
2. HOSAKA Yasuhiro
c/o Mitsubishi Electric Corporation 7 3 Marunouchi 2 chome Chiyoda ku Tokyo 1008310
3. FUJIMOTO Tadayuki
c/o Mitsubishi Electric Engineering Company Limited 1 13 5 Kudankita Chiyoda ku Tokyo 1020073
4. TANIGAWA Masaaki
c/o Mitsubishi Electric Engineering Company Limited 1 13 5 Kudankita Chiyoda ku Tokyo 1020073

Specification

Documents

Application Documents

# Name Date
1 3182-CHENP-2014-RELEVANT DOCUMENTS [20-09-2023(online)].pdf 2023-09-20
1 3182-CHENP-2014.pdf 2014-04-28
2 3182-CHENP-2014-RELEVANT DOCUMENTS [15-09-2022(online)].pdf 2022-09-15
2 MITSUBISHI ELECTRIC CORPORATION.,..pdf 2014-04-29
3 3182-CHENP-2014-RELEVANT DOCUMENTS [09-08-2021(online)].pdf 2021-08-09
3 1520-2014.pdf 2014-04-29
4 3182-CHENP-2014-RELEVANT DOCUMENTS [09-03-2020(online)].pdf 2020-03-09
4 1520-2014 OTHERS.pdf 2014-04-29
5 3182-CHENP-2014-IntimationOfGrant27-08-2019.pdf 2019-08-27
5 1520 Form 5.pdf 2014-04-29
6 3182-CHENP-2014-PatentCertificate27-08-2019.pdf 2019-08-27
6 1520 Form 3.pdf 2014-04-29
7 Abstract_Granted 319168_27-08-2019.pdf 2019-08-27
7 3182-CHENP-2014 CORRESPONDENCE OTHERS 24-10-2014.pdf 2014-10-24
8 Claims_Granted 319168_27-08-2019.pdf 2019-08-27
8 3182-CHENP-2014 FORM-3 24-10-2014.pdf 2014-10-24
9 3182-CHENP-2014 FORM-1 24-10-2014.pdf 2014-10-24
9 Description_Granted 319168_27-08-2019.pdf 2019-08-27
10 Drawings_Granted 319168_27-08-2019.pdf 2019-08-27
10 ENGLISH TRANSLATION.pdf 2014-11-18
11 abstract3182-CHENP-2014.jpg 2014-11-18
11 Marked up Claims_Granted 319168_27-08-2019.pdf 2019-08-27
12 3182-CHENP-2014 CORRESPONDENCE OTHERS 16-07-2015.pdf 2015-07-16
12 3182-CHENP-2014-ABSTRACT [21-12-2018(online)].pdf 2018-12-21
13 3182-CHENP-2014-CLAIMS [21-12-2018(online)].pdf 2018-12-21
13 3182-CHENP-2014-FER.pdf 2018-06-25
14 3182-CHENP-2014-DRAWING [21-12-2018(online)].pdf 2018-12-21
14 3182-CHENP-2014-OTHERS [21-12-2018(online)].pdf 2018-12-21
15 3182-CHENP-2014-FER_SER_REPLY [21-12-2018(online)].pdf 2018-12-21
15 3182-CHENP-2014-Information under section 8(2) (MANDATORY) [21-12-2018(online)].pdf 2018-12-21
16 3182-CHENP-2014-FORM 3 [21-12-2018(online)].pdf 2018-12-21
16 3182-CHENP-2014-FORM-26 [21-12-2018(online)].pdf 2018-12-21
17 3182-CHENP-2014-FORM-26 [21-12-2018(online)].pdf 2018-12-21
17 3182-CHENP-2014-FORM 3 [21-12-2018(online)].pdf 2018-12-21
18 3182-CHENP-2014-FER_SER_REPLY [21-12-2018(online)].pdf 2018-12-21
18 3182-CHENP-2014-Information under section 8(2) (MANDATORY) [21-12-2018(online)].pdf 2018-12-21
19 3182-CHENP-2014-DRAWING [21-12-2018(online)].pdf 2018-12-21
19 3182-CHENP-2014-OTHERS [21-12-2018(online)].pdf 2018-12-21
20 3182-CHENP-2014-CLAIMS [21-12-2018(online)].pdf 2018-12-21
20 3182-CHENP-2014-FER.pdf 2018-06-25
21 3182-CHENP-2014 CORRESPONDENCE OTHERS 16-07-2015.pdf 2015-07-16
21 3182-CHENP-2014-ABSTRACT [21-12-2018(online)].pdf 2018-12-21
22 abstract3182-CHENP-2014.jpg 2014-11-18
22 Marked up Claims_Granted 319168_27-08-2019.pdf 2019-08-27
23 Drawings_Granted 319168_27-08-2019.pdf 2019-08-27
23 ENGLISH TRANSLATION.pdf 2014-11-18
24 Description_Granted 319168_27-08-2019.pdf 2019-08-27
24 3182-CHENP-2014 FORM-1 24-10-2014.pdf 2014-10-24
25 Claims_Granted 319168_27-08-2019.pdf 2019-08-27
25 3182-CHENP-2014 FORM-3 24-10-2014.pdf 2014-10-24
26 Abstract_Granted 319168_27-08-2019.pdf 2019-08-27
26 3182-CHENP-2014 CORRESPONDENCE OTHERS 24-10-2014.pdf 2014-10-24
27 3182-CHENP-2014-PatentCertificate27-08-2019.pdf 2019-08-27
27 1520 Form 3.pdf 2014-04-29
28 3182-CHENP-2014-IntimationOfGrant27-08-2019.pdf 2019-08-27
28 1520 Form 5.pdf 2014-04-29
29 3182-CHENP-2014-RELEVANT DOCUMENTS [09-03-2020(online)].pdf 2020-03-09
29 1520-2014 OTHERS.pdf 2014-04-29
30 3182-CHENP-2014-RELEVANT DOCUMENTS [09-08-2021(online)].pdf 2021-08-09
30 1520-2014.pdf 2014-04-29
31 3182-CHENP-2014-RELEVANT DOCUMENTS [15-09-2022(online)].pdf 2022-09-15
31 MITSUBISHI ELECTRIC CORPORATION.,..pdf 2014-04-29
32 3182-CHENP-2014-RELEVANT DOCUMENTS [20-09-2023(online)].pdf 2023-09-20
32 3182-CHENP-2014.pdf 2014-04-28

Search Strategy

1 Search(19)_07-03-2018.pdf

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