Text-are-coatad silica The invention relates to a "exture-coated sixjjuci, ^J ct process for its preparation and to its use An. aerogel-like textured silica is known f r£m DiLJ2£_A£~-£3-$. That siiica is prepared by incorporating water with uniform distribution, into an air-dispersed fumed siiica and drying the resulting pulverulent mixcure. That silica has the disadvantage that Ax has a pronounced tendency to sedimentation and can be re disdersed onlv with difficulty or not at ail. Document j)E 15 92 363 describes organically modified precipitated silicas which are coated, for example, with a wax and can be used as delustering agents. Those known silicas exhibit poor transparency in various lacquer systems. Owing to their nigh moisture content, those silicas cannot be used An moisture-curing polyurethane systems. Lacquer systems that cannot readily be delustered, such as poly^rethane and epoxy lacquer systems, cannot be delusteted satisfactorily using the known silicas. The object is, therefore to prepare a silica that does not exhibit those disadvantages. The invention provided a texture-coated silica- In a preferred embodiment of the invention, the texture-coated silica can have a carbon content of from 1 to 3D wt.%. The silica according to the invention can have a BET surface area of from 30 to 450 m2 g. It can have a tamped density of from 10 to 100 q l. The DBP number can be from 2.4 to 3.8. A 4 % aqueous suspension of the silica according to the invention can have a pH value of from 5 to 8. Texture-coated means that the end product i< more highly textured than the starting product and is additionally coated. The texture-coated silica has a higher L)PB number than the starting silica. The texture-coated silica according to the invention can be prepared by spraying a fumed silica with water and a coating agent while mixing in a suitable mixing vessel, then milling and subsequently drvinc the mixture. Any known fumed silica can be used the fumed silica". In a preferred embodiment of the invention, the fumed silicas according ro Table i can pe used. Fumed silica are known from Ul Imann's Encyklopadie der technischen Chemie 4th edtion valume 21, pages 464 ff (1982). They are prepared by means of flame hydrolysis, in which a vaporizable metal compound or metalloid compound, such as, for example, silicon tetrachloride, are burnt in a flame with gases containing hydrogen and oxygen. JIS K 5l6l l (not screened) 8) based on material ignited for 3) following DIN ISO 787 11, 2 hours at 1000°C ASTM D 280 JIS K 5101 21 9) -special packaging that protects 4) following DlN 55921, from moisture ASTM D 1Z08, JIS K -5101 23 10) HCI content is a constituent of the 5) following DIN ISO 797 IX, ignition loss ASTM D 1208, JIS K 5101 24 11) V product is supplied in 20 kg bags 6) follow ng DIN ISO 787 XVIII, 12) W product is at present supplied JIS K 5101 20 only from the Rheinfalden factory Of the fumed silicas listed' in Table 1, there can preferably be used all types of Aerosil with he exception of AEROSIL OX50, including' the uncomoressed Variants. Thermoplastic elastomers can be used as coating agent. The thermoplastic elastomers can be used in the form of aqueous and or solvent-containing dispersions. Particular preference is given to the use, as thermoplastic elastomers, of'"dimethylpolysiloxane elastomers having terminal epoxy groups, especially having a molecular weight of greater than' 100,000. The thermoplastic elsatomers can be prepared by: (I) mixing, (A) a rheologically stable polyamide resin having a melting point or glas^s transition temperature of 25.degree.c to 278. degree. c, (B) a silicone base comprising (Bf) 100 parts by weight of a diorganopolysiloxane gum having a plasticity of at least 30 and having an average of At least 2 alkenyl groups in its molecule and (Blf) 5 to 200 parts by weight of a reinforcing filler, the weight ratio of said silicone base to said polyamide resin beinq greater than 35:65 to 85:15, (C) for each 100 parts by weight of said polyamide resin, a compatibilizer