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System In Package Using Embedded Die Coreless Substrates And Processes Of Forming Same
Abstract: An apparatus includes a coreless substrate with an embedded die that is integral to the coreless substrate and at least one device assembled on a surface that is opposite to a ball-grid array disposed on the coreless substrate. The apparatus may include an over-mold layer to protect the at least one device assembled on the surface.
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Notices, Deadlines & Correspondence
Notices, Deadlines & Correspondence
Patent Information
Application #
Filing Date
29 August 2012
Publication Number
51/2014
Publication Type
INA
Invention Field
ELECTRICAL
Status
Email
Parent Application
Patent Number
Legal Status
Grant Date
2021-03-25
Renewal Date
Applicants
INTEL CORPORATION
2200 MISSION COLLEGE BLVD. SANTA CLARA CA 95052 USA
Inventors
1. GUZEK John S.
805 W. Beechnut Dr. Chandler AZ 85248 (US).
2. NAIR Vijay
3430 N. Mountain Ridge Unit 35 Mesa AZ 85207 (US).
Specification
An apparatus includes a coreless substrate with an embedded die that is integral to the coreless substrate and at least one device assembled on a surface that is opposite to a ball-grid array disposed on the coreless substrate. The apparatus may include an over-mold layer to protect the at least one device assembled on the surface.
Documents
Application Documents
| # | Name | Date |
|---|---|---|
| 1 | Form-1.pdf | 2012-09-04 |
| 2 | Drawings.pdf | 2012-09-04 |
| 3 | 7453-CHENP-2012 FORM-18 18-10-2012.pdf | 2012-10-18 |
| 4 | 7453-CHENP-2012 CORRESPONDENCE OTHERS 18-10-2012.pdf | 2012-10-18 |
| 5 | 7453-CHENP-2012 CORRESPONDENCE OTHERS. 20-02-2013.pdf | 2013-02-20 |
| 6 | 7453-CHENP-2012 CORRESPONDENCE OTHERS 20-02-2013.pdf | 2013-02-20 |
| 7 | 7453-CHENP-2012 FORM-3 20-02-2013.pdf | 2013-02-20 |
| 8 | 7453-CHENP-2012 ASSIGNMENT 20-02-2013.pdf | 2013-02-20 |
| 9 | 7453-CHENP-2012 POWER OF ATTORNEY 07-05-2013.pdf | 2013-05-07 |
| 10 | 7453-CHENP-2012 CORRESPONDENCE OTHERS 07-05-2013.pdf | 2013-05-07 |
| 11 | FORM-2.pdf | 2014-11-26 |
| 12 | abstract7453-CHENP-2012.jpg | 2014-11-26 |
| 13 | ABSTRACT.pdf | 2014-11-26 |
| 14 | 7453-CHENP-2012-FER.pdf | 2018-02-07 |
| 15 | 7453-CHENP-2012-Information under section 8(2) (MANDATORY) [16-05-2018(online)].pdf | 2018-05-16 |
| 16 | 7453-CHENP-2012-FORM 3 [16-05-2018(online)].pdf | 2018-05-16 |
| 17 | 7453-CHENP-2012-OTHERS [30-05-2018(online)].pdf | 2018-05-30 |
| 18 | 7453-CHENP-2012-FER_SER_REPLY [30-05-2018(online)].pdf | 2018-05-30 |
| 19 | 7453-CHENP-2012-COMPLETE SPECIFICATION [30-05-2018(online)].pdf | 2018-05-30 |
| 20 | 7453-CHENP-2012-Correspondence to notify the Controller [12-10-2020(online)].pdf | 2020-10-12 |
| 21 | 7453-CHENP-2012-Correspondence to notify the Controller [27-10-2020(online)].pdf | 2020-10-27 |
| 22 | 7453-CHENP-2012-Information under section 8(2) [16-11-2020(online)].pdf | 2020-11-16 |
| 23 | 7453-CHENP-2012-FORM 3 [16-11-2020(online)].pdf | 2020-11-16 |
| 24 | 7453-CHENP-2012-Written submissions and relevant documents [17-11-2020(online)].pdf | 2020-11-17 |
| 25 | 7453-CHENP-2012-PatentCertificate25-03-2021.pdf | 2021-03-25 |
| 26 | 7453-CHENP-2012-IntimationOfGrant25-03-2021.pdf | 2021-03-25 |
| 27 | 7453-CHENP-2012-US(14)-HearingNotice-(HearingDate-27-10-2020).pdf | 2021-10-17 |
| 28 | 7453-CHENP-2012-US(14)-ExtendedHearingNotice-(HearingDate-02-11-2020).pdf | 2021-10-17 |
| 29 | 7453-CHENP-2012-RELEVANT DOCUMENTS [24-09-2022(online)].pdf | 2022-09-24 |
| 30 | 7453-CHENP-2012-RELEVANT DOCUMENTS [15-09-2023(online)].pdf | 2023-09-15 |
| 31 | 7453-CHENP-2012-FORM-27 [28-09-2024(online)].pdf | 2024-09-28 |
Search Strategy
| 1 | SEARCHSTRATEGY_13-11-2017.pdf |