DESC:EARLIEST PRIORITY DATE:
This Application claims priority from a Provisional patent application filed in India having Patent Application No. 202021048860, filed on November 09, 2020 and titled “A SYSTEM FOR HEAT PIPE-BASED HEAT EXCHANGER”.
FIELD OF INVENTION
[0001] Embodiments of a present disclosure relate to a heat exchanger, and more particularly, to a system for a heat pipe-based heat exchanger.
BACKGROUND
[0002] A heat exchanger is a system used to transfer heat between two or more fluids. Heat exchangers are used in both cooling and heating processes. The fluids may be separated by a solid wall to prevent mixing or they may be in direct contact. They are widely used in space heating, refrigeration, air conditioning, power stations, chemical plants, petrochemical plants, petroleum refineries, natural-gas processing, sewage treatment, and the like. In one approach, wet scrubber-based technology is used for emission control from furnaces and boilers. However, such an approach with high water evaporation rates and high relative humidity (RH) of outlet gas impacts the visibility of the exhaust gases.
[0003] In another approach, a fin-type heat exchanger is used to overcome the visibility of the exhaust gases. However, the overall pressure drop obtained from the system used this approach is generally very restrictive for furnaces and boilers which have limited capability to support backpressure. Also, these fin type heat exchangers cannot solve the RH issue of the outlet exhaust gas. In addition, temperature drop of in the existing system is not significant for naturally cooled heat exchanger. Also, for forced convection, power required will add to the parasitic losses. Furthermore, for water or oil cooled heat exchangers, maintenance of such system is huge issue.
[0004] Hence, there is a need for an improved system for a heat pipe-based heat exchanger to address the aforementioned issue/s.

BRIEF DESCRIPTION
[0005] In accordance with one embodiment of the disclosure, a system for heat pipe-based heat exchanger is provided. the system includes a casing. The casing includes one or more heat pipes arranged in a pre- defined pattern. The casing also includes a first channel configured to receive the hot fluid via a first inlet, to enable the hot fluid to release heat to the heat exchanging fluid flowing through each of the one or more heat pipes and to eliminate the hot fluid which has released the heat via a first outlet. The casing also includes a second channel configured to receive the cold fluid via a second inlet, to enable the cold fluid to gain heat from the heat exchanging fluid flowing through each of the one or more heat pipes and to eliminate the cold fluid which has gained the heat via a second outlet. The first channel is operatively coupled to the second channel via an interface. The casing also includes one or more baffles of a pre-defined shape. The one or more baffles is configured to direct the hot fluid and the cold fluid towards the one or more heat pipes.
[0006] To further clarify the advantages and features of the present disclosure, a more particular description of the disclosure will follow by reference to specific embodiments thereof, which are illustrated in the appended figures. It is to be appreciated that these figures depict only typical embodiments of the disclosure and are therefore not to be considered limiting in scope. The disclosure will be described and explained with additional specificity and detail with the appended figures.
BRIEF DESCRIPTION OF THE DRAWINGS
The disclosure will be described and explained with additional specificity and detail with the accompanying figures in which:
[0007] FIG. 1 is a block diagram representation of a system for a heat pipe-based heat exchanger in accordance with an embodiment of the present disclosure;
[0008] FIG. 2 is a schematic representation of a Computational Fluid Dynamics (CFD) analysis result for one or more velocity contours along an X-Y plane for the system of FIG. 1 in accordance with an embodiment of the present disclosure;
[0009] FIG. 3 is a schematic representation of a CFD analysis result for one or more pressure contours along the X-Y plane for the system of FIG 1 in accordance with an embodiment of the present disclosure; and
[0010] FIG. 4 is a schematic representation of a CFD analysis result for one or more velocity path lines in the system of FIG 1 in accordance with an embodiment of the present disclosure.
