Claims:CLAIMS

We claim:
1. A tamper-proof resistor based smart envelope (100), comprising:
at least three substrates (1, 2, 3); and
an electronic assembly module (4);
wherein,
said substrates (1, 2, 3) are light weight, stretchable and barrier like material with each substrate printed with a conductive ink and said conductive ink is then sandwiched with a dielectric ink to form a resistor protected from humidity and temperature for avoiding corrosion; and
said substrates (1, 2, 3) with plurality of conductive paths printed on said substrates (1, 2, 3) are integrated with said electronic assembly module (4) to form a resistor circuit of the tamper-proof resistor based smart envelope which in event of disconnection of resistor circuit indicates tampering.
2. The tamper-proof resistor based smart envelope (100) as claimed in claim 1 wherein, said substrate (1) and substrate (2) are made of material including but not limited to paper/polyethylene terephthalate (PET) like material and the substrate (3) with stretchable properties like thermoplastic polyurethanes (TPU).
3. The tamper-proof resistor based smart envelope (100) as claimed in claim 1 wherein, said interconnections of substrates (1, 2, 3) are made through techniques that include but not limited to anisotropic conductive adhesive, crimps, and conductive magnetic buttons.
4. A system for authentication using a tamper-proof resistor based smart envelope (100), comprising:
an internal server wirelessly connected to the tamper-proof resistor based smart envelope (100);
a cloud server wirelessly connected to said internal server;
wherein,
said tamper-proof resistor based smart envelope (100) is made of substrates (1, 2, 3) printed with a conductive ink sandwiched with a dielectric ink to form a resistor circuit protected from humidity and temperature for avoiding corrosion and integrated with an electronic assembly module (4);
said integrated electronic assembly module (4) includes a GSM, GPS module and an energy storing device for real time tracking of said smart envelope (100);
said internal server receives a trigger from integrated electronic assembly module (4) upon disconnection of said resistor circuit and sends geo-coordinates, battery percentage and other details through the cloud server to an operator or user, thereby alerting said operator or user about said event of tamper in real time.
5. The system for tamper-proof resistor based smart envelope (100) as claimed in claim 4, wherein said substrate (1, 2, 3) are printed with the conductive ink and dielectric ink through a process comprising the steps of:
a) pre-annealing Polyethylene Terephthalate (PET) for shrinkage in the substrate (1) and substrate (2);
b) curing/annealing a conductive/carbon ink in a box oven to evaporate solvents;
c) sandwiching the conductive/carbon ink with a dielectric ink to protect from humidity, temperature and also avoiding the corrosion;
d) curing the dielectric ink under ultraviolet (UV) light to ensure polymerization; and
e) repeating steps, a) to d) for Thermoplastic Polyurethanes (TPU) substrate (3).
6. The system for tamper-proof resistor based smart envelope (100) as claimed in claim 5, wherein said pre-annealing in step a) is carried at a temperature of 120°C for a duration of 20 minutes for shrinkage in the substrate and same is carried out for thermoplastic polyurethanes (TPU) substrate i.e., substrate (3), but the preheating results in stretching of the film.
7. The system for tamper-proof resistor based smart envelope (100) as claimed in claim 5, wherein said conductive/carbon ink is sub sequentially cured/annealing in box oven at 120°C for proper curing and to ensure the solvents are evaporated.
, Description:FIELD OF THE INVENTION
The present invention relates to a tamper-proof resistor based smart envelope and a system thereof. More specifically, the present invention provides a printed resistor with conductive ink and dielectric ink on paper/polyethylene terephthalate and thermoplastic polyurethanes forming a tramper evident global positioning system (GPS) and global system for mobiles (GSM) enabled smart envelope.

BACKGROUND OF THE INVENTION
Several countries have played a key role in communicating and expressing one’s feelings and emotions through conventional mails. In order to ensure privacy, various types of envelopes and bags were developed to contain such information.
As privacy tends to be a necessity, it also draws unwanted curiosity, and to easily detect whether contents inside envelope and bag has been tampered, the methods of ancient wax sealing to today’s temporary sealing of wax or glue were developed. But till date, even after all these years of development, different methods of tampering continue to exist and violate privacy through tampering of bags and envelops visually intact. Nowadays, with developing and new technologies, electronic mails have become an important communication medium among people. However, users tend to think that electronic mails are virtual, insubstantial, and intangible, and thus they have safety issue during transfer. Thus, conventional mails are the common medium to deliver formal or important articles of items. This is an important issue of securing the safety and confidentiality of the mail which needs to be resolved.
