DESC:BACKGROUND
Technical Field
[0001] The embodiments herein generally relate to a system for dimensional measurement of a component, and, more particularly, to a system and method for measuring a dimension of the component by using back pressure of air towards to the component.

Description of the Related Art
[0002] Air gauging relies on a law of physics that states flow and pressure are directly proportionate to clearance and react inversely to each other. As the clearance increases, air flow also increases, and air pressure decreases proportionately. As the clearance decreases, the air flow also decreases, and the air pressure increases. This is accomplished by having a regulated air flow that travels through some type of restriction, such as a needle valve or jeweled orifice, and then through the nozzle in the air tool. As the obstruction (i.e., work piece) is brought closer to the nozzle, air flow is reduced and the back pressure is increased. When the nozzle is completely obstructed, the flow is zero, and the back pressure is equal to the regulated air. Conversely, when the nozzle is open to the atmosphere, air flow is at a maximum, and the back pressure is at a minimum. One of the method is Pneumatic gauging circuit based on the principle of either measuring the flow of compressed air to a nozzle disposed in close proximity to a work piece surface, such as to determine the dimensional relationship between the nozzle outlet and the surface, or by measuring back pressure in a chamber through which compressed air is flowing via a restricted orifice, the back pressure being a function of the distance separating a nozzle connected to the chamber from the surface of the work piece. Even though this method is reliable but it’s introduce parasitical friction and hysteresis, which results in inaccurate measurement and need frequent recalibration and maintenance.
[0003] Accordingly, there remains need for a system and method sensing the back pressure of the component to measure a dimension of the component.

SUMMARY
[0004] In view of the foregoing, an embodiment herein provides a transfer adhesive tape applicator device. The apparatus for measuring dimensional of a component is provided. The apparatus includes a pressure regulator, an air splitter, a first air flow control unit, a second air flow control unit, a differential sensor and a microcontroller. The pressure regulator regulates pressure of an input air to a predefined pressure value. The air splitter is coupled with the pressure regulator. In one embodiment, the air splitter splits the input air obtained from the pressure regulator into (i) a first flow of air and (ii) a second flow of the air.
[0005] The first air flow control unit is coupled with the air splitter 104. In one embodiment, the first air flow control unit is adapted to receive the first flow of air with the predefined pressure value to proceed the first flow of the air towards the component to generate back pressure. The second air flow control unit is coupled with air splitter. In another embodiment, the second air flow splitter is adapted to receive the second flow of air with the predefined pressure value.
[0006] The differential sensor is coupled with the first air flow control unit and the second air flow control unit. In one embodiment, the differential sensor is adapted to determine pressure difference between (i) the back pressure from the first air flow control unit and (ii) the input air with the predefined pressure value from the second air flow control. The microcontroller is coupled with the differential sensor. In one embodiment the microcontroller is adapted to receive the pressure difference to determine shape of the component base on the pressure difference.
[0007] The apparatus includes a signal conditioning unit. The signal conditioning unit is coupled with the differential sensor amplifies signal value of the pressure difference from the differential sensor and sends an amplified analog signal to an analog to digital converter.
[0008] In one embodiment, the analog to digital converter converts the amplified analog signal to digital signal.
[0009] In another embodiment, the micro controller receives the digital signal from the analog to digital converter to process and dispense a digital output based on the digital signal.
[0010] In another aspect, a method for determining dimensional of a component is provided. The method includes the steps of: (a) regulating, using a pressure regulator, pressure of an input air to a predefined pressure value; (b) splitting, using an air splitter, the input air obtained from the pressure regulator into (i) a first flow of air and (ii) a second flow of the air; (c) receiving, using a first air flow control unit 106, the first flow of air with the predefined pressure value to proceed the first flow of the air towards the component to generate back pressure; (d) receiving, using a second air flow control unit, the second flow of air with the predefined pressure value; (e) determining, using a differential sensor, pressure difference between (i) the back pressure from the first air flow control unit 106 and (ii) the input air with the predefined pressure value from the second air flow control; and (f) receiving, using a microcontroller, the pressure difference to determine shape of the component base on the pressure difference.
[0011] In one embodiment, the method includes amplifying, using a signal conditioning unit, signal value of the pressure difference from the differential sensor and sends an amplified analog signal to an analog to digital converter.
[0012] In another embodiment, the method includes receiving, using the micro controller 210, a digital signal from the analog to digital converter to process and dispense a digital output based on the digital signal.
[0013] The apparatus is easy to operate and works efficiently. The apparatus reduces time taken for measuring the dimension of the component.
[0014] These and other aspects of the embodiments herein will be better appreciated and understood when considered in conjunction with the following description and the accompanying drawings. It should be understood, however, that the following descriptions, while indicating preferred embodiments and numerous specific details thereof, are given by way of illustration and not of limitation. Many changes and modifications may be made within the scope of the embodiments herein without departing from the spirit thereof, and the embodiments herein include all such modifications

BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The embodiments herein will be better understood from the following detailed description with reference to the drawings, in which:
[0016] FIG. 1 is an exploded view of a system for dimensional measurement according to an embodiment herein;
[0017] FIG. 2 is an exploded view of the system for analyzing back pressure using a micro controller of FIG.1 according to an embodiment herein;
[0018] FIG. 3 is a flow diagram that illustrates method for measuring a dimension of a component of FIG. 1 according to an embodiment herein;
[0019] FIG. 4 illustrates an exploded view of the micro controller of FIG. 2 according to an embodiment herein;
[0020] FIG. 5 illustrates an exploded view of a receiver used in accordance with the embodiments herein; and
[0021] FIG. 6 illustrates a schematic diagram of a computer architecture used in accordance with the embodiments herein.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS
[0022] The embodiments herein and the various features and advantageous details thereof are explained more fully with reference to the non-limiting embodiments that are illustrated in the accompanying drawings and detailed in the following description. Descriptions of well-known components and processing techniques are omitted so as to not unnecessarily obscure the embodiments herein. The examples used herein are intended merely to facilitate an understanding of ways in which the embodiments herein may be practiced and to further enable those of skill in the art to practice the embodiments herein. Accordingly, the examples should not be construed as limiting the scope of the embodiments herein.
[0023] As mentioned, there remains need for a system and method for measuring dimension of the component. Referring now to the drawings, and more particularly to FIGS. 1 through 6, where similar reference characters denote corresponding features consistently throughout the figures, there are shown preferred embodiments.
[0024] FIG. 1 is an exploded view of a system for dimensional measurement according to an embodiment herein. The exploded view includes a pressure regulator 102, an air splitter 104, a first air flow control unit 106, a second air flow control unit 108, a differential sensor 110, and an air plug 112. The pressure regulator 102 regulates an input air pressure to a desired value. In one embodiment, the pressure regulator 102 includes a control valve to reduce an input air pressure of the air to the desired value. The air splitter 104 splits the regulated air from the pressure regulator 102 into (i) a first flow of air and (ii) a second flow of the air. In one embodiment, the pressure of the first flow of the air is same as the pressure of the second flow of the air. The first air flow control unit 106 includes a first flow control valve, a first output channel, and a second output channel. The first flow control valve controls the flow of the air towards the component from the air splitter 104. The first output channel of the flow of air is coupled to the differential sensor 110 and the second output channel is coupled to the air plug 112. The back pressure is obtained when the air plug 112 is on or proximity to the component.
[0025] The second air flow control unit 108 includes a second flow control valve, and a third output channel. The second flow control valve controls the reference flow of the air from the air splitter 104. The third output channel of the second air flow control unit 108 is coupled to the differential sensor 110. The differential sensor 110 obtains back pressure of the flow of the air towards the component. In one embodiment, the reference flow of the air is considered as a reference value for measuring the dimension of the component. In another embodiment, the differential sensor 110 measures the difference value between (i) the back pressure of the flow of the air towards the component and (ii) the reference flow of the air. In yet another embodiment, a dimension of the component is determined based on the difference value. The dimension may include but it is not limited to a shape, and a size of the component.
[0026] FIG. 2 is an exploded view of the system for analyzing back pressure using a micro controller of FIG.1 according to an embodiment herein. The exploded view includes an air input unit 202, a differential sensor 110, a signal conditioning unit 206, an analog to digital converter 208, a micro controller 210, a display unit 212, and a storage unit 214. The air input unit 202 dispenses the pressurized air to the differential sensor 204. The differential sensor 110 senses the difference between the back pressure air and average pressurized air. In one embodiment, the differential sensor 110 is a transducer that measures the dimension of the component. The signal conditioning unit 206 obtains a signal that indicates the value from the differential sensor 110. The signal conditioning unit 206 dispensing manipulates of an analog signal from the differential sensor 110 to meet the requirements of a next stage for further processing. The signal conditioning unit 206 amplifies the signal from the differential sensor 204 and sends an amplified analog signal to the analog to digital converter 208. The analog to digital converter 208 converts the amplified analog signal to digital signal. The micro controller 210 receives the digital signal from the analog to digital converter 208. The digital signal includes information of the difference value of the differential sensor. The micro controller 210 dispenses a digital output based on the digital input signal from the analog to digital converter 208 and displays the digital output at the display unit 212. In one embodiment, the digital output is displayed in Tri color digital display on the display unit 212. In another embodiment, the display unit 212 that includes six LED’S for display the digital output. Three LED’S indicates accept, reject or rework status of the part dimension measured against a preset upper and lower tolerance limits. The storage unit 214 that stores the output of the micro controller for further analysis using a serial port.
[0027] FIG. 3 is a flow diagram that illustrates method for measuring a dimension of a component of FIG. 1 according to an embodiment herein. At step 302, pressurized air is obtained. At step 304, the pressurized air is regulated by a pressure regulator. At step 306, the pressurized air is splitted into (i) a flow of air towards the component and (ii) a reference flow of air by air splitter. At step 308, back pressure is obtained when air plug is on or proximity to a component. At step 310, a difference value between (i) the back pressure of the flow of air towards the component (ii) the reference flow of the air is measured. At step 312, a dimension of the component is obtained based on the differential value.
[0028] FIG. 4 illustrates an exploded view of the micro controller 210 of FIG. 2 according to an embodiment herein. The exploded view includes a database 402, a back pressure obtaining module 404, a difference value obtaining module 406, and a dimension determination module 408. The back pressure obtaining module 404 obtains back pressure of the flow of air when the air plug is on or proximity to the component. The difference value obtaining module 406 obtains a difference value between the back pressure and the reference flow of air. The dimension determination module 408 determines the dimension of the component based on the difference value.