[0011] Further, those skilled in the art will appreciate that elements in the figures are illustrated for simplicity and may not have necessarily been drawn to scale. Furthermore, in terms of the construction of the device, one or more components of the device may have been represented in the figures by conventional symbols, and the figures may show only those specific details that are pertinent to understanding the embodiments of the present disclosure so as not to obscure the figures with details that will be readily apparent to those skilled in the art having the benefit of the description herein.
DETAILED DESCRIPTION
[0012] For the purpose of promoting an understanding of the principles of the disclosure, reference will now be made to the embodiment illustrated in the figures and specific language will be used to describe them. It will nevertheless be understood that no limitation of the scope of the disclosure is thereby intended. Such alterations and further modifications in the illustrated system, and such further applications of the principles of the disclosure as would normally occur to those skilled in the art are to be construed as being within the scope of the present disclosure.
[0013] The terms "comprises", "comprising", or any other variations thereof, are intended to cover a non-exclusive inclusion, such that a process or method that comprises a list of steps does not include only those steps but may include other steps not expressly listed or inherent to such a process or method. Similarly, one or more devices or sub-systems or elements or structures or components preceded by "comprises... a" does not, without more constraints, preclude the existence of other devices, sub-systems, elements, structures, components, additional devices, additional sub-systems, additional elements, additional structures or additional components. Appearances of the phrase "in an embodiment", "in another embodiment" and similar language throughout this specification may, but not necessarily do, all refer to the same embodiment.
[0014] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this disclosure belongs. The system, methods, and examples provided herein are only illustrative and not intended to be limiting.
[0015] In the following specification and the claims, reference will be made to a number of terms, which shall be defined to have the following meanings. The singular forms “a”, “an”, and “the” include plural references unless the context clearly dictates otherwise.
[0016] Embodiments of the present disclosure relate to a system for heat pipe-based heat exchanger. The system includes a casing. The casing includes one or more heat pipes arranged in a pre- defined pattern. The casing also includes a first channel configured to receive the hot fluid via a first inlet, to enable the hot fluid to release heat to the heat exchanging fluid flowing through each of the one or more heat pipes and to eliminate the hot fluid which has released the heat via a first outlet. The casing also includes a second channel configured to receive the cold fluid via a second inlet, to enable the cold fluid to gain heat from the heat exchanging fluid flowing through each of the one or more heat pipes and to eliminate the cold fluid which has gained the heat via a second outlet. The first channel is operatively coupled to the second channel via an interface. The casing also includes one or more baffles of a pre-defined shape. The one or more baffles is configured to direct the hot fluid and the cold fluid towards the one or more heat pipes.
[0017] FIG. 1 is a block diagram representation of a system (10) for heat pipe-based heat exchanger in accordance with an embodiment of the present disclosure. The system (10) includes a casing (20). The casing includes one or more heat pipes (30) arranged in a pre- defined pattern. In one embodiment, a count of the one or more heat pipes (30) may be about ten. In one embodiment, the pre-defined pattern may be a staggered pattern so that distance between each of the one or more heat pipes (30) is such that not even one of the one or more heat pipes (30) should come in the fluid wake formed by one or more exhaust fluids as the one or more exhaust fluids pass through each of the one or more heat pipes (30) to maximum effectiveness from each of the one or more heat pipes (30). In one exemplary embodiment, the one or more fluids may include one of hot fluid, cold fluid, or a combination thereof. In such embodiment, the one or more fluids may be in one of a form of gas, liquid, plasma, or the like.
[0018] The one or more heat pipes (30) include a heat exchanging fluid flowing through each of the one or more heat pipes (30). The one or more heat pipes (30) are one or more heat transfer devices which are configured to combine a principle of both thermal conductivity and phase transition to effectively transfer heat between two solid interfaces. In one exemplary embodiment, the system (10) may further include one or more fins. The one or more fins are operatively coupled to the one or more heat pipes (30). The one or more fins may be configured to increase an overall surface area which will increase the effectiveness of the one or more heat pipes (30).