selected from (i) 0.1 to 5 parts by weight of a coupling agent having a molecular weight of less than 800 which contains at least two groups independently selected from ethylenically unsaturated group, epoxy, anhvririHp. .qi'flnoL carboxvL oxazoline or alkoxy having 1 to 20 carbcn atoms, in its molecule- (ii) 0.1 to 10 parts by weight of a functional diorganopolysiloxane having at least one group selected from epoxy, anhydride, silanol carboxyl, amine, oxazoline or alkoxy having 1 to 20 carbon atoms, in its molecule, or (iii) from 0,1 to 10 parts by weight of a copolymer comprising a~ least one diorganopolysiloxane block and at least one block selected from polyamide, polyether, polyurethane, polyurea, polycarbonate or polyacrylate, (D) an organohydrido silicon compound which contains an average of a" least 2 silicon-bonded hydrogen groups in its molecule and (E) a hydrosilation catalyst, components (D) and {E) being present in an amount sufficient to cure said diorganopolysiloxane (B'); and (II) dynamically curing said diorganopolysiloxane (B'). The invention further relates to a thermoplastic elastomer whtch is prepared by the above method. Component (A) of the present invention is a thermoplastic polyamide resin. These resins are well known by the generic term "nylon" and are long chain synthetic polymers containing amide (i.e., —C(O)—NH—) linkages along the main polymer chain. For the purposes of the present invention, tne polyamide resin has a melt point (m.p.), or glass transition temperature (Tg) if the polyamide is amorphous, of room temperature (i.e., 25 °C ) to 275 °C Attempts TO prepare TPSiV elastomers from polyamides having higher melt points (e.g., nylon 4 6) resulted in poor physical properties, the ultimate elongation of such products being less than the required 25% according to the present invention. Furthermore, for the purposes of the' present invention, the polyamide resin is preferably dried . by passing a dry, inert gas over resin pelLets or powder at elevated temperatures. The degree of drying consistent with acceptable properties and processing debends on the particular polyamide and its value is generally recommended by the manufacturer or may be determined by a few simple experiments. It is generally preferred that the polyamide resin contains no more than, about O.l weight percent of moisture. Finally, the polyamide must also be rheologically stable under the mixing conditions required to prepare the .TPSiV elastomer, as described infra. This stability is evaluated on the neat resin at the appropriate processing temperature and a change of more than 20% in melt viscosity (mixing torque.)- within the t me generally required to prepare the corresponding TPSiVs (e.g., 10 to 30 minutes in a bowl mixer) indicates that the resin is outside the- scope of the present invention Thus, for example, a dried nylon 11 sample having a m.p of 198 °C was. mixed, in a bowl mixer under a nitrogen gas purge at about 210 to 220 °C for about 15 minutes and the observed mixing torque increased by approximately 200% Such a polyamide resin is not a suitable Candidate for the instant method. Other than the above mentioned limitations, resin (A) can be any thermoplastic crystalline or amorphous high molecular weight solid homopolymer, copolymer or terpolymer having recurring amide units within the polymer chain. In copolymer' and terpolymer systems, more than 50 mole percent of the epeat units are amide-containing units. Examples of suitable polyamides are polylactams such as nylon 6, polyenantholactam (nylon .7), polycapryllactam (nylon 3), polyluryllactam (nylon 12), and the like; homopolymers of aminoacids such as polypyrrolidinone (nylon 4) ; copolyamides of dicarboxylic acid and diamine such as nylon 6 6, polyhexamethyleneazelamide (nylon 6 9) , pclyhexamethylene-sebacamide (nylon 6 10 pclyhexamethyleneisophthalamide (nylon 6,1 polyhexamethylenedodecar.cic acid (nylon 6 12) and the like; aromatic and partially aromatic polyamides; copolyamides such as copolymers of caprolactam