Packaging bags and envelopes are temporarily sealed to prevent them from opening. These bags are usually sealed with tape or glue to make sure than there are no leakages from them. But if the bags and envelopes contain more expensive or confidential documents, this temporary or traditional method of sealing falls inadequate they can be easily opened and re sealed without any surface visibility. Therefore, important or confidential objects are easily lost or mislead.
GB2394207A discloses an envelope assembly includes one or more envelopes, each envelope having two seals. The assembly can be used to provide a record of confidential disclosure. The assembly may include two envelopes, each of which can contain a document in use, each envelope being folded and sealed using first flaps, and the whole assembly being folded in half and sealed using a further flap. The assembly may be printed with a confidentiality agreement and may be signed in various places by users of the assembly. At a later stage a user may break one or other of the first flaps to gain access to one of the documents and may reseal one or more of the envelopes using second flaps. One or more of the flaps may include perforations to provide tamper evidence. But this invention does not the intimate about the tampering at the time of it’s happening like through GSM or GPS technology, therefore, the only way to find the tampering is when the receiver receives the tapered envelope.
US20040251298A1 discloses a confidential envelope/ bag is composed of a face and a back. The face and the back are linked with each other and formed with an edge at circumference; a sealing print is formed across the edges either at the back or on both the face and the back. The sealing print includes patterns, marks, graphics, texts or numbers made of paint, coating, ink, fluorescent dye, or even concaves, or extrusions. The circumference of the face and the back are adhered to each other with a suitable region to form a sealing zone. But this invention does not the intimate about the tampering at the time of it’s happening like through GSM or GPS technology, therefore, the only way to find the tampering is when the receiver receives the tapered envelope.
Therefore, there is a requirement of modification in envelope/bag and provide a system for tamper-proof resistor based smart envelope for handling and tracking valuable materials in transit. The smart envelope has printed resistor using conductive ink and dielectric ink on paper/polyethylene terephthalate and thermoplastic polyurethanes with enabled GPS and GSM technology.

OBJECT OF THE INVENTION
The main object of the present invention is to provide a tamper-proof resistor based smart envelope and a system thereof.
Another object of the present invention is to provide a tamper-proof resistor based smart envelope and a system thereof with enabled GPS and GSM.
Yet another object of the present invention is to provide a tamper-proof resistor based smart envelope and a system thereof with printed resistor using conductive ink and dielectric ink on paper/polyethylene terephthalate and thermoplastic polyurethanes.
Yet another object of the present invention is to provide a tamper-proof resistor based smart envelope and a system thereof with the potential to handle valuables having the integration of both printed electronics and conventional electronic assembly.
Still another object of the present invention is to provide a tamper-proof resistor based smart envelope and a system thereof for handling and tracking valuable materials in transit.

SUMMARY OF THE INVENTION
The present invention relates to a tamper-proof resistor-based smart envelope and a system which intimates the location of the envelope, in any sort of tampering, by activating SMS and the GPS location as soon as the resistor disconnects from the electronic assembly module.
In an embodiment, the present invention discloses a tamper-proof resistor based smart envelope comprising a stand-up smart envelope formed with plurality of substrates, wherein, the substrates are made up of a light weight, barrier like material with stretchable properties and said substrates are printed with a conductive ink and said conductive ink is then sandwiched with a dielectric ink to form a resistor that is protected from humidity and temperature for avoiding corrosion and the substrates are integrated to form a resistor and plurality of conductive paths hover on said substrates for making sure that said stand-up smart envelope of tamper-proof resistor based smart envelope forms said resistor that is interlinked with each substrate.
In another embodiment, the present invention discloses a stand-up smart envelope formed with plurality of substrates, an integrated electronic assembly module, wherein, the substrates are made up of a light weight, barrier like material with stretchable properties and said substrates are printed with a conductive ink and said conductive ink is then sandwiched with a dielectric ink to form a resistor that is protected from humidity and temperature for avoiding corrosion, the substrates are integrated to form a resistor and plurality of conductive paths hover on said substrates for making sure that said stand-up smart envelope of tamper-proof resistor based smart envelope forms said resistor that is interlinked with each substrate, the stand-up smart envelope is connected with said integrated electronic assembly module which includes a GSM, GPS and an energy storing device for real time of tracking of said smart envelope and said integrated electronic assembly module is wirelessly connected to an internal server which is further connected with a cloud server, the resistor disconnects from said integrated electronic assembly module in case of any event of tamper which triggers said internal server and sends geo-coordinates, battery percentage and other details to an operator or user, thereby alerting said operator or user about said event of tamper in real time.