[0019] Furthermore, the casing (20) includes a first channel (40). The casing also includes a second channel (50). The first channel (40) is operatively coupled to the second channel (50) via an interface. The interface includes one or more holes (100), wherein the one or more heat pipes (30) pass through the one or more holes (100). The first channel (40) is configured to receive the hot fluid via a first inlet (60). The first channel (40) is also configured to enable the hot fluid to release heat to the heat exchanging fluid flowing through each of the one or more heat pipes (30). The first channel (40) is also configured to eliminate the hot fluid which has released the heat via a first outlet (70). In one exemplary embodiment, the first channel (40) may correspond to an evaporator.
[0020] The second channel (50) is configured to receive the cold fluid via a second inlet (80). The second channel (50) is also configured to enable the cold fluid to gain heat from the heat exchanging fluid flowing through each of the one or more heat pipes (30). The second channel (50) is also configured to eliminate the cold fluid which has gained the heat via a second outlet (90). In one exemplary embodiment, the second channel (50) may correspond to a condenser.
[0021] Furthermore, the casing (20) includes one or more baffles (110) of a pre-defined shape. The one or more baffles (110) are designed in such a way that the hot fluid and the cold fluid are directed towards the one or more heat pipes (30) with minimal backpressure. In one embodiment, the pre-defined shape of the one or more baffles (110) includes a diamond shape, an annular shape, and the like.
[0022] In operation, heat exchanging fluids are made to flow through the one or more heat pipes (30) continuously. Further, the hot fluid from a source is received into the casing via the first inlet (60) at the first channel (40). As the hot gas passes through the one or more heat pipes (30), the heat from the hot fluid is released to the heat exchanging fluid. The hot fluid upon removing the heat is passed out of the first channel (40) via the first outlet (70). Simultaneously, cold fluid is received by the second inlet (80) into the second channel (50). The cold fluid is made to gain heat from the heat exchanging fluid flowing through each of the one or more heat pipes (30). The cold fluid upon gaining heat from the one or more heat pipes (90) is transmitted out of the second channel (80) via the second outlet (90). The cold fluid and the hot fluid entering the chamber is directed towards the one or more heat pipes (30) by the one or more baffles (110).
[0023] FIG. 2 is a schematic representation of a Computational Fluid Dynamics (CFD) analysis result (120) for one or more velocity contours along an X-Y plane for the system (10) of FIG. 1 in accordance with an embodiment of the present disclosure. As used herein, the term “CFD” is defined as a science that, with the help of digital computers, produces quantitative predictions of fluid-flow phenomena based on the conservation laws (conservation of mass, momentum, and energy) governing fluid motion.
[0024] FIG. 3 is a schematic representation of a CFD analysis result (130) for one or more pressure contours along the X-Y plane for the system (10) of FIG 1 in accordance with an embodiment of the present disclosure.
[0025] FIG. 4 is a schematic representation of a CFD analysis result (140) for one or more velocity pathlines in the system (10) of FIG 1 in accordance with an embodiment of the present disclosure. FIG. 4 shows an enhanced interaction of the exhaust flow with the heat pipe which in turn results in drastic increase in the heat transfer. Thus, more temperature drop can be achieved in the lower chamber. Further, the velocity and pressure contours (as shown in FIGs 2 and 3) are representing the absolute velocity and total pressure values at a particular section of the system (10). Velocity and pressure contours (FIG 2 & 3) are representing the absolute velocity and total pressure values at a particular section of the system (10).
[0026] In one embodiment, the plurality of parameters included for the CFD analysis are as listed below:
1. Simulation type: 3D
2. Mesh type: Tetra + Prism
3. Multiphase Model: NA
4. Turbulence model: K-e (Realizable)
5. Wall Treatment: Enhanced
6. Energy model: ON
7. Boundary conditions applied:
• Inlet Exhaust: Mass Flow of exhaust in kg/s, Temperature in K
• Device Inlet: Pressure outlet: 0 Pa-g
• Device Outlet: Mass Flow rate of Exhaust in kg/s, Temperature in K
• Main Outlet: Pressure Outlet: 0 Pa-g
8. Material properties used:
• Solid: Steel
9. Density: in kg/m^3
10. Thermal Conductivity in W/m-K
• Fluid: Air: Ideal Gas
11. Density: NA
12. Viscosity: Sutherland Approach
[0027] Various embodiments of the present disclosure enable maximizing the heat drop in the one or more exhaust fluids as a heat pipe arrangement used is specifically designed with diamond shape arrangement. The system transfers heat from an exhaust inlet of a scrubber to an exhaust outlet with minimal back pressure to the exhaust. This helps to resolve a visibility issue of the one or more exhaust fluids while being within acceptable backpressure limits.
[0028] Also, these fin type heat exchangers solves the RH issue of the outlet exhaust gas. In addition, temperature drop of in the system is significant for naturally cooled heat exchanger. Also, for forced convection, power required will not add to the parasitic losses, thereby making the system consume less power and is being more efficient. In addition, maintenance of the system is easy and is user friendly.
[0029] Further, enhance heat transfer annular baffles can be provided inside Drums which will increase turbulence and thermal mass of the drum. Also, with the help of forced convection overall heat transfer coefficient increases. Moreover, with Dual Finned Tube heat exchanger fans can be provided and arranged in such a way that air with high velocity covers all the parts of the heat exchanger.
[0030] While specific language has been used to describe the disclosure, any limitations arising on account of the same are not intended. As would be apparent to a person skilled in the art, various working modifications may be made to the method in order to implement the inventive concept as taught herein.
[0031] The figures and the foregoing description give examples of embodiments. Those skilled in the art will appreciate that one or more of the described elements may well be combined into a single functional element. Alternatively, certain elements may be split into multiple functional elements. Elements from one embodiment may be added to another embodiment. For example, order of processes described herein may be changed and are not limited to the manner described herein. Moreover, the actions of any flow diagram need not be implemented in the order shown; nor do all of the acts need to be necessarily performed. Also, those acts that are not dependent on other acts may be performed in parallel with the other acts. The scope of embodiments is by no means limited by these specific examples.
,CLAIMS:1. A system (10) for heat pipe-based heat exchanger, wherein the system (10) comprises:
a casing (20) comprising:
one or more heat pipes (30) arranged in a pre- defined pattern;
a first channel (40) configured to:
receive the hot fluid via a first inlet (60);
enable the hot fluid to release heat to the heat exchanging fluid flowing through each of the one or more heat pipes (30); and
eliminate the hot fluid which has released the heat via a first outlet (70);
a second channel (50) configured to:
receive the cold fluid via a second inlet (80);
enable the cold fluid to gain heat from the heat exchanging fluid flowing through each of the one or more heat pipes (30); and
eliminate the cold fluid which has gained the heat via a second outlet (90),
wherein the first channel (40) is operatively coupled to the second channel (50) via an interface, wherein the interface comprises one or more holes (100); and
one or more baffles (110) of a pre-defined shape, and configured to direct the hot fluid and the cold fluid towards the one or more heat pipes (30).
2. The system (10) as claimed in claim 1, wherein the fluids include one of hot fluid, cold fluid, or a combination thereof.
3. The system (10) as claimed in claim 1, wherein the pre-defined shape of the one or more baffles (110) comprises one of a diamond shape or an annular shape.
4. The system (10) as claimed in claim 1, wherein the first channel (40) corresponds to an evaporator.
5. The system (10) as claimed in claim 1, wherein the second channel (50) corresponds to a condenser.
6. The system (10) as claimed in claim 1, comprising one or more fins are operatively coupled to the one or more heat pipes (30), wherein the one or more fins is configured to increase an overall surface area which will increase the effectiveness of the one or more heat pipes (30).

Dated this 28th day of May 2021

Signature

Harish Naidu
Patent Agent (IN/PA-2896)
Agent for the Applicant