and hexamethyleneadipanu.de nylon 6,6 6) , oh a terpolyamice (e.g., nylon 6,6 6,6);-clock copolymers such as polyether pclyamides; or mixtures "hereof. Preferred polyamide resins are nylon 6, nylon 12, nylon 6 12 and nylon 6 6. Silicone base (B) is a uniform blend of a diorganopolysiloxane gum (B1) and a reinforcing filler (B") . Diorganopolysiloxane (B!; is a high consistency (gum) polymer or copolymer which contains at least 2 alkenyl groups having 2 to 2 0 carbarn atoms in its molecule. The alkenyl group is specifically exemplified by vinyl, allyl, burenyl, pentenyl, hexenyl and decenyl The position of the alkenyl functionality is not critical and it may be bonded at the molecular chain terminals, in non-terminal positions on the molecular chaan or at both positions. It is preferred that the Alkenyl group is vinyl or hexenyl and that this group is present at a level of 0.001 to 3 weight percent, preferably 0.01 to 1 weight percent, in the diorganopolvsiloXne gum. The remaining (i.e., non-alkenyl) silicon-bonded organic groups in component (B') are independently selected from hydrocarbon or halogenated hydrocarbon groups which contain no aliphatic unsaturation. These may be specifically exemplified by alkyl groups having 1 to 20 carbon atoms, such as methyl, ethyl, propyl, butyl, pentyl and hexyl; cycloakyl groups, such as cyclohexyl and cycloheptyl; aryl groups having 6 to 12 carbon atoms, such as phenyl, tolyl and ^ylyl; aralkyl groups having 7 to 20 carbon atoms, such as l6enzyl and phenethyl; and halogenated alkyl groups having 1 to 20 carbon atoms, such as 3, 3, 3-trifluoropropyi WO 2004 055105 (j>CT EP20O3 fl 12381 ) ■ , ..... . ^ and chloromethyl. It will be understood, of course, that these groups are selected such that the diorganopolysiloxane gum (B') has a glass temperature (or melt point) which is below room temperature and the gum is therefore eiastomeric. Methyl preferably makes up at lease 50, more preferably at least 90, mole percent of the non- unsaturated silicon-bonded organic groups in component (B'). Thus, polydiorganosiloxane (B') can be a homopolymer or a copolymer containing such organic groups. Examples include gums comprising dimethylsiloxy units and phenylmethylsiloxy units; dimethylslloxy units and diphenyisiloxy units; and dimethylslloxy units, diphenyLsiloxy units and phenylmethylsiloxy units, among others. The molecular structure is also not critical and is exemplified by straight-chain and partially branched straight-chain, linear structures being preferred. Specific illustrations of organopolysiloxane (B1) include: trimethylsiloxy-endblocked dimethylsiloxane-methylhexenylsiloxane copolymers; dimethylhexenlylsiloxy-endblocked dimethylsiloxane-methylhexenylsiloxane copolymers; trimethylsiloxy-endblocked dimethylsiloxane-methylvinylsiloxane copolymers; trimethylsiloxy-endblocked methylphenylsiloxane-dimethylsiloxane-methylvinylsiloxane copolymers; dimethylvinylsiloxy-endblocked dimethylpolysiloxanes; dimethyl vinylsiloxy-endblocked dimethylsiloxane-methylvinylsiloxane copolymers; dimethylvinylsiloxy-endblocked methylphenylpolysiloxanes ; dimethyl vinylsiloxy-endblocked methylphenylsiloxane-dimethyleiloxane-methylvinylsiloxane copolymers; and similar copolymers wherein at least one end group is dimethilhydroxysiloxy. Preferred systems for low temperature applications include methylphenylsiloxane-dimechylsiloxane-methylvinylsiloxane copolymers and and chloromethyl. It will be understood, of course, that these groups are selected such that the diorganopolysiloxane gum (B') has a glass temperature (or melt point) which is below room temperature and the gum is therefore eiastomeric. Methyl preferably makes up at leasr 50, more preferably at least 90, mole percent of the non— unsaturated1silicon-bonded organic groups in component (Bf ) . Thus, polydiorganosiloxane (B') car be a homopolymer or a copolymer containing such organic groups. Examples include gums comprising dimethylsiloxy units and phenylmethylsiloxy units; dimethylsiloxy units and diphenyisiloxy