In another embodiment, the present invention discloses a process of printing pattern with conductive and dielectric ink on each substrate is: a) pre-annealing of Polyethylene Terephthalate (PET) for enough shrinkage in the substrate; b) sub sequentially curing/annealing the conductive/carbon ink in box oven to ensure the solvents are evaporated; c) sandwiching the conductive/carbon ink with dielectric ink to protect from humidity, temperature and also avoiding the corrosion; d) curing the dielectric ink under Ultra Violet (UV) light to ensure polymerization; and e) same process is carried out for Thermoplastic Polyurethanes (TPU) Substrate.
The above objects and advantages of the present invention will become apparent from the hereinafter set forth brief description of the drawings, detailed description of the invention, and claims appended herewith.

BRIEF DESCRIPTION OF THE DRAWING
An understanding of the present invention may be obtained by reference to the following drawings:
Figure 1 shows side view of the stand-up envelope in which substrate 1 and substrate 2 are Paper/ Polyethylene Terephthalate (PET) and substrate 3 has stretchable properties like Thermoplastic Polyurethanes (TPU) and having an electronic assembly module inside the envelope according to an embodiment of the present invention.
Figure 2 shows a block diagram of the electronic assembly module that is connected and present inside the smart envelope according to an embodiment of the present invention.
Figures 3(a) and 3(b) show block diagram of process of printing the pattern with conductive and dielectric ink on each substrate according to an embodiment of the present invention.
Figures 4(a) to 4(c) show the front view of the printed pattern of conductive and dielectric ink on each substrate according to an embodiment of the present invention.
Figure 5 shows the block diagram of the system for tamper-proof resistor based smart envelope according to an embodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION
The present invention will now be described hereinafter with reference to the accompanying drawings in which a preferred embodiment of the invention is shown. This invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiment set forth herein. Rather, the embodiment is provided so that this disclosure will be thorough, and will fully convey the scope of the invention to those skilled in the art.
Many aspects of the invention can be better understood with references made to the drawings below. The components in the drawings are not necessarily drawn to scale. Instead, emphasis is placed upon clearly illustrating the components of the present invention. Moreover, like reference numerals designate corresponding parts through the several views in the drawings. Before explaining at least one embodiment of the invention, it is to be understood that the embodiments of the invention are not limited in their application to the details of construction and to the arrangement of the components set forth in the following description or illustrated in the drawings. The embodiments of the invention are capable of being practiced and carried out in various ways. In addition, the phraseology and terminology employed herein are for the purpose of description and should not be regarded as limiting.
The present invention provides a tamper-proof resistor-based smart envelope and a system for authentication, wherein said smart envelope comprises of three substrates forming a stand-up envelope in which substrate 1 and substrate 2 are paper/polyethylene terephthalate (PET) and substrate 3 has stretchable properties like thermoplastic polyurethanes (TPU). A conductive ink is printed on each substrate is either printed of carbon/silver or any conductive ink which is screen printed. The conductive ink is further sandwiched with a dielectric ink to protect from humidity and temperature for avoiding corrosion. Each of the substrate has a printed pattern with conductive and dielectric ink. Integrating/connecting the three substrates to form a complete resistor. The interconnection of substrates is made through anisotropic conductive adhesive, crimps, conductive magnetic buttons. A conductive pattern hover on the entire substrate is to make sure that the smart envelope forms a resistor which is interlinked with each substrate.
Further, in an embodiment the present invention provides a system for authentication that comprises a tamper-proof resistor-based smart envelope integrated with an electronic assembly module which includes an ESIM(GSM) antenna, GPS module and an energy storing device (battery) integrated inside the smart envelope. The electronic assembly module is wirelessly connected to the internal server. In an event of tampering/cutting, the resistor disconnects from the electronic assembly module forming a trigger to the internal server and activating the SMS and GPS location of the pouch through cloud server, additionally the location, battery and other information are sent to a mobile device for updating the owner or receiver of the smart envelope in real time.
