Claims:A computer implemented method for simulation of bonded composite components, comprising:
interfacing at least one bonded component with a base component by at least one first interface and interfacing at least one base component with support by at least one second interface;
applying pressure on the at least bonded component and at least two interfaces via at least one base component for joining the at least one bonded component and the base component;
removing pressure after a predetermined time interval for curing; and
simulating the bonded components to get adhesive effect and compression only stiff springs to simulate the effect of the support.
2. The method of claim 1, wherein the bonded component offers significant bending resistance.
3. The method of claim 1, wherein the base component comprising a curved surface and the bonded component comprising an initial geometrical surface.
4. The method of claim 1 comprising a step of computing a spring-back of the base component and also stress due to the spring back.
5. A system comprising;
a finite element model unit for:
interfacing at least one bonded component with a base component by at least one first interface and interfacing at least one base component with a support by at least one second interface;
applying pressure on the at least bonded component and at least two interfaces via at least one base component for joining the at least one bonded component, at least one base component , and the support;
removing pressure on the applied loads after a predetermined time interval for curing; and
simulating the bonded components to get adhesive and compression only stiff springs to simulate the effect of the support.
6. The system of claim 1, wherein the finite element module unit further comprises a interfacing logic configured for interfacing at least one bonded component with a base component by at least one first interface and interfacing the at least one base component with the support by at least one second interface.

7. The system of claim 1, wherein the finite element module unit further comprises a pressure applying logic configured to apply pressure on the at least bonded component and the two interfaces via at least one base component for joining the bonded component, the base component and the support.

8. The system of claim 1, wherein the finite element module unit further comprises a pressure removing logic configured for removing pressure on the applied loads after a predetermined time interval for curing.

9. The system of claim 1, wherein the finite element module unit further comprises a simulating logic configured for simulating the bonded components to get adhesive effect and compression-only stiff springs. , Description:TECHNICAL FIELD
[001] The present disclosure relates to the field of bonding process of bi-materials. More particularly, the present disclosure relates to a system and method for simulation of bonded composite components.
BACKGROUND

[002] Typically, bi-materials used in different engineering applications are divided into three categories, namely, coatings, claddings and bonded components.

[003] Bonded assemblies consist of a base component and a bonded component and pressure loads may be applied so as to bring the two components into contact and a suitable adhesive retains the components together. The applied loads are removed after a predetermined time interval. At the end of the process the bonded component carries some residual stress due to deformation. In addition, the bonded component tries to regain the original shape (spring back effect) and pulls back, to some extent, the base component with it. As a result the base component can also carry some residual stress. It may thus become necessary to modify the original shape, so as to account for the spring-back effect. The residual stress plays another role by affecting the free vibration characteristics and this residual stress can be affect the load carrying capacity of the bonding components.

[004] In the light of aforementioned discussion there exists a need for system and method that would account for all the structural changes which take place.

BRIEF SUMMARY

[005] The following presents a simplified summary of the disclosure in order to provide a basic understanding to the reader. This summary is not an extensive overview of the disclosure and it does not identify key/critical elements of the invention or delineate the scope of the invention. Its sole purpose is to present some concepts disclosed herein in a simplified form as a prelude to the more detailed description that is presented later.

[006] A more complete appreciation of the present invention and the scope thereof can be obtained from the accompanying drawings which are briefly summarized below and the following detailed description of the presently preferred embodiments.

[007] According to an exemplary embodiment, the method provides the load, in magnitude and direction; need to be adequate to bring the two component parts together.

[008] According to an exemplary embodiment, the method includes interfacing one bonded component with a base component by first interface and interfacing the base component with support by second interface.

[009] According to an exemplary embodiment, the method includes applying pressure on the at least bonded component and at least two interfaces via the base component for joining the at least one bonded component, the base component.

[010] According to an exemplary embodiment, the method includes removing pressure on the applied loads after a predetermined time interval for curing.

[011] According to an exemplary embodiment, the method includes simulating the bonded components to get adhesive effect and compression-only stiff springs to simulate the effect of the support.

BRIEF DESCRIPTION OF DRAWINGS

[012] Other objects and advantages of the present invention will become apparent to those skilled in the art upon reading the following detailed description of the preferred embodiments, in conjunction with the accompanying drawings, wherein like reference numerals have been used to designate like elements, and wherein:

[013] FIG. 1 is a diagram depicting a system for simulation of composite bonded components, according to an exemplary embodiment of the present disclosure.