units; and dimethylsiloxy units, diphenyLsiloxy units and phenylmethylsiloxy units, among others. The molecular structure is also not critical and is exemplified by straight-chain and partially branched straight-chain, linear structures being preferred. Specific illustration of organopolysiloxane (B') include: trimethylsiloxy-endocked dimethylsiloxane-methylhexenylsiloxane copolymers; dimethylhexenlylsiloxy-endblocked dimethylsiloxane-methylhexenylsiloxane copolymers; trimethylsiloxy-endblocked dimethylsiloxane-methylvinylsiloxane copolymers; trimethylsiloxy-endblocked methylphenylsiloxane-dimethylsiloxane-methylvinylsiloxane copolymers; dimethylvinylsiloxy-endblocked dimethylpolysiloxanes; dimethylvinylsiloxy-endblocked dimethylsiloxane-methylvinylsiloxane copolymers; dimethylvinylsiloxy-endblocked methylphenylpolysiloxanes ; dimethylvinylsiloxy-endblocked methylphenylsiloxane-dimethylsiloxane-methylvinylsiloxane copolymers; and similar copolymers wherein at least one end group is dimethylhydroxysiloxy. Preferred systems for low temperature applications include methylphenylsiloxane-dime hylsiloxane-methylvinylsiloxane copolymers and diphenylsiloxane-dimethylsiloxar.e-methylvinylsiloxane copolymers, particularly whereir. the mriflr content of the dimethylsiloxane units is abou~ 93%. Component (B1) may also consist of combinations of two or more organopolysilcxanes. Most preferably, component (37 ) is a polydimethylsiloxane homopolyme which is terminated with a vinyl group at each end of its molecule cr is such a homopolymer which also contains at least one vinyl group along its main chain. For the purposes of the present invention, the molecular weight of the diorganopolysiloxane gum is sufficient to impart a Williams plasticity number of at least about 30 as determined by the American Society for Tesoing and Materials (ASTM) test method 926. The plascicity number, as used herein,- is defined a^ the thickness in millimeters. times,. 100 of a cylindrical test specimen 2 cm in. volume and approximately 10 mm in height after the specimen has been subjected to a compressive load of 4 9 Newtons for three minutes at 25 °C. When the plasticity oi this component is less than abou~ 30, as in the case of the low viscosity fluid siioxanes employed by Arkles', cited supra, the TPSiVs prepared by dynamic vulcanization according to the instant method exhibit poor uniformity such that at high silicone contents (e.g., 50 to 70 weight percent) there are regions of essentially only silicone and those of essentially only thermoplastic resin, and the blends are weak and friable. The gums of the present invention are considerably more viscous than the silicone fluids employed in the prior art. For example, silicones contemplated by Arkles, cited supra, have an upper viscosity limit of 100,000 cS (0.1 m2 s) and, although the plasticity of fluids of such low viscosity are not readily measured by the ASTM D 926 procedure, it was determined that this corresponds zo a plasticity of approximately 24. Although there is no absolute upper limit on the plasticity of component (B'), practical considerations of processability in conventional mixing equipment generally restrict this value, trererably, the plasticity number should be about ICO to 200, most preferably about 120 to 185. Methods for preparing high consistency unsaturated group-containing polydiorganosiloxanes are well known and they do not require a detailed discussion in this specification. For exampler a typical method for preparing an alkenyl-functional polymer comprises the case-catalyzed equilibration of cyclic and or linear diorganopoiysiloxanes in the presence of similar alkenyl functional species. Component 4 2 units; and silicone resins composed of (CH3)2 Hsi01 :, (CH3) 3 SiOi £, CK3Si 03 2, PhSi03 2 and SiC- 2 units, wherein Me and Ph hereinafter denote methyl and phenyl groups, respectively. Particularly preferred organohydrido silicon compounds are polymers or copolymers comprising RLTSiO units ended with either R3SiOi 2 or HR2Si0i 2, wherein