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Systems And Methods For Module Configurability

Abstract: A component (e.g. a module configuration system) of a device may include an interface and processor circuitry. The processor circuitry may be configured to: determine identification information of a hardware device (e.g. module, microchip) connected to the component via the interface; obtain device information for the connected hardware device based on the determined identification information; and initialize the connected hardware device based on the obtained device information.

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Notices, Deadlines & Correspondence

Patent Information

Application #
Filing Date
23 November 2021
Publication Number
25/2022
Publication Type
INA
Invention Field
COMPUTER SCIENCE
Status
Email
ipo@iphorizons.com
Parent Application

Applicants

INTEL CORPORATION
2200 Mission College Boulevard, Santa Clara, California 95054, USA

Inventors

1. EHUD RESHEF
16 Rabin Yitzhak Street, Qiryat Tivon, ISRAEL 36551
2. EYTAN MANN
Sara Imenu 120/1, Modiin M, ISRAEL 71727
3. MARKUS DOMINIK MUECK
Jaegerstrasse 4B, Unterhaching, GERMANY 82008

Specification

Claims:1. A component of a device, comprising:
interface means; and
processing means for:
determining identification information of a hardware device operably connected to the component via the interface means;
obtaining device information for the connected hardware device based on the determined identification information; and
initializing the connected hardware device based on the obtained device information.
, Description:TECHNICAL FIELD
[0001] Various aspects of this disclosure generally relate to module configuration systems and methods. Some aspects relate to cloud-based configurations.

BACKGROUND
[0002] Wireless transmitters are configured to comply with one or more regulatory constraints (e.g. max Transmission power, Error Vector Magnitude (EVM), etc.) and/or module-specific configurations (e.g. stock-keeping unit (SKU)). The specific settings for individual transmitters may be different due to silicon and bill-of-material (BOM) performance variations. The configurations are generally encoded into a secure memory, such as a One Time Programmable (OTP) memory, on the module during production. This generally requires embedding fairly large OTP memories into module, such as on the radio-frequency (RF) and media access control (MAC) portions of the implementation.

BRIEF DESCRIPTION OF THE DRAWINGS/FIGURES
[0003] The accompanying drawings, which are incorporated herein and form a part of the specification, illustrate the aspects of the present disclosure and, together with the description, further serve to explain the principles of the aspects and to enable a person skilled in the pertinent art to make and use the aspects.
[0004] FIG. 1 illustrates a module configuration system according to exemplary aspects of the present disclosure.
[0005] FIG. 2 illustrates a module configuration system according to exemplary aspects of the present disclosure.
[0006] FIG. 3 illustrates a configurable device according to exemplary aspects of the present disclosure.
[0007] FIGS. 4A-4B illustrate a configurable module or chip according to exemplary aspects of the present disclosure.
[0008] FIG. 5 illustrates the communication device according to exemplary aspects of the present disclosure.
[0009] FIG. 6 is a flowchart of a module manufacturing method according to an exemplary aspect of the present disclosure.
[0010] FIG. 7 is a flowchart of a module configuration method according to an exemplary aspect of the present disclosure.
[0011] FIG. 8A is a flowchart of a module configuration method according to an exemplary aspect of the present disclosure.
[0012] FIG. 8B is a flowchart of a module configuration method according to an exemplary aspect of the present disclosure.
[0013] FIGS. 9A-9C illustrate example packet structures according exemplary aspects of the present disclosure.
[0014] FIG. 10 is an example computer system according to an exemplary aspect of the present disclosure.
[0015] The exemplary aspects of the present disclosure will be described with reference to the accompanying drawings. The drawing in which an element first appears is typically indicated by the leftmost digit(s) in the corresponding reference number.

DETAILED DESCRIPTION
[0016] In the following description, numerous specific details are set forth in order to provide a thorough understanding of the aspects of the present disclosure. However, it will be apparent to those skilled in the art that the aspects, including structures, systems, and methods, may be practiced without these specific details. The description and representation herein are the common means used by those experienced or skilled in the art to most effectively convey the substance of their work to others skilled in the art. In other instances, well-known methods, procedures, components, and circuitry have not been described in detail to avoid unnecessarily obscuring aspects of the disclosure.

Documents

Application Documents

# Name Date
1 202144053755-FORM 1 [23-11-2021(online)].pdf 2021-11-23
2 202144053755-DRAWINGS [23-11-2021(online)].pdf 2021-11-23
3 202144053755-DECLARATION OF INVENTORSHIP (FORM 5) [23-11-2021(online)].pdf 2021-11-23
4 202144053755-COMPLETE SPECIFICATION [23-11-2021(online)].pdf 2021-11-23
5 202144053755-FORM-26 [23-02-2022(online)].pdf 2022-02-23
6 202144053755-FORM 3 [23-05-2022(online)].pdf 2022-05-23
7 202144053755-FORM 3 [23-11-2022(online)].pdf 2022-11-23
8 202144053755-FORM 18 [17-12-2024(online)].pdf 2024-12-17