[014] FIG. 2 is a block diagram depicting a system for simulation of composite bonded components, according to an exemplary embodiment of the present disclosure.

[015] FIG. 3 is a block diagram of embodiments shown in FIG. 1 and FIG. 2, according to an exemplary embodiment of the present disclosure.

[016] FIG. 4A- FIG. 4B are diagrams depicting results in response to performing finite element analysis of composite bonded components, according to an exemplary embodiment of the present disclosure.

[017] FIG. 5A- FIG. 5D are diagrams depicting an arch type bonded components in a two-dimensional plane, according to an exemplary embodiment of the present disclosure.

[018] FIG. 6A- FIG. 6C are diagrams depicting a stress static analysis results of the bonded component, according to an exemplary embodiment of the present disclosure.

[019] FIG. 7A- FIG. 7B are diagrams depicting cylindrical surface and conical surface of the bonded component simulation models for three dimensional objects, according to an exemplary embodiment of the present disclosure.

[020] FIG. 8 is a flow chart depicting a method for simulation of bonded composite components, according to an exemplary embodiment of the present disclosure.
DETAILED DESCRIPTION

[021] It is to be understood that the present disclosure is not limited in its application to the details of construction and the arrangement of components set forth in the following description or illustrated in the drawings. The present disclosure is capable of other embodiments and of being practiced or of being carried out in various ways. Also, it is to be understood that the phraseology and terminology used herein is for the purpose of description and should not be regarded as limiting.

[022] The use of “including”, “comprising” or “having” and variations thereof herein is meant to encompass the items listed thereafter and equivalents thereof as well as additional items. The terms “a” and “an” herein do not denote a limitation of quantity, but rather denote the presence of at least one of the referenced item. Further, the use of terms “first”, “second”, and “third”, and the like, herein do not denote any order, quantity, or importance, but rather are used to distinguish one element from another.
[023] Referring to FIG. 1 is a diagram 100 depicting a system for simulation process of composite bonded components, according to an exemplary embodiment of the present disclosure. The present invention may be implemented in a computing device 104 and the system 102 connected over a network 106. The network 106 may include, but not limited to, an Ethernet, a local area network (LAN), or a wide area network (WAN), e.g., the Internet, or a combination of networks. The system 102 displays the simulation results on a display unit of the computing device 104.

[024] As shown in FIG. 1 the computing device 104 and system 102 may include a finite element analysis (FEA) tool which is used to assist in creation, modification, analysis or optimization of a design model and also used to analyze the simulation process of composite bonded components. The simulation may be performed in finite element analysis tools like, ANSYS, ABQUS and NASTRAN known in the art or future implemented.

[025] Referring to FIG. 2 is a block diagram depicting a system 102 for simulation of composite bonded components, according to an exemplary embodiment of the present disclosure. The system 102 may include a finite element module unit 108. The finite element module unit 108 may further includes, a interfacing logic 110, a pressure applying logic 112, a pressure removing logic 114, and a simulating logic 116. The interfacing logic 110 is configured to interfacing a bonded component with a base component by the first interface and interfacing the base component with the support by the second interface.

[026] As shown in FIG. 2 the pressure applying logic 112 may be configured to apply pressure on the at least bonded component and the two interfaces via the base component for joining the bonded component and the base component. The pressure removing logic 114 may be configured for removing pressure on the applied loads after a predetermined time interval for curing. The simulating logic 116 may be configured for simulating the bonded components to get the adhesive effect and compression-only stiff springs to simulate the effect of the support.

[027] Referring to FIG. 3 is a diagram 300 depicting the system 102, according to an exemplary embodiment of the present disclosure. It should be noted, however, that embodiments are not limited to implementation on such computing devices, but may be implemented on any of a variety of different types of computing units within the scope of embodiments hereof. The system 102 is only one example of search and it is not intended to suggest any limitation as to the scope of use or functionality of the disclosure.

[028] As shown in FIG. 3 in some embodiments, the system 102 may include a bus 302, a processor 304, a memory 306, a network device 308, an input device 310, and an output device 312. The bus 302 may include a path that permits communication among the components of the system 102.

[029] As shown in FIG. 3 the memory 306 stores the interfacing logic 110, the pressure applying logic 112, the pressure removing logic 114 and the simulating logic 116. The memory 306 may be any type of computer memory known in the art or future-developed for electronically storing data and/or logic, including volatile and non-volatile memory. In this regard, memory 306 can include random access memory (RAM), read-only memory (ROM), flash memory, any magnetic computer storage unit, including hard disks, floppy discs, or magnetic tapes, and optical discs.

[030] As shown in FIG. 3 the processor 304 comprises processing hardware for interpreting or executing tasks or instructions stored in the memory 306. Note that the processor 304 may be a microprocessor, a digital processor, or other type of circuitry configured to run and/or execute instructions. The network device 308 may be any type of network unit (e.g., a modem) known in the art or future-developed for communicating over a network 106 (FIG. 1).

[031] As shown in FIG. 3 the input device 310 is any type of input unit known in the art or future-developed for receiving data. As an example, the input unit 310 may be a keyboard, a mouse, a touch screen, a serial port, a scanner, a camera, or a microphone. The output device 312 may be any type of output unit known in the art or future-developed for displaying or outputting data. For example, the output device 312 may be a liquid crystal display (LCD) or other type of video display unit, a speaker, or a printer. Further note that, the system 102 components may be implemented by software, hardware, firmware or any combination thereof. In the exemplary system 102, depicted by FIG. 1 and FIG. 2, all the components are implemented by software and stored in the memory 306.

[032] Referring to FIG. 4A- FIG. 4B are diagrams 400a and 400b depicting results in response to performing finite element analysis of bonded composite components, according to an exemplary embodiment of the present disclosure. The system 102 (FIG. 1) may be implemented with a finite element analysis software tool for simulation of composite bonded components. The base component 402 is placed over the support 404 and the two interfaces 408a-408b are at upper and lower parts of the base component 402. The pressure load 410 may be applied on the bonded component 406 and the bonded component 406 may offer significant bending resistance. The base component 402 may be a curved surface and the bonded component 406 may be of any initial geometry.

[033] As shown in FIG. 4A- 4B, the first nonlinearity is due to the bonded component 406 which continuously undergoes change in shape during the application of pressure load 410. After a predetermined time interval on removing the applied pressure load 410, the original shape of the bonded composite component undergoes change and conforms to the profile of the mating surface of the base component. This process may be realized by appropriate simulation of the interface 408b as shown in FIG. 4A. The first nonlinearity feature ability to simulate adhesive effect as shown in FIG. 4B.

[034] As shown in FIG. 4A- 4B, the second nonlinearity is due to the interface 408b between the base component 402 and the support 404 which behave differently for downward and upward application of load. These results may be simulated by using a “compression-only” stiff spring or the inter-surface standard contacts, without limiting the scope of the present disclosure. All the applied loads are removed the components are bonded together. The final shape of the assembly is insensitive to the magnitude and direction and the mode of the application of the pressure load.

[035] Referring to FIG. 5A- FIG. 5D diagrams 500a-500d depicting a 90 degree arch type bonded components in a two-dimensional plane, according to an exemplary embodiment of the present disclosures. As shown in FIG. 5A there is a base component 502, a bonded component 506 and a support 504. The base component 502 may be fixed at end sections, It is placed over the support 504 whose inner surface is fully constrained. The bonded component 506 may be initially flat may be placed horizontally over the base component 502.

[036] As shown in FIG. 5B, the bonding interfaces 508 connects the base and the bonding components. The compression-only springs 510 connects the base component and the support. The bonded component 506 may be initially flat. In this case the length of bonded component 506 is equal to perimeter of the top surface of the base component 502. In general, the shape of the bonded component 506 should match with the development of the interface surface of the base component 502. The implication is that the base component must be developable, if the base component has spherical shape, which is not developable, one cannot get a suitable bonded component.

[037] As shown in FIG. 5C and FIG. 5D the analysis procedure consists of applying loads 512 in a predetermined sequence. For example, the sequence may be P1 – P2 – P3. This gradual application eliminates the possibility of distortion of the bonded component 502. The sequence and the number of sub-steps is arbitrary so also the magnitude of the applied load. The applied loads may be removed after predetermined time interval. The bonded component 506 is no longer in the original shape and hence it will be stressed. A static analysis (loading + unloading) is followed by free vibration analysis for evaluation of natural frequencies needs to be carried out. The natural frequencies are computed using a special type of dynamic analysis called “Prestressed” modal analysis. The analysis, as described can be yielding all important design information. Thus the effects of technological process are fully evaluated.

[038] The results of free vibration analysis may be compared with those obtained from a simpler model. The simpler model is based on the assumption that the two components are initially bonded together as shown in FIG. 5D. The implication is that the process does not introduce any residual effect. The required model may be, for example, as shown in FIG. 5D. At the interface, the two surfaces and the nodes of the finite element mesh are merged.

[039] Referring to FIG. 6A- FIG. 6C are diagrams 600a-600c depicting the stress and modal analysis results of the bonded component, according to an exemplary embodiment of the present disclosures. The diagram 600a shows the stress distribution in the bonded component. The bonded component may be initially flat and hence tries to become flat again. The stiffness of the base component prevents its total recovery. The final shape of the base component is depicted in diagram FIG 6B. In this case the spring back magnitude is not very high.

[040] The normal modes of vibration of the composite assembly (base + bonded component) are shown in FIG. 6C. The support structure does not participate in vibration because it is fully fixed and it is structurally decoupled from the base after load removal. The frequencies for a range of values of important parameters are presented in the table below. The parameters are the ratio of young’s modulus of cover to that of the base (E-R) and the ratio of the cover thickness to base thickness. Models 1 and 2 respectively refer to the rigorous and simple model respectively. As the cover becomes relatively stiffer, it is seen that the error increases.

Table: Comparisons of natural frequencies
Thickness Ratio = 0.4 Thickness Ratio = 0.2
E-R Model 1 Model 2 Error (%) E-R Model 1 Model 2 Error (%)
0.4 806 872 8.2 0.4 1472 1524 3.5
1524 1620 6.3 2545 2606 2.4
2872 2975 3.6 4154 4190 0.9
3581 3634 1.5 4941 5069 2.6
0.6 846 946 11.8 0.6 1516 1600 5.5
1613 1753 8.7 2617 2708 3.5
3011 3226 7.1 4269 4277 0.2
3753 3810 1.5 5116 5306 3.7
0.8 878 1008 14.8 0.8 1552 1666 7.3
1686 1862 10.4 2679 2797 4.4
3166 3431 8.4 4377 4389 0.3
3898 3961 1.6 5267 5513 4.7
1 903 1059 17.3 1 1583 1725 9.0
1746 1942 11.2 2734 2877 5.2
3296 3602 9.3 4479 4493 0.3
4031 4097 1.6 5401 5697 5.5

[041] Referring to FIG. 7A- FIG. 7B are diagrams 700a-700b depicting cylindrical surface and conical surface of the bonded component simulation models for three dimensional objects, according to an exemplary embodiment of the present disclosure. The cylindrical surface bonded component may include a cantilever plate with curved surface, and also includes a base component 702, a support 704, and a bonded component 706. The base component 702 may be placed over the support 704 for bonding. The bonded component 706 may be placed over on the curved surface of the base component 702 and the support 704. The load 708 may be gradually applied starting from the fixed end and proceeding towards the free end as shown (diagram 708) for allowing a bonding between them. The simulation models for both cylindrical surface and conical surface of the bonded component are shown in FIG. 7A and FIG. 7B.

[042] Referring to FIG. 8 is a flow chart 800 depicting a method for simulation of bonded composite components, according to an exemplary embodiment of the present disclosure. The method starts at step 802 by interfacing at least one bonded component with a base component by at least one first interface. The method continues to next step 804 by interfacing at least one base component with support by at least one second interface. The method continues to next step 806 by applying pressure on the at least bonded component and at least two interfaces via at least one base component for joining the at least one bonded component, at least one base component, and the support. The method continues to next step 808 by removing pressure or applied load after a predetermined time interval for curing. The method continues to next step 810 by simulating the bonded components to get adhesive and compression only stiff springs to simulate the effect of the support.

[043] Although the present disclosure has been described in terms of certain preferred embodiments and illustrations thereof, other embodiments and modifications to preferred embodiments may be possible that are within the principles and spirit of the invention. The above descriptions and figures are therefore to be regarded as illustrative and not restrictive.

[044] Thus the scope of the present disclosure is defined by the appended claims and includes both combinations and sub combinations of the various features described herein above as well as variations and modifications thereof, which would occur to persons skilled in the art upon reading the foregoing description.