R is independently selected from alkyl groups having l to 20 carbon atoms, phenyl or trifluoropropyl, preferably methyl. It is also preferred that the viscosity of component (D) ,1s about 0.5 to 1,000'mPa-s at 25 °C, preferably 2 to 500 mPa-s. Further, this component preferably has 0.5 to 1.7 weight percent hydrogen bonded to silicon. It is highly preferred that component (D) is selected .from a polymer consisting essentially of methylhydrLaosiloxane units or a copolymer consisting essentially of dimethylsiloxane units and methylhydridosiloxane units, having 0.5 to 1.7 percent hydrogen bonded to silicon and having a viscosity of 2 to 500 mPa-s at 25.degree C. It is understood that such a highly preferred system will have terminal groups selected from trimethylsiloxVor dimethylhdridosiloxy groups. Component (D) may Also be a combination of two or more of the above described systems. The organohydrido silicon compound (D) is used at a level such that the molar ratio of SiH therein to Si-alkenyl in component (B') is greater than 1 and preferably below about 50, more preferably 3 to 30, most preferably 4 to 20. These SiH-fnnctional materials are well known in the art and many of them are commercially available. Hydrosilation catalyst (E) is a catalyst that accelerates the cure of diorganopolysiloxane (B') in the present composition. This hydrosilation catalyst As exemplified by platinum catalysts, such as platinum black, platinum supported on silica, platinum supported on carbon, chloroplatinic acid, alcohol solutions of chloroplatinic acid, platinum olefin complexes, platanum alkenylsiloxane complexes, platinum beta-diketone complexes, platinum phosp'fiine complexes and the like; rhodium catalysts, such as rhodium chloride and rhodium chloride di (n-butyl) sulfide complex and the like; and palladium catalysts, such' as palladium on carbon, palladium chloride and the like. _ Component (E) is preferably a platinum-based catalyst such ars chloroplatinic acid; platinum dichloride; platinun tetrachloride; a platinum complex catalyst produced by reacting chloroplatinic acid and divinyltetramethyldisiloxane which is diluted with dimethylvinylsiloxy endblocked polydimethyisiloxane, prepared according to U.Sr. Pat. No. 3,419,593 to Willing; and a neutralized complex of platinous chloride and divinyltetramethyldisiloxane, prepared according to U.S. Pat. No. 5,175,325 to Brown et al. Most preferably, catalyst (E) is a neutralized complex of platinous chloride and divinyltetramethyldisiloxane. Component (E) is added to the present composition in a catalytic quantity sufficient to promote the reaction of components (B') And (D) and thereby cure the diorganopolysiloxane to form an elastomer. The catalyst is preferably added so as to provide about 0.1 to 500 parts per million (ppm) of metal atoms based on the total weight of the thermoplastic elastomer composition, more preferably 0.25 to 100 ppm. In preferred embodiments of the present invention, a hindered phenol 5.5 methanol, p.a. buffer solutions pH 7.00 pH 4.66 Devices for determining the pH value laboratory balance (readable to o 1 g) glass beaker, 250 ml magnetic stirrer magnetic rod, . length 4 cm combined pH electrode pH meter Dispensette, 100 ml Procedure for determining the pH value The determination is carried out following DIN ISO 787 IX: Calibration: Before the pH value is measured, the meter is calibrated with the buffet solutions. If several measurements are carried out in succession, it is sufficient to calibrate the meter once. 4 g of hydrophilic oxide are stirred in a 250 ml glass beaker with 96 g (96 ml) of water with the aid of a Dispensette and for five minutes by means of a magnetic stirrer (speed about 1000 min-1) with the pH electrode immersed. 