Claims:CLAIMS
1. A system (102) for interconnection and arrangement of battery cells in a battery pack, the system comprising:
a first multilayer printed circuit board (PCB) (104) having a top surface (104A) and a bottom surface (102B), wherein the first multilayer PCB (104) comprises a first set of grooves (106A to 106F) formed as through-holes in the first multilayer PCB (104), and wherein the first multilayer PCB (104) is used as a base to support interconnection between a first group of battery cells (202) in the battery pack, and wherein each battery cell of the first group of battery cells (202) has a positive terminal on a first surface and a negative terminal surrounding the positive terminal on the same first surface;
a plurality of conductive metal strips (108A to 108F) used as a plurality of positive connection points on the top surface (104A) of the first multilayer PCB (104), wherein each conductive metal strip has a curved portion, and wherein each conductive metal strip is arranged on one groove of the first set of grooves (106) such that the curved portion of each conductive metal strip enters a corresponding groove on the top surface (104A) of the first multilayer PCB (104);
a plurality of negative connection points (122A to 122F) formed on the bottom surface (104B) of the first multilayer PCB (104) around each groove of the first set of grooves (106A to 106F); and
a layer of insulating spacers (112) arranged on the bottom surface (104B) of the first multilayer PCB (104) to physically segregate each groove of the first set of grooves (106A to 106F) and hold the first group of battery cells (202), wherein the first group of battery cells (202) are arranged via the bottom surface (104B) of the first multilayer PCB (104) by press-fit and bolting within the layer of insulating spacers (112) such that the positive terminal of each battery cell comes in contact with the curved portion of each conductive metal strip used as the positive connection point, and a negative terminal of each battery cell is connected with each corresponding negative point of the plurality of negative connection points (122A to 122F) on the bottom surface (104B) of the first multilayer PCB (104).

2. The system (102) as claimed in claim 1, wherein the top surface (104A) and the bottom surface (104B) of the first multilayer PCB (104) are electrically conductive layers, and wherein the electrically conductive layers are separated by a core layer (118) made of a dielectric material in the first multilayer PCB (104).
3. The system (102) as claimed in claim 1, wherein each positive terminal of the first group of battery cells arranged on the first multilayer PCB (104) are connected to each other via the plurality of conductive metal strips (108A to 108F) to form a common positive connection (110) for the first multilayer PCB (104), and wherein each negative terminal of the first group of the battery cells (202) arranged on the first multilayer PCB (104) are connected to each other via the plurality of negative connection points (122A to 122F) on the bottom surface (104B) to form a common negative connection (120) of the first multilayer PCB (104).
4. The system (102) as claimed in claim 1, wherein each positive terminal of the first group of battery cells arranged on the first multilayer PCB (104) are connected to each other via the plurality of conductive metal strips (108A to 108F) to form a first common positive connection for the first multilayer PCB (104), and wherein each negative terminal of the first group of the battery cells arranged on the first multilayer PCB (104) are connected to each other via the plurality of negative connection points (122A to 122F) on the bottom surface (104B) to form a first common negative connection of the first multilayer PCB (104).
5. The system (102) as claimed in claim 4, wherein the system (104) further comprises a second multilayer PCB (212), and wherein the first common positive connection of the first group of battery cells (202) for the first multilayer PCB (104) is connected to a second common negative connection of a second group of battery cells (214) of the second multilayer PCB (212) in the battery pack.
6. The system (102) as claimed in claim 4, wherein the first common negative connection of the first group of battery cells (202) arranged on the first multilayer PCB (104) is connected to a second common positive connection of the second group of battery cells (214) of the second multilayer PCB (212) in the battery pack.
7. The system (102) as claimed in claim 1, wherein each conductive metal strip is spot welded on either side of a groove of the first set of grooves (106A to 106F) on the top surface (104A) of the first multilayer PCB (104).
8. The system (102) as claimed in claim 1, wherein each conductive metal strip of the plurality of conductive metal strips (108A to 108F) is a nickel strip or a nickel plated metal strip.
9. A method (300) for interconnecting and arranging battery cells in a battery pack, the method (300) comprising:
providing a first multilayer printed circuit board (PCB) (104) having a top surface (104A) and a bottom surface (104B) to be used as a base to support interconnection between a first group of battery cells (202) in the battery pack, wherein each battery cell of the first group of battery cells (202) has a positive terminal on a first surface and a negative terminal surrounding the positive terminal on the same first surface, and wherein the first multilayer PCB (104) comprises a first set of grooves (106A to 106F) as through-holes;
attaching a plurality of conductive metal strips (108A to 108F) as a plurality of positive connection points on the top surface (104A) of the first multilayer PCB (104), wherein each conductive metal strip has a curved portion, and wherein each conductive metal strip is attached and arranged on one groove of the first set of grooves (106A to 106F) such that the curved portion of each conductive metal strip enters a corresponding groove on the top surface (104A) of the first multilayer PCB (104);
mounting a layer of insulating spacers (112) on the bottom surface (104B) of the first multilayer PCB (104) for physically segregating each groove of the first set of grooves (106A to 106F) and hold the first group of battery cells (202); and
anchoring the first group of battery cells (202) via the bottom surface (104B) of the first multilayer PCB (104) by press-fitting and bolting within the layer of insulating spacers (112) such that the positive terminal of each battery cell comes in contact with the curved portion of each conductive metal strip used as the positive connection point, and a negative terminal of each battery cell is connected with each corresponding negative point of a plurality of negative connection points on the bottom surface (104B) of the first multilayer PCB (104).
