[Technical Field of the Invention] [0001] The present invention relates to a surface-treated steel sheet having excellent corrosion resistance (batTier property) of plating in corrosive environments and excellent coating film adhesion. The present application claims Japm1ese Patent Application No. 2015-116554 and Japanese Patent Application No. 2015-116604 filed on June 9, 2015, the contents of which are incorporated herein by reference. [Related Art] [0002] From the related art, electrogalvanized steel sheets have been used in a variety of fields such as home appliances, construction materials, and automobiles. For electrogalvanized steel sheets, there is a demand for further improving the corrosion resistance (hereinafter, barrier property) of plating in corrosive environments. As a method for improving the barrier property of electrogalvanized steel sheets, at1 increase in the plating amount (basis weight) of galvanized layers is considered. However, when the basis weight of a galvanized layer is increased, there has been a problem in that the manufacturing costs increase and the workability or weldability degrades. [0003] In addition, as a method for improving the barrier property or external appearance of electrogalvanized steel sheets, thus far, techniques of forming coating - I - films on surfaces have been widely used. Howeve1~ when the adhesion (coating film adhesion) between plating layers and coating films in electrogalvanized steel sheets is insufficient, in spite of the fonnation of coating films on surfaces, the effect of the formation of coating films cannot be sufficiently obtained. Therefore, there is a demand for not only improving the barrier property of electrogalvanized steel sheet but also improving the coating film adhesion. [0004] In recent years, studies have been underway regarding the improvement of the barrier prope1ty by adding a vanadium element to galvanized layers in electrogalvanized steel sheets. For example, Non Patent Documents I to 4 describe teclmiques of electrocrystallizing Zn-V composite oxides on the surface of a copper sheet which is a negative electrode. Patent Document 1 describes a technique of forming a V-thickened layer in a surface layer portion of a plating layer in a zinc-based plated steel sheet. Patent Document 2 describes a technique regarding a plating layer including zinc and vanadium and having a plurality of dendrite-shaped arms. [0005] Patent Document 3 describes that a plating layer formed on a steel sheet and including zinc and vanadium has dendrite-shaped crystals in which a vanadium oxide is present in zinc and describes that, in portions other than the dendrite-shaped crystals, phases having a higher vanadium content ratio than the dendrite-shaped crystals are present. [0006] Patent Document 4 describes that, in a zinc-based composite electroplated steel sheet including zinc and a vanadium hydroxide, a vanadium hydroxide is - 2 - coprecipitated in zinc. [Prior Art Document] [Patent Document] [0007] [Patent Document 1] Japanese Unexamined Patent Application, First Publication No. 2013-185199 [Patent Document 2] Japanese Patent No. 5273316 [Patent Document 3] Japanese Unexamined Patent Application, First Publication No. 2013-108183 [Patent Document 4] Japanese Unexamined Patent Application, First Publication No. 2011 · 111633 [Non Patent Document] [0008] [Non-Patent Document 1] CAMP-ISIJ Vol. 22 (2009) 933 to 936 [Non-Patent Document 2] Iron and steel Vol. 93 (2007) No. 11, pp. 49 to 54 [Non-Patent Document 3] The Surface Finishing Society of Japan, The summary of the 1 15th Lectures, 9A-26, pp. 139 and 140 [Non-Patent Document 4] Bulletin of The Iron and Steel Institute of Japan, Vol. 13, No.4, p. 245, 2008. 4. 1 [Disclosure of the Invention] [Problems to be Solved by the Invention] [0009] However, for surface-treated steel sheets of the related art having a plating " 3 " layer including zinc and vanadium on the surface of a steel sheet, there has been a demand for further improving the barrier property. In addition, since vanadium (V) is a rare element, there is a desire for platings having an excellent barrier property which replace zinc-vanadium platings. The present invention has been made in consideration of the above-described circumstances, and an object of the present invention is to provide a surface-treated steel sheet having an excellent barrier property and excellent coating fihn adhesion in which a plating layer including zinc and vanadium or zirconium is formed on the surface of a steel sheet. [Means for Solving the Problem] [0010] In order to solve the above-described problems, the present inventors repeated intensive studies as described below. That is, the present inventors formed plating layers including zinc and vanadium or zirconium on the surfaces of steel sheets under a variety of conditions using an electroplating method and the steel sheets as a negative electrode and investigated the barrier property and the coating film adhesion. [0011] As a result, the present inventors found that it is preferable to form a plating layer which includes zinc and vanadium and has dendrite-shaped crystals including metallic zinc and intercrystal filling regions including a hydrated vanadium oxide or a vanadium hydroxide. The above-described plating layer has intercrystal filling regions including a hydrated vanadium oxide or a vanadium hydroxide and thus has a higher corrosion potential and a superior barrier property compared with, for example, - 4 - I., plated steel sheets formed by providing a galvanized layer instead of this plating layer. In addition, the present inventors found that, under certain conditions, phases including a hydrated zirconia oxide or a zirconia hydroxide are formed in the peripheries of the dendrite-shaped crystals made of metallic zinc. It was clarified that the plating layer has an equal or better barrier property and excellent coating film adhesion compared with zinc-vanadium platings, which led to the completion of the present invention. Individual aspects of the present invention are as described below. [0012] (1) A surface-treated steel sheet according to an aspect of the present invention includes a steel sheet; and a plating layer which is fonned on one surface or both surfaces of the steel sheet and which includes zinc and one of the group consisting of vanadium and zirconium; in which the plating layer includes dendrite-shaped crystals including metallic zinc, and intercrystal filling regions which fill spaces between the dendrite-shaped crystals and show amorphous diffraction patterns when electron beam diffraction is carried out, in which when the plating layer includes the vanadium, the intercrystal filling regions include a hydrated vanadium oxide or a vanadium hydroxide, and, in which when the plating layer includes zirconium, the intercrystal filling regions include a hydrated zirconium oxide or a zirconium hydroxide. (2) In the surface-treated steel sheet according to (I), a constitution in which, when the plating layer includes the vanadium, V/Zn which is a molar ratio of the vanadium to the zinc in the intercrystal filling regions is 0.10 or more and 2.00 or less, and, in which when the plating layer includes the zirconium, Zr/Zn which is a molar ratio of the zirconium to the zinc in the intercrystal filling regions is 1.00 or more and 3.00 or less may be employed. - 5 - (3) In the surface-treated steel sheet according to (1) or (2), a constitution in which the plating layer includes the vanadium and surface layers of the dendriteshaped crystals include a zinc oxide or a zinc hydroxide may be employed. [0013] ( 4) The surface-treated steel sheet according to any one of (1) to (3) further includes a base-material plating layer having Zn!V, which is a molar ratio of the zinc to the vanadium, of 8.00 or more between the steel sheet and the plating layer. (5) The surface-treated steel sheet according to any one of(!) to (4), finther incluses an organic resin film having a polyurethane resin and 1% to 20% by mass of carbon black on a surface of the plating layer. ( 6) A method for manufacturing the surface-treated steel sheet according to the aspect of the present invention is a method for manufacturing the surface-treated steel sheet according to any one of(!) to (5), the method including: a base-materialforming process of forming protrusions and recesses by precipitating a hydrated vanadium oxide or a vanadium hydroxide on the steel sheet by carrying out an electroplating at a current density ofO to 18 A/dm2 using a plating bath containing 0.10 to 4.00 mol/1 ofZn2 + ions and 0.01 to 2.00 mol/1 ofVions or 0.10 to 4.00 mol/1 ofZr ions; and an upper layer plating process of carrying out an electroplating on the steel sheet on which the protrusions and the recesses are formed at a current density of 21 to 200 A/dm2 using the plating bath. [Effects of the Invention] [0014] According to the respective aspects, it is possible to provide a surface-treated steel sheet having an excellent barrier property and excellent coating film adhesion. " 6 " [Brief Description of the Drawings] [00 15] Fig. 1 is a schematic cross sectional view showing an example of a surfacetreated steel sheet according to a first embodiment. Fig. 2 is a schematic cross sectional view showing an example of a surfacetreated steel sheet according to a second embodiment. Fig. 3 is a schematic view showing an example of a plating apparatus that is used to manufacture the surface-treated steel sheet according to the present embodiment. Fig. 4A is a schematic view showing the precipitation of a vanadium compound in a process of manufacturing the surface-treated steel sheet shown in Fig. 1. Fig. 48 is a schematic view showing the growth of dendrite-shaped crystals in the process of manufacturing the surface-treated steel sheet shown in Fig. 1. Fig. 4C is a schematic view showing the generation of hydrogen at front ends of branch portions of the dendrite-shaped crystals in the process of manufacturing the surface-treated steel sheet shown in Fig. I. Fig. 5A is a cross sectional photograph of a plating layer in a surface-treated steel sheet of Example V4 captured in the entire thickness direction using a transmission electron microscope (TEM). Fig. 58 is an enlarged photograph of an interface portion between a steel sheet and a plating layer in the cross section of Fig. 5A. Fig. 5C is an enlarged photograph of dendrite-shaped crystals and peripheral portions thereof in the cross section of Fig. 5A. Fig. 6 is a scanning electron microscopic (SEM) photograph of the plating - 7 - .