4 g of hydrophobic oxide are made into a paste with 48 g (61 ml) of methanol in a 250 ml glass beaker, and the suspension is diluted with 48 g (48 ml) of water and stirred for five minutes by means of a magnetic stirrer (speed about 1000 min-1) with the pH electrode immersed. After the stirrer has been switched off, the pH value is read off after the mixture has been allowed to stand for one minute. The result is read off to one decimal place. Loss on drying In contrast to the weighed portion of 10 g mentioned in DIN ISO 787 II, a weighed portion of i g is used for determining the.loss on drying, The cover is fitted before cooling is carried out. A second drying operation is not carried out. About 1 g of the sample is weighed, to an accuracy of 0.1 mg, avoiding the formation of dustf into a weighing pan which has a ground-glass cover and has been dried at 105°C, and is dried for two hours at 105°C in a drying cabinet. After cooling with the cover in place in a desiccator over blue gel, the samole isr re-weighed. g loss in weight % loss on drying at 105°C = *x 100 ' g initial weight The result is read off to one decimal place. Ignition loss Devices for determining the ignition loss porcelain crucible with crucible lid muffle furnace analytical balance (readable to 0.1 mg) desiccator Carrying out the determination of the ignition loss Debartina from DIN 55 9-21, 0.3 to 1 g of the material, which has not been pre-dried, is weighed to an accuracy of 0.1 mg, into a porcelain crucible, having a crucible lid, which has previously been ignited, and is ignited for 2 hours at 1000°C in a muffle furnace, The formation of dust is carefully to be avoided. It has proved advantageous for the weighed Samples to be placed into the muffle furnace while it is still cold. More pronounced air turbulence in the porcelain crucibles is avoided by slow heating of the furnace. After 1000°C has been reached, the sample is ignited further for 2 hours. The crucible is then covered with a crucible lid and the ignition loss of the crucible is determined in a desiccator ovsrr blue gel. Evaluation of the icnition loss determination Because the ignition loss, is based on the sample dried for 2 hours at 105°C, the calculation formula is as follows: l00 - LD m0 x - mi 100 % ignition loss =hx 100 100 - LD rao x 100 m0 = initial weight g) LD = loss on drying (%) mi = weight of the ignited sample (g) The result is read off to one decimal place. DBF number Devices for determining the DBP number . . top-pan balance poly-beaker (250 ml) Brabender plastograph with metering unit Reagent Dibutyl phthalate (commercial grade} Implementation 1. Checking of the switch-off point -Switch on the plastcgraph without the metering pump. -Open the flap covering the operating element (beneath the display) between the switch-off value "1000" and the alarm "AI H.A.",'after 5 seconds the display returns to normal mode. 2. Calibration -Switch on the plastcgraph without the metering pump. -Switch on the kneader (press both Start buttons simultaneously-With the "Cal" button depressed press the "Funk" button once, the display alternates between the current zero point ana "Lo S.C.". -Press the "Cal" button again, after four seconds (calibration) the device displays the current overall range "10000" and "Fu S.C". -Press the "Cal" button again, after four seconds (calibration) the device shows the friction-corrected zero point "tare" -Press the "Cal" Button again and wait 5 seconds. -Carry out the steps "Switch-off point" and "Calibration operation" once daily as required before the measurements! 3. Measurement -12.5 g sample are weighed into a poly-beaker and placed into the kneading -chamber. If instructed, a different initial weight may also be used (e.g. 8 or 2-0 g) . The DB? metering unit is switched on. As soon as the, filling procedure (display F) is complete, the plastograph is ready for operation. - The measurement begins by simultaneous pressing of the Start buttons. -The metering unit meters in 4 ml of DBP min until the switch-off point that has been set (1000) is reached. -The device switches off automatically. -The DBP consumption can now be read off on the display of the metering device. Calculation Dosimat display x 1.047 x 100 DBP (%) = initial weight (g) Always give the result together with the initial weight.