10. The method (300) as claimed in claim 9, wherein the attaching of the plurality of conductive metal strips (108A to 108F) comprises spot welding each conductive metal strip on either side of a groove of the first set of grooves (106A to 106F) on the top surface (104A) of the first multilayer PCB (104) to form the plurality of positive connection points on the top surface (104) of the first multilayer PCB (104)
, Description:TECHNICAL FIELD
The present disclosure relates generally to the field of a battery pack and more specifically, to a system and a method for interconnection and arrangement of battery cells in a battery pack.
BACKGROUND
Generally, a battery pack is used to provide output power to different components of an electric vehicle. The conventional battery pack includes a number of battery cells, such as cylindrical cells, and the like. Further, each battery cell includes a positive terminal, and a negative terminal and the number of battery cells are generally assembled on a printed circuit board, for example in different combinations to collectively provide the output power. Conventionally, one or more positive conducting strips and one or more negative conducting strips are welded on the same side of the printed circuit board. Therefore, a positive conducting strip is connected with the positive terminal of a corresponding battery cell, and a negative conducting strip is also connected with the negative terminal of the same battery cell, and similarly, other battery cells are arranged to form the number of battery cells. In general, the cell connection of each positive conducting strip and each negative conducting strip should have a constant value to prevent uneven loading of the number of battery cells during operation, especially with parallel-connected battery cells. In addition, a high priority is also given to the reliability of the cell connection of each positive conducting strip and each negative conducting strip over the entire lifetime of the battery pack. Furthermore, each positive conducting strip and each negative conducting strip must be able to safely withstand the dynamic loads in the electric vehicle. However, as the positive conducting strip and the negative conducting strip are welded close to each other, therefore there exists a possibility of a short circuit between the positive terminal and the negative terminal of the number of battery cells. Moreover, welding of the positive conducting strip and the negative conducting strip also results in an increased cost as well as an increased electrical resistance of the battery pack, due to which the conventional approach is not reliable for connection and arrangement of the number of battery cells.
Currently, certain attempts have been made for battery cell connection of the number of battery cells within the battery pack, such as by soldering each positive terminal and each negative terminal of each battery pack on the PCB. In such attempts, the battery cell connection aims to achieve the highest possible electrical conductivity between the number of battery cells. However, due to direct soldering of each positive terminal and each negative terminal, recovery of each battery cell requires a high depth of disassembly, which is again cost-effective and is not desirable. Additionally, each battery cell experiences a different load due to which the temperature inside the battery pack is not homogenous, and few battery cells with less capacity experience more depth of discharge than the battery cells with more capacity. Moreover, when the number of battery cells is arranged parallelly on the same PCB, then few battery cells with less internal resistance experience more current, hence more heat generation, than the battery cells with more internal resistance. In general, such effects are independent of the failure probability under homogenous conditions, so the probability of failure of the battery pack is also increased. As a result, battery cell contacting and connection of the number of battery cells represents a serious challenge in the battery packs. Moreover, there exists a technical problem of how to connect the number of battery cells of the battery pack in a more reliable way and with reduced cost.
Therefore, in light of the foregoing discussion, there exists a need to overcome the aforementioned drawbacks associated with the conventional approaches for connecting battery cells in conventional battery packs.
SUMMARY
The present disclosure provides a system for interconnection and arrangement of battery cells in a battery pack. The present disclosure further provides a method for interconnection and arrangement of the battery cells in the battery pack. The present disclosure provides a solution to the existing problem of how to connect the number of battery cells of the battery pack in a more reliable way and with reduced cost. An objective of the present disclosure is to provide a solution that overcomes at least partially the problems encountered in the prior art and provides an improved system and an improved method for interconnection and arrangement of the battery cells in the battery pack with reduced cost and increased reliability.
One or more objectives of the present disclosure is achieved by the solutions provided in the enclosed independent claims. Advantageous implementations of the present disclosure are further defined in the dependent claims.
In one aspect, the present disclosure provides a system for interconnection and arrangement of battery cells in a battery pack. The system comprises a first multilayer printed circuit board (PCB) having a top surface and a bottom surface, wherein the first multilayer PCB comprises a first set of grooves formed as through-holes in the first multilayer PCB and wherein the first multilayer PCB is used as a base to support interconnection between a first group of battery cells in the battery pack, and wherein each battery cell of the first group of battery cells has a positive terminal on a first surface and a negative terminal surrounding the positive terminal on the same first surface. The system further comprises a plurality of conductive metal strips used as a plurality of positive connection points on the top surface of the first multilayer PCB, wherein each conductive metal strip has a curved portion, and wherein each conductive metal strip is arranged on one groove of the first set of grooves such that the curved portion of each conductive metal strip enters a corresponding groove on the top surface of the first multilayer PCB. The system further comprises a plurality of negative connection points formed on the bottom surface of the first multilayer PCB around each groove of the first set of grooves, and a layer of insulating spacers arranged on the bottom surface of the first multilayer PCB to physically segregate each groove of the first set of grooves and hold the first group of battery cells. Moreover, the first group of battery cells is arranged via the bottom surface of the first multilayer PCB by press-fit and bolting within the layer of insulating spacers such that the positive terminal of each battery cell comes in contact with the curved portion of each conductive metal strip used as the positive connection point, and a negative terminal of each battery cell is connected with each corresponding negative point of the plurality of negative connection points on the bottom surface of the first multilayer PCB.