~, layer in the surface-treated steel sheet of Example V4. Fig. 7 is a scanning electron microscopic (SEM) photograph of a plating layer in a surface-treated steel sheet of Comparative Example x2. Fig. 8 is a photograph showing electron beam diffraction images of the plating layer in the surface-treated steel sheet of Example V4. Fig. 9 is a transmission electron microscopic (TEM) photograph of a plating layer in a surface-treated steel sheet of Example Z4. [Embodiments of the Invention] [0016] "First embodiment, surface-treated steel sheet I 0" Hereinafter, a surface-treated steel sheet 10 of a first embodiment when a plating layer contains vanadium will be described in detail with reference to the accompanying drawings. Fig. 1 is a schematic cross sectional view showing an example of the surfacetreated steel sheet I 0 according to the present embodiment. In the surface-treated steel sheet I 0 shown in Fig. I, a base-material layer 20, a plating layer 30, and a surface layer 40 are sequentially formed on each of both surfaces of the steel sheet 1 from the steel sheet 1 side. Fig. 1 shows only the base-material layer 20, the plating layer 30, and the surface layer 40 fanned on one surface (upper surface) side of the steel sheet 1 and does not show those on the other surface (lower surface) side. [0017] In the present embodiment, the steel sheet I having the plating layer 30 fanned on the surface is not particularly limited. For example, as the steel sheet I, any types of steel sheets such as an extremely low C-type (a ferrite-dominant structure) - 8 - I., steel sheet, an Al-k-type (a structure including pearlite in ferrite) steel sheet, a twophase structure-type (for example, a structure including martensite in ferrite or a structure including bainite in ferrite) steel sheet, a working-induced transformationtype (a structure including residual austenite in ferrite) steel sheet, or a fine ctystal-type (a ferrite-dominant structure) steel sheet may be used. [0018] The base-material layer 20 may be provided between the steel sheet I and the plating layer 30 as shown in Fig. I. The base-material layer 20 is provided as necessary in order to improve the adhesion between the steel sheet 1 and the plating layer 30. In the present embodiment, the base-material layer 20 which has a thickness of 1 to 300 nm and is made of crystals including nickel is preferably provided. [0019] As shown in Fig. I, the plating layer 30 has dendrite-shaped crystals 31 and intercrystal filling regions 32 which are disposed between the dendrite-shaped crystals 31 and shows amorphous diffraction patterns when electron beam diffraction is carried out. In the present invention, "being amorphous" means that, when electron beam diffraction is carried out on each layer in the cross sectional direction using a transmission electron microscope (TEM), diffraction patterns attributed to crystal structures are not obtained. [0020] The intercrystal filling region 32 includes a hydrated vanadium oxide or a vanadium hydroxide. The intercrystal filling region 32 preferably includes a vanadium hydroxide since the coating film adhesion is improved. In addition, the intercrystal filling region 32 preferably includes zinc. When - 9 - I., the interctystal filling region 32 includes zinc, the corrosion resistance improves. [0021] When the intercrystal filling region 32 includes a hydrated vanadium oxide or a vanadium hydroxide and zinc, the molar ratio (V/Zn) of vanadium to zinc in the intercrystal filling region 32 is preferably 0.10 or more and 2.00 or less. When the molar ratio (V /Zn) is in the above-described range, and the intercrystal filling regions show amorphous diffraction patterns when electron beam diffraction is carried out, excellent corrosion resistance (barrier property) and coating film adhesion can be obtained. When the molar ratio (V/Zn) of vanadium to zinc in the intercrystal filling region 32 is less than 0.1 0, there are cases in which amorphous diffraction patterns cannot be stably obtained, and the corrosion resistance deteriorates. On the other hand, when the molar ratio exceeds 2.00, the sacrificial protection property of platings deteriorates. [0022] As shown in Fig. 1, a plurality of the dendrite-shaped crystals 31 is formed in the plating layer 30. The shapes of the plurality of dendrite-shaped crystals 31 may be different from one another, or some of them may have the same shape. The shape of each of the dendrite-shaped crystals 3lmay be a needle shape or a rod shape. In addition, the respective dendrite-shaped crystals 31 may be ctystals which extend linearly in the length direction or extend in a curved manner. The cross sectional shapes of the respective dendrite-shaped crystals 31 are not particularly limited, and examples thereof include a circular shape, an elliptical shape, a polyhedral shape, and the like. In addition, the cross sectional shapes of the respective dendrite-shaped crystals 31 may be even or uneven in the length direction. In addition, the outer circumference dimensions of the respective dendrite-shaped crystals 31 may be even or - 10 - uneven in the length direction. [0023] In the surface-treated steel sheet 10 of the present embodiment, the respective dendrite-shaped crystals 31 have an inside 3a of the dendrite-shaped crystal and a surface layer 3b formed on the surface of the dendrite-shaped crystal31 as shown in Fig. I. The inside 3a of the dendrite-shaped crystal 31 grows from the steel sheet I side toward the outside and has a plurality of branch portions. The surface layer 3b is formed in a substantially uniform thickness so as to cover the surface of the inside 3a of the dendrite-shaped crystal 31. [0024] The dendrite-shaped crystal 31 having the inside 3a of the dendrite-shaped crystal 31 and the surface layer 3b which is shown in Fig. 1 preferably has a maximum length of 4.0 J.lm or less and a maximum cross sectional width of0.5 ~1111 or less. When the maximum length and the maximum width of the dendrite-shaped crystal 31 are in the above-described ranges, the plating layer 30 has fme dendrite-shaped crystals 31 and becomes dense. Therefore, the barrier action of the plating layer 30 improves and a superior barrier property can be obtained. In order to further improve the barrier property, the maximum length of the dendrite-shaped crystal 31 is more preferably 3.0 11m or less. In addition, the maximum cross sectional width of the dendrite-shaped crystal 31 is more preferably 0.4 ~1111 or less. [0025] In the present embodiment, "the maximum length of the dendrite-shaped crystal 31" is obtained by observing a cross section of the plating layer using a scanning electron microscope (SEM), measuring the maximum lengths of 50 dendriteshaped crystals 31, and computing the average value thereof. - 11 - In addition, "the maximum cross sectional width of the dendrite-shaped crystal31" is obtained by observing a cross section of the plating layer using a transmission electron microscope (TEM), measuring the maximum widths of 50 dendrite-shaped crystals 31, and computing the average value thereof. [0026] The inside 3a of the dendrite-shaped crystal31 preferably includes metallic zmc. In addition to the metallic zinc, the inside 3a of the dendrite-shaped crystal31 may include other metal components having a higher precipitation potential than zinc such as nickel. In addition, the surface layer 3b preferably includes crystals including a zinc oxide or a zinc hydroxide. The surface layer 3b more preferably includes the crystals of a zinc oxide. The thickness of the surface layer 3b is preferably 0.1 to 500 nm. [0027] In addition, as shown in Fig. I, the inside 3a of the dendrite-shaped crystal31 may include granular crystals 3c. The granular crystal 3c includes zinc and nickel. The grain diameters of the granular crystals 3c are preferably 0.1 to 500 nm. When the grain diameters of the granular crystals 3c are in the above-described range, superior coating film adhesion can be obtained. [0028] In the surface-treated steel sheet 10 of the present embodiment, Zn!V which is the molar ratio of zinc to vanadium included in the plating layer 30 is preferably 0.50 or more and less than 8.00. When Zn!V is 0.50 or more and less than 8.00, vanadium being included provides a superior barrier function, which is preferable. [0029] In the surface-treated steel sheet 10, a base-material plating layer (not shown) - 12 - containing zinc may be formed between the steel sheet 1 and the plating layer 30 (between the base-material layer 20 and the plating layer 30 when the base-material layer 20 is formed). This is because the base-material plating layer (not shown) being formed provides an excellent corrosion resistance improvement effect which is attributed to the sacrificial protection by zinc. The base-material plating layer (not shown) may include zinc and vanadium and may have Zn/V, which is the molar ratio of the zinc to the vanadium, of 8.00 or more. In addition, the base-material plating layer (not shown) may also be constituted of zinc alone. [0030] As an upper layer of the plating layer 30, an upper layer plating layer (not shown) containing zinc may be fom1ed. The upper layer plating layer (not shown) being formed provides an excellent corrosion resistance improvement effect which is attributed to the sacrificial protection by zinc, which is preferable. The upper layer plating layer (not shown) may also be constituted of zinc alone. h1 addition, the upper layer plating layer (not shown) includes zinc and vanadium and may have Zn/V, which is the molar ratio of the zinc to the vanadium, of 8.00 or more. [0031] The base-material plating layer (not shown) can be formed between the steel sheet I and the plating layer 30 (between the base-material layer 20 and the plating layer 30 when the base-material layer 20 is formed) by controlling the current density for electroplating and the adjusting the molar ratio of zinc to vanadium. The upper layer plating layer (not shown) can be formed on the plating layer 30 using the same method for the base-material plating layer (not shown). - 13 - [0032] The molar ratio (alb) of the amount of zinc (a) included in the insides 3a of the dendrite-shaped crystals 31 to the total of the amounts of zinc (b) included in the intercrystal filling regions 32 and the surface layers 3b of the dendrite-shaped crystals 31 is preferably in a range ofO.IO or more and 3.00 or less. When the molar ratio (alb) is 0.10 or more, the sacrificial protection action of the metallic zinc in the dendrite-shaped crystals 31 can be effectively obtained when flaws are generated on the surface of the plating layer 30, and a superior ban-ier property can be obtained. In order to more effectively obtain the sacrificial protection action of the metallic zinc in the dendrite-shaped crystals 3 I, the molar ratio (alb) is more preferably set to 0.20 or more. In addition, when the molar ratio (alb) is 3.00 or less, the barrier property improvement action of the steel sheet I which is attributed to the zinc oxide or the zinc hydroxide in the surface layers of the dendrite-shaped crystals 31 which does not easily transmit the air or water can be effectively obtained, and a superior barrier prope1ty can be obtained. In order to more effectively obtain the barrier property improvement action of the surface layers 3 b of the dendrite-shaped crystals 31, the mo Jar ratio (alb) is more preferably 0.25 or less. [0033] In addition, the molar ratio (NB) of the total (A) of the amount of zinc included in the dendrite-shaped crystals 3 I and the amount of zinc .included in the surface layers 3b of the dendrite-shaped crystals 31 to