[0029] FIG. 5 illustrates an exploded view of a receiver having an a memory 502 having a computer set of instructions, a bus 504, a display 506, a speaker 508, and a processor 510 capable of processing a set of instructions to perform any one or more of the methodologies herein, according to an embodiment herein. The processor 510 may also enable digital content to be consumed in the form of video for output via one or more displays 506 or audio for output via speaker and/or earphones 508. The processor 510 may also carry out the methods described herein and in accordance with the embodiments herein. Digital content may also be stored in the memory 502 for future processing or consumption. The memory 502 may also store program specific information and/or service information (PSI/SI), including information about digital content (e.g., the detected information bits) available in the future or stored from the past.
[0030] A user of the receiver may view this stored information on display 506 and select an item of for viewing, listening, or other uses via input, which may take the form of keypad, scroll, or other input device(s) or combinations thereof. When digital content is selected, the processor 510 may pass information. The content and PSI/SI may be passed among functions within the receiver using bus 504.
[0031] The techniques provided by the embodiments herein may be implemented on an integrated circuit chip (not shown). The chip design is created in a graphical computer programming language, and stored in a computer storage medium (such as a disk, tape, physical hard drive, or virtual hard drive such as in a storage access network). If the designer does not fabricate chips or the photolithographic masks used to fabricate chips, the designer transmits the resulting design by physical means (e.g., by providing a copy of the storage medium storing the design) or electronically (e.g., through the Internet) to such entities, directly or indirectly.
[0032] The stored design is then converted into the appropriate format (e.g., GDSII) for the fabrication of photolithographic masks, which typically include multiple copies of the chip design in question that are to be formed on a wafer. The photolithographic masks are utilized to define areas of the wafer (and/or the layers thereon) to be etched or otherwise processed.
[0033] The resulting integrated circuit chips can be distributed by the fabricator in raw wafer form (that is, as a single wafer that has multiple unpackaged chips), as a bare die, or in a packaged form. In the latter case the chip is mounted in a single chip package (such as a plastic carrier, with leads that are affixed to a motherboard or other higher level carrier) or in a multichip package (such as a ceramic carrier that has either or both surface interconnections or buried interconnections).
[0034] In any case the chip is then integrated with other chips, discrete circuit elements, and/or other signal processing devices as part of either (a) an intermediate product, such as a motherboard, or (b) an end product. The end product can be any product that includes integrated circuit chips, ranging from toys and other low-end applications to advanced computer products having a display, a keyboard or other input device, and a central processor.
[0035] The embodiments herein can take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment including both hardware and software elements. The embodiments that are implemented in software include but are not limited to, firmware, resident software, microcode, etc.
[0036] Furthermore, the embodiments herein can take the form of a computer program product accessible from a computer-usable or computer-readable medium providing program code for use by or in connection with a computer or any instruction execution system. For the purposes of this description, a computer-usable or computer readable medium can be any apparatus that can comprise, store, communicate, propagate, or transport the program for use by or in connection with the instruction execution system, apparatus, or device.
[0037] The medium can be an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system (or apparatus or device) or a propagation medium. Examples of a computer-readable medium include a semiconductor or solid state memory, magnetic tape, a removable computer diskette, a random access memory (RAM), a read-only memory (ROM), a rigid magnetic disk and an optical disk. Current examples of optical disks include compact disk - read only memory (CD-ROM), compact disk - read/write (CD-R/W) and DVD.
[0038] A data processing system suitable for storing and/or executing program code will include at least one processor coupled directly or indirectly to memory elements through a system bus. The memory elements can include local memory employed during actual execution of the program code, bulk storage, and cache memories which provide temporary storage of at least some program code in order to reduce the number of times code must be retrieved from bulk storage during execution.
[0039] Input/output (I/O) devices (including but not limited to keyboards, displays, pointing devices, etc.) can be coupled to the system either directly or through intervening I/O controllers. Network adapters may also be coupled to the system to enable the data processing system to become coupled to other data processing systems or remote printers or storage devices through intervening private or public networks. Modems, cable modem and Ethernet cards are just a few of the currently available types of network adapters.
[0040] A representative hardware environment for practicing the embodiments herein is depicted in FIG. 6. This schematic drawing illustrates a hardware configuration of an information handling/computer system in accordance with the embodiments herein. The system comprises at least one processor or central processing unit (CPU) 10. The CPUs 10 are interconnected via system bus 12 to various devices such as a random access memory (RAM) 14, read-only memory (ROM) 16, and an input/output (I/O) adapter 18. The I/O adapter 18 can connect to peripheral devices, such as disk units 11 and tape drives 13, or other program storage devices that are readable by the system. The system can read the inventive instructions on the program storage devices and follow these instructions to execute the methodology of the embodiments herein.
[0041] The system further includes a user interface adapter 19 that connects a keyboard 15, mouse 17, speaker 24, microphone 22, and/or other user interface devices such as a touch screen device (not shown) to the bus 12 to gather user input. Additionally, a communication adapter 20 connects the bus 12 to a data processing network 25, and a display adapter 21 connects the bus 12 to a display device 23 which may be embodied as an output device such as a monitor, printer, or transmitter, for example.
[0042] A system and method for dimensional measurement of a component provides linear output and compatibility with any type of tooling. The system doesn’t requires a fix or adjustable orifices which can get clogged or tampered and causing an erroneous readings. The system provides considerable savings in compressed air usage and provides the output in digital format that is compatible with all instruments.
[0043] The foregoing description of the specific embodiments will so fully reveal the general nature of the embodiments herein that others can, by applying current knowledge, readily modify and/or adapt for various applications such specific embodiments without departing from the generic concept, and, therefore, such adaptations and modifications should and are intended to be comprehended within the meaning and range of equivalents of the disclosed embodiments. It is to be understood that the phraseology or terminology employed herein is for the purpose of description and not of limitation. Therefore, while the embodiments herein have been described in terms of preferred embodiments, those skilled in the art will recognize that the embodiments herein can be practiced with modification within the spirit and scope of the appended claims.
,CLAIMS:I/We Claim:

1. An apparatus for measuring dimensional of a component, comprising:
a pressure regulator 102 that regulates pressure of an input air to a predefined pressure value;
an air splitter 104 that is coupled with said pressure regulator 102, wherein said air splitter 104 splits said input air obtained from said pressure regulator 102 into (i) a first flow of air and (ii) a second flow of said air;
Characterized in that
a first air flow control unit 106 that is coupled with said air splitter 104, wherein said first air flow control unit 106 is adapted to receive said first flow of air with said predefined pressure value to proceed said first flow of said air towards said component to generate back pressure;
a second air flow control unit 108 that is coupled with air splitter 104, wherein said second air flow splitter 108 is adapted to receive said second flow of air with said predefined pressure value;
a differential sensor 110 that is coupled with said first air flow control unit 106 and said second air flow control unit 108, wherein said differential sensor 110 is adapted to determine pressure difference between (i) said back pressure from said first air flow control unit 106 and (ii) said input air with said predefined pressure value from said second air flow control 108; and
a microcontroller 210 that is coupled with said differential sensor 110, wherein said microcontroller 210 is adapted to receive said pressure difference to determine shape of said component base on said pressure difference.


2. The apparatus as claimed in claim 1, wherein said apparatus comprises
a signal conditioning unit that is coupled with said differential sensor 110 amplifies signal value of the pressure difference from the differential sensor 110 and sends an amplified analog signal to an analog to digital converter 208.