The system is used for interconnection and arrangement of the battery cells in the battery pack. The first multilayer PCB of the system is beneficial to support interconnection between the first group of battery cells in the battery pack. Moreover, the plurality of conductive metal strips is beneficial for providing the plurality of positive connection points on the top surface of the first multilayer PCB. As the plurality of conductive metal strips is welded via spot welding, thus the overall cost of production of the system is reduced. Furthermore, as the plurality of negative connection points is formed as a part of the bottom surface of the first multilayer PCB, thus the overall cost, as well as electrical resistance of the system, is reduced. In addition, the first group of battery cells is arranged via the bottom surface of the first multilayer PCB by press-fit and bolting within the layer of insulating spacers. By virtue of using the press-fit and bolting, the system avoids short-circuiting during the arrangement of the first group of battery cells through the bottom surface of the first multilayer PCB with reduced cost. Moreover, the press-fit and bolting are also beneficial to reduce assembly time, manufacturing time, and overall cost of the system. In addition, the system can be automated for the assembly as well disassembly of the first group of battery cells through the bottom surface of the first multilayer PCB without causing any damage to the first group of battery cells as well as to the first multilayer PCB. As a result, the first group of battery cells can be separated easily from the first multilayer PCB. Furthermore, the weight and packaging requirements of the system are also reliable and comparable with the battery packs.
In an implementation form, the top surface and the bottom surface of the first multilayer PCB are electrically conductive layers, and wherein the electrically conductive layers are separated by a core layer made of a dielectric material in the first multilayer PCB.
The core layer is used to separate the electrically conductive layers of the top surface and the bottom surface, such as to form a capacitor-like structure. The core layer is also beneficial to avoid short-circuiting during the arrangement of the first group of battery cells and also achieving a safety concept in case of a thermal runaway of the first set of battery cells.
In an implementation form, each positive terminal of the first group of battery cells arranged on the first multilayer PCB are connected to each other via the plurality of conductive metal strips to form a common positive connection for the first multilayer PCB, and wherein each negative terminal of the first group of the battery cells arranged on the first multilayer PCB are connected to each other via the plurality of negative connection points on the bottom surface to form a common negative connection of the first multilayer PCB.
The common positive connection and the common negative connection are beneficial to obtain power output from the battery pack with reduced electrical resistance.
In an implementation form, the system further comprises a second multilayer PCB, and wherein the first common positive connection of the first group of batteries for the first multilayer PCB is connected to a second common negative connection of a second group of batteries of the second multilayer PCB in the battery pack.
In this implementation, the first common negative connection of the first group of battery cells of the first multilayer PCB and the second common positive connection of the second group of battery cells of the second multilayer PCB in the battery pack is used to obtain a power output from the battery pack. Moreover, by virtue of using the second multilayer PCB, and overall output power of the battery pack can be increased.
In an implementation form, each conductive metal strip is spot welded on either side of a groove of the first set of grooves on the top surface of the first multilayer PCB.
By virtue of using spot welding, the overall cost of production, as well as an overall electrical resistance on the top surface of the first multilayer PCB, is reduced.
In an implementation form, each conductive metal strip of the plurality of conductive metal strips is a nickel strip or a nickel plated metal strip.
The nickel strip or the nickel plated metal strip are good conductors of electricity, that are beneficial to reduce the overall electrical resistance on the top surface of the first multilayer PCB.
In another aspect, the present disclosure provides a method for interconnecting and arranging battery cells in a battery pack. The method comprises providing a first multilayer printed circuit board (PCB) having a top surface and a bottom surface to be used as a base to support interconnection between a first group of battery cells in the battery pack, wherein each battery cell of the first group of battery cells has a positive terminal on a first surface and a negative terminal surrounding the positive terminal on the same first surface, and wherein the first multilayer PCB comprises a first set of grooves as through-holes. The method further comprises attaching a plurality of conductive metal strips as a plurality of positive connection points on the top surface of the first multilayer PCB, wherein each conductive metal strip has a curved portion, and wherein each conductive metal strip is attached and arranged on one groove of the first set of grooves such that the curved portion of each conductive metal strip enters a corresponding groove on the top surface of the first multilayer PCB. The method further comprises mounting a layer of insulating spacers on the bottom surface of the first multilayer PCB for physically segregating each groove of the first set of grooves and hold the first group of battery cells. The method further comprises anchoring the first group of battery cells via the bottom surface of the first multilayer PCB by press-fitting and bolting within the layer of insulating spacers such that the positive terminal of each battery cell comes in contact with the curved portion of each conductive metal strip used as the positive connection point, and a negative terminal of each battery cell is connected with each corresponding negative point of the plurality of negative connection points on the bottom surface of the first multilayer PCB.
The disclosed method achieves all the advantages and technical features of the system of the present disclosure
It is to be appreciated that all the aforementioned implementation forms can be combined.
It has to be noted that all devices, elements, circuitry, units and means described in the present application could be implemented in the software or hardware elements or any kind of combination thereof. All steps which are performed by the various entities described in the present application as well as the functionalities described to be performed by the various entities are intended to mean that the respective entity is adapted to or configured to perform the respective steps and functionalities. Even if, in the following description of specific embodiments, a specific functionality or step to be performed by external entities is not reflected in the description of a specific detailed element of that entity which performs that specific step or functionality, it should be clear for a skilled person that these methods and functionalities can be implemented in respective software or hardware elements, or any kind of combination thereof. It will be appreciated that features of the present disclosure are susceptible to being combined in various combinations without departing from the scope of the present disclosure as defined by the appended claims.
Additional aspects, advantages, features and objects of the present disclosure would be made apparent from the drawings and the detailed description of the illustrative implementations construed in conjunction with the appended claims that follow.