the amount of vanadium (B) included in the interc1ystal filling regions 32 is preferably 0.05 or more and 6.00 or less. When the molar ratio (NB) is 0.05 or more, the sacrificial protection action of the metallic zinc in the dendrite-shaped crystals 3 I and the barrier property -14 I., improvement action of the zinc oxide or the zinc hydroxide in the surface layers 3b of the dendrite-shaped crystals 31 are effectively obtained, and a superior barrier property can be obtained. In order to more effectively obtain the sacrificial protection action of the dendrite-shaped crystals 31 and the barrier property improvement action of the surface layers 3b of the dendrite-shaped crystals 31, the molar ratio (A/B) is more preferably 0.10 or more. In addition, when the molar ratio (AlB) is 6.00 or less, an effect of improving the barrier property by the corrosion potential set to a positive potential by containing vanadium is more effectively showed. In order to further improve the barrier property improvement action of vanadium being included, the molar ratio (A/B) is more preferably 5.00 or less and more preferably 4.50 or less. [0034] In the present embodiment, the amount of vanadium in the plating layer 30 is preferably 1% by mass to 20% by mass. When the amount of vanadium in the plating layer 30 is 1% by mass or more, a superior barrier property can be obtained. The amount of vanadium in the plating layer 30 is more preferably 4% by mass or more in order to further improve the barrier property and the coating film adhesion. When the amount of vanadium in the plating layer 30 is 20% by mass or less, the amount in the dendrite-shaped crystals 31 and the surface layers 3 b of the dendrite-shaped ctystals 31 become relatively great, and the sacrificial protection action of the dendrite-shaped crystals 3 I and the barrier property improvement action of the surface layers 3b of the dendrite-shaped crystals 31 can be effectively obtained. The amount of vanadium in the plating layer 30 is more preferably 15% by mass or less in order to ensure the amount in the dendrite-shaped crystals 3 I and the surface layers 3b of the dendrite-shaped crystals 31. - I5 - I ' [0035] The adhered amount of the plating layer 30 is preferably 1 g/m2 or more and more preferably 3 g/m2 or more in order to improve the barrier property. In addition, the adhered amount of the plating layer 30 is preferably 90 g/m2 or less, more preferably 50 g/m2 or less, and stillmore preferably 15 g/m2 or less. When the adhered amount of the plating layer 30 is 15 g/m2 or less, the amount of metal being precipitated is smaller compared with that in electrogalvanizing of the related art (generally, approximately 20 g/m2 ), and the adhered amount is economically excellent from the viewpoint of metal costs or electric power costs for forming the plating layer 30. [0036] In the surface-treated steel sheet 10 of the present embodiment, the natural immersion potential (corrosion potential) when the plating layer 30 is immersed in a 5% aqueous NaCI solution at 25°C as a working electrode is preferably -0.8 V or more. The corrosion potential is preferably 0.2 V or more higher (positive) than those of plated steel sheets (the corrosion potentials are approximately -1.0 V) formed by providing a galvanized layer instead ofthe plating layer 30. In order to further improve the barrier property, the corrosion potential is more preferably -0.7 V or more. [0037] As shown in Fig. 1, the surface layer 40 made of one or more films is formed on the surface of the plating layer 30. The surface layer 40 is provided as necessaty. The surface layer 40 being formed improves the corrosion resistance. One or more films fanning the surface layer 40 preferably c.ontain an organic resin (R). [0038] - 16 - The organic resin (R) in the film is not particularly limited, and examples thereof include polyurethane resins. As the organic resin (R) in the film, one or more organic resins (not modified) may be mixed and used, or one or more organic resins obtained by modifYing at least one organic resin in the presence of at least one different organic resin may be mixed and used. [0039] Examples of the polyurethane resin that is used as the organic resin (R) include resins obtained by reacting a polyol compound and a polyisocyanate compound and then elongating chains using a chain elongation agent. The pol yo! compound that is used as a raw material of the polyurethane resin is not particularly limited as long as the polyol compound has two or more hydroxyl groups per molecule, and examples thereof include ethylene glycol, propylene glycol, diethylene glycol, 1,6-hexanediol, neopentyl glycol, triethylene glycol, glycerin, trimethylolethane, trimethylolpropane, polycarbonate polyol, polyester polyol, polyether polyols such as bisphenol hydroxypropyl ether, polyesteramide polyol, aery! polyol, polyurethane polyol, and mixtures thereof. [0040] As the polyisocyanate compound that is used as a raw material of the polyurethane resin, compounds having two or more isocyanate groups per molecule are used, and examples thereof include aliphatic isocyanates such as hexamethylene diisocyanate (HOI), alicyclic diisocyanates such as isophorone isocyanate (IPDI), aromatic diisocyanates such as torylene diisocyanate (TDI), aromatic aliphatic diisocyanates such as diphenylmethane diisocyanate (MDI), and mixtures thereof. [0041] - 17 - I ' As the chain elongation agent that is used to manufacture the polyurethane resin, compounds having one or more active hydrogen atoms per in the molecule can be used, and examples thereof include aliphatic polyamines such as ethylenediamine, propylenediamine, hexamethylenedimnine, diethylenetriamine, dipropylenetriamine, triethylenetetramine, and tetraethylenepentamine, aromatic polyamines such as torylenediamine, xylylenedimaine, and diaminodiphenylmethane, alicyclic polyamines such as diaminocyclohxylmethane, pyperazine, 2,5-dimethylpyperazine, and isophorodiamine, hydrozines such as hydrazine, succinic dihydrazide, adipic dihydrazide, and phthalic dihydrazide, alkanoleamines such as hydroxyethyl diethylenetriamine, 2-[(2-aminoethyl)amino]ethanol and 3-aminopropanediol, and the like. These compounds that are used as the chain elongation agent can be used singly, or two or more compounds can be used as a mixture. [0042] In addition, the polyurethane resin that is used as the organic resin (R) may be a polyurethane resin obtained by heating a raw material solution including a blocked isocyanate compound and the polyol compound to a temperature at which a block agent is dissociated and reacting regenerated isocyanate groups and the polyol component of the polyol compound in the raw material solution. The blocked isocyanate compound is a compound that regenerates isocyanate groups when heated to a temperature or higher at which the block agent is dissociated. As the blocked isocyanate compound, it is possible to use, for example, compounds obtained by masking the isocyanate groups in the polyisocyante compound with a well-known block agent of the related art. As the block agent, it is possible to use, for example, dimethylpyrazole (DMP}, methyl ethyl ketone oxime, and the like. [0043] - 18 - I., One or more films forming the surface layer 40 preferably include, in addition to the organic resin (R), one or more raw materials selected from a phosphoric acid compound (P), an organic silicon compound (W), carbon black (C), a fluoro metal complex compound (F), and polyethylene wax (Q). [0044] The phosphoric acid compound (P) in the film is more preferably a compound that emits phosphate ions in the film. When the phosphoric acid compound (P) is a compound (P) that emits phosphate ions in the film, when a coating composition for forming the films during the formation of the films is brought into contact with the plating layer 30 or phosphate ions derived from the phosphoric acid compound are eluted fi:om the films after the fonnation of the films, the phosphoric acid compound (P) and a vanadium oxide present on the surface of the plating layer 30 react with each other, and a poorly-soluble phosphoric acid-vanadium-based film is formed on the surface of the plating layer 30. Therefore, the white rust resistance can be significantly improved. [0045] When the phosphoric acid compound (P) is a insoluble compound that does not emit phosphate ions in the environment, the phosphoric acid compound (P) in the film inhibits the migration of corrosion factors such as water and oxygen, and thus an excellent barrier property can be obtained. [0046] As the phosphoric acid compound (P) in the film, it is possible to use, for example, phosphoric acids such as orthophosphoric acid, metaphosphoric acid, pyrophosphoric acid, triphosphoric acid, and tetraphosphoric acid or ammonium dihydrogen phosphate. These phosphoric acid compounds (P) may be used singly, or - 19 - I . I two or more phosphoric acid compounds may be jointly used. [0047] The amount of the phosphoric acid compound (P) in the film is preferably 1% to 20% by mass, more preferably 6% to 18% by mass, and most preferably 10% to 15% by mass in terms of phosphate ions. When the concentration of phosphate ions in the film is 1% by mass or more, an excellent barrier property can be obtained. In addition, when the concentration of phosphate ions in the film is 20% by mass or less, the swelling of coating film caused by the elution of phosphoric acid can be prevented. [0048] When the phosphoric acid compound (P) is included in the film, a barrier layer (not shown) including vanadium in the plating layer 30 and the phosphoric acid compound in the films and having an excellent barrier property against corrosion factors (water, oxygen, and the like) is formed on the surface of the steel sheet I. As a result, compared with a case in which the surface layer 40 is not formed on the surface of the plating layer 30, the white rust resistance is excellent, and an effect of delaying the generation of red rust can be obtained, and thus the barrier property significantly improves. [0049] Examples of the organic silicon compound (W) in the film include hydrolysis condensates of silane coupling agents and the like. Examples of silane coupling agents that are used to generate the organic silicon compound (W) in the film include 3-glycidoxypropyl trimethoxysilane, 3- aminopropyl triethoxysilane. The silane coupling agents may be used singly or two or more silane coupling agents may be jointly used. [0050] - 20-.: The organic silicon compound (W) in the film is preferably a compound obtained from a reaction between a silane coupling agent (WI) containing an amino group and a silane coupling agent (W2) containing an epoxy group. In this case, dense films having a high crosslinking density are formed from a reaction between the amino group and the epoxy group and a reaction between alkoxysilyl groups that are respectively included in the silane coupling agent (Wl) and the silane coupling agent (W2) or partial hydrolysis products thereof. As a result, the barrier property, flaw resistance, and contamination resistance of the surface-treated steel sheet further 1m prove. [0051] Examples of the silane coupling agent (Wl) containing an amino group include 3-aminopropyltriethoxysilane. Examples of the silane coupling agent (W2) containing an epoxy group include 3-glycidoxypropyltrimethoxysilane. [0052] The molar ratio {(Wl)/(W2)} of the silane coupling agent (Wl) containing an amino group to the silane coupling agent (W2) containing an epoxy group is preferably 0.5 or more and 2.5 or less and more preferably 0. 