3. The apparatus as claimed in claim 2, wherein said analog to digital converter 208 converts the amplified analog signal to digital signal.


4. The apparatus as claimed in claim 3, wherein said micro controller 210 receives the digital signal from the analog to digital converter 208 to process and dispense a digital output based on the digital signal.


5. A method for determining dimensional of a component, comprising:
regulating, using a pressure regulator 102, pressure of an input air to a predefined pressure value;
splitting, using an air splitter 104, said input air obtained from said pressure regulator 102 into (i) a first flow of air and (ii) a second flow of the air;
receiving, using a first air flow control unit 106, said first flow of air with said predefined pressure value to proceed said first flow of the air towards said component to generate back pressure;
receiving, using a second air flow control unit 108, said second flow of air with the predefined pressure value;
determining, using a differential sensor 110, pressure difference between (i) said back pressure from said first air flow control unit 106 and (ii) said input air with said predefined pressure value from said second air flow control 108; and
receiving, using a microcontroller 210, said pressure difference to determine shape of said component base on said pressure difference.

6. The method as claimed in claim 5, wherein said method comprises
amplifying, using a signal conditioning unit, signal value of the pressure difference from the differential sensor 110 and sends an amplified analog signal to an analog to digital converter 208.

7. The method as claimed in claim 6, wherein said method comprises
receiving, using the micro controller 210, a digital signal from the analog to digital converter 208 to process and dispense a digital output based on the digital signal.