Referring to Figure 1, shows a tamper-proof resistor-based smart envelope (100) having three substrates forming a stand-up smart envelope in which substrate (1) and substrate (2) are paper/polyethylene terephthalate (PET) and substrate (3) has stretchable properties like thermoplastic polyurethanes (TPU) and having an electronic assembly module (4) inside the smart envelope. The smart envelope formed by integrating these three substrates are pre-printed by conductive and dielectric inks. The conductivity of the conductive elements passes through different substrates by anisotropic conductive adhesive, double sided copper tape, crimps and magnetic buttons. These conductors act as a connecting agent as well as connections forming a complete resistor.
Referring to Figure 2, shows a block diagram of an electronic assembly module (4) that is connected and present inside the smart envelope (100). The electronic assembly module (4) includes an ESIM(GSM) antenna, GPS module and an integrated energy storing device (battery). The electronic assembly module (4) is wirelessly connected to the internal server. The resistance value of resistor is an authentic data for the electronic assembly module (4). The smart envelope checks the resistance value which has a pre-set frequency to ensure about its activity. In an event of tampering/cutting, the resistor disconnects from the electronic assembly module which triggers the internal server and activating SMS and GPS location of the smart envelope. Additionally, the location, battery percentage and other information are sent to a mobile device for updating the owner or receiver of the smart envelope in real time.
Referring to Figures 3(a) and 3(b), shows the block diagram of process of printing the pattern with conductive and dielectric ink on each substrate (1, 2, 3). Substrate (1) and (2), i.e., the Polyethylene Terephthalate (PET) is pre-annealed with 120°C for 20 minutes so that there is enough shrinkage in the substrate which is related to interatomic spacing of PET/Paper while fabrication. The conductive/ carbon ink is sub sequentially cured/annealing in box oven at 120°C for proper curing and to ensure the solvents are evaporated. The annealing ensures the sheet resistance of carbon to 11 ohms/Sq. Conductive/ carbon ink is then sandwiched with dielectric ink to protect from humidity and temperature avoiding the corrosion of conductive/ carbon ink. The dielectric ink is cured under ultraviolet (UV) light to ensure polymerization. The dry thickness of the carbon and dielectric ink is found to be 11 and 15 micrometer (µm). The same process is carried out for thermoplastic polyurethanes (TPU) substrate i.e., substrate (3), but the preheating results in stretching of the film.
Referring to Figures 4(a) to 4(c), shows the printed pattern of conductive and dielectric ink on each substrate (1, 2, 3). Figures 4(a) and 4(b) show the pattern on paper/polyethylene terephthalate (PET) i.e. Substrate (1) and Substrate (2) and Figure 4(c) show the pattern on thermoplastic polyurethanes (TPU) i.e. substrate (3). The pattern printed on the different substrates are non-connected. Therefore, integrating/connecting the three substrates forms the complete resistor through anisotropic conductive adhesive, crimps, conductive magnetic buttons. The conductive pattern hover on the entire substrate to make sure the entire smart envelope forms a resistor which is interlinked with each substrate. So that, in case of any tampering with the smart envelope, the conductive path disconnects from the electronic assembly module forming a trigger to internal server which further activating SMS and GPS location of the envelope.
Referring to Figure 5, shows the system for tamper-proof resistor based smart envelope (100) that comprises the smart envelope having an electronic assembly module (4) which has ESIM(GSM) antenna, GPS module and energy storing device (battery). The electronic assembly module (4) is wirelessly connected to the internal server. In an event of tampering/cutting, the resistor disconnects from the electronic assembly module (4) forming a trigger to the internal server and activating the SMS and GPS location of the smart envelope through cloud server. Additionally, the location, battery percentage and other information are sent to a mobile device for updating the owner or receiver of the smart envelope (100) in real time.
Therefore, the present invention provides a tamper-proof resistor-based smart envelope and a system as there was a requirement for modification the packaging bags and envelopes that are used to deliver formal or important articles of items. The present invention provides a tamper-proof resistor based smart envelope and a system thereof. The present invention in any event of tampering/cutting with the envelope, the resistor disconnects from the electronic assembly module which triggers the internal server and activating SMS and GPS location of the envelope.
Many modifications and other embodiments of the invention set forth herein will readily occur to one skilled in the art to which the invention pertain having the benefit of the teachings presented in the foregoing descriptions and the associated drawings. Therefore, it is to be understood that the invention is not to be limited to the specific embodiments disclosed and that modifications and other embodiments are intended to be included within the scope of the appended claims. Although specific terms are employed herein, they are used in a generic and descriptive sense only and not for purposes of limitation.