7 or more and 1.6 or less. When the molar ratio { (Wl )I(W2)} is 0.5 or more, a sufficient film production property can be obtained, and thus the barrier property improves. In addition, when the molar ratio is 2.5 or less, a sufficient water resistance can be obtained, and thus an excellent barrier property can be obtained. [0053] The number-average molecular weight of the organic silicon compound (W) in the film is, for example, preferably I ,000 or more and I 0,000 or less and more preferably 2,000 or more and I 0,000 or less. When the number-average molecular - 21 - i " I weight of the organic silicon compound (W) is 1,000 or more, the film becomes excellent in tenns of the water resistance, and the alkali resistance and the barrier property become more favorable" On the other hand, when the number-average molecular weight of the organic silicon compound (W) is 10,000 or less, it is possible to stably dissolve or disperse the organic silicon compound (W) in aqueous media which contain water as a main component, and there are cases in which the storage stability degrades. [0054] As the method for measuring the number-average molecular weight of the organic silicon compound (W), direct measurement by means of time of flight mass spectrometry (TOF-MS) may be used, or conversion measurement by means of chromatography may be used. [0055] The mass ratio (RIW) of the organic resin (R) to the organic silicon compound (W) in the film is preferably 1.0 to 3.0. When R1W is 1.0 or more, cohesion failure does not easily occur in the film during working, and the working adhesion becomes favorable. In addition, when RIW is 3.0 or less, the effect of the inclusion of the organic silicon compound (W) can be sufficiently obtained, and films having high hardness can be obtained. [0056] The organic silicon compound (W) can be manufactured using, for example, a method in which the above-described silane coupling agent is dissolved or dispersed in water and is stirred at a predetennined temperature for a predetermined period of time, thereby obtaining hydrolysis condensates. [0057] - 22 - The film containing the organic silicon compound (W) can be formed by, for example, manufacturing an aqueous liquid or alcohol-based liquid containing the organic silicon compound (W) as a raw material ofthe coating composition for forming the film and applying and drying the coating composition including the liquid on the plating layer. The aqueous liquid or alcohol-based liquid containing the organic silicon compound (W) can be manufactured using, for example, a method in which the organic silicon compound such as the hydrolysis condensate of the silane coupling agent is dissolved or dispersed in water, thereby obtaining aqueous liquids, a method in which the organic silicon compound such as the hydrolysis condensate of the silane coupling agent is dissolved in an alcohol-based organic solvent such as methanol, ethanol, or isopropanol, thereby obtaining alcohol-based liquids, or the like. [0058] When the aqueous liquid or alcohol-based liquid containing the organic silicon compound (W) is manufactured, in addition to the organic silicon compound (W) and water or the alcohol-based organic solvent, acids, alkalis, organic solvents, surfactants, and the like may be added thereto in order to dissolve or disperse the silane coupling agent or the hydrolysis condensate thereof in the aqueous liquid or alcoholbased liquid. Particularly, the pH of the aqueous liquid or alcohol-based liquid is preferably adjusted to 3 to 6 by adding organic acids in addition to water or the alcohol-based organic solvent from the viewpoint of the storage stability ofthe aqueous liquid or alcohol-based liquid. [0059] The solid content concentration of the organic silicon compound (W) in the aqueous liquid or alcohol-based liquid of the organic silicon compound (W) is - 23 - preferably 25% by mass or less. When the solid content concentration of the organic silicon compound (W) is 25% by mass or less, the storage stability of the aqueous liquid or alcohol-based liquid becomes favorable. [0060] In the film, the carbon black (C) is preferably included as a coloring pigment. When the carbon black is included in the film, fine unevenness present on the surface of the plating layer is covered, a beautiful black external appearance is obtained, and excellent designability can be obtained. [0061] Examples of the carbon black (C) in the film include well-known carbon blacks such as furnace black, keljenblack, acetylene black, and channel black. In ·addition, as the carbon black (C) in the film, carbon black on which a well-known ozone treatment, plasma treatment, or liquid-phase oxidation treatment is carried out may be used. [0062] The particle diameters of the carbon black (C) in the film are not particularly limited as long as there are no problems with the dispersibility in the coating composition for forming the film, the qualities of coating films, and the coatability. When dispersed in water-based solvents, the carbon black coheres together in the process of dispersing the carbon black. Therefore, generally, it is difficult to disperse the carbon black in water-based solvents while maintaining the primary particle diameters. Therefore, the carbon black in the coating composition for forming the film is present in a form of secondary particles having larger particle diameters than the primary particle diameters. Therefore, the carbon black in the film fonned using the coating composition is, similar to those in the coating composition, present in a - 24 - form of secondary particles. [0063] As the carbon black that is used as the raw material of the film, for example, carbon black having primmy patiicle diameters of 10 11111 to 120 11111 can be used. When the designability and barrier prope1iy of the film are taken into account, the particle diameters of the carbon black in the film are preferably 10 nm to 50 nm. In order to secure the designability and barrier property of the film, the particle diameters of the carbon black in a form of secondary particles which is dispersed in the film are impmiant. The average particle diameter of the carbon black in the film is preferably 20 nm to 300 nm. [0064] The amount of the carbon black (C) in the film is, for example, preferably 1% to 20% by mass, more preferably 3% to 15% by mass, and most preferably set to 5% to 13% by mass. When the amount of the carbon black (C) in the film is I% by mass or more, an even black external appearance can be obtained. In addition, when the amount of the carbon black (C) in the film is 20% by mass or less, it is possible to ensure the amount of raw materials other than the carbon black (C) in the film, and thus an excellent barrier property can be obtained. [0065] In the film, the fluoro metal complex compound (F) may be included. The fluoro metal complex compound (F) acts as a cross linking agent in the film and improves the cohesive force of the film. The fluoro metal complex compound (F) is not particularly limited, and a fluoro metal complex compound having titanium is preferably used fi·om the viewpoint of the barrier prope1iy. Examples of the fluoro metal complex compound (F) include hexafluorotitanic acid. - 25 - [0066] In the film, the polyethylene wax (Q) may be included. The polyethylene wax (Q) is capable of improving the flaw resistance of the film. Therefore, when the polyethylene wax (Q) is included in the film, the lubricity of the surface-treated steel sheet enhances, the friction resistance attributed to the contact between, for example, the steel sheet and a press die decreases, and it is possible to prevent damages in worked portions of the steel sheet and scratches being generated during the handling of the steel sheet. [0067] The polyethylene wax (Q) in the film is not particularly limited, and wellknown lubricants can be used. Specifically, as the polyethylene wax (Q), polyolefin resin-based lubricants are preferably used. [0068] The polyolefin resin-based lubricants that are used as the polyethylene wax (Q) are not particularly limited, and examples thereof include hydrocarbon-based wax such as polyethylene. [0069] The amount of the polyethylene wax (Q) in the fihn is preferably 0.5% by mass or more and 10% by mass or less and more preferably 1% by mass or more and 5% by mass or less in the film. When the amount ofthe polyethylene wax (Q) is 0.5% by mass or more, a flaw resistance improvement effect can be obtained. When the amount of the polyethylene wax (Q) is 10% by mass or less, it is possible to ensure the amount of raw materials other than the polyethylene wax (Q) in the film, and thus an excellent barrier property can be obtained. [0070] - 26 - "Method for manufacturing surface-treated steel sheet 1 0" Next, a method for manufacturing the surface-treated steel sheet I 0 will be described. A method for manufacturing the surface-treated steel sheet of the present embodiment includes a base-material-forming process of fom1ing protrusions and recesses by precipitating a hydrated vanadium oxide or a vanadium hydroxide on the steel sheet I by carrying out an electroplating at a current density ofO to 18 A/dnl using a plating bath containing 0.10 to 4.00 mol/1 ofZr2 + ions and 0.01 to 2.00 moll! of V ions or 0.10 to 4.00 mol/! ofZr ions and an upper layer plating process of carrying out an electroplating on the steel sheet 1 on which the protrusions and the recesses are formed at a current density of21 to 200 A/dnl using the plating bath. The abovedescribed base-material-forming process is a factor that affects V/Zn which is the molar ratio of the vanadium to the zinc in the above-described intercrystal filling regions in the plating layer. When the current density in the base-material-forming process exceeds 18 A/dm2 , V/Zn which is the molar ratio of vanadium to zinc in the intercrystal filling regions reaches less than 0.10. [0071] In the present embodiment, a pretreatment is carried out on both surfaces of the steel sheet 1 forming the plating layer 30 as necessary. As the pretreatment, it is preferable to provide I to 300 nm-thick nickel platings on both surfaces of the steel sheet 1 and fonn the base-material layers 20. Next, the plating layer 30 is formed on one surface or both surfaces of the steel sheet I. The present embodiment will be described using a method in which the plating layers 30 are formed on both surfaces of the steel sheet I by means of electroplating using a plating apparatus shown in Fig. 3 as an example. :: 27 [0072] Fig. 3 is a schematic view showing an example of the plating apparatus. In the present embodiment, out of rolls 4a, 4b, 5a, and 5b, the rolls 4a and 4b disposed above the steel sheet 1 function as connection portions (conductors) that electrically connect a power supply (not shown) and the steel sheet I. The steel sheet I is electrically connected to the rolls 4a and 4b and acts as a negative electrode. When electroplating is carried out, a plurality of the plating apparatuses shown in Fig. 3 is arranged in series and used. The base-material-forming process is carried out in the plating apparatus shown in Fig. 3 or in a region surrounded by the rolls 4a and Sa and the intennediate branching paths 2d and 2fin Fig. 3. In addition, the upper layer plating process is carried out in the plating apparatus shown in Fig. 3 or in a region surrounded by the intem1ediate branching paths 2d and 2f and the rolls 4b and 5b in Fig. 3. [0073] A plating tank 21 has an upper portion tank 21 a disposed above the steel sheet 1 and a lower portion tank 21b disposed below the steel sheet I. As shown in Fig. 3, at locations adjacent to the steel sheet I in the upper portion tank 21 a and the lower portion tank 2lb, a plurality of positive electrodes 3 made of platinum or the like is disposed at predetermined intervals from the steel sheet I. The respective positive electrodes 3 are disposed so that the surfaces of the positive electrodes facing the steel sheet I become substantially parallel to the surface of the steel sheet I. The respective positive electrodes 3 are electrically connected to the power supply (not shown) using non-shown connection members. [0074] The upper portion tank 2la and the lower portion tank 21 bare filled with a - 28 - plating bath 2. As shown in Fig. 3, the steel sheet I migrating with the surface direction set to be substantially horizontal is disposed between the upper portion tank 21a and the lower portion tank 2lb of the plating tank 21. In addition, the steel sheet 1 being passed through the plating tank 21 in an arrow direction using the rolls 4a, 4b, Sa, and Sb is in a state of being immersed in the plating bath 2 in the upper portion tank 21a and the lower portion tank 2lb. Therefore, in the present embodiment, the steel sheet I is transported using the rolls 4a, 4b, Sa, and Sb, and the steel sheet 1 is migrated in the plating bath 2, whereby the plating bath 2 falls into a fluid state in which the plating bath 2 is relatively fluid with respect to the steel sheet 1. [007S] As shown in Fig. 3, in the upper portion tank 21a, an upper portion supply pipe 2a that supplies the plating bath 2 to the upper portion tank 21a is provided so as to penetrate through the upper surface of the upper portion tank 21a. The upper portion supply pipe 2a is branched into a plurality of outer circumferential branching paths 2c and the plurality of intermediate branching paths 2d (only one path is shown in Fig. 3) in the upper portion tank 21a. The plurality of intermediate branching paths 2d is disposed along the width direction of the steel sheet I between the positive electrodes 3 adjacent to each other in a plan view. The intermediate branching path 2d includes an opening portion that supplies the plating bath 2 toward between the positive electrodes 3 on both sides and the steel sheet 1. The plurality of outer circumferential branching paths 2c is disposed along the width direction of the steel sheet 1 between the positive electrode 3 and the rolls 4a and 4b in a plan view. The outer circumferential branching path 2c includes an opening portion that supplies the plating bath 2 toward between the positive electrode 3 and the steel sheet I. [0076] - 29 - In the upper portion tank 2la, a discharge opening (not shown) that discharges the plating bath 2 is provided and is connected to the upper portion supply pipe 2a through a pipe including a pump (not shown). Therefore, in the upper portion tank 2la, the plating bath 2 which has been supplied from the upper portion supply pipe 2a and been discharged from the discharging opening turns into the plating bath 2 in a fluid state in which the plating bath is again supplied from the upper portion supply pipe 2a through the pipe using the pump and is circulated. [0077] In the lower portion tank 2lb, a lower portion supply pipe 2b that supplies the plating bath 2 to the lower portion tank 2lb is provided so as to penetrate through the lower surface of the lower portion tank 21b. The lower portion supply pipe 2b is branched into a plurality of outer circumferential branching paths 2e and the plurality of intennediate branching paths 2f (only one path is shown in Fig. 3) in the lower portion tank 21 b. The plurality of intermediate branching paths 2f is disposed along the width direction of the steel sheet 1 between the positive electrodes 3 adjacent to each other in a plan view. The intermediate branching path 2f includes an opening portion that supplies the plating bath 2 toward between the positive electrodes 3 on both sides and the steel sheet I. The plurality of outer circumferential branching paths 2e is disposed along the width direction of the steel sheet 1 between the positive electrode 3 and the rolls Sa and 5b in a plan view. The outer circumferential branching path 2e includes an opening portion that supplies the plating bath 2 toward between the positive electrode 3 and the steel sheet 1. [0078] In the lower portion tank 21 b, a discharge opening (not shown) that discharges the plating bath 2 is provided and is connected to the lower portion supply pipe 2b - 30 - through a pipe including a pump (not shown). Therefore, in the lower portion tank 21 b, the plating bath 2 which has been supplied from the lower portion supply pipe 2b and been discharged from the discharging opening turns into the plating bath 2 in a fluid state in which the plating bath is again supplied from the lower portion supply pipe 2b through the pipe using the pump and is circulated. [0079] When the electric conduction time in the base-material-forming process is adjusted to O.OS seconds to 8.00 seconds, the intercrystal filling regions 32 stably show amorphous diffraction patterns. [0080] In the present embodiment, it is assumed that the plating layer 30 is formed on the surface of the steel sheet I. through a mechanism described below. Fig. 4A to Fig. 4C are schematic views showing the state of the surface of the steel sheet I in the process of manufacturing the surface-treated steel sheet 10 shown in Fig. 1. In the plating apparatus shown in Fig. 3, the steel sheet I having a nickel plating layer (base-material layer) 20a formed on the surface sequentially comes into contact with the plating bath 2 from a portion that has passed through between the rolls 4a and Sa, and plating is initiated at a current density of 18 A/dm2 or less. That is, the rolls 4a and Sa are rolls for electric conduction and are also referred to as conductor rolls. The steel sheet and a plating liquid come into contact with each other after passing through between these conductor rolls 4a and Sa. [0081] In the present embodiment, on the surface (solid-liquid interface) of the steel sheet I on which the nickel plating layer 20a is formed which has passed through the rolls 4a and Sa, before the precipitation of zinc, a vanadium compound 6 including a - 31 - hydrated vanadium oxide or a vanadium hydroxide is precipitated as shown in Fig. 4A, and the base-material-forming process in which protrusions and recesses are fom1ed is initiated. This is assumed to be because, at the current density of 18 A/dm2 or less, vanadium having a high precipitation potential is reduced and precipitated, but zinc having a low precipitation potential is not precipitated. Meanwhile, in the basematerial- fanning process, the vanadium compound 6 including a hydrated vanadium oxide or a vanadium hydroxide is precipitated. This base-material is different from the above-described base-material layer 20. This base-material is incorporated into the plating layer 30 in the end. [0082] In the base-material-fonning process, when the precipitation of the vanadium compound 6 on the surface of the steel sheet 1 is initiated, a plurality of currentconcentrating portions 61 is formed on the surface of the steel sheet 1 as shown in Fig. 4A The current-concentrating portions 61 can be assumed as portions which are made of portions in which the vanadium compound 6 is not or slightly precipitated on the surface of the steel sheet 1 and allow electric currents to easily flow. [0083] When the current density is set to 21 A/dm2 or more, the potential reaches the precipitation potential ofZn, and the reduction and precipitation reaction of zinc is initiated. The current-concentrating portions 61 act as the starting points, as shown in Fig. 4B, the dendrite-shaped crystals 3a including metallic zinc grow, and the upper layer plating process is initiated. When the dendrite-shaped crystals 3a grow, it is assumed that it becomes easier for the crystals to grow at the front end sections of the dendrite-shaped crystals 3a. - 32 - [0084] In the upper portion plating process, electric currents further concentrate at the front ends of a plurality of branching portions branched from the dendrite-shaped crystals 3a as the dendrite-shaped crystals 3a grow, and, as shown in Fig. 4C, it is assumed that hydrogen 62 is generated at the solid-liquid interfaces between the front ends of the branching portions and the plating bath 2. [0085] The hydrogen 62 generated in the above-described mrumer increases the pH of the solid-liquid interfaces between the surfaces of the dendrite-shaped crystals 3a and the plating bath 2. As a result, it is assumed that crystals including a zinc oxide or a zinc hydroxide are precipitated so as to cover the surfaces of the dendrite-shaped crystals 31 and the dendrite-shaped crystals 31 having the surface layer 3b shown in Fig. I are fonned. In addition, it is assumed that, as the pH of the plating bath 2 increases, amorphous substances including a hydrated vanadium oxide or a vanadium hydroxide are precipitated between the dendrite-shaped crystals 3 I adjacent to each other, and the intercrystal filling regions 32 shown in Fig. 1 are formed. [0086] In the present embodiment, as described above, in the base-material-forming process, the electric conduction time is controlled to a range of 0.05 to 8.00 seconds. Therefore, before the precipitation of zinc on the surface of the steel sheet I, the precipitation of the vanadium compound 6 is initiated, and the plurality of currentconcentrating pmtions 61 is formed on the surface of the steel sheet I. As a result, it is assumed that, through the above-described mechanism, the dendrite-shaped crystals 31 are obtained, and the intercrystal filling regions 32 showing amorphous diffraction patterns when electron beam diffraction is carried out are obtained. The migration - 3J - time of the steel sheet 1 passing through the interval Dis more preferably in a range of 1.00 to 6.00 seconds. [0087] When the electric conduction time in the base-material-forming process is shorter than 0.05 seconds, the precipitation amount ofthe vanadium compound 6 precipitated before the precipitation of zinc on the surface of the steel sheet I is insufficient. Therefore, it becomes difficult for the dendrite-shaped crystals 3 I made of metallic zinc to grow in the current -concentrating pmtions 6 I formed on the surface of the steel sheet I. In addition, the intercrystal filling regions 32 including a hydrated vanadium oxide or a vanadium hydroxide are not obtained or the amorphous diffraction patterns become unstable even when the interc1ystal filling regions 32 are obtained. When the electric conduction time in the base-material-forming process exceeds 8.00 seconds, the precipitation amount of the vanadium compound 6 precipitated before the precipitation of zinc on the surface of the steel sheet I becomes too great, and thus the number of the current -concentrating portions 61 formed on the surface of the steel sheet 1 becomes smaller or zero. Therefore, it becomes difficult for the dendrite-shaped crystals 3 I made of metallic zinc to grow, and the dendriteshaped crystals 31 and the intercrystal filling regions 32 are not obtained or the amorphous diffraction patterns become unstable even when the intercrystal filling regions 32 are obtained. [0088] In the present embodiment, in the base-material-forming process, electroplating is preferably carried out under a condition in which the current density reaches 0 to 18 A/dm2 , and electroplating is more preferably carried out under a - 34 - i I condition in which the current density reaches 2 to 15 Ndm2 • When the current density is set to 18 Ndm2 or less in the base-material-forming process, the molar ratio (V/Zn) of vanadium to zinc in the intercrystal filling regions 32 reaches 0.10 or more and 2.00 or less, the intercrystal filling regions 32 show amorphous diffi"action patterns when electron beam diffi"action is carried out, and consequently, the barrier property and the coating film adhesion can be improved. On the other hand, when the current density is not in the above-described range in the base-material-forming process, the intercrystal filling regions 32 are not formed or the amorphous diffiaction patterns become unstable even when the intercrystal filling regions 32 are obtained. In addition, in the upper layer plating process, electroplating is preferably carried out under conditions in which the current density reaches 21 to 200 Ndm2 • When the current density is set to 21 Ndm2 or more, it is possible to sufficiently generate the hydrogen 62 in the solid-liquid interfaces between the front ends of the branching portions of the dendrite-shaped crystals 31 and the plating bath 2. Therefore, the precipitation amount ofthe hydrated vanadium oxide or the vanadium hydroxide in the intercrystal filling regions 32 increases. Therefore, it is possible to fonn the plating layer 30 in which the amount of vanadium is great and the barrier properties are excellent. In addition, when the current density exceeds 200 Ndm2 , plating structures become coarse or cracks are likely to be generated, and thus there is a concern that the adhesion between the plating layer 30 and the steel sheet I may degrade. [0089] The average flow rate of the plating bath 2 in the plating tank 21 during plating is preferably in a range of20 to 300m/min and more preferably in a range of 40 to 200m/min. When the average flow rate of the plating bath 2 is in a range of20 - 35 - to 300m/min, it is possible to prevent the generation of cracks in the plating layer 30 and supply ions to the surface of the steel sheet I from the plating bath 2 without any hindrance. [0090] As the plating bath 2, a plating bath including a V compound and a Zn compound is used. Meanwhile, to the plating bath 2, in addition to the V compound and the Zn compound, a pH adjuster, metal compounds other than the V compound and the Zn compound, and additives may be added as necessary. Examples of the pH adjuster include H2S04, NaOH, and the like. Examples of the additives include Na2S04 and the like which stabilize the electric conductivity of the plating bath 2. [0091] Examples of other metal compounds include nickel compounds such as NiS04 · 6H20 and the like. When the plating bath 2 includes a nickel compound, the concentration orNe+ in the plating bath 2 is preferably O.Olmol/1 or more. ln such a case, the plating layer 30 including a sufficient amount of nickel can be formed. The plating layer 30 including nickel is capable of providing excellent plating adhesion, which is preferable. [0092] Examples of the Zn compound that is used in the plating bath 2 include metallic Zn, ZnS04·?H20, ZnC03, and the like. These Zn compounds may be used singly or two or more zinc compounds may be jointly used. In addition, examples of the V compound that is used in the plating bath 2 include ammonium (V) metavanadate, potassium (V) metavanadate, sodium (V) metavanadate, VO(CsH102)2 (vanadyl acetylacetonate (IV)), VOS04·SH20 (vanadyl - 36 - sulfate (IV)), and the like. These V compounds may be used singly or two or more vanadium compounds may be jointly used. [0093] As the plating bath 2, a plating bath including Zn2+ and V02+ is preferably used. When the plating bath 2 includes Zn2+, the concentration of Zn2+ is preferably 0.10 to 4.00 mol/! and more preferably 0.35 to 2.00 mol/!. When the plating bath 2 includes V02+, the concentration ofV02+ in the plating bath 2 is preferably O.Olmol/1 or more and less than 2.00 mol/!. When the plating bath 2 including V02+ in the above-described range is used, it is possible to easily form the plating layer 30 in which the amount of vanadium is great and the barrier property is excellent. When the amount ofV02+ in the plating bath 2 is below the above-described range, it becomes difficult to ensure the amount of vanadium in the plating layer 30. In addition, when the amount ofV02+ in the plating bath 2 is above the above-described range, a large amount of expensive vanadium is used in the plating bath 2, which becomes economically disadvantageous. [0094] In addition, as the plating bath 2, a plating bath including 0.10 mol/! or more ofNa +in the plating bath 2 is preferably used. In this case, it is possible to enhance the electric conductivity of the plating bath 2 and easily form the plating layer 30 in the present embodiment. [0095] The temperature of the plating bath 2 is not particularly limited, but is preferably in a range of 40°C to 60°C in order to easily and efficiently form the plating layer 30 in the present embodiment. - 37 - In addition, the pH of the plating bath 2 is preferably in a range of 1 to 5 and more preferably in a range of I .5 to 4 in order to easily form the plating layer 30 in the present embodiment. [0096] In the present embodiment, after the formation ofthe plating layer 30, the surface layer 40 is preferably formed on the plating layer 30 as necessary by applying a treatment agent that improves a barrier property, fingerprint resistance, flaw resistance, lubricity, designability, and the like. Through the above-described process, the surface-treated steel sheet 10 shown in Fig. I can be obtained. [0097] "Second embodiment, surface-treated steel sheet 21 0" Hereinafter, a surface-treated steel sheet 2 I 0 of a second embodiment when a plating layer 230 contains zirconium will be described. The surface-treated steel sheet 210 of the present embodiment includes a steel sheet 201 and a plating layer 230 formed on one surface or both surfaces of the steel sheet. The plating layer 230 includes zinc and zirconium. In addition, the plating layer 230 has dendrite-shaped ctystals 23 I including metallic zinc and intercrystal filling regions 232 including one or both of a hydrated zirconium oxide and a zirconium hydroxide. Hereinafter, the surface-treated steel sheet 210 will be described in detail. [0098] The steel sheet 201 is the same as the steel sheet 1 in the first embodiment and thus will not be described. [0099] " 38 " i I As described above, the plating layer 230 has the dendrite-shaped crystals 231 including metallic zinc and the intercrystal filling regions 232 including one or both of a hydrated zirconium oxide and a zirconium hydroxide. The dendrite-shaped ctystal 231 is a dendrite-shaped crystal phase including metallic zinc, and the intercrystal filling region 232 includes one or both of a hydrated zirconium oxide and a zirconium hydroxide, is formed in the peripheries of the dendrite-shaped crystal 231, and has an amorphous pattern in electron beam diffraction. The plating layer 230 has an aspect in which the dendrite-shaped crystals 231 are precipitated earlier, and then the intercrystal filling regions 232 are precipitated in the peripheries of the dendrite-shaped crystals 231. [0100] As described above, the dendrite-shaped crystal 31 in the first embodiment has the inside 3a and the surface layer 3b. As described above, the inside 3a of the dendrite-shaped crystal 31 preferably includes metallic zinc and may include other metal components such as nickel. On the other hand, the surface layer 3b of the dendrite-shaped ctystal 31 preferably includes a zinc oxide or a zinc hydroxide and more preferably include crystals of a hydrated zinc oxide. Meanwhile, the dendriteshaped crystal 231 in the present embodiment does not have any insides and any surface layers. The dendrite-shaped crystal 231 may be formed of metallic zinc alone and may include, in addition to metallic zinc, other metal components having a higher precipitation potential than zinc such as nickel. In addition, the dendrite-shaped crystals 231 grow from the steel sheet 201 side toward the plating layer 230 surface side along the thickness direction of the plating layer 230 and have a structure of being branched toward the surface of the plating layer 230. When the dendrite-shaped - 39 ij crystals 231 include metallic zinc, it is possible to impart a sacrificial protection property to the plating layer 230. [0101] The intercrystal filling region 232 may include a zinc oxide in addition to one or both of the hydrated zirconium oxide and the zirconium hydroxide. When the intercrystal filling regions 232 include the above-described substances, it is possible to impart a barrier property to the plating layer 230. In addition, since the intercrystal filling regions 232 include the hydrated oxide or the hydroxide as a main body, it is possible to ensure coating film adhesion when coating films are formed in the intercrystal filling regions 232. The intercrystal filling regions 232 show amorphous diffraction patterns when electron beam diffraction is carried out. [0102] When the intercrystal filling region 232 includes the hydrated zirconium oxide or the zirconium hydroxide and a zinc oxide, the molar ratio (Zr/Zn) of zirconium to zinc in the intercrystal filling regions 232 is preferably 1.00 or more and 3.00 or less. When the molar ratio (Zr/Zn) is in the above-described range, and the intercrystal filling regions 232 show amorphous diffraction patterns when electron beam diffi·action is carried out, arr excellent corrosion resistarrce (barrier property) and excellent coating film adhesion can be obtained. [0103] On the plating layer 230, an amorphous layer 250 showing amorphous diffraction patterns when electron beam diffraction is carried out may be formed. The amorphous layer 250 is assumed to be a layer that is first formed during the formation of the plating layer 230. That is, it is assumed that the amorphous layer - 40 - 250 is first formed on the steel sheet 201 and then the plating layer 230 including the dendrite-shaped crystals 231 and the intercrystal filling regions 232 grows between the steel sheet 201 and the amorphous layer 250. [0104] The amorphous layer 250 is a layer including zirconium oxide as a main body and may include a small amount of zinc. The amorphous layer 250 shows a barrier property when formed on the plating layer 230. [0105] After the formation of the plating layer 230, the steel sheet 201 having the plating layer 230 is immersed in an acidic solution, whereby the amorphous layer 250 can be removed. Through the above-described process, the amorphous layer 250 may be removed from the surface-treated steel sheet 20 I. When the amorphous layer 250 is removed, the plating layer 230 is exposed. The surface of the plating layer 230 has a higher surface roughness than the amorphous layer 250 and superior coating film adhesion compared with a case in which the amorphous layer 250 is formed. [0106] The adhered amount of the plating layer 230 is preferably I g/m2 or more and preferably 3 gjm2 or more in order to improve the barrier property. In addition, the adhered amount of the plating layer 230 is preferably 60 gjm2 or less, more preferably 40 gjm2 or less, and stillmore preferably 20 gjm2 or less. When the adhered amount of the plating layer 230 is 20 gjm2 or less, the amount of metal being precipitated is smaller compared with that in electrogalvanizing of the related art (generally, approximately 20 g/m2 ). In addition, when the adhered amount is too large, it becomes easy for cracks to be generated in the plating layer 230. - 41 - [0107] The thickness of the plating layer 230 is preferably in a range of0.5 to 40 fUll, more preferably in a range of 1.0 to 20 fllll, and still more preferably in a range of 2.0 to 15 fUll. When the thickness of the plating layer 230 is the lower limit or more, the barrier property can be improved. In addition, when the thickness of the plating layer 230 is the upper limit or less, it becomes difficult for cracks to be generated in the plating layer 230. The thickness of the plating layer 230 can be controlled by adjusting the amount of electric power that is conducted dnring electroplating. [0108] The thickness of the amorphous layer 250 is preferably in a range of0.20 to 2.00 f!m, more preferably in a range of0.30 to 1.50 f!m, and still more preferably in a range of0.50 to LOO f!m. When the thickness of the amorphous layer 250 is the upper limit or more, it is possible to impart the barrier property to the plating layer 230. In addition, when the thickness of the amorphous layer 250 is the lower limit or less, it is possible to ensnre the barrier property by preventing the generation of cracks. The thickness of the amorphous layer 250 can be controlled by adjusting the concentration ofZr in the plating bath during electroplating. That is, as the concentration ofZr in the plating bath during electroplating increases, it is possible to increase the thickness of the amorphous layer 250. [0109] The plating layer 230 is made of, in terms of the average concentration, Zr: 3 to 40 atm%, Zn: 3 to 40 atm%, residual oxygen, and impurities. When the concentration ofZr in the plating layer 230 is 3 atm% or more, it is possible to enhance the barrier property. In addition, when the concentration of Zr in the plating layer 230 is 40 atm% or less, it is possible to ensure the barrier property by preventing the - 42 - generation of cracks in the plating layer 230. In addition, when the concentration of Zn in the plating layer 230 is 3 atm% or more, it is possible to impart a sacrificial protection effect to the plating layer 230. In addition, when the concentration of Zn in the plating layer 230 is 40 atm% or less, it is possible to relatively ensure the amount ofZr and improve the barrier property of the plating layer 230. [0 II 0] The dendrite-shaped crystal 231 includes metallic Zn as described above and may additionally include Ni and the like. For the dendrite-shaped crystals 231, diffraction patterns attributed to the crystal structures can be obtained when electron beam diffraction is carried out on a cross section of the plating layer 230 using a transmission electron microscope (TEM). [Olll] The intercrystal filling region 232 is made of, in terms of the average concentration, Zr: 10 to 80 atm%, Zn: 3 to 40 atm%, residual oxygen, and impurities. When the concentration of Zr in the intercrystal filling region 232 is 10 atm% or more, it is possible to enhance the barrier property. In addition, when the concentration of Zr in the intercrystal filling region 232 is 80 atm% or less, it is possible to ensure the barrier property by preventing the generation of cracks in the plating layer 230. In addition, when the concentration of Zn in the intercrystal filling region 232 is 3 atm% or more, it is possible to enhance the barrier property. In addition, when the concentration of Zn in the intercrystal filling region 232 is 40 atm% or less, it is possible to relatively ensure the amount ofZr and improve the barrier property of the plating layer 230. [0112] The amorphous layer 250 is made of, in terms of the average concentration, - 43 - Zr: 10 to 60 atm%, Zn: 0 to 15 atm%, residual oxygen, and impurities. When the concentration ofZr in the amorphous layer 250 is 10 atm% or more, it is possible to enhance the barrier property. In addition, when the concentration of Zr in the amorphous layer 250 is 60 atm% or less, it is possible to ensure the barrier property by preventing the generation of cracks. The amorphous layer 250 may include a small amount of Zn or no Zn. [0113] Similar to the first embodiment, a base-material layer 220 may be formed between the steel sheet 201 and the plating layer 230. [0114] Similar to the first embodiment, a surface layer 240 may be formed on the plating layer 230 (the amorphous layer 250 when the amorphous layer 250 is formed). [0115] The surface-treated steel sheet 210 of the present embodiment has an L * value, which represent the brightness, of 40 or less and has a black external appearance. The black external appearance makes the surface-treated steel sheet available in a variety of fields. When the L *value exceeds 40, it is difficult to use the steel sheet as a material having a black external appearance. Particularly, when the concentration of Zr in the plating layer 230 is set to 5% by mass or more, it is possible to reliably set to the L * value to 40 or less. [0116] In addition, regarding the surface-treated steel sheet 210 of the present embodiment, an example in which the plating layer 230 is formed on the steel sheet 20 I has been described, but the present embodiment is not limited thereto, and the plating layer 230 in the present embodiment may be formed on galvanized layers in -44 - electro galvanized steel sheets, hot -dip galvanized steel sheets, and galvannealed steel sheets. That is, a second galvanized layer (not shown) containing zinc may be further formed between the steel sheet 201 and the plating layer 230. When the second galvanized layer (not shown) is further formed, the corrosion resistance of the surfacetreated steel sheet 210 can be further improved. For example, even when corrosive substances pass through the plating layer 230, a sacrificial protection effect can be sho wed due to the second galvanized layer (not shown), and the corrosion resistance of the surface-treated steel sheet 210 can be improved. [0117] "Method for manufacturing surface-treated steel sheet 21 0" Next, a method for manufacturing the surface-treated steel sheet 210 will be described. The method for manufacturing the surface-treated steel sheet 210 and the method for manufacturing the surface-treated steel sheet I according to the first embodiment are different from each other only in terms of the composition of the plating bath and are the same as each other in terms of the other facts. [0118] Similar to the first embodiment, the method for manufacturing the surfacetreated steel sheet 210 has the base-material-forming process and the upper layer plating process. In the base-material-forming process and the upper layer plating process, the same plating bath is used, and a plating bath including a Zr compound (Zr02l and a Zn compound (Zn2l is used. The Zr compound is preferably a compound that forms Zr02 + ions in the plating bath, and examples thereof include soluble salts such as zirconium nitrate oxide, zirconium sulfate oxide, and zirconium nitrate chloride oxide. These Zr compounds may be used singly or two or more Zr compounds may be jointly used. - 45 - I I [0119] The plating bath preferably includes 0.10 to 4.00 moll! of Zn2 + and more preferably includes 0.50 to 2.00 moll! of Zn2+ In addition, the plating bath preferably includes 0.10 to 4.00 mol/! ofZr02+ and more preferably includes 0.50 to 2.00 moll! of Zr02+. When a plating bath including Zr02+ in the above-described range is used, it is possible to easily form the plating layer 230 having a high amount ofZr and an excellent barrier property. When the amount of Zr02 + in the plating bath is below the above-described range, it becomes difficult to ensure the amount of Zr in the plating layer 230. In addition, when the amount of Zr02+ in the plating bath is above the above-described range, a large amount of Zr is used in the plating bath 2, which becomes economically disadvantageous. [0120] To the plating bath, in addition to the Zr compound and the Zn compound, a pH adjuster, metal compounds other than the Zr compound and the Zn compound, additives, and the like may be added as necessary. [0121] The current densities in the base-material-forming process and the upper layer plating process are the same as those in the first embodiment and thus will not be described. [0122] "Other examples" The present invention is not limited to the above-described embodiments. The present embodiment has been described using a case in which the plating layers are fonned on both surfaces of the steel sheet as an example, but the plating layer may be formed only on one surface of the steel sheet. - 46 - I I In addition, it is preferable that the base-material layer is formed between the steel sheet and the plating layer, but the base-material layer may not be formed. In addition, when the plating layers are formed on both surfaces of the steel sheet, the base-material layer may be formed only between one surface of the steel sheet and the plating layer. [0123] In the present embodiment, a case in which the plating layer includes vanadium and a case in which the plating layer includes zirconium have been separately described, but these embodiments may be included at the same time. [0124] In addition, the present embodiment has been described using a case in which the surface layer is fanned on the surface of the plating layer as an example, but the surface layer may not be fanned. The surface-treated steel sheet of the present embodiment has an excellent barrier property, and thus the surface layer for improving the barrier property may not be formed on the surface of the plating layer. In addition, when the plating layers are formed on both surfaces ofthe steel sheet, the surface layer may be formed on the surface of the plating layer only on one surface. [0125] In addition, the present embodiment has been described using a case in which the surface-treated steel sheet is manufactured using the plating apparatus shown in Fig. 3 as an example, but the plating apparatus for manufacturing the surface-treated steel sheet is not limited to the plating apparatus shown in Fig. 3. For example, in the plating apparatus shown in Fig. 3, four positive electrodes 3 are disposed, but the number of the positive electrodes 3 is not limited. In addition, the sizes and shapes of the plating tank 21, the steel sheet I, and the positive electrode 3, the dispositions and - 47 - shapes of the upper pmtion supply pipe 2a and the lower pmtion supply pipe 2b are not particularly limited and can be appropriately determined depending on the applications and the like of the surface-treated steel sheet I 0. Example I [0126] "Test results of vanadium-containing surface-treated steel sheet" A surface-treated steel sheet having plating layers including vanadium on both surfaces of a steel sheet was produced using the plating apparatus shown in Fig. 3 and a method described below and was evaluated. A plating bath in a fluid state was prepared by circulating a plating bath having a plating bath composition, a temperature, and a pH shown in Table I at a relative average flow rate of I 00 m/min. - 48 - [0127] [Table 1] Plating bath composition (molll) Plating batb temperature Plating bath pH Zu2+ V(VH)+{V02+) Na+ Ni2 .. ("C) Bath (Zn-V) 1.0 0.8 L3 0.1 50 2.2 Bath (Zn) 1.0 - - - 50 1.0 [0128] As the steel sheet, a 0.5 mm-thick SPCD steel sheet which is a drawing quality cold-rolled steel sheet defined by JIS 0 3141 was used. A pretreatment (nickel plating) was carried out on the steel sheet, and the steel sheet was used as a negative electrode. In the pretreatment, first, as a plating bath for the nickel plating, ion exchange water, dense sulfuric acid, and NiS04·6H20 were mixed together, thereby adjusting a plating bath having a concentration ofNi2 + of 60 giL and a pH at 60°C of2.0. In addition, the steel sheet was immersed in the plating bath, and an electrolytic treatment was carried out using the steel sheet as a negative electrode and a platinum electrode as a positive electrode so that the adhered amount ofNi reached 200 mglnl. In a base-material-forming process and an upper layer plating process, individual electric conduction times were set to times shown in Table 2 and Table 3, and a plating layer was formed using an electroplating method. - 49 - [0129] [Table 2] Base-material-forming process Upper layer plating process Example Plating bat1t (Seconds) Current density (Seconds) Current density A/dm2 A/dnl VI Bath (Zn-V) 8 10 3 100 V2 Bath (Zn-V) 4 10 3 100 V3 Bath (Zn-V) 2 10 3 100 V4 Bath (Zn-V) I 10 3 100 V5 Bath (Zn-V) 0.5 10 3 100 V6 Bath (Zn-V) 0.2 10 3 100 V7 Bath (Zn-V) 0.05 10 3 100 V8 Bath (Zn-V) I 18 3 100 V9 Bath (Zn-V) I 5 3 100 VlO Bath (Zn-V) 4 18 3 100 VII Bath (Zn-V) 4 14 3 100 Vl2 Bath (Zn-V) 4 5 3 100 Vl3 Bath (Zn-V) 4 0 3 100 Vl4 Bath (Zn-V) I 10 6 100 Vl5 Bath (Zn-V) I 10 12 100 Vl6 Bath (Zn-V) I 10 3 150 Vl7 Bath (Zn-V) I 10 3 50 Vl8 Bath (Zn-V) I 10 3 100 Vl9 Bath (Zn-V) I 10 3 100 V20 Bath (Zn-V) I 10 3 100 [0130] [Table 3] Comparati\'C Base-matcrial-fonning process Upper layer plating process Example Plating bath (Seconds) Current density (Seconds) Current density Aldm2 A/dm2 XI Bath (Zn-V) 0 - 15 21 X2 Bath (Zn-V) 4 25 3 100 X3 Bath (Zn-V) I 25 3 100 X4 Bath (Zn-V) 0 - 18 18 X5 Bath (Zn-V) 0 - 3 100 X6 Bath (Zn) I 10 12 100 X7 Bath (Zn-V) 12 10 3 100 [0131] Meanwhile, in the plating bath composition shown in Table I, ZnS04 · ?H20 was used as a Zn compound, VOS04 · SH20 was used as a V compound, and furthermore, Na2S04 and, as another metal compound, NiS04·6H20 were used as necessary. The amounts thereof were adjusted so as to obtain the concentrations of I I [0132] The plating layers of examples and comparative examples obtained as described above were observed using a field-emission transmission electron microscope (FE-TEM) (manufactured by JEOL Ltd. (JED-2100F)). [0133] Fig. SA to Fig. 5C are the transmission electron microscopic (TEM) photographs of a plating layer in a surface-treated steel sheet of Example V4. Fig. SA is a cross sectional photograph in the entire thickness direction of the plating layer 30 fanned on the steel sheet 1, Fig. 58 is an enlarged photograph of an interface portion between the steel sheet and the plating layer in the cross section of Fig. SA, and Fig. 5C is an enlarged photograph of dendrite-shaped crystals and peripheral portions thereof in the cross section of Fig. SA. [0134] In Fig. 58, a reference symbol 51 indicates a base-material layer, and a reference symbol 52 indicates an intercrystal filling region in the vicinity of an interface between the steel sheet and the plating layer. In addition, in Fig. 5C, a reference symbol 53 indicates a dendrite-shaped crystal, a reference symbol 54 · indicates an interctystal filling region, and a reference symbol 55 indicates a surface layer fanned on the surface of the dendrite-shaped crystal. [0135] As shown in Fig. SA to Fig. 5C, in the surface-treated steel sheet of Example V4, dendrite-shaped crystals, intercrystal filling regions, and the surface layers of the dendrite-shaped crystals were formed in the plating layer. [0136] - 51 - Similar to Example V4, the plating layers in the surface-treated steel sheets of Examples VI to V3 and V5 to V20 were observed using TEM. As a result, dendriteshaped crystals, intercrystal filling regions, and the surface layers of the dendriteshaped crystals were formed in the plating layers. [0137] The plating layer in the surface-treated steel sheet of Example V4 was observed using a scanning electron microscope (SEM: A-4300SE manufactured by Hitachi, Ltd.) in a cross section direction. The plating layer was observed after a gold film was deposited on the surface of the plating layer in order to facilitate the observation of the surface shape of the plating layer. Fig. 6 is a scanning electron microscopic (SEM) photograph of the plating layer in the surface-treated steel sheet of Example V4. In Fig. 6, a reference symbol 56 indicates a dendrite-shaped crystal, a reference symbol 57 indicates an intercrystal filling region disposed between dendrite-shaped crystals, and a reference symbol 58 indicates a surface layer covering the surface of the dendrite-shaped crystal. Meanwhile, in the photograph shown in Fig. 6, white portions on the surface of the plating layer are the gold film deposited to observe the plating layer. [0138] Similar to the plating layer in Example V4, in the plating layers in the surfacetreated steel sheets of Examples VI to V3 and V5 to V20, dendrite-shaped crystals, intercrystal filling regions, and the surface layers of the dendrite-shaped crystals were formed. [0139] Similar to Example V4, the plating layers in the surface-treated steel sheets of Comparative Example xl to Comparative Example x7 were observed using SEM. - 52 - i I Fig. 7 is a scanning electron microscopic (SEM) photograph of the plating layer in the surface-treated steel sheet of Comparative Example x2. As shown in Fig. 7, the plating layer in Comparative Examples x2 was a single phase made of a dendriteshaped c1ystal. [0140] For the plating layers in Examples VI to Example V20, elements in the dendrite-shaped crystals, the intercrystal filling regions, and the surface layers of the dendrite-shaped crystals were each analyzed using an energy dispersive X -ray analyzer (EDS) (manufactured by JEOL (JED-2300T)). In addition, elements (composition) in the dendrite-shaped crystals, elements (composition) in the intercrystal filling regions, the amount of vanadium, the amount of zinc, and elements (composition) in the surface layers of the dendrite-shaped crystals were investigated. In addition, the molar ratio (V/Zn) of the amount of vanadium to the amount of zinc in the intercrystal filling regions was computed using the results of the element analyses. [0141] For the plating layers in Comparative Example xl to Comparative Example x7 as well, elements in the dendrite-shaped crystals, the intercrystal filling regions, and the surface layers of the dendrite-shaped crystals were analyzed in the same mmmer as in Example VI to Example V20. The results are shown in Table 4 and Table 5. - 53 - ·mrwrmr!Wi [0142] [Table 4] (A) Dendrite-shaped crystal (B) Intcrcrystal filling region (C) Surface layer of dendrite~ shaped cryst:ll Lower layer plating Exnmplo Presence or a Ptcscneo or V/Zn molar Presence or Presence or a Adhered bscncc Composition absence Composition ratio absence Composition bsenee Composition amount (g/m~) V1 Present Zn (hexagonal) Present Zn, V, 0 (amorphous) 0.20 Present ZoO ( cryst:ll) Absent - - V2 Present Zn (hexagonal) Present Zn, V, 0 (amorphous) 1.20' Present ZnO (crystal) Absent - - V3 Present Zn (hexagonal) Present Zn, V, 0 (amorphous) 0.80 Present ZnO (crystal) Absent - - V4 Present Zn (hexagonal) Present Zn. V. 0 (amorphous) 0.60 Present ZnO (crystal) Absent - - V5 Present Zn (hexagonal) Present Zn. V, 0 (amorphous) 0.40 Present ZoO (crystal) Abscnt - - V6 Present Zn (hexogonol) Present Zn, V, 0 (amorphous) 0.30 Present ZnO (cryst:ll) Absent - - V7 Present Zn (hexagonal) Present Zn, V, 0 (amorphous) 0.20 Present ZnO (crystal) Absent - - V8 Present Zn (hexagonal) Present Zn. V, 0 (amorphous) 0.70 Present ZnO (crystal) Absent - - V9 Present Zn (hexogonal) Present Zn. V, 0 (amorphous) 0.50 Present ZnO (crystal) Absent - - V10 Present Zn (hexogonal) Present Zn, V. 0 (amorphous) 0.30 Present ZnO (cryst:ll) Absent - - Vll Present Zn (hexagonal) Present Zn. V. 0 (amorphous) 0.80 Present ZnO (cryst:ll) Absent - - V12 Present Zn (hexagonal) Present Zn, V, 0 (amorphous) 0.90 Present ZnO (crystal) Absent - - V13 Present Zn (hcx:~.gonal) Present Zn, V, 0 (runorphous) 0.15 Present ZoO (crystal) Absent - - V14 Present Zn (hexagonal) Present Zn, V, 0 (amorphous) 0.70 Present ZoO (crystal) Absent - - VIS Present Zn (hexagon:~.!) Present Zn, V, 0 (amorphous) 0.80 Present ZnO (crystal) Absent - - V16 Present Zn (hexagonal) Present Zn, V. 0 (amorphous) 0.70 Present ZnO (crystal) Absent - - V17 Present Zn (hexagonal) Present Zn, V, 0 (amorphous) 0.40 Present ZoO (cryst:ll) Absent - - V18 Present Zn (hexagonal) Present Zn. V. 0 (amorphous) 0.60 Present ZnO ( cryst:ll) Present Zn 3 V19 Present Zn (hexagonal) Present Zn. V, 0 (amorphous) 0.60 Present ZnO (crystal) Present Zn 10 V20 Present Zn (hcxogonol) Present Zn. V. 0 (amorphous) 0.60 Present ZnO (crystal) Present Zn 20 ------ - 54 - [0143] [Table 5] (A) Dcndritc~shapcd crystal (B) Intcrcrystal filling region (C) Surfncc layer of dcndritcM ComparatiYe shaped crys!