BRIEF DESCRIPTION OF THE DRAWINGS
The summary above, as well as the following detailed description of illustrative embodiments, is better understood when read in conjunction with the appended drawings. For the purpose of illustrating the present disclosure, exemplary constructions of the disclosure are shown in the drawings. However, the present disclosure is not limited to specific methods and instrumentalities disclosed herein. Moreover, those in the art will understand that the drawings are not to scale. Wherever possible, like elements have been indicated by identical numbers.
Embodiments of the present disclosure will now be described, by way of example only, with reference to the following diagrams wherein:
FIGs. 1A, 1B and 1C are different perspective views of a system for interconnection and arrangement of battery cells in a battery pack, in accordance with different embodiments of the present disclosure;
FIG. 2A is a perspective view of a system for interconnection and arrangement of battery cells in a battery pack, in accordance with an embodiment of the present disclosure;
FIGs. 2B and 2C are different perspective views of a system for interconnection and arrangement of battery cells in a battery pack, in accordance with an embodiment of the present disclosure; and
FIG. 3 is a flowchart of a method for interconnecting and arranging battery cells in a battery pack, in accordance with an embodiment of the present disclosure.
In the accompanying drawings, an underlined number is employed to represent an item over which the underlined number is positioned or an item to which the underlined number is adjacent. A non-underlined number relates to an item identified by a line linking the non-underlined number to the item. When a number is non-underlined and accompanied by an associated arrow, the non-underlined number is used to identify a general item at which the arrow is pointing.
DETAILED DESCRIPTION OF EMBODIMENTS
The following detailed description illustrates embodiments of the present disclosure and ways in which they can be implemented. Although some modes of carrying out the present disclosure have been disclosed, those skilled in the art would recognize that other embodiments for carrying out or practicing the present disclosure are also possible.
FIGs. 1A, 1B, and 1C are different perspective views of a system for interconnection and arrangement of battery cells in a battery pack, in accordance with different embodiments of the present disclosure. With reference to FIG. 1A, there is shown a perspective view 100A of a system 102 that includes a first multilayer printed circuit board (PCB) 104 with a top surface 104A, a first set of grooves 106A to 106F, a plurality of conductive metal strips 108A to 108F, and a common positive connection 110. With reference to FIG. 1B, there is shown a perspective view 100B that illustrates different components used by the system 102. The system 102 includes a conductive metal strip 108A of the plurality of conductive metal strips 108A to 108F, the first multilayer PCB 104 with the first set of grooves 106A to 106F, a layer of insulating spacers 112, and a battery cell 114. The battery cell 114 includes a positive terminal 114A, a negative terminal 114B, and an insulating layer 116. With reference to FIG. 1C, there is shown another perspective view 100C of the system 102 that includes a bottom surface 104B of the first multilayer PCB 104, a core layer 118, a common negative connection 120, a plurality of negative connection points 122A to 122F, and the layer of insulating spacers 112
There is provided the system 102 for interconnection and arrangement of battery cells in a battery pack. The system 102 is used to prevent the danger of causing short circuits during the interconnection and arrangement of the battery cells in the battery pack, and also during the assembly as well as disassembly of the battery cells, such as the battery cell 114.
The system 102 includes the first multilayer printed circuit board (PCB) 104 includes the top surface 104A and the bottom surface 104B. The first multilayer PCB 104 corresponds to a double-sided general-purpose PCB that includes the top surface 104A and the bottom surface 104B. In an implementation, the top surface 104A and the bottom surface 104B of the first multilayer PCB 104 are electrically conductive layers, and the electrically conductive layers are separated by the core layer 118 made of a dielectric material in the first multilayer PCB 104. In an example, the electrically conductive layers of the top surface 104A and the bottom surface 104B are made of the copper layer. However, other conductive layers can also be used without limiting the scope of the invention. Moreover, the core layer 118 is made of the dielectric material with a specific dielectric constant value, such as FR-4 dielectric material with a dielectric constant of around 4.3, as shown in FIG. 1C. The core layer 118 is used to separate the electrically conductive layers of the top surface 104A and the bottom surface 104B, such as to form a capacitor-like structure. The core layer 118 is also beneficial to avoid short-circuiting during the arrangement of the first group of battery cells, and also achieve a safety concept in case of a thermal runaway of the first set of battery cells, such as the battery cell 114.
The first multilayer PCB 104 includes the first set of grooves 106A to 106F formed as through-holes in the first multilayer PCB 104. In an example, the first set of grooves 106A to 106F is formed through drilling, such as drilling the through-holes from the top surface 104A to the bottom surface 104B and also via the core layer 118, as further shown in FIGs. 1B and 1C. The first set of grooves 106A to 106F is beneficial for the arrangement of the first group of battery cells. In an implementation, the first multilayer PCB 104 of the system 102 includes more than six grooves. Moreover, the first multilayer PCB 104 is used as a base to support interconnection between the first group of battery cells in the battery pack, and each battery cell of the first group of battery cells has a positive terminal on a first surface and a negative terminal surrounding the positive terminal on the same first surface. In an example, each battery cell from the first group of battery cells corresponds to cylindrical cells that include the positive terminal on the first surface (e.g., top surface) and the negative terminal surrounding the positive terminal on the same first surface. For example, the battery cell 114 of FIG. 1B includes the positive terminal 114A on the first surface (e.g., top surface) and the negative terminal 114B surrounding the positive terminal on the same first surface. Moreover, the positive terminal 114A and the negative terminal 114B are separated by the insulating layer 116, as shown in FIG. 1B. In an example, other types of battery cells can also be used in the battery pack without limiting the scope of the invention. In another example, the battery pack includes two or more groups of battery cells, as further shown in FIG. 2C.
The system 102 further includes the plurality of conductive metal strips 108A to 108F that are used as a plurality of positive connection points on the top surface 104A of the first multilayer PCB 104. Each conductive metal strip has a curved portion, and each conductive metal strip is arranged on one groove of the first set of grooves 106A to 106F such that the curved portion of each conductive metal strip enters a corresponding groove on the top surface 104A of the first multilayer PCB 104, as shown in an extended part of FIG. 1A and 1B. The plurality of conductive metal strips 108A to 108F is arranged on the top surface 104A of the first multilayer PCB 104 so as to form the plurality of positive connection points, such as to form the common positive connection 110 of FIG. 1A. Moreover, each conductive metal strip is arranged on one groove of the first set of grooves 106A to 106F. For example, the conductive metal strip 108A is used as a first positive connection point that is arranged on the top surface 104A of the first multilayer PCB 104, and also on a groove 106A. Moreover, a curved portion of the conductive metal strip 108A also enters within the groove 106A from the top surface 104A of the first multilayer PCB 104. Similarly, a conductive metal strip 108B is used as a second positive connection point that is arranged on the top surface 104A of the first multilayer PCB 104, and also on a groove 106B, and the like. In addition, a curved portion of the conductive metal strip 108B also enters within the groove 106B from the top surface 104A of the first multilayer PCB 104, and other conductive metal strips are arranged also on the top surface 104A of the first multilayer PCB 104 in a similar manner, as shown in FIG. 1A. The curved portion of each conductive metal strip is beneficial to connect with the positive terminal of a corresponding battery cell, as further shown and described in FIG. 2B. In an implementation, each conductive metal strip is electrically connected with the top surface 104A of the first multilayer PCB 104, which is beneficial for further connection with a second multilayer PCB as further shown and described in FIG. 2C.
In accordance with an embodiment, each conductive metal strip is spot welded on either side of the groove of the first set of grooves 106A to 106F on the top surface 104A of the first multilayer PCB 104. In such embodiments, an overall cost of production, as well as an overall electrical resistance on the top surface 104A of the first multilayer PCB 104, is reduced. In such embodiment, each conductive metal strip of the plurality of conductive metal strips 108A to 108F is a nickel strip or a nickel plated metal strip. The nickel strip or the nickel plated metal strip are good conductors of electricity and are beneficial to reduce the overall electrical resistance on the top surface 104A of the first multilayer PCB 104.
With reference to FIG. 1C, there is shown that the system 102 further includes the plurality of negative connection points 122A to 122F formed on the bottom surface 104B of the first multilayer PCB 104 around each groove of the first set of grooves 106A to 106F. For example, a negative connection point 122A is formed on the bottom surface 104B of the first multilayer PCB 104 and around the groove 106A, and similarly, other negative connection points are formed around other grooves. In an implementation, each negative point from the plurality of negative connection points 122A to 122F is formed as a part of the bottom surface 104B of the first multilayer PCB 104. The system 102 further includes the layer of insulating spacers 112 that is arranged on the bottom surface 104B of the first multilayer PCB 104 to physically segregate each groove of the first set of grooves 106A to 106F and hold the first group of battery cells. In an example, the layer of insulating spacers 112 is a single piece that is arranged through glue on the bottom surface 104B of the first multilayer PCB 104, as shown in FIG. 1B. In another example, the layer of insulating spacers 112 includes a plurality of insulators for each groove from the first set of grooves 106A to 106F, as shown in FIG. 1C. The layer of insulating spacers 112 is beneficial to physically segregate each groove of the first set of grooves 106A to 106F and hold the first group of battery cells with reduced cost. The layer of insulating spacers 112 is also beneficial to avoid short circuits during the arrangement of the first group of battery cells.
The first group of battery cells is arranged via the bottom surface 104B of the first multilayer PCB 104 by press-fit and bolting within the layer of insulating spacers 112 such that the positive terminal of each battery cell comes in contact with the curved portion of each conductive metal strip used as the positive connection point, and a negative terminal of each battery cell is connected with each corresponding negative point of the plurality of negative connection points 122A to 122F on the bottom surface 104B of the first multilayer PCB 104. For example, the battery cell 114 is arranged by press-fit and bolting within the layer of insulating spacers 112 and through the bottom surface 104B of the first multilayer PCB 104. As a result, the positive terminal 114A of the battery cell 114 is connected with the curved portion of the conductive metal strip 108A, and the negative terminal 114B of the battery cell 114 is connected with the negative connection point 122A of the first multilayer PCB 104. Similarly, another battery cell is arranged by press-fit and bolting within the layer of insulating spacers 112 and through the bottom surface 104B of the first multilayer PCB 104. As a result, the positive terminal of the another battery cell is connected with the curved portion of the conductive metal strip 108B, and the negative terminal of the another battery cell is connected with the negative connection point 122B of the first multilayer PCB 104, and similarly for additional battery cells for the first group of battery cells. By virtue of using the press-fit and bolting for the arrangement of the first group of battery cells, the overall cost of the system 102 is reduced. Moreover, the press-fit and bolting are also beneficial to avoid short-circuiting during the arrangement of the first group of battery cells through the bottom surface 104B of the first multilayer PCB 104.
The system 102 is used for interconnection and arrangement of the battery cells in the battery pack, such as of the first group of battery cells. The first multilayer PCB 104 of the system is beneficial to support interconnection between the first group of battery cells in the battery pack. Moreover, the plurality of conductive metal strips 108A to 108F is beneficial to provide the plurality of positive connection points on the top surface 104A of the first multilayer PCB 104. As the plurality of conductive metal strips 108A to 108F are welded via spot welding, thus an overall cost of production of the system 102 is reduced. Furthermore, as the plurality of negative connection points 122A to 122F is formed as a part of the bottom surface 104B of the first multilayer PCB 104, thus the overall cost of the system 102 is reduced. In addition, the first group of battery cells is arranged via the bottom surface 104B of the first multilayer PCB 104 by press-fit and bolting within the layer of insulating spacers 112. By virtue of using press-fit and bolting, the system 102 is beneficial to avoid short-circuiting during the arrangement of the first group of battery cells through the bottom surface 104B of the first multilayer PCB 104 with reduced cost. Moreover, the press-fit and bolting are also beneficial to reduce assembly time, manufacturing time, and overall cost of the system 102. The system 102 is also beneficial to automatize the assembly as well disassembly of the first group of battery cells through the bottom surface 104B of the first multilayer PCB 104 without causing any damage to the first group of battery cells as well as to the first multilayer PCB 104. As a result, the first group of battery cells can be separated easily from the first multilayer PCB 104. Furthermore, the weight and packaging requirements of the system 102 are also reliable and comparable with the battery packs.
FIG. 2A is a perspective view of a system for interconnection and arrangement of battery cells in a battery pack, in accordance with an embodiment of the present disclosure. With reference to FIG. 2A, there is shown a perspective view 200A of the system 102 that includes the first multilayer printed circuit board (PCB) 104. There is further shown a first group of battery cells 202, a first battery cell 204A, a second battery cell 204B, a first positive terminal 206, a first negative terminal 208, and a first insulating layer 210.
In accordance with another embodiment, each positive terminal of the first group of battery cells 202 arranged on the first multilayer PCB 104 is connected to each other via the plurality of conductive metal strips 108A to 108F to form the common positive connection 110 for the first multilayer PCB 104. Further, each negative terminal of the first group of the battery cells 202 arranged on the first multilayer PCB 104 is connected to each other via the plurality of negative connection points 122A to 122F on the bottom surface 104B to form the common negative connection 120 of the first multilayer PCB 104. For example, the first battery cell 204A of the first group of battery cells 202 includes the first positive terminal 206 that is connected to the positive terminals of each battery cell of the first group of battery cells 202, such as with the second battery cell 204B and with subsequent battery cells. Similarly, the first battery cell 204A of the first group of battery cells 202 includes the first negative terminal 208, which is connected to the negative terminals of each battery cell of the first group of battery cells 202. As a result, the first group of battery cells 202 includes the common positive connection 110, and the common negative connection 120 for the first multilayer PCB 104, as shown in FIG. 2A. The common positive connection 110 and the common negative connection 120 are beneficial to obtain power output from the battery pack with reduced electrical resistance.
FIG. 2B is a perspective view of a system for interconnection and arrangement of battery cells in a battery pack, in accordance with another embodiment of the present disclosure. With reference to FIG. 2B, there is shown a perspective view 200B of the system 102. The perspective view 200B represents an exemplary embodiment of the interconnection and arrangement of the first battery cell 204A, and the second battery cell 204B on the first multilayer PCB 104.
In an implementation, the first group of battery cells is arranged via the bottom surface 104B of the first multilayer PCB 104 by press-fit and bolting within the layer of insulating spacers 112 such that the positive terminal of each battery cell comes in contact with the curved portion of each conductive metal strip used as the positive connection point, and a negative terminal of each battery cell is connected with each corresponding negative connection point of the plurality of negative connection points 122A to 122F on the bottom surface 104B of the first multilayer PCB 104. For example, the first battery cell 204A and the second battery cell 204B are arranged via the bottom surface 104B of the first multilayer PCB 104 by press-fit and bolting within the layer of insulating spacers 112. Therefore, the first positive terminal 206 of the first battery cell 204A comes in contact with the curved portion of the conductive metal strip 108A, and the first negative terminal 208 of the first battery cell 204A comes in contact with the negative connection point 122A on the bottom surface 104B of the first multilayer PCB 104. Similarly, a positive terminal of the battery cell also comes in contact with the curved portion of the conductive metal strip 108B, and a negative terminal of the second battery cell 204B comes in contact with the negative connection point 122B on the bottom surface 104B of the first multilayer PCB 104. Therefore, additional battery cells of the first group of battery cells 202 can be arranged in a similar manner within the battery. Moreover, the common positive connection 110 is used to obtain the output power from the battery pack.
FIG. 2C is a perspective view of a system for interconnection and arrangement of battery cells in a battery pack, in accordance with yet another embodiment of the present disclosure. With reference to FIG. 2C, there is shown a perspective view 200C of the system 102 that includes a second multilayer PCB 212, a second group of battery cells 214, and a battery cell 216. The battery cell 216 further includes a positive terminal 218, a negative terminal 220, and an insulating layer 222. There is further shown the first multilayer printed circuit board (PCB) 104, the first group of battery cells 202, the first battery cell 204A, the second battery cell 204B, the first positive terminal 206, the first negative terminal 208, and the first insulating layer 210.
In accordance with an embodiment, each positive terminal of the first group of battery cells 202 arranged on the first multilayer PCB 104 is connected to each other via the plurality of conductive metal strips 108A to 108F to form the first common positive connection for the first multilayer PCB 104. Moreover, each negative terminal of the first group of the battery cells 202 arranged on the first multilayer PCB 104 is connected to each other via the plurality of negative connection points 122A to 122F on the bottom surface 104B to form the first common negative connection of the first multilayer PCB 104. For example, the first group of battery cells 202 includes the first common positive connection for the first multilayer PCB 104. The first common positive connection is also connected with the plurality of conductive metal strips 108A to 108F of FIG. 1A. The group of battery cells 202 includes the first common negative connection for the first multilayer PCB 104. The first common negative connection is also connected with the plurality of negative connection points 122A to 122F of FIG. 1C.
In such embodiments, the system 102 further includes the second multilayer PCB 212, and the first common positive connection of the first group of battery cells 202 for the first multilayer PCB 104 is connected to a second common negative connection of the second group of battery cells 214 of the second multilayer PCB 212 in the battery pack. The second multilayer PCB 212 includes the second group of battery cells 214, and each battery cell from the second group of battery cells 214 includes the positive terminal and the negative terminal. For example, the battery cell 216 of the second group of battery cells 214 includes the positive terminal 218, and the negative terminal 220 that are separated from each other through the insulating layer 222, and similar to other battery cells of the second group of battery cells 214 of the second multilayer PCB 212. In addition, the second multilayer PCB 212 further includes the second common negative connection that is connected with the first common positive connection of the first group of battery cells 202 for the first multilayer PCB 104 in the battery pack. As a result, the first group of battery cells 202 are connected in parallel with the second group of battery cells 214. Moreover, the first common negative connection of the first group of battery cells 202 of the first multilayer PCB 104 and the second common positive connection of the second group of battery cells 214 of the second multilayer PCB 212 in the battery pack is used to obtain a power output from the battery pack. By virtue of using the second multilayer PCB, and overall output power of the battery pack can be increased.
In accordance with another embodiment, the first common negative connection of the first group of battery cells 202 arranged on the first multilayer PCB 104 is connected to the second common positive connection of the second group of battery cells 214 of the second multilayer PCB 212 in the battery pack. In other words, the first group of battery cells 202 of the first multilayer PCB 104 are connected in parallel with the second group of battery cells 214 of the second multilayer PCB 212. Therefore, the first common positive connection of the first group of battery cells 202 of the first multilayer PCB 104 and the second common negative connection of the second group of battery cells 214 of the second multilayer PCB 212 in the battery pack is used to obtain the power output from the battery pack.
FIG. 3 is a flowchart of a method for interconnecting and arranging battery cells in a battery pack, in accordance with an embodiment of the present disclosure. With reference to FIG. 3 there is shown a flowchart of a method 300. The method includes steps 302 to 308.
The method 300 is used for interconnecting and arranging battery cells in a battery pack. The method 300 is used for preventing the danger of causing short circuits during the interconnection and arrangement of the battery cells in the battery pack, and also during the assembly as well as disassembly of the battery cells.
At step 302, the method 300 includes, providing the first multilayer printed circuit board (PCB) 104 having the top surface 104A and the bottom surface 104B be used as a base to support interconnection between the first group of battery cells 202 in the battery pack. Moreover, each battery cell of the first group of battery cells 202 has a positive terminal on a first surface and a negative terminal surrounding the positive terminal on the same first surface. The first multilayer PCB 104 further includes the first set of grooves 106A to 106F as through-holes. In an implementation, the top surface 104A and the bottom surface 104B of the first multilayer PCB 104 are electrically conductive layers, and the electrically conductive layers are separated by the core layer 118 made of a dielectric material in the first multilayer PCB 104. In an example, the electrically conductive layers of the top surface 104A and the bottom surface 104B are made of the copper layer. Moreover, the core layer 118 is made of the dielectric material with a specific dielectric constant value, such as FR-4 dielectric material with a dielectric constant of around 4.3. The core layer 118 is used to separate the electrically conductive layers of the top surface 104A and the bottom surface 104B, such as to form a capacitor-like structure. The core layer 118 is also beneficial to avoid short-circuiting during the arrangement of the first group of battery cells 202.
The method 300 further includes drilling the first multilayer PCB 104 to form the first set of grooves 106A to 106F as through-holes in the first multilayer PCB 104. The first set of grooves 106A to 106F is beneficial for the arrangement of the first group of battery cells 202. Moreover, the first multilayer PCB 104 is used as the base to support interconnection between the first group of battery cells 202 in the battery pack, and each battery cell of the first group of battery cells 202 has the positive terminal on the first surface and a negative terminal surrounding the positive terminal on the same first surface.
At step 304, the method 300 includes, attaching the plurality of conductive metal strips 108A to 108F as a plurality of positive connection points on the top surface 104A of the first multilayer PCB 104. Moreover, each conductive metal strip has a curved portion, and each conductive metal strip is attached and arranged on one groove of the first set of grooves 106A to 106F such that the curved portion of each conductive metal strip enters a corresponding groove on the top surface 104A of the first multilayer PCB 104.
The method 300 includes forming the plurality of positive connection points by arranging the plurality of conductive metal strips 108A to 108F on the top surface 104A of the first multilayer PCB 104. Moreover, each conductive metal strip is arranged on one groove of the first set of grooves 106A to 106F. For example, the conductive metal strip 108A is used as a first positive connection point that is arranged on the top surface 104A of the first multilayer PCB 104, and also on the groove 106A. Moreover, a curved portion of the conductive metal strip 108A also enters within the groove 106A from the top surface 104A of the first multilayer PCB 104. Similarly, the conductive metal strip 108B is used as a second positive connection point that is arranged on the top surface 104A of the first multilayer PCB 104, and also on the groove 106B, and the like. Moreover, a curved portion of the conductive metal strip 108B also enters within the groove 106B from the top surface 104A of the first multilayer PCB 104, and other conductive metal strips are arranged also on the top surface 104A of the first multilayer PCB 104 in a similar manner. The curved portion of each conductive metal strip is beneficial to connect with the positive terminal of the corresponding battery cell from the first group of battery cells 202. In an implementation, each conductive metal strip is electrically connected with the top surface 104A of the first multilayer PCB 104, which is beneficial for further connection with the second multilayer PCB 212.
In accordance with an embodiment, attaching the plurality of conductive metal strips 108A to 108F includes spot welding each conductive metal strip on either side of a groove of the first set of grooves 106A to 106F on the top surface 104A of the first multilayer PCB 104 to form the plurality of positive connection points on the top surface 104A of the first multilayer PCB 104. In such embodiments, an overall cost of production, as well as an overall resistance on the top surface 104A of the first multilayer PCB 104, is reduced. In such implementation, each conductive metal strip of the plurality of conductive metal strips 108A to 108F is a nickel strip or a nickel plated metal strip. The nickel strip or the nickel plated metal strip are good conductors of electricity and are beneficial for reducing the overall resistance on the top surface 104A of the first multilayer PCB 104.
The method 300 further includes forming the plurality of negative connection points 122A to 122F on the bottom surface 104B of the first multilayer PCB 104 around each groove of the first set of grooves 106A to 106F. For example, the negative connection point 122A is formed on the bottom surface 104B of the first multilayer PCB 104 and around the groove 106A, and similarly, other negative connection points are formed around other grooves.
At step 306, the method 300 includes, mounting the layer of insulating spacers 112 on the bottom surface 104B of the first multilayer PCB 104 for physically segregating each groove of the first set of grooves 106A to 106F and holding the first group of battery cells 202. In an example, the layer of insulating spacers 112 is a single piece that is arranged through glue on the bottom surface 104B of the first multilayer PCB 104. In another example, the layer of insulating spacers 112 includes a plurality of insulators for each groove from the first set of grooves 106A to 106F. The layer of insulating spacers 112 is beneficial to physically segregate each groove of the first set of grooves 106A to 106F and hold the first group of battery cells with reduced cost. The layer of insulating spacers 112 is beneficial to avoid short circuits during the arrangement of the first group of battery cells.
At step 308, the method 300 includes, anchoring the first group of battery cells 202 via the bottom surface 104B of the first multilayer PCB 104 by press-fitting and bolting within the layer of insulating spacers 112 such that the positive terminal of each battery cell comes in contact with the curved portion of each conductive metal strip used as the positive connection point. Moreover, a negative terminal of each battery cell is connected with each corresponding negative point of the plurality of negative connection points 122A to 122F on the bottom surface 104B of the first multilayer PCB 104. For example, the first battery cell 204A is arranged by press-fit and bolting within the layer of insulating spacers 112 and through the bottom surface 104B of the first multilayer PCB 104. As a result, the first positive terminal 206 of the first battery cell 204A is connected with the curved portion of the conductive metal strip 108A, and the first negative terminal 208 of the first battery cell 204A is connected with the negative connection point 122A of the first multilayer PCB 104. By virtue of using the press-fit and bolting for the arrangement of the first group of battery cells, the overall cost of the system 102 is reduced. Moreover, the press-fit and bolting are also beneficial to avoid short-circuiting during the arrangement of the first group of battery cells through the bottom surface 104B of the first multilayer PCB 104.
The method 300 is used for interconnecting and arranging the battery cells in the battery pack, such as interconnecting and arranging the first group of battery cells 202 and the second group of battery cells 214. The first multilayer PCB 104 is beneficial to support interconnection between the first group of battery cells 202 in the battery pack. Moreover, the plurality of conductive metal strips 108A to 108F is beneficial to provide the plurality of positive connection points on the top surface 104A of the first multilayer PCB 104. As the plurality of conductive metal strips 108A to 108F are welded via spot welding, thus the overall cost of production of the system 102 is reduced. Furthermore, as the plurality of negative connection points 122A to 122F is formed as a part of the bottom surface 104B of the first multilayer PCB 104, thus the overall cost of the system 102 is reduced. In addition, the first group of battery cells 202 are arranged through the bottom surface 104B of the first multilayer PCB 104 by press-fitting and bolting within the layer of insulating spacers 112. By virtue of using press-fit and bolting, the method 300 is beneficial to avoid short-circuiting during the arrangement of the first group of battery cells 202 through the bottom surface 104B of the first multilayer PCB 104 with reduced cost.
Modifications to embodiments of the present disclosure described in the foregoing are possible without departing from the scope of the present disclosure as defined by the accompanying claims. Expressions such as "including", "comprising", "incorporating", "have", "is" used to describe and claim the present disclosure are intended to be construed in a non-exclusive manner, namely allowing for items, components or elements not explicitly described also to be present. Reference to the singular is also to be construed to relate to the plural. The word "exemplary" is used herein to mean "serving as an example, instance or illustration". Any embodiment described as “exemplary” is not necessarily to be construed as preferred or advantageous over other embodiments or to exclude the incorporation of features from other embodiments. The word "optionally" is used herein to mean "is provided in some embodiments and not provided in other embodiments". It is appreciated that certain features of the present disclosure, which are, for clarity, described in the context of separate embodiments, may also be provided in combination in a single embodiment. Conversely, various features of the invention, which are, for brevity, described in the context of a single embodiment, may also be provided separately or in any suitable combination or as suitable in any other